METHOD FOR MANUFACTURING A CONVERSION ELEMENT AND OPTOELECTRONIC ARRANGEMENT

Abstract

A method for manufacturing a conversion element (1) is disclosed. The method comprises providing a substrate (2) with chip regions (24), arranging a source wafer (3) over the substrate (2), wherein a source layer (4) with a conversion material (5) is arranged on a side of the source wafer (3) facing the substrate (2), depositing a portion (51) of the conversion material (5) onto the substrate (2) by irradiating the source wafer (3) with laser radiation (6), wherein the portion (51) of the conversion material (5) at least partially forms the conversion element (1), and wherein the deposition is designed such that different amounts of the conversion material (5) are arranged on different chip regions (24). Furthermore, an optoelectronic arrangement (8) is disclosed. The optoelectronic arrangement (8) may include a micro-LED.

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