Printed circuit board module and electronic device so that
Patent Information
- Application Number
- DE602021057330
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-08-18
- Filing Date
- 2021-08-13
- Publication Date
- 2026-07-15
- Estimated Expiration
- 2041-08-13
AI Technical Summary
The miniaturization of electronic devices is limited by the presence of empty spaces due to varying component thicknesses and the vulnerability of interposers to bending and cracking during high-temperature processes, especially in multilayer printed circuit boards with non-standardized shapes.
Implementing separate interposers of different heights and arranging components with varying thicknesses efficiently, utilizing a plurality of discontinuous and separated interposers to improve electrical connections and reduce bending, warpage, and cracking in circuit boards.
This approach allows for efficient space utilization and minimizes bending and cracking, while enhancing electrical connections and shielding performance in circuit board modules.