Dicing configuration

Abstract

Herein is provided a method, comprising the steps of providing a substrate (10), wherein the substrate (10) comprises a handle layer (201), a device layer (203), and an insulator layer (202) in between the handle layer (201) and the device layer (203), wherein the substrate (10) comprises a device (110), etching a groove (101) into the substrate (10) reaching the insulator layer (202), and dicing the substrate (10) into dies (100) by using the groove (101) to prevent cracking of the substrate (10). Herein is further provided a die obtained by the method, and an apparatus comprising a die (100) having a groove surface (S101) and a dicing surface (S220) on the faces of the die (100).