Method for manufacturing an electronic device

Abstract

Method for manufacturing an electronic device. This description relates to a method comprising the following steps: - laminating an organic film (300) onto an assembly comprising a substrate (100) in which a first chip is formed and on which conductive areas (110) are positioned, a second chip (200) being mounted on the substrate (100) and connected to the first chip, the second chip (200) comprising through-vias (220), - forming openings (350, 360) in the organic film opposite the conductive areas (110) and the through-vias (220), - forming contact points (350, 360) on the organic film (300), up to the conductive areas (110) and the through-vias (220), - depositing an electrically insulating element (400) onto the organic film (300) and forming openings in the electrically insulating element (400) opposite the contact points (350, 360),- to form conductive elements (160) on the contact points (350, 360). Figure for the abbreviation: Fig. 2D,

Claims

8. Device according to the preceding claim, wherein an electrically insulating material (300) is formed on a second face (102) and on lateral faces (103) of the substrate (100).

9. Assembly comprising a device as defined in any one of claims 7 to 8, and a printed circuit board (500) comprising connection pads (510), the conductive elements (160) being assembled on the connection pads (510), for example by means of solder pads (170).

10. A method for manufacturing an assembly as defined in claim 9, the method comprising a step in which the conductive elements (160) are assembled on the connection pads (510) of the printed circuit board (500), for example during a soldering step. [Fig. IA] [Fig. IB] Fig. 1B [Fig. IC] Fig. 1C [Fig. 1D] [Fig. 1E] [Fig. 1F] 100 110 [Fig. 2A] Fig. 2A [Fig. 2B] Fig.2B [Fig. 2C] Fig. 2C [Fig. 2D] Fig.2D 120 120 110 120 110 120 110 [Fig. 2E] Fig.2E [Fig. 2F] Fig. 2F 220 200 120 110 170 170 [Fig. 3] Fig. 3 [Fig. 4] 220 210 120 110 360 510

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