Planar Litz coil improved according to a third type
The 3D planar Litz coil with a stack of bifacials and strategic interconnection/exchange zones addresses high-frequency resistive losses by ensuring uniform current flow and copper density, enhancing coil performance.
FR3170096A1Pending Publication Date: 2026-06-19THALES SA
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Patent Information
- Application Number
- FR2024014079
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2026-06-19
Abstract
Improved Planar Litz Coil of a Third Type: This coil is supported by a printed circuit board consisting of a stack of at least two bifacials, each bifacial having two conductive layers etched to present a plurality of tracks (371 to 376). This coil comprises a bundle, said bundle having a plurality of strands, each strand having a plurality of wires, each wire having a pair of strands (371-1, 371-2 to 376-1, 376-2), each pair of strands resulting from the connection of several tracks etched on different conductive layers of the printed circuit board. Each strand of the coil results from the association of identical unit elements (351), a unit element extending radially between an inner and an outer periphery of the coil, a unit element having a track for each strand of each pair of strands of each wire in the strand. Figure for the abbreviation: Figure 6
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Citation Information
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