Method for manufacturing a substrate for radio frequency applications
FR3171734A1Pending Publication Date: 2026-07-31COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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Patent Information
- Application Number
- FR2025000945
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-30
- Publication Date
- 2026-07-31
Abstract
Title: Method for manufacturing a substrate for radio frequency applications. The invention relates to a substrate (1) for radio frequency applications comprising, stacked along the z-axis, - a highly resistive support layer (10) having an electrical resistivity greater than or equal to 500 Ω.cm, - a crystalline electron trapping layer (11) having a surface dislocation density (D) greater than or equal to 10⁶ cm⁻², - an oxide layer (12) on the electron trapping layer (11), - a layer of interest (13) on the oxide layer (12). The invention also relates to a method for manufacturing such an RF substrate. Figure for the abstract: Fig. 1E
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