Method and device for cutting and bending an axial electronic component
FR3172011A1Pending Publication Date: 2026-08-14SEMO
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Patent Information
- Application Number
- FR2025001323
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-08-14
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Abstract
A method for cutting and bending the tabs of an axial electronic component (12) comprising the following steps: - conveying an axial electronic component (12) in a plane to a cutting and bending station (6), - placing the axial electronic component (12) on a die (58), - cutting each end of the tab (16) of the axial electronic component (12) by the action of a blade (42) moving substantially perpendicular to the conveying plane, - bending each cut tab (16) by a lever (48) moving perpendicular to the conveying plane so as to bend the tab (16) downwards perpendicular to the conveying plane and pivotally mounted so as to fold the bent tab in a controlled manner towards the underside of the electronic component (12), and - continuing the conveying of the electronic component (12). Cutting and bending device (6) operating according to such a method. Abstract figure: Figure 2
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