Method and device for cutting and bending an axial electronic component

FR3172011A1Pending Publication Date: 2026-08-14SEMO
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Patent Information

Application Number
FR2025001323
Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-10
Publication Date
2026-08-14

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Abstract

A method for cutting and bending the tabs of an axial electronic component (12) comprising the following steps: - conveying an axial electronic component (12) in a plane to a cutting and bending station (6), - placing the axial electronic component (12) on a die (58), - cutting each end of the tab (16) of the axial electronic component (12) by the action of a blade (42) moving substantially perpendicular to the conveying plane, - bending each cut tab (16) by a lever (48) moving perpendicular to the conveying plane so as to bend the tab (16) downwards perpendicular to the conveying plane and pivotally mounted so as to fold the bent tab in a controlled manner towards the underside of the electronic component (12), and - continuing the conveying of the electronic component (12). Cutting and bending device (6) operating according to such a method. Abstract figure: Figure 2
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