Cooling of immersion electronic systems

Abstract

The present invention relates to a method and equipment for cooling electronic components by immersion in a dielectric liquid contained in a chamber (1), characterized in that said electronic component (11) is thermally coupled to a porous heat sink (16) comprising an open-cell, interconnected-channel porous heat sink (16a), the assembly being immersed in said dielectric liquid, and in that a gaseous phase is injected into the lower part of said porous heat sink. Abstract figure: Figure 1

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