Temperature sensing device

Abstract

A temperature sensing device for an induction cooker and a method for assembling the temperature sensing device are described. An example temperature sensing device includes: a sensor kit including one or more sensors; a plunger assembly, the plunger assembly being configured to hold the sensor kit; and a support base configured to provide physical support for the plunger assembly.

Description

(19) State Intellectual Property Office (12) Invention Patent Application (10) Publication Number (43) Publication Date (21) Application Number 202480014554.9 (22) Application Date 2024.02.23 (30) Priority Data 63 / 486,632 2023.02.23 US (85) PCT International Application Entering National Phase Date 2025.08.25 (86) PCT International Application Application Data PCT / US2024 / 017159 2024.02.23 (87) PCT International Application Publication Data WO2024 / 178387 EN 2024.08.29 (71) Applicant: Impulse Laboratories, Inc. Address: USA (72) Inventors: S.R. Damico, S.W. Lenius, J. Davis, K. Stegner, B.J. Talon (74) Patent Agency: China Council for the Promotion of International Trade Patent & Trademark Office Co., Ltd. 11038 Patent Attorney: Lin Zhenbo (51) Int.Cl. H05B 6 / 12 (2006.01) F24C 7 / 08 (2006.01) F24C 7 / 06 (2006.01) (54) Invention Title: Temperature Sensing Device (57) Abstract: A temperature sensing device for an induction cooker and a method for assembling the temperature sensing device are described. An example temperature sensing device includes: a sensor kit including one or more sensors; a plunger assembly configured to hold the sensor kit; and a support base configured to provide physical support to the plunger assembly. Claims (2 pages), Description (9 pages), Drawings (7 pages), CN 120937497 A, 2025.11.11, CN 1 20 93 74 97 A. 1. A temperature sensing device for an induction cooker, comprising: a sensor kit including one or more sensors; a plunger assembly configured to hold the sensor kit; and a support base configured to provide physical support to the plunger assembly. 2. The temperature sensing device of claim 1, wherein the plunger assembly includes a movable plunger, a fixed plunger support, and a spring disposed between the plunger and the plunger support. 3. The temperature sensing device of claim 1, wherein the one or more sensors include at least one self-heating flux sensor. 4. The temperature sensing device of claim 1, further comprising one or more auxiliary sensors disposed between the sensor kit and the plunger assembly. 5. The temperature sensing device of claim 4, wherein the one or more auxiliary sensors are disposed within a cavity of a sensor holding unit.6. The temperature sensing device of claim 5, further comprising a compliant anti-collision device disposed between the sensor holding unit and the plunger assembly. 7. The temperature sensing device of claim 6, wherein each of the sensor holding unit, the compliant anti-collision device, and the plunger assembly has a central hollow portion allowing one or more cables or wires to pass through. 8. The temperature sensing device of claim 2, wherein the plunger has an inner pillar portion and an outer cap portion disposed on a top side of the plunger. 9. The temperature sensing device of claim 8, wherein when the plunger assembly is assembled, at least a portion of the spring is held between the inner pillar portion and the outer cap portion of the plunger. 10. The temperature sensing device of claim 9, wherein the outer cap portion of the plunger includes a set of protrusions disposed along the lower edge of the cap portion. 11. The temperature sensing device of claim 10, wherein the plunger support includes a corresponding set of openings disposed on a side surface of the plunger support. 12. The temperature sensing device of claim 11, wherein the protrusion passes through an opening disposed on the side surface of the plunger support and is restricted to move within the opening in a predefined direction. 13. The temperature sensing device of claim 5, further comprising a sliding ramp for holding the sensor kit and the sensor holding unit together by circularly enclosing them. 14. The temperature sensing device of claim 13, wherein the sliding ramp has a conical shape at its top portion. 15. The temperature sensing device of claim 13, further comprising a sensor cap for covering the one or more sensors, wherein a side portion of the sensor cap is disposed between the sensor holding unit and the sliding ramp. 16. The temperature sensing device of claim 15, wherein the sensor cap comprises a non-ferrous sheet. 17. The temperature sensing device of claim 13, further comprising a partition assembly for attaching the sensor kit and the plunger assembly to the cooktop of the induction cooker. 18. The temperature sensing device of claim 17, wherein the partition assembly includes an upper collar, a lower collar, an O-ring, and a resilient partition. (Claims 1 / 2 page 2 CN 120937497 A) 19. The temperature sensing device of claim 18, wherein the partition includes an upper edge portion extending into a recess located on the lower edge of the sliding ramp.20. A method for assembling a temperature sensing device, the temperature sensing device including a temperature sensor subsystem, the temperature sensor subsystem including a sensor kit, a sensor holding unit, a compliant bumper, a plunger assembly, and a support base, the method comprising: attaching the plunger assembly to the support base; disposing the compliant bumper with a flexible top hollow portion within a plunger included in the plunger assembly; positioning the sensor holding unit above the compliant bumper and positioning the sensor kit above the sensor holding unit; and using a sliding ramp to press the sensor kit and the sensor holding unit together. Claims 2 / 2 Page 3 CN 120937497 A Temperature Sensing Device

[0001] Cross-Reference to Related Applications

[0002] This application claims the benefit and priority of U.S. Provisional Patent Application No. 63 / 486,632, filed February 23, 2023, entitled “Temperature Sensing Device”, under 35 U.S. SC §119(e), which is hereby incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure generally relates to temperature sensing devices, and more particularly to methods and apparatus for accurately sensing the temperature of any cookware made of different types of materials. Background Art

[0004] In the related art, there are various existing induction cookers that utilize temperature sensing for heating control. However, existing induction cookers are often limited by the diversity of types of cookware used. At the same time, the temperature measurements of different types of materials are also different, resulting in inconsistent results from associated temperature sensors.

[0005] Accurate measurement of cookware temperature is crucial for accurately controlling the temperature of cookware in use. Accurate measurement of the rate of change of cookware temperature is necessary for safety (e.g., preventing temperature spikes during startup or when the cookware is empty) and to reduce setpoint temperature overshoot and minimize temperature oscillations (i.e., knowing how much power is needed to change the temperature by a certain amount).

[0006] Therefore, there is a need for a temperature sensing device that is adaptable to different types of materials and capable of providing accurate and precise temperature measurements to control cookware temperature while operating with minimal time lag (i.e., the amount of time between reaching the desired temperature and recording that temperature on a temperature sensor or system). Summary of the Invention

[0007] To address the above-mentioned drawbacks, a temperature sensing device for an induction cooker and a method for assembling the temperature sensing device are described. In some examples, the temperature sensing device includes: a sensor kit including one or more sensors; a plunger assembly configured to hold the sensor kit; and a support base configured to provide physical support to the plunger assembly.

[0008] The above and other preferred features, including various novel details and combinations of elements, will now be described in more detail with reference to the accompanying drawings, and the preferred features are pointed out in the claims. It will be understood that particular methods and devices are shown by way of illustration only and not as limitations. Those skilled in the art will understand that the principles and features explained herein can be applied to numerous different embodiments. Brief Description of the Drawings

[0009] Various embodiments according to the present disclosure will be described with reference to the accompanying drawings, in which:

[0010] FIG1 illustrates an example sensor response time and time constant response to a step change in temperature according to one implementation.

[0011] FIG2 illustrates an example thermal response of an aluminum pot to input power according to one implementation.

[0012] FIG3 illustrates an example configuration for placing a temperature sensor subsystem inside a stove according to one implementation.

[0013] FIG4A and FIG4B illustrate different cross-sectional views of an example architecture of a temperature sensor subsystem according to one implementation.

[0014] FIG5 illustrates an exploded view of an example plunger assembly according to one implementation.

[0015] FIG6 illustrates an example support base and additional sensor according to one implementation.

[0016] FIG7 illustrates an example electronics included in a temperature sensor subsystem according to one implementation. Detailed Description

[0017] The figures (Figures) and the following description relate to some embodiments only by way of illustration. It should be noted that alternative embodiments of the structures and methods disclosed herein are feasible alternatives that can be adopted without departing from the principles of this disclosure, and will be readily recognized from the following discussion.

[0018] Reference will now be made in detail to specific embodiments, examples of which are illustrated in the figures. It should be noted that similar or identical reference numerals may be used in the figures and may indicate similar or identical functions, as long as it is feasible. The figures describe embodiments of the disclosed sensor design for illustrative purposes only. Those skilled in the art will readily recognize from the following description that alternative embodiments of the structures and methods shown herein can be adopted without departing from the principles described herein.

[0019] In general, accurate and precise measurement of cookware temperature is crucial for preventing overheating or underheating in food preparation. One of the challenges in achieving precise temperature measurement lies in the wide variety of containers used in cookware. For example, cookware materials and dimensions (such as thickness and size) affect the heating and temperature measurement process.

[0020] In addition to accurate and precise temperature measurement, response time is also an important factor for proper temperature control. Response time is crucial for the performance of the control loop, especially for the safety of the cooking system during the initial heating of the unknown cookware to the setpoint temperature. The response time of a cookware sensor is typically the time required to detect 99.3% (or close to) a temperature step change.For contact sensors, such as thermocouples (TC), resistance temperature detectors (RTDs), thermistors, etc., measurements are typically performed by immersing the sensor in boiling water and recording the time taken to read 99.3% of the signal (potentially 5 times the time constant). Figure 1 illustrates an exemplary sensor response time and time constant response to a temperature step change according to one implementation.

[0021] For photodiode sensors, the response time is limited by the rate of charge accumulation in the semiconductor. The short response time of photodiodes is well-suited for detecting rapid temperature changes, but the dependence on emissivity either requires a coating with a known emissivity on the cookware or means that the absolute temperature cannot be known before calibration using a sensor such as a contact sensor.

[0022] Although the response times of contact sensors (e.g., TC, RTD, thermistors) are relatively slow, these sensors can be oversampled (e.g., sampled at rates much greater than the Nyquist rate), and the dynamic response of these sensors can be measured. A model of a contact sensor can be used to estimate the actual temperature from several samples. The rate of change of sensor temperature can be determined using the delay of the nominal sampling rate (e.g., at least two readings may be needed to determine the slope), or it can be determined immediately by implementing an analog differentiator.

[0023] The controller of an induction cooker may have different, even conflicting, performance priorities for different operating states. Specifically, nominal cooker operation can be divided into two distinct phases: (1) initially heating an unknown cookware to a setpoint temperature; and (2) maintaining the temperature of a known cookware at the setpoint temperature.

[0024] In the initial heating phase, the goal is to bring a cookware with an unknown heat capacity to the setpoint temperature as quickly as possible in a safe and controllable manner. This is the first phase of the control loop, starting from when the user inputs the setpoint temperature and ending when the cookware approaches the stated temperature. The challenge of this phase is that the system has no information about the heat capacity or any other physical properties of the cookware, and therefore may heat the cookware too quickly. At this stage, response time (or time constant) is more important than accuracy to avoid dangerous situations such as spontaneous combustion of rapeseed oil, which can occur in as little as 1.2 seconds in a thin (e.g., 1 mm wall) aluminum pot (e.g., with 10 kW input power).

[0025] Figure 2 illustrates an exemplary thermal response of a cooker to 10 kW input power according to one implementation. In the figure, the Y-axis represents temperature in °K and the X-axis represents time in seconds. At the end of the initial heating phase, the temperature of the cooker may have reached or is close to the setpoint, and the system may have data or knowledge about the thermal response of the cooker to the power input at this time.

[0026] In the temperature maintenance phase, the goal is to maintain the temperature of the hot cooker at the setpoint as accurately as possible in a safe and controllable manner.This is the second stage of the control loop, which begins once the cooker reaches or approaches the setpoint temperature, and is also the main operating stage of the stove. In this stage, accuracy is more important than sensing speed because the stove already has information about the cooker's thermal response to power input and can modulate the supplied power to maintain the temperature at the setpoint. Unlike the initial heating stage (where optimal performance (fastest heating) is achieved by providing the cooker with full power), power modulation is more critical during the temperature maintenance stage.

[0027] Several options are available for modulating the cooker's power:

[0028] - Modulating the amplitude of the coil excitation at the nominal frequency (i.e., the frequency marked on the oscillator output). This method provides the highest resolution control of power and does not require additional characterization of the cooker. Possible solutions for this method include variable amplifier architectures and heat dissipation;

[0029] - Modulating the duty cycle of the power supply at the cooker's nominal frequency and 100% amplitude by pulse width modulation of the power switch. Possible solutions to this approach include the switching speed of the power electronics, the heat dissipation of the switch, and electromagnetic shielding (EMI shielding) of the rest of the system against the switching transients; and

[0030] effectively modulating the skin depth of the power transfer to the cooker by modulating the frequency of the coil excitation at 100% amplitude. In this approach, the coil can be driven with 100% power. This approach may require some characterization of the cooker's thermal response to different frequencies, which may be done as part of the initial heating phase.

[0031] Sensor Architecture

[0032] A temperature sensing system is disclosed herein. In one example, the temperature sensing system may be part of a cooktop element that delivers a large amount of power (and is therefore also referred to as the "temperature sensor subsystem" of an induction cooker). In some implementations, the temperature sensor subsystem may be used to control the cooker to a precise temperature with a very high heating rate and very low hysteresis. The temperature sensor subsystem may be located at the center of the cooktop coil within the induction cooker, thereby allowing the temperature sensor included in the subsystem to be in continuous contact with the cooker placed on the cooktop element. Throughout the specification, the temperature sensor may also be referred to as a "contact sensor". In some implementations, the temperature sensor subsystem can automatically detect whether a cooking appliance is placed on the stove element to determine whether to activate the temperature sensor subsystem. If the stove is accidentally turned on without a cooking appliance, the power output of the temperature sensor subsystem and the main coil may not be activated for safety reasons.

[0033] In some example implementations, the temperature sensor subsystem can be actively driven by utilizing an internal heater within the sensor subsystem itself. In one example, the sensor disclosed herein may be a self-heating flux sensor that uses an internal heater within the flux sensor itself to generate heat. Here, the flux sensor is a transducer that generates an electrical signal proportional to the total rate applied to the sensor surface.In some implementations, this active-drive method combines the fast response time of the temperature derivative sensing method with the accuracy of a contact sensor with a small thermal time constant that directly contacts the cookware. In an exemplary application, during the preheating phase of the contact sensor, once the user inputs the temperature setpoint of the induction cooker, the contact sensor can be rapidly heated to the setpoint using a control system utilizing a proportional-integral-derivative (PID) control loop. Because the thermal response of the contact sensor is known, heating can be performed quickly and safely. In operation, the contact sensor can be in contact with the cookware, and due to environmental losses, some stable (short-term) electrical charge can be provided to maintain the contact sensor at the target temperature.

[0034] During the cookware heating phase, once the contact sensor has stabilized at the setpoint temperature, the high-power stove coil used to heat the cookware can be turned on at 100% power. The cookware temperature may rise linearly, with the slope depending on the heat capacity. Once the cookware reaches the contact sensor temperature, the coil controller can cut off the power and stop the cookware heating process. The trigger for this power outage may not be the absolute temperature of the contact sensor (limited by its response time), but rather the direction of the heat flux entering the contact sensor (the direction can change immediately once the cookware exceeds the contact sensor temperature). Here, heat flux refers to the flow of thermal energy. Two exemplary methods for measuring heat flux include:

[0035] - Intermittently cutting off the power to the sensor heater and observing the rate of temperature change. When the rate of change changes from negative (the sensor is being heated by its internal heater) to positive (the sensor is being passively heated by contact with the pot), the cookware is at the setpoint temperature. A control sensor with the same geometry as the contact sensor but thermally insulated from the cookware can be used as the other end of a differential measurement to eliminate environmental influences.

[0036] - Observing the command power output of the sensor controller. When the command power switches from positive to negative, the cookware is at the sensor temperature. The control system can account for heat flux leakage from the environment. This is one function implemented by the system and may vary further depending on the individual device. Calibration may be required.

[0037] By detecting changes in heat flux entering the contact sensor at a setpoint temperature rather than the absolute temperature of the cookware, thermal hysteresis problems caused by the contact resistance and heat capacity of the contact sensor can be avoided. At least two samples may be required to determine the heat flux, thus maximizing the sensor's sampling rate during this operating phase.

[0038] During the cooking phase, once the cookware temperature has stabilized at the contact sensor temperature, the contact sensor's heater power is turned off, and the sensor becomes a passive contact sensor. The contact sensor's response time is less critical during the cooking operation phase because the temperature does not change rapidly.The contact sensor can sample slowly (e.g., approximately 2 Hz), and the coil controller can use a conventional PID loop or other control mechanism to maintain the cookware temperature at a set point.

[0039] It should be noted that the above description is only some exemplary implementations, and the temperature sensor subsystem disclosed herein is not limited to these implementations, but other different implementations can be performed.

[0040] Some features

[0041] Here are some identified features of the disclosed temperature sensor subsystem (or contact sensor) and associated induction cooker:

[0042] Physical features:

[0043] - The sensor kit (i.e., the temperature sensor and direct attachments such as sensor caps) is in contact with the bottom surface of the cookware.

[0044] - The sensor can be placed vertically or slightly tilted to maintain contact with cookware of various sizes and geometries at various physical locations on the cooking surface.

[0045] - The sensor kit is thermally isolated from the cooktop elements with a minimum resistance of a predefined value.

[0046] Safety / performance features:

[0047] - The sensor is capable of detecting cookware placement, therefore the sensor does not operate when not in contact with the pot.

[0048] - The top surface of the contact sensor can withstand continuous contact with containers exceeding 250°C.

[0049] - Other components of the contact sensor (excluding the top surface) can withstand temperatures exceeding 100°C.

[0050] User interaction features:

[0051] - The movable and static cooktop components are easy to clean and do not leave food particles. (Instruction manual 4 / 9 pages 7 CN 120937497 A)

[0052] - Exposed materials (such as sensor caps, sliding ramps, etc.) are scratch-resistant and also prevent scratches on cookware surfaces.

[0053] Assembly / manufacturing related features:

[0054] - The sensor kit requires minimal calibration per unit.

[0055] - The contact sensor can be inspected before installation into the cooktop.

[0056] - The range of fastener types and sizes is minimized.

[0057] - The use of adhesives is minimized, and the adhesives used are able to withstand certain temperatures (e.g., temperatures exceeding 100°C).

[0058] - The sensor assembly method enables the repair and replacement of components.

[0059] Mechanical Design and Integration

[0060] FIG3 illustrates an example induction cooker 300 with an embedded temperature sensor subsystem (TSSY) 310 according to an implementation. As illustrated, the temperature sensor subsystem 310 may be located at the center of the cooktop coil 320 within the induction cooker 300, wherein the temperature sensor included in the temperature sensor subsystem 310 is in continuous contact with the cookware regardless of how it is placed on the cooktop element. The induction cooker 300 may have a glass surface 330 that may be made of low thermal expansion glass-ceramic.As shown in the figure, in some implementations, the induction cooker 300 may include a set of control switches 340, the number of which may match the number of cooker coils 320. The control switches may allow the user to control the on / off state of each cooker coil 320 and / or set it to a specific temperature or heating level. It should be noted that although four cooker coils 320 are illustrated in Figure 3, in practical applications, the induction cooker 300 may have any number of cooker coils 320. Different cooker coils 320 may have the same or different sizes. Additionally, although each cooker coil 320 in Figure 3 is shown with the TSSY 310 disclosed herein, in practical applications, one or more cooker coils 320 may not have an associated TSSY 310.

[0061] It should also be noted that although the TSSY 310 is illustrated as being located at the center of the cooker coil, this disclosure is not limited to this configuration. In practical applications, the TSSY can be located in any possible position. Furthermore, although the TSSY 310 is illustrated as being integrated into the cooker coil, this disclosure is not limited to this configuration. In some implementations, the TSSY 310 may be part of a remote sensing system.

[0062] As will be described in more detail later, when no cookware is placed, the contact sensor included in the TSSY 310 can be pushed to a level above the surface of the cooktop element by a spring located below, as can be seen more clearly in FIG4A. When a cookware is placed on the cooktop element, the weight of the cookware can be loaded onto the contact sensor to move the sensor to a lower level (e.g., keeping the top surface of the TSSY flush with the surface of the cooktop element). The thrust from the bottom spring can keep the contact sensor in the TSSY 310 in constant contact with the bottom surface of the cookware. The specific structure of the TSSY 310 will be further described in detail with reference to FIGS. 4A through 6.

[0063] FIGS. 4A and 4B illustrate different cross-sectional views of an exemplary TSSY 310 according to one implementation. As shown, the TSSY 310 includes a temperature sensor kit 402 located at the central top of the temperature sensor subsystem 310. The sensor kit 402 includes one or more contact sensors 404, which may be further packaged and protected by a sensor cap 406. The sensor cap 406 may be a round cap with the shape of a general glass bottle cap, except that the bottom edge of the cap extends outward to form a lip. As shown in Figures 4A and 4B, the lip of the sensor cap 406 may be further held by a sliding ramp 408, allowing the sensor cap 406 to press against the sensor assembly 402. In some implementations, the sensor cap 406 may be a metal cap configured to adhere firmly to the contact sensor 404. The metal cap on top of the sensor cap 406 may be made flat with a filled edge for a more stable bond. In one implementation, the metal cap may be an iron-free sheet with minimal thermal mass, such as stainless steel 316.

[0064] The sliding ramp 408 may have a conical outer profile at the top and a large recess at the bottom on the outer surface (i.e., the surface facing away from the sensor assembly 402). The slope of the conical top may vary and may have an angle range between 20 degrees and 70 degrees (or another value less than 20 degrees or greater than 70 degrees). The bottom recess of the sliding ramp 408 may be curved and rounded, and the shape of said portion may match the upper edge of the formed resilient partition (or washer) 410, as can be seen in Figures 4A and 4B. The inner surface of the conical portion of the sliding ramp 408 (i.e., the surface facing the sensor assembly 402) may have a recess that clamps to the lip portion of the sensor cap 406. Below the recess, a set of internal threads may be configured along the inner surface of the sliding ramp 408, as shown in Figures 4A and 4B.

[0065] In some implementations, one or more auxiliary sensors 412 may also be included below the sensor assembly 402. The auxiliary sensors may have different functions. In one example, the auxiliary sensor may be configured to detect changes in heat flux as described above. In some implementations, the auxiliary sensor 412 may be disposed within a chamber portion of the sensor holding unit 414, as shown in Figures 4A and 4B. The sensor holding unit 414 may also provide physical support for the upper sensor assembly 402. Additionally, the sensor holding unit 414 may have a central hollow portion through which cables or wires contacting the sensor 404 and the auxiliary sensor 412 may pass for connection to a power supply unit and / or a control unit (not shown).

[0066] As can be seen in Figures 4A and 4B, in some implementations, the outer surface of the sensor holding unit 414 (i.e., the surface facing the inner side of the sliding ramp 408) may also have a set of threads, the size and shape of which may match the threads of the sliding ramp 408. Threads along the inner surface of the sliding ramp 408 and along the outer surface of the sensor holding unit 414 allow for a better seal between the sensor holding unit 414 and the sliding ramp 408, thereby preventing liquids, food, or environmental contaminants from entering the sensor kit 402 and / or auxiliary sensor 412. An O-ring or other sealing mechanism may also be included between the sliding ramp 408 and the sensor cap 406.

[0067] In some implementations, the partition assembly may be configured to allow free movement of the temperature sensor kit and the sliding ramp 408 while protecting internal components from liquids, food, or environmental contaminants. In short, the resilient partition described herein may be a silicon resilient partition that provides a waterproof seal between the movable sensor kit and the static glass or ceramic cooktop.As shown in Figures 4A and 4B, the partition assembly may include an upper collar 420, a lower collar 422, an O-ring 424, and a resilient partition 410, as well as other components. In some implementations, the upper collar 420, lower collar 422, O-ring 424, and resilient partition 410 may have a circular shape, similar to some other components included in TSSY 310.

[0068] As shown in Figures 4A and 4B, the resilient partition 410 may have a vertically aligned edge portion molded to match the inner surface of the upper collar 420. The aligned edge portion may be securely attached to the inner surface of the upper collar 420, for example, by using an adhesive or by overmolding two separate materials. The unfolded portion of the resilient partition 410 may not be flattened, but rather molded with a wavy shape, as seen in Figures 4A and 4B. The wavy shape of the partition 410 may provide more space for extension and thus provide flexibility to allow the sensor kit 402 and the sliding ramp 408 to move freely in the vertical direction. Additionally, the wavy recessed portion of the partition 410 can also contain small amounts of liquid, food, or environmental contaminants encountered during cooking.

[0069] In some implementations, the resilient partition 410 can be configured to seal the moving sensor assembly, allowing the seal to be removed during maintenance. This allows the system to remain waterproof while still being cleanable, and allows for maintenance of internal components without damaging the temperature sensor subsystem.

[0070] The O-ring 424 can be disposed along a recess formed in the upper portion of the outer surface of the upper collar 420. Below the recess, the outer surface of the upper collar 420 may also include a set of threads that can mate with a set of threads formed along the inner surface of the lower collar 422, as seen in Figures 4A and 4B. The upper collar 420 and the lower collar 422 can form a collar assembly due to the mating of the threads therebetween. O-ring 424 can also seal the collar assembly to glass 426, thus preventing liquids, food, or environmental contaminants from entering the cooktop.

[0071] As described elsewhere herein, the temperature sensor subsystem 310 disclosed herein also includes a plunger 430 for holding sensor kit 402 and auxiliary sensor 412. Sensor kit 402 and auxiliary sensor 412 can be attached to plunger 430 via compliant bumper 432. As can be seen in Figures 4A and 4B, compliant bumper 432 has a top, neck, and bottom. The top may have a flat surface that provides support for sensor holding unit 414. The shape of the bottom may match the top circular hollow portion of plunger 430. compliant bumper 432 may also include a central hollow portion to allow wires or cables of the sensor to pass through. compliant bumper 432 may allow sensor kit 402 to self-align to the bottom surface of the cookware. The specific structure of plunger 430 is further described in Figure 5.

[0072] FIG. 5 shows an exploded view of a plunger assembly according to one implementation. As shown, the plunger assembly includes a plunger 430, a plunger support 442, and a spring 434 disposed between the plunger 430 and the plunger support 442. The temperature sensor subsystem also includes a support base 440 that can be molded monolithically with the plunger support 442. The plunger 430 may include an inner pillar portion and an outer cap portion disposed on one side (e.g., the top). When assembled, at least a portion (e.g., the top) of the spring 434 can be held between the inner portion and the outer cap portion of the plunger 430. Along the bottom edge of the cap portion of the plunger 430, there are a plurality of outwardly extending protrusions 446, as shown in FIG. 5. When assembled, these protrusions 446 can pass through openings or slits 444 disposed along the side surface of the plunger support 442. The opening 444 of the plunger support 442 provides constraints on the minimum and maximum vertical stroke of the plunger, as the protrusion 446 may be blocked by the top edge of the opening 444 once assembled. The driving force for moving the plunger 430 vertically may include an upward thrust from the spring 434 and a downward thrust when the cookware is loaded onto the stove element.

[0073] It should be noted that the number of protrusions 446 and openings 444 is not limited to the three shown in FIG. 5, but may be another different number. The shape and size of the openings may also be varied, and there is no limitation on this in this disclosure.

[0074] It should also be noted that in some implementations, the plunger assembly may be immovable. In this case, it is not necessary to include a spring in the plunger assembly, and certain further structural modifications can be made to the plunger support and the plunger itself due to the exclusion of the spring controlling the movement. In addition, when the plunger assembly is immovable, the top surface of the temperature sensor subsystem may not necessarily be above the stove when no cookware is placed above the stove element. This can be achieved by configuring partitions with different shapes and making other possible changes to the components included in the partition assembly and / or other components included in the temperature sensor subsystem disclosed herein. For example, a compliant bumper may not necessarily be included in the disclosed temperature sensor subsystem.

[0075] In some implementations, the temperature sensor subsystem 310 disclosed herein may also include a photoelectric sensor 450, as shown in Figures 4A, 4B, and 6. The photoelectric sensor 450 may be an encapsulated reflective sensor that transmits and receives signals. In some implementations, the photoelectric sensor 450 may be configured to determine a calibration position in the vertical direction in order to determine the minimum mass of the cookware allowed by the temperature sensor subsystem. In some implementations, the photoelectric sensor 450 may be mounted on a support base 440, as shown in Figures 4A, 4B, and 6.

[0076] In some implementations, the support base 440 may also be mounted to the coil support (also referred to as a "coil holder") of the induction cooker.

[0077] Assembly Process

[0078] In some implementations, when assembling the different components of the temperature sensor subsystem, the partition 410 can be mounted to the glass using threaded clamping collars 420 and 422 and O-rings 424 or room temperature vulcanized silicone rubber (which can be dispensed with a syringe). The packaged temperature sensor subsystem can then be mounted to the coil holder included in the induction cooker. The glass and the mounted partition can be mounted from above.

[0079] Electronic Devices

[0080] FIG7 illustrates an example electronic device for a temperature sensor subsystem (TSSY) according to one implementation. As shown in the specification on pages 7 / 9 of CN 120937497 A, the sensor kit 402 and photoelectric sensor 450 included in the temperature sensor subsystem can be connected to a printed circuit board assembly (PCBA), which can be further connected to the control hardware and software of the induction cooker 300. The control hardware and software of the induction cooker 300 can be configured to control temperature sensing and the heating process during actual cooking. In one example, the control hardware and software of the induction cooker 300 can modulate the supplied power to maintain the temperature at the setpoint as described above.

[0081] In some implementations, the sensor kit 402 and the photoelectric sensor 450 may use different numbers of channels when electrically connected to the same PCBA. In some implementations, the sensor kit 402 and the photoelectric sensor 450 may be electrically connected to different PCBAs. This disclosure does not limit the manner in which the sensor kit 402, the auxiliary sensor 412, and the photoelectric sensor 450 are electrically connected to the control hardware and software of the induction cooker 300.

[0082] In some implementations, the electronics of the disclosed temperature sensor subsystem may be configured to have a communication unit, which includes a wireless communication unit that allows wireless control of the disclosed temperature sensor subsystem. For example, a user can wirelessly configure the setpoint temperature, adjust the power level, etc., for the disclosed temperature sensor subsystem via an application installed on a mobile device.

[0083] Basic Characteristics of the Temperature Sensor

[0084] As previously described, the temperature sensor subsystem disclosed herein can provide accurate and precise temperature measurements for any container with a very high heating rate (e.g., greater than 4 degrees Celsius per second) and a very low (e.g., sub-second) hysteresis. Therefore, when configuring the temperature sensor, the selected sensor can be configured to have the smallest possible heat capacity, resulting in the fastest possible response time to changes in cooker temperature / power input. The temperature sensor can also be configured to be iron-free and therefore have little or no interaction with the coil magnetic field. Protection or magnetic field shaping can be used to minimize the effects of self-heating when components in the temperature sensing system may self-heat due to the magnetic field generated by the main coil. Additionally, the temperature sensor is configured to have good thermal contact with the cooker.

[0085] Additional Considerations

[0086] In some implementations, the disclosed temperature sensor system can be further improved by miniaturization, circular design, resizing, iron-free design, etc. For example, the disclosed temperature sensor system can be made as small as possible and has a circular profile with a centerline, as shown in Figures 3 to 6. Additionally, the power density and wiring size can be adjusted according to power requirements. To be iron-free, the temperature sensor subsystem disclosed herein can use a T-type thermocouple, an iron-free RTD, or other similar temperature detection solutions.

[0087] The construction and arrangement of the components of the device shown in the exemplary embodiments are illustrative only. While only some embodiments are described in detail in this disclosure, those skilled in the art will readily appreciate that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions, parameter values, mounting arrangements, materials used, colors, orientations, etc.) without substantially departing from the novelty and advantages of the enumerated subject matter.

[0088] Furthermore, elements shown as integrally formed may be composed of multiple parts, or elements shown as multiple parts may be integrally formed; the operation of the assembly may be reversed or otherwise altered; the structure of the system and / or the length or width of components or connectors or other elements may be changed; the nature or number of adjustment or attachment positions provided between elements may be changed. It should be noted that the elements and / or assemblies of the system may be constructed of any of a variety of materials that provide sufficient strength or durability. Therefore, all such modifications are intended to be included within the scope of this disclosure. Other substitutions, modifications, alterations, and omissions may be made in the design, operating conditions, and arrangement of exemplary embodiments without departing from the spirit of the subject matter.

[0089] The features and functions of the various embodiments may be arranged in various combinations and arrangements, and all of these are considered to be within the scope of the disclosed invention. Therefore, the described embodiments should be considered to be illustrative in all respects and not restrictive. Furthermore, the configurations, materials, and dimensions described herein are for illustrative purposes only and are not intended to limit in any way. Similar to page 8 / 9 of the specification, CN 120937497 A, although a physical explanation has been provided for explanatory purposes, it is not intended to be bound by any particular theory or mechanism, or to limit the claims under it.

[0090] It should also be understood that, as used herein and throughout the claims, the meanings of “a,” “an,” and “the” include plural references unless the context clearly specifies otherwise. Moreover, as used herein and throughout the claims, the meaning of “in” includes both “in” and “on” unless the context clearly specifies otherwise.Finally, as described herein and throughout the following claims, the meanings of “and” and “or” include connection and separation, and they may be used interchangeably unless the context clearly specifies otherwise; the phrase “exclusive or” may be used to indicate a situation where only the meaning of separation applies.

[0091] Each numerical value presented herein (e.g., in a table, chart, or graph) is considered to represent a minimum or maximum value within a corresponding parameter range. Therefore, when added to the claims, the numerical value provides explicit support for the scope of the claim, which may be higher or lower than the numerical value in accordance with the teachings herein. Unless included in the claims, each numerical value presented herein should not be considered a limitation in any aspect.

[0092] The terms and expressions used herein are used as descriptive rather than limiting terms and expressions, and in using such terms and expressions, no equivalents of the features shown and described or portions thereof are intended to be excluded. Furthermore, while certain embodiments of the invention have been described, it will be apparent to those skilled in the art that other embodiments can be used in conjunction with the concepts disclosed herein without departing from the spirit and scope of the invention. Instruction manual, page 9 / 9, 12 CN 120937497 A, Figure 1, Figure 2; Instruction manual, Figure 1 / 7, page 13 CN 120937497 A, Figure 3; Instruction manual, Figure 2 / 7, page 14 CN 120937497 A, Figure 4A; Instruction manual, Figure 3 / 7, page 15 CN 120937497 A, Figure 4B; Instruction manual, Figure 4 / 7, page 16 CN 120937497 A, Figure 5; Instruction manual, Figure 5 / 7, page 17 CN 120937497 A, Figure 6; Instruction manual, Figure 6 / 7, page 18 CN 120937497 A, Figure 7; Instruction manual, Figure 7 / 7, page 19 CN 120937497 A.

Claims

1. A temperature sensing device for an induction cooker, comprising: A sensor kit, comprising one or more sensors; A plunger assembly configured to hold the sensor kit; as well as A support base is configured to provide physical support for the plunger assembly.

2. The temperature sensing device of claim 1, wherein the plunger assembly includes a movable plunger, a fixed plunger support, and a spring disposed between the plunger and the plunger support.

3. The temperature sensing device of claim 1, wherein the one or more sensors include at least one self-heating flux sensor.

4. The temperature sensing device of claim 1, further comprising one or more auxiliary sensors disposed between the sensor kit and the plunger assembly.

5. The temperature sensing device as claimed in claim 4, wherein the one or more auxiliary sensors are disposed within the cavity of the sensor holding unit.

6. The temperature sensing device of claim 5, further comprising a compliant anti-collision device disposed between the sensor holding unit and the plunger assembly.

7. The temperature sensing device of claim 6, wherein each of the sensor holding unit, the compliant anti-collision device, and the plunger assembly has a central hollow portion that allows one or more cables or wires to pass through.

8. The temperature sensing device of claim 2, wherein the plunger has an inner pillar portion and an outer cap portion disposed on the top side of the plunger.

9. The temperature sensing device of claim 8, wherein when the plunger assembly is assembled, at least a portion of the spring is held between the inner post portion and the outer cap portion of the plunger.

10. The temperature sensing device of claim 9, wherein the outer cap portion of the plunger includes a set of protrusions disposed along the lower edge of the cap portion.

11. The temperature sensing device of claim 10, wherein the plunger support includes a corresponding set of openings disposed on the side surface of the plunger support.

12. The temperature sensing device of claim 11, wherein the protrusion passes through an opening provided on the side surface of the plunger support and is restricted to move within the opening in a predefined direction.

13. The temperature sensing device of claim 5, further comprising a sliding ramp for holding the sensor kit and the sensor holding unit together by circularly enclosing the sensor kit and the sensor holding unit.

14. The temperature sensing device of claim 13, wherein the sliding ramp has a conical shape at the top portion of the sliding ramp.

15. The temperature sensing device of claim 13, further comprising a sensor cap for covering the one or more sensors, wherein a side portion of the sensor cap is disposed between the sensor holding unit and the sliding ramp.

16. The temperature sensing device of claim 15, wherein the sensor cap comprises an iron-free sheet.

17. The temperature sensing device of claim 13, further comprising a partition assembly for attaching the sensor kit and the plunger assembly to the cooktop of the induction cooker.

18. The temperature sensing device of claim 17, wherein the partition assembly includes an upper collar, a lower collar, an O-ring, and an elastic partition.

19. The temperature sensing device of claim 18, wherein the partition includes an upper edge portion extending into a recess located on the lower edge of the sliding ramp.

20. A method for assembling a temperature sensing device, the temperature sensing device including a temperature sensor subsystem, the temperature sensor subsystem including a sensor kit, a sensor holding unit, a compliant anti-collision device, a plunger assembly, and a support base, and the method comprising: Attach the plunger assembly to the support base; The flexible top hollow portion of the anti-collision device is disposed inside the plunger included in the plunger assembly; Position the sensor holding unit above the compliant bumper, and position the sensor kit above the sensor holding unit; and A sliding ramp is used to press down the sensor kit and the sensor holding unit.

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