Base material cleaning apparatus

Abstract

The purpose of the present disclosure is to provide a substrate cleaning device capable of shortening the cleaning time for removing an object to be removed adhering to a cleaning surface of a substrate. A substrate cleaning device (71) is provided with an internal converging nozzle (25) having a gas accommodating space (S25) therein. In the gas accommodating space (S25), a mist gas output port (15a) of the mist gas supply pipe (15) and an air gas output port (16a) of the air gas supply pipe (16) are disposed so as to face each other across a collision region (80), and a gas output surface (F25) of the internal confluence nozzle (25) is located below the collision region (80). The cleaning mist gas (MG1) and the air gas (AG1) collide in the collision region (80) and merge together, and a substrate supply gas (MG3) is obtained in the gas storage space (S25).

Description

(19) State Intellectual Property Office (12) Invention Patent Application (10) Application Publication Number (43) Application Publication Date (21) Application Number 202480065901.0 (22) Application Date 2024.10.04 (85) PCT International Application Entering National Phase Date 2026.04.14 (86) PCT International Application Application Data PCT / JP2024 / 035587 2024.10.04 (87) PCT International Application Publication Data WO2026 / 074702 JA 2026.04.09 (71) Applicant: TMEIC Corporation Address: Japan Applicant: Toyota Motor Corporation (72) Inventors: Hiramatsu Takahiro, Goto Kou, Mori Rentaro, Kuroda Keiji, Yanagimoto Hiroshi, Inaoka Hiroya, Inagaki Koji, Kondo Koji (74) Patent Agency: Yung-Hsin Patent & Trademark Agency Co., Ltd. 72002 Patent Attorney Liu Jie (51) Int.Cl. B08B 5 / 00 (2006.01) B08B 3 / 02 (2006.01) B08B 3 / 10 (2006.01) (54) Title of Invention Substrate Cleaning Apparatus (57) Abstract The object of this disclosure is to provide a substrate cleaning apparatus that can shorten the cleaning time for removing the material adhering to the cleaning surface of a substrate. The substrate cleaning apparatus (71) includes an internal confluence nozzle (25) having a gas containing space (S25) inside. In the gas containing space (S25), the mist gas outlet (15a) of the mist gas supply pipe (15) and the air gas outlet (16a) of the air gas supply pipe (16) are arranged opposite each other across a collision area (80), and the gas outlet surface (F25) of the internal confluence nozzle (25) is located below the collision area (80). Cleaning mist gas (MG1) and air gas (AG1) merge by colliding in the collision zone (80), and substrate supply gas (MG3) is obtained in the gas containing space (S25). Claims 2 pages Description 12 pages Drawings 10 pages CN 122161674 A 2026.06.05 CN 1 22 16 16 74 A 1. A substrate cleaning apparatus comprising: a mist gas supply unit for supplying cleaning mist gas containing cleaning liquid mist obtained by atomizing cleaning liquid for cleaning a cleaning surface of a substrate; an air gas supply unit for supplying air gas; and an internal merging nozzle having a gas containing space for containing the cleaning mist gas and the air gas, wherein when the cleaning mist gas and the air gas are supplied to the gas containing space, the air gas and the cleaning mist gas merge to generate substrate supply gas, and the substrate supply gas is output from an opening of a gas output surface facing the cleaning surface of the substrate.2. The substrate cleaning apparatus according to claim 1, wherein the mist gas supply unit includes a mist gas supply pipe extending from the outside of the internal confluence nozzle into the gas containing space and supplying the cleaning mist gas into the gas containing space; the air gas supply unit includes an air gas supply pipe extending from the outside of the internal confluence nozzle into the gas containing space and supplying the air gas into the gas containing space; the mist gas supply pipe outputs the cleaning mist gas from a mist gas outlet; the air gas supply pipe outputs the air gas from an air gas outlet; the mist gas outlet and the air gas outlet are arranged opposite each other across a collision area within the gas containing space; and the gas output surface is located below the collision area. 3. The substrate cleaning apparatus according to claim 1 or 2, wherein the gas output surface has at least three first-type ejection holes, each circular; the opening of the gas output surface includes the at least three first-type ejection holes; and the at least three first-type ejection holes are not on the same straight line when viewed from above. 4. The substrate cleaning apparatus according to claim 1 or 2, wherein the gas output surface is circular when viewed from above, the gas output surface has a plurality of second-type ejection holes, the plurality of second-type ejection holes are respectively slit-shaped with a predetermined direction as the long side direction, the opening of the gas output surface includes the plurality of second-type ejection holes, such that the predetermined direction of each of the plurality of second-type ejection holes is consistent with the radial direction from the center of the gas output surface, and the plurality of second-type ejection holes are arranged radially from the center of the gas output surface. 5. The substrate cleaning apparatus according to claim 1 or 2, wherein the gas output surface is circular when viewed from above, the gas output surface has a plurality of first-type ejection holes and a plurality of second-type ejection holes, the opening of the gas output surface includes the plurality of first-type ejection holes and the plurality of second-type ejection holes, the plurality of first-type ejection holes are respectively circular and are classified into different predetermined groups according to a predetermined number, the plurality of second-type ejection holes are respectively slit-shaped with a predetermined direction as the long side direction, so that the predetermined number of first-type ejection holes in each predetermined group are arranged on the same straight line from the center of the gas output surface along the radial direction when viewed from above, the plurality of first-type ejection holes are arranged radially from the center of the gas output surface in the predetermined group unit, so that the predetermined direction of each of the plurality of second-type ejection holes is consistent with the radial direction from the center of the gas output surface, the plurality of second-type ejection holes are arranged radially from the center of the gas output surface.Claims 1 / 2 Page 2 CN 122161674 A 6. The substrate cleaning apparatus according to claim 1 or 2, wherein the gas output surface is circular when viewed from above, the gas output surface has a plurality of third-type ejection holes, the plurality of third-type ejection holes are respectively annular, the plurality of third-type ejection holes are of different sizes, the opening of the gas output surface includes the plurality of third-type ejection holes, and the plurality of third-type ejection holes are arranged such that the center of each of the plurality of third-type ejection holes coincides with the center of the gas output surface. 7. The substrate cleaning apparatus according to any one of claims 1 to 6, wherein the mist gas supply unit includes a mist gas supply control unit, which performs a mist gas effectiveness control process to control whether or not the cleaning mist gas is supplied to the internal confluence nozzle, and the air gas supply unit includes an air gas supply control unit, which performs an air gas effectiveness control process to control whether or not the air gas is supplied to the internal confluence nozzle. 8. The substrate cleaning apparatus according to any one of claims 1 to 7, wherein it further comprises a rotating mechanism that performs a rotating action to rotate the substrate along the rotation direction. Claims 2 / 2 Page 3 CN 122161674 A Substrate Cleaning Apparatus Technical Field

[0001] This disclosure relates to a substrate cleaning apparatus for cleaning substrates, for example to a substrate cleaning apparatus for cleaning substrates used in plating processes that form metal coatings in the manufacture of electronic components. Background Art

[0002] Conventional cleaning apparatuses for cleaning substrates used in plating processes that form metal coatings in the manufacture of electronic components include, for example, the closed-type cleaning apparatus disclosed in Patent Document 1, the substrate liquid treatment apparatus disclosed in Patent Document 2, the substrate cleaning apparatus disclosed in Patent Document 3, the cleaning apparatus disclosed in Patent Document 4, and the cleaning apparatus disclosed in Patent Document 5.

[0003] The cleaning apparatuses disclosed in Patent Documents 1 to 3 basically clean the object to be cleaned by directly spraying cleaning liquid onto the object to be cleaned. The cleaning apparatus disclosed in Patent Document 4 performs cleaning under a mist atmosphere. The cleaning apparatus disclosed in Patent Document 5 directly sprays cleaning liquid onto the object to be cleaned under a mist atmosphere.

[0004] FIG10 is an explanatory diagram schematically showing the structure of a conventional substrate cleaning apparatus 78. FIG10 shows an XYZ orthogonal coordinate system. Furthermore, the substrate cleaning apparatus 78, like the cleaning apparatus disclosed in Patent Document 5, utilizes a mist gas.

[0005] As shown in the figure, the ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained inside to generate a cleaning liquid mist MT. The carrier gas TG is supplied to the ultrasonic atomizer 11 via the carrier gas supply pipe 13.

[0006] Therefore, the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is transported by the carrier gas TG to become the cleaning mist gas MG9. This cleaning mist gas MG9 is supplied to the mist nozzle 61 via the mist supply pipe 62. In this way, the cleaning mist gas MG9 containing the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is supplied to the mist nozzle 61 via the mist supply pipe 62.

[0007] The mist nozzle 61 is disposed above the conveying path of the substrate 1 along the substrate conveying direction T1, and the mist nozzle 61 supplies the cleaning mist gas MG9 downward from a mist spray outlet (not shown) provided on the bottom surface, for example, in the form of a slit.

[0008] Therefore, by supplying the cleaning mist gas MG9 containing the cleaning liquid mist MT to the surface 1s of the substrate 1, which becomes the cleaning surface, the substances to be removed or decomposed on the surface 1s of the substrate 1 are removed or decomposed, and as a result, the substances to be removed that are the objects to be cleaned are cleaned.

[0009] Prior Art Documents Patent Documents Patent Document 1: Japanese Unexamined Patent Publication No. 11-76962 Patent Document 2: International Publication No. 2018 / 501665 Patent Document 3: Japanese Unexamined Patent Publication No. 2009-136742 Patent Document 4: Japanese Unexamined Patent Publication No. 2020-18993 Patent Document 5: Japanese Unexamined Patent Publication No. 2007-33730 Summary of the Invention

[0010] Problems to be Solved by the Invention Conventional substrate cleaning apparatus 78 supplies cleaning mist gas MG9 locally from mist nozzle 61 toward the surface 1 of substrate 1 in a certain direction. In FIG10, the case where the supply direction of cleaning mist gas MG9 is the -Z direction is shown. Instruction manual, page 1 / 12, CN 122161674 A

[0011] On the other hand, in the conventional substrate cleaning apparatus 78, as shown in FIG10, the substrate 1 to be cleaned is conveyed along the substrate conveying direction T1 (X direction) orthogonal to the supply direction (-Z direction) of the cleaning mist gas MG9.

[0012] Therefore, there is a first problem: the supply area of ​​the cleaning mist gas MG9 relative to the surface 1s of the substrate 1 is narrowed, and the cleaning time for removing the material adhering to the entire surface 1s of the substrate 1 is relatively long.

[0013] Furthermore, as shown in FIG10, consider the case where a plurality of uneven regions 18 are provided on the surface 1s of the substrate 1. The plurality of uneven regions 18 are each composed of a combination of a recess 1a and a protrusion 1b, and are formed by extending along the Y direction. The plurality of uneven regions 18 are provided along the X direction. That is, the formation direction of each of the plurality of uneven regions 18, i.e. the uneven formation direction D18, is the Y direction, and the arrangement direction of the plurality of uneven regions 18 is the X direction.

[0014] When cleaning a substrate 1 having multiple uneven regions 18 on its surface 1s using a substrate cleaning apparatus 78, the multiple uneven regions 18 become obstacles, resulting in a relatively high possibility that cleaning mist gas MG9 cannot be supplied to the entire surface 1s of the substrate 1 that serves as the cleaning surface. In particular, as shown in FIG10, this possibility increases if the unevenness formation direction D18 of each of the multiple uneven regions 18 is orthogonal to the substrate transport direction T1 of the substrate 1.

[0015] Thus, in conventional substrate cleaning apparatuses 78 that supply cleaning mist gas MG9 to the surface 1s of the substrate 1 serving as the cleaning surface from one direction, there is also a second problem: the material adhering to the surface 1s of the substrate 1 cannot be cleaned and removed completely.

[0016] The object of the present invention is to provide a substrate cleaning apparatus that can solve at least the first problem of the first and second problems described above, and shorten the cleaning time for removing the material adhering to the cleaning surface of the substrate.

[0017] Means for Solving the Problem The substrate cleaning apparatus of this disclosure includes: a mist gas supply unit for supplying a cleaning mist gas containing a cleaning liquid mist obtained by atomizing a cleaning liquid for cleaning the cleaning surface of a substrate; an air gas supply unit for supplying air gas; and an internal confluence nozzle having a gas receiving space for receiving the cleaning mist gas and the air gas, wherein when the cleaning mist gas and the air gas are supplied to the gas receiving space, the air gas and the cleaning mist gas are confluenced to generate a substrate supply gas, and the substrate supply gas is output from an opening of a gas output surface facing the cleaning surface of the substrate.

[0018] Effects of the Invention The internal confluence nozzle of the substrate cleaning apparatus of this disclosure can supply substrate supply gas to a relatively wide area facing the cleaning surface of the substrate by outputting substrate supply gas from an opening of a gas output surface facing the cleaning surface of the substrate.

[0019] As a result, the substrate cleaning apparatus of this disclosure can shorten the cleaning time for removing the residue adhering to the cleaning surface of the substrate.

[0020] The objects, features, aspects, and advantages of this disclosure will become clearer from the following detailed description and accompanying drawings. Brief Description of the Drawings

[0021] FIG1 is an explanatory diagram schematically showing the structure of the substrate cleaning apparatus of Embodiment 1.

[0022] FIG2 is an explanatory diagram schematically showing the cross-sectional structure of the gas containing space in the internal confluence nozzle shown in FIG1. ​​

[0023] FIG3 is an explanatory diagram schematically showing the basic configuration of the substrate cleaning apparatus of Embodiment 1.

[0024] FIG4 is a cross-sectional view schematically showing the configuration of the rotating mechanism.

[0025] FIG5 is an explanatory diagram showing the planar configuration of the spray plate of the first configuration.Instruction Manual 2 / 12 Page 5 CN 122161674 A

[0026] FIG6 is an explanatory diagram showing the planar structure of the spray plate of the second form.

[0027] FIG7 is an explanatory diagram showing the planar structure of the spray plate of the third form.

[0028] FIG8 is an explanatory diagram showing the planar structure of the spray plate of the fourth form.

[0029] FIG9 is an explanatory diagram schematically showing the structure of the substrate cleaning apparatus of Embodiment 2.

[0030] FIG10 is an explanatory diagram schematically showing the structure of a conventional substrate cleaning apparatus. Detailed Embodiments

[0031] <Embodiment 1> FIG1 is an explanatory diagram schematically showing the structure of the substrate cleaning apparatus 71 of Embodiment 1 of the present disclosure. An XYZ orthogonal coordinate system is shown in FIG1. ​​

[0032] As shown in the figure, the substrate cleaning apparatus 71 of Embodiment 1 includes a mist gas supply unit, an air gas supply unit, and a rotating mechanism 30 (not shown in FIG1) as main components.

[0033] The mist gas supply unit includes an ultrasonic atomizer 11, a carrier gas supply pipe 13, and a mist gas supply pipe 15 as its main components, and the air gas supply unit includes an air gas supply pipe 16.

[0034] The ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained inside to generate a cleaning liquid mist MT. The carrier gas TG is supplied to the ultrasonic atomizer 11 via the carrier gas supply pipe 13.

[0035] Therefore, the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is transported by the carrier gas TG to become a cleaning mist gas MG1. This cleaning mist gas MG1 is supplied to the internal confluence nozzle 25 via the mist gas supply pipe 15. The mist gas supply pipe 15 is configured to extend from the outside of the internal confluence nozzle 25 through the upper surface of the internal confluence nozzle 25 and into the gas containing space S25 described later.

[0036] Thus, the cleaning mist gas MG1, which includes the cleaning liquid mist MT generated within the ultrasonic atomizer 11, is supplied to the gas containing space S25 of the internal confluence nozzle 25 via the mist gas supply pipe 15.

[0037] The air gas supply pipe 16 is configured to extend from the outside of the internal confluence nozzle 25 through the upper surface of the internal confluence nozzle 25 into the gas containing space S25. Therefore, the air gas AG1 is supplied to the gas containing space S25 of the internal confluence nozzle 25 via the air gas supply pipe 16.

[0038] FIG2 is an explanatory diagram schematically showing the cross-sectional structure of the internal space of the internal confluence nozzle 25, i.e., the gas containing space S25. The XYZ orthogonal coordinate system is shown in this figure.

[0039] The internal confluence nozzle 25 has a cylindrical structure and has a gas containing space S25 inside.As shown in Figure 2, the mist gas supply pipe 15 is configured to penetrate the upper surface of the internal confluence nozzle 25 from the outside and extend into the gas containing space S25, supplying cleaning mist gas MG1 into the gas containing space S25. The mist gas supply pipe 15 extends in the -Z direction within the gas containing space S25 and bends at the midpoint, with its front end extending in the +X direction.

[0040] On the other hand, the air gas supply pipe 16 penetrates the upper surface of the internal confluence nozzle 25 from the outside and extends into the gas containing space S25, supplying air gas AG1 into the gas containing space S25. The air gas supply pipe 16 extends in the -Z direction within the gas containing space S25 and bends at the midpoint, with its front end extending in the -X direction.

[0041] The mist gas supply pipe 15 outputs cleaning mist gas MG1 from the mist gas outlet 15a along the +X direction, and the air gas supply pipe 16 outputs air gas AG1 from the air gas outlet 16a along the -X direction.

[0042] The mist gas outlet 15a and the air gas outlet 16a are arranged opposite each other across the collision area 80 in the gas containing space S25, and the gas outlet surface F25, which is the bottom surface of the internal confluence nozzle 25, is located below the collision area 80.

[0043] Therefore, when cleaning mist gas MG1 is supplied to the gas containing space S25 via the mist gas supply pipe 15 and air gas AG1 is supplied to the gas containing space S25 via the air gas supply pipe 16 on page 3 / 12 of the specification, the cleaning mist gas MG1 and the air gas AG1 collide in the collision area 80 and merge to obtain a substrate supply gas MG3, which is a mixture of cleaning mist gas MG1 and air gas AG1.

[0044] Furthermore, the distances between the mist gas outlet 15a and the collision zone 80, the distances between the air gas outlet 16a and the collision zone 80, the flow rate VA1 of the air gas AG1, and the flow rate VM1 of the cleaning mist gas MG1 are set such that the cleaning mist gas MG1 and the air gas AG1 will inevitably collide in the collision zone 80. In addition, the flow rate VM1 of the cleaning mist gas MG1 is determined by the flow rate of the carrier gas TG.

[0045] The substrate supply gas MG3 diffuses downward from the collision zone 80 along the diffusion direction DR3 and is supplied from the opening provided on the gas outlet surface F25 (not shown in FIG. 2) toward the surface 1s of the substrate 1 below.

[0046] Thus, the internal confluence nozzle 25 in the substrate cleaning apparatus 71 of Embodiment 1 has a gas containing space S25 for containing cleaning mist gas MG1 and air gas AG1. When the cleaning mist gas MG1 and air gas AG1 are supplied into the gas containing space S25, the air gas AG1 and the cleaning mist gas MG1 are combined to generate substrate supply gas MG3.Furthermore, the internal confluence nozzle 25 outputs substrate supply gas MG3 from the opening of the gas output surface F25, which is opposite to the surface 1s of the substrate 1 that serves as the cleaning surface.

[0047] Therefore, the substrate supply gas MG3 diffused within the gas containing space S25 of the internal confluence nozzle 25 can be output from the opening of the gas output surface F25 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0048] For example, by setting the shape of the opening of the gas output surface F25 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0049] FIG3 is an explanatory diagram schematically showing the basic configuration of the substrate cleaning apparatus 71 of Embodiment 1, which includes the internal confluence nozzle 25 with a spray plate 40. The XYZ orthogonal coordinate system is shown in the figure.

[0050] As shown in the figure, the internal confluence nozzle 25 has a spray plate 40 as the gas output surface F25, and a plurality of spray holes 50 are provided on the spray plate 40 as openings. The plurality of circular nozzles 50 and the spray plate 40 are arranged discretely to each other.

[0051] Therefore, the basic form of the substrate cleaning apparatus 71 of Embodiment 1 can output the substrate supply gas MG3 diffused in the gas containing space S25 of the internal confluence nozzle 25 from the plurality of nozzles 50 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0052] For example, by setting the shape of the plurality of nozzles 50 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1. In addition, the shape of the plurality of nozzles 50 is approximately circular, with the line connecting a predetermined number of nozzles 50 present on the outermost periphery of the plurality of nozzles 50 as a circle.

[0053] The substrate 1 is rotated along the rotation direction R1 or the rotation direction R2 by the rotation operation of the rotation mechanism 30 described later. The surface 1s of the substrate 1 becomes the cleaning surface. The rotation direction R1 is the first rotation direction, and the rotation direction R2 is the second rotation direction opposite to the rotation direction R1.

[0054] FIG4 is a cross-sectional view schematically showing the structure of a rotating mechanism 30 that rotates the substrate 1 along a rotation direction R1 or a rotation direction R2. An XYZ orthogonal coordinate system is shown in this figure.

[0055] As shown in the figure, the rotating mechanism 30 includes a mounting table 31, a plurality of vibration-absorbing components 32, a rotating table 33, a vibration motor 34, a rotation motor 35, and a motor control unit 36 ​​as its main components. The plurality of vibration-absorbing components 32 are preferably arranged at equal intervals in the relatively outer regions of the substrate mounting portion 31a and the support surface 33a, respectively. Furthermore, in FIG4, two vibration-absorbing components 32 are shown as a plurality of vibration-absorbing components 32.

[0056] The mounting table 31 has a substrate mounting portion 31a and a vibration transmission portion 31b. The substrate mounting portion 31a has a surface for supporting the substrate 1 from the back side of the substrate 1 on page 4 / 12 of the specification (CN 122161674 A). The vibration transmission portion 31b extends downward from the center of the back side of the substrate mounting portion 31a. The mounting table 31 supports the substrate 1 stably from the back side on the surface of the substrate mounting portion 31a.

[0057] The rotary table 33 has a support surface 33a, a motor housing portion 33b, and a rotation shaft component 33c. The motor housing portion 33b houses the vibration motor 34 and most of the vibration transmission portion 31b. The rotation shaft component 33c is provided at the bottom of the vibration transmission portion 31b. The rotary table 33 is configured to rotate about the rotation shaft component 33c as the rotation axis.

[0058] A vibration motor 34 is connected to the lower part of the vibration transmission unit 31b and performs a table vibration operation that imparts vibration to the substrate mounting part 31a and the substrate 1 via the vibration transmission unit 31b.

[0059] The substrate mounting part 31a of the mounting table 31 is connected to the support surface 33a of the rotary table 33 via a plurality of vibration absorbing members 32. The plurality of vibration absorbing members 32 connect the mounting table 31 and the vibration absorbing members 32 in a manner that allows them to rotate relative to each other, and have a vibration absorption function. For example, a spring or other spring member can be considered as a vibration absorbing member 32.

[0060] A rotary motor 35 is provided below the rotary table 33 and connected to the rotary shaft member 33c, and performs a table rotation operation that rotates the rotary table 33 with the rotary shaft member 33c as the rotation center.

[0061] A motor control unit 36 ​​controls the table rotation operation based on the rotary motor 35. If the rotary motor 35 performs a table rotation operation under the control of the motor control unit 36, the rotary table 33 rotates, and the mounting table 31, which is connected to the rotary table 33 via multiple vibration absorption members 32, rotates in conjunction with the rotation of the rotary table 33 while the substrate 1 is mounted.

[0062] Thus, when the table rotation operation is performed, the mounting table 31, which is connected to the rotary table 33 via multiple vibration absorption members 32, rotates while the substrate 1 is mounted.

[0063] As shown in Figures 1 and 3, the rotation direction of the substrate 1 includes rotation directions R1 and R2 that are opposite to each other. Rotation directions R1 and R2 are the first and second rotation directions.

[0064] The motor control unit 36, which functions as a motor rotation control unit, performs the table rotation operation. The table rotation operation includes rotation direction control processing and rotation speed control processing. The rotation direction control processing and rotation speed control processing are processes that can be performed during the execution of the table rotation operation.

[0065] The rotation direction control process is the process of switching the rotation direction between rotation directions R1 and R2.The rotation speed control process is the process of changing the rotation speed along the rotation direction (rotation direction R1 or rotation direction R2).

[0066] The vibration motor 34 performs a table vibration operation that imparts vibration to the substrate mounting part 31a via the vibration transmission part 31b. The motor control unit 36 ​​also functions as a motor vibration control unit that controls the table vibration operation based on the vibration motor 34.

[0067] The motor control unit 36, which also functions as a motor vibration control unit, controls the vibration motor 34 together with the rotation motor 35 so that the table vibration operation described above is performed in parallel with the table rotation operation. In addition, the table vibration operation includes a vibration frequency change process that changes the vibration frequency imparted to the substrate 1 per unit time.

[0068] In this way, the motor control unit 36 ​​serves as both a motor rotation control unit and a motor vibration control unit, controlling the execution of the table rotation operation based on the rotation motor 35 and the table vibration operation based on the vibration motor 34.

[0069] The substrate cleaning apparatus 71 with such a structure performs a substrate cleaning process on the surface 1s of the substrate 1, which is the object of cleaning, as follows.

[0070] The mist gas supply unit supplies cleaning mist gas MG1 from the mist gas supply pipe 15 to the internal confluence nozzle 25, and the air gas supply unit supplies air gas AG1 from the air gas supply pipe 16 to the internal confluence nozzle 25.

[0071] The internal confluence nozzle 25 merges air gas AG1 and cleaning mist gas MG1 in the gas containing space S25 to generate substrate supply gas MG3, and outputs substrate supply gas MG3 from a plurality of ejection holes 50 (openings) of the spray plate 40 (gas output surface specification 5 / 12 page 8 CN 122161674 AF25) which is opposite to the surface 1s of the substrate 1.

[0072] As a result, the substrate supply gas MG3 obtained by merging cleaning mist gas MG1 and air gas AG1 is supplied to the surface 1s of the substrate 1.

[0073] On the other hand, under the control of the motor control unit 36, which functions as a motor rotation control unit, the rotating mechanism 30 causes the rotating motor 35 to perform a table rotation operation, causing the substrate 1 to rotate in the rotation direction R1 or the rotation direction R2.

[0074] Thus, during the execution of the table rotation operation based on the rotating mechanism 30, the substrate supply gas MG3 obtained in the gas containment space S25 of the internal confluence nozzle 25 is supplied to the surface 1s of the substrate 1, which becomes the cleaning surface.

[0075] The motor control unit 36 ​​causes the rotating motor 35 to perform a table rotation operation that includes the above-described rotation direction control process and rotation speed control process.

[0076] For example, during the supply of substrate supply gas MG3 to the surface of substrate 1 for 1 second, the rotation direction of substrate 1 can be changed sequentially to rotation direction R1, rotation direction R2, rotation direction R1, and rotation direction R2, and the rotation speed can also be changed.

[0077] Furthermore, the rotation mechanism 30 can, under the control of the motor control unit 36 ​​which functions as a motor vibration control unit, cause the vibration motor 34 to perform a table vibration operation to apply vibration to substrate 1. Thus, the rotation mechanism 30 has a vibration function that applies vibration to substrate 1 in an indeterminate direction.

[0078] Therefore, the substrate cleaning apparatus 71 of this embodiment can perform the supply process of substrate supply gas MG3 to the surface of substrate 1 for 1 second, the table rotation operation, and the table vibration operation in parallel. Furthermore, the table rotation operation includes rotation direction control processing and rotation speed control processing, and the table vibration operation includes vibration frequency changing processing that changes the vibration frequency applied to substrate 1 per unit time.

[0079] Furthermore, the substrate mounting portion 31a of the mounting table 31 is connected to the support surface 33a of the rotary table 33 via multiple vibration absorption members 32. Each of the multiple vibration absorption members 32 has a vibration absorption function, so the vibration of the substrate mounting portion 31a based on the vibration of the table can be absorbed by the multiple vibration absorption members 32.

[0080] Therefore, by means of multiple vibration absorption members 32, the vibration transmission from the substrate mounting portion 31a of the mounting table 31 to the support surface 33a of the rotary table 33 is effectively suppressed, so the rotation of the table will not be affected by the vibration of the table.

[0081] (Effect) In the basic form of the substrate cleaning apparatus 71 of Embodiment 1, the internal confluence nozzle 25 outputs substrate supply gas MG3 from multiple ejection holes 50 (openings) of the spray plate 40 (gas output surface F25) which is opposite to the surface 1s of the substrate 1, which is the cleaning surface, and can supply substrate supply gas MG3 to a relatively wide area opposite to the surface 1s of the substrate 1.

[0082] As a result, the substrate cleaning apparatus 71 of Embodiment 1 can shorten the cleaning time for removing the residue adhering to the surface of the substrate 1 by 1 second.

[0083] In the substrate cleaning apparatus 71 of Embodiment 1, the mist gas outlet 15a of the mist gas supply pipe 15 and the air gas outlet 16a of the air gas supply pipe 16 are arranged opposite each other across the collision area 80 in the gas containing space S25.

[0084] Therefore, when cleaning mist gas MG1 and air gas AG1 are supplied to the gas containing space S25, the cleaning mist gas MG1 output from the mist gas outlet 15a and the air gas AG1 output from the air gas outlet 16a collide in the collision area 80 and merge, thereby obtaining substrate supply gas MG3.

[0085] The substrate supply gas MG3 diffuses towards the direction described on page 6 / 12 of the specification, CN 122161674 A, while the cleaning mist gas MG1 and air gas AG1 are mixed.

[0086] Then, the substrate supply gas MG3, in a state where the cleaning mist gas MG1 and air gas AG1 are mixed and diffused, is supplied to the cleaning surface of the substrate 1, i.e., surface 1s, from the plurality of ejection holes 50 (openings) of the spray plate 40 (gas output surface F25) located below the collision area 80.

[0087] Therefore, when the substrate cleaning apparatus 71 of Embodiment 1 supplies the cleaning mist gas MG1 from the mist gas supply pipe 15, it is able to supply the substrate supply gas MG3 containing the cleaning mist gas MG1 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0088] Furthermore, the substrate cleaning apparatus 71 of Embodiment 1 rotates the substrate 1 by rotating the rotating mechanism 30. Therefore, even if there is an uneven area 18 on the surface 1s of the substrate 1, the fog dead zone area where the substrate supply gas MG3 is not supplied can be effectively suppressed, and the substrate supply gas MG3 can be supplied with high precision throughout the entire surface 1s.

[0089] As a result, the substrate cleaning apparatus 71 of Embodiment 1 can improve the cleaning efficiency of the removed material adhering to the surface 1s of the substrate 1.

[0090] (Form of the spray plate) (First form) FIG5 is an explanatory diagram showing the planar structure of the spray plate 41 of the first form. The XYZ orthogonal coordinate system is shown in the figure. The first form of the substrate cleaning apparatus 71 of Embodiment 1 has the spray plate 41 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0091] As shown in FIG5, the spray plate 41, which serves as the gas output surface F25, is circular in the XY plane. The spray plate 41 has a plurality of spray holes 51 as openings of the gas output surface F25. The plurality of spray holes 51 are each at least three first-type spray holes that are circular.

[0092] For example, the spray holes 51a to 51c in FIG5 are not on the same straight line on the spray plate 41. That is, the spray holes 51a to 51c are not on the same straight line when viewed from above.

[0093] Thus, the plurality of spray holes 51 include at least three first-type spray holes (e.g., spray holes 51a to 51c) that are not on the same straight line when viewed from above on the spray plate 41.

[0094] The first configuration of the substrate cleaning apparatus 71 of Embodiment 1 can supply substrate supply gas MG3 to the surface 1s of the substrate 1 by outputting substrate supply gas MG3 from the plurality of spray holes 51 including at least three first-type spray holes.

[0095] As a result, the first configuration of the substrate cleaning apparatus 71 of Embodiment 1 is able to supply substrate supply gas MG3 to a relatively wide area on the surface 1s of the substrate 1.

[0096] For example, by setting the shape of the plurality of ejection holes 51 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0097] Furthermore, in FIG5, the shape of the plurality of ejection holes 51 is such that the line connecting the plurality of ejection holes 50 present on the outermost periphery is approximately circular. In this case, the surface 1s of the substrate 1 is preferably circular.

[0098] (Second form) FIG6 is an explanatory diagram showing the planar structure of the spray plate 42 of the second form. The XYZ orthogonal coordinate system is shown in the figure. The second form of the substrate cleaning apparatus 71 of Embodiment 1 has the spray plate 42 as the gas output surface F25 of the internal confluence nozzle 25.

[0099] As shown in FIG6, the spray plate 42, which is the gas output surface F25, is circular in the XY plane. The spray plate 42 has a plurality of ejection holes 52 as openings of the gas output surface F25. The plurality of ejection holes 52 are each a slit-shaped second type of ejection hole in the longitudinal rectangular shape with a predetermined direction as the long side.

[0100] The plurality of ejection holes 52, which are the plurality of second type of ejection holes, are arranged in such a way that their respective predetermined directions (long side directions) are aligned with the radial direction starting from the center point C42 of the spray plate 42, and the plurality of ejection holes 52 are arranged radially from the center point C42 of the spray plate 42. Moreover, the plurality of ejection holes 52 are arranged equally along the circumferential direction centered on the center point C42. Figure 6 shows the state in which 8 ejection holes 52 are arranged radially at equal intervals along the circumferential direction.

[0101] In the second form of the substrate cleaning apparatus 71 of Embodiment 1, substrate supply gas MG3 is output to the surface 1s of the substrate 1 from the plurality of ejection holes 52, which are respectively slit-shaped and arranged radially.

[0102] Therefore, the second embodiment of the substrate cleaning apparatus 71 of Embodiment 1 can supply substrate supply gas MG3 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0103] For example, by setting the shape of the plurality of ejection holes 52 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0104] Furthermore, in FIG6, by arranging the plurality of ejection holes 52 at relatively close intervals, the shape of the plurality of ejection holes 52 becomes approximately circular with the center point C42 as the center. At this time, the surface 1s of the substrate 1 is preferably circular.

[0105] (Third Embodiment) FIG7 is an explanatory diagram showing the planar structure of the spray plate 43 of the third embodiment. The XYZ orthogonal coordinate system is shown in this figure. The third embodiment of the substrate cleaning apparatus 71 of Embodiment 1 has the spray plate 43 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0106] As shown in FIG. 7, the spray plate 43, which serves as the gas output surface F25, is circular in the XY plane. The spray plate 43 has a plurality of spray holes 51 and a plurality of spray holes 52 as openings of the gas output surface F25. The plurality of spray holes 51 are each circular first type of spray hole. The plurality of spray holes 52 are each slit-shaped second type of spray hole with a predetermined direction as the long side direction.

[0107] The plurality of spray holes 51, which serve as the plurality of first type of spray holes, are classified into different predetermined groups according to a predetermined number. In the configuration shown in FIG. 7, the plurality of spray holes 51 are classified into 8 groups (predetermined number of groups) in every "3" (predetermined number).

[0108] In a configuration where a predetermined number of nozzles 51 in each predetermined group are arranged in a straight line along the radial direction from the center point C43 of the spray plate 43 when viewed from above, the multiple nozzles 51 are arranged radially from the center point C43 in predetermined group units.

[0109] In the configuration shown in FIG7, in a configuration where three nozzles 51 existing in the same group are arranged in a straight line along the radial direction from the center point C43 when viewed from above, the nozzles are arranged equally radially in eight group units centered on the center point C43.

[0110] On the other hand, multiple nozzles 52 that are multiple second type nozzles are arranged radially from the center point C43 of the spray plate 43 in a configuration where their respective predetermined directions (long side directions) are aligned with the radial direction from the center point C43 of the spray plate 43. Moreover, the multiple nozzles 52 are arranged equally along the circumferential direction centered on the center point C42. FIG7 shows a state in which eight nozzles 52 are arranged at equal intervals in the circumferential direction.

[0111] Furthermore, as shown in FIG7, three of the multiple ejection holes 51 and one of the multiple ejection holes 52, which are classified into eight groups, are arranged alternately along the circumferential direction when viewed from above, and are located on the same straight line.

[0112] The third form of the substrate cleaning apparatus 71 of Embodiment 1 outputs substrate supply gas MG3 from the multiple ejection holes 51 and multiple ejection holes 52 arranged radially in a predetermined number of groups provided on the spray plate 43, and can output substrate supply gas MG3 from the multiple ejection holes 52 and multiple ejection holes 52 together to the surface 1s of the substrate 1.

[0113] As a result, the third form of the substrate cleaning apparatus 71 of Embodiment 1 can supply substrate supply gas MG3 to a wide area on the surface 1s of the substrate 1. (Comparative Specification 8 / 12 Page 11 CN 122161674 A)

[0114] For example, by setting the combined shape of the plurality of ejection holes 51 and the plurality of ejection holes 52 to the same shape as the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0115] Furthermore, in FIG7, the above-described combined shape becomes approximately circular with the center point C43 centered by arranging a plurality of ejection holes 51 and a plurality of ejection holes 52 at relatively close intervals. In this case, the surface 1s of the substrate 1 is preferably circular.

[0116] (Fourth form) FIG8 is an explanatory diagram showing the planar structure of the ejection plate 44 in the fourth form. The XYZ orthogonal coordinate system is shown in the figure. The fourth form of the substrate cleaning apparatus 71 of Embodiment 1 has an ejection plate 44 serving as the gas output surface F25 of the internal confluence nozzle 25.

[0117] As shown in FIG8, the ejection plate 44, which serves as the gas output surface F25, is circular in the XY plane. The ejection plate 44 has a plurality of ejection holes 53 serving as the openings of the gas output surface F25.

[0118] The plurality of ejection holes 53, which serve as a plurality of third type ejection holes, are each annular in shape, and the size (radius) of the plurality of ejection holes 53 is different among the plurality of ejection holes 53.

[0119] The plurality of ejector holes 53 are arranged such that the center of each of the plurality of ejector holes 53, which are multiple third-type ejector holes, coincides with the center point C44 of the spray plate 44. In the configuration shown in FIG8, the three ejector holes 53 are arranged without overlapping each other with the center point C44 as the center.

[0120] In the fourth form of the substrate cleaning apparatus 71 of Embodiment 1, the substrate supply gas MG3 is output to the surface 1s of the substrate 1 from the plurality of ejector holes 53, each of which is annular and arranged with their centers aligned.

[0121] As a result, the fourth form of the substrate cleaning apparatus 71 of Embodiment 1 can supply the substrate supply gas MG3 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0122] For example, by setting the shape of the plurality of ejector holes 53 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0123] Furthermore, in FIG8, by arranging a plurality of ejection holes 53 at relatively close intervals, the shape of the plurality of ejection holes 53 is approximately circular with the center point C44 as the center. At this time, the surface 1s of the substrate 1 is preferably circular.

[0124] <Embodiment 2> FIG9 is an explanatory diagram schematically showing the structure of the substrate cleaning apparatus 72 of Embodiment 2 of the present disclosure. An XYZ orthogonal coordinate system is shown in FIG9.

[0125] As shown in the figure, the substrate cleaning apparatus 72 of Embodiment 2 includes a mist gas supply unit, an air gas supply unit, and a rotating mechanism 30 (not shown) described later as main components.

[0126] The mist gas supply unit includes a flow regulator 5 as a main component in addition to the ultrasonic atomizer 11, the carrier gas supply pipe 13, and the mist gas supply pipe 15, and the air gas supply unit includes a flow regulator 6 as a main component in addition to the air gas supply pipe 16.

[0127] Hereinafter, the same reference numerals will be used to describe the same structure as the substrate cleaning apparatus 71 of Embodiment 1 shown in FIGS. 1 to 8, and descriptions will be omitted as appropriate. The description will focus on the features of the substrate cleaning apparatus 72 of Embodiment 2.

[0128] The ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained inside to generate a cleaning liquid mist MT. The carrier gas TG is supplied to the ultrasonic atomizer 11 via the flow regulator 5 and the carrier gas supply pipe 13.

[0129] The flow regulator 5, which functions as a mist gas supply control unit, has the function of adjusting the flow rate of the carrier gas TG within the range of "0" to a first maximum adjustment value (>0). Therefore, the flow rate of the carrier gas TG, i.e., the flow velocity VM1 of the cleaning mist gas MG1, is adjusted by the flow regulator 5. Instruction manual, pages 9 / 12, CN 122161674 A

[0130] The flow regulator 5, which is the mist gas supply control unit, can perform a mist gas effective control process to control whether or not the cleaning mist gas MG1 is supplied to the internal confluence nozzle 25 by adjusting the flow rate of the carrier gas TG to a meaningful flow rate other than "0". That is, when the flow rate is set to "0" by the flow regulator 5, the supply of cleaning mist gas MG1 to the internal confluence nozzle 25 is cut off, and when a meaningful flow rate other than "0" is set, the supply of cleaning mist gas MG1 to the internal confluence nozzle 25 is performed.

[0131] Therefore, when the flow regulator 5 sets the flow rate of the carrier gas TG to a meaningful flow rate other than "0", the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is transported by the carrier gas TG and becomes the cleaning mist gas MG1.

[0132] This cleaning mist gas MG1 is supplied to the gas containing space S25 of the internal confluence nozzle 25 via the mist gas supply pipe 15.

[0133] The flow regulator 6, which functions as an air supply control unit, has the function of adjusting the flow rate of air gas AG1 within the range of "0" to a second maximum flow rate value (>0). Therefore, the flow rate of air gas AG1, i.e., the flow velocity VA1 of air gas AG1, is adjusted by the flow regulator 6.

[0134] By adjusting the flow rate of air gas AG1 to a meaningful flow rate other than "0", the flow regulator 6, which functions as an air supply control unit, can perform an air gas efficiency control process that controls whether air gas AG1 is supplied to the internal confluence nozzle 25. That is, when the flow rate is set to "0" by the flow regulator 6, the supply of air gas AG1 to the internal confluence nozzle 25 is cut off, and when a meaningful flow rate other than "0" is set, the supply of air gas AG1 to the internal confluence nozzle 25 is performed.

[0135] Therefore, when the flow regulator 6 sets the flow rate of air gas AG1 to a meaningful flow rate that is not "0", air gas AG1 is supplied to the gas receiving space S25 of the internal confluence nozzle 25 via the air gas supply pipe 16.

[0136] In addition to the effects of the substrate cleaning device 71 based on Embodiment 1, the substrate cleaning device 72 of Embodiment 2 with this structure also has the following effects.

[0137] The substrate cleaning device 72 of Embodiment 2 can perform fog gas activation control processing based on the flow regulator 5, which is a fog gas supply control unit, and air gas activation control processing based on the flow regulator 6, which is an air gas supply control unit.

[0138] Therefore, through fog gas activation control processing and air gas activation control processing, the substrate supply gas MG3 generated in the gas receiving space S25 of the internal confluence nozzle 25 can be set to one of three gas types: a combination of cleaning fog gas and air gas, cleaning fog gas only, or air gas only.

[0139] Therefore, the substrate cleaning apparatus 72 of Embodiment 2 can supply any one of the following as substrate supply gas MG3 to the surface 1s of the substrate 1: a mixed gas obtained by combining cleaning mist gas MG1 and air gas AG1, cleaning mist gas MG1 alone, and air gas AG1 alone.

[0140] For example, when a chemical agent is applied to the surface 1s of the substrate 1, which is to be cleaned, and the coating on the surface 1s, which is the cleaning surface, is dissolved and removed by chemical reaction with the chemical agent, it is preferable to supply the substrate supply gas MG3, which is a gas of the cleaning mist gas MG1 alone, to the surface 1s of the substrate 1. Therefore, the supply of cleaning mist gas MG1 is set to be effective by the mist gas effective control process of the flow regulator 5, and the supply of air gas AG1 is set to be ineffective by the air gas effective control process of the flow regulator 6.

[0141] Furthermore, when removing oil, fine particulate matter, rust, etc., adhering to the surface 1s of the substrate 1, it is preferable to supply substrate supply gas MG3, which is a mixture of cleaning mist gas MG1 and air gas AG1, to the surface 1s of the substrate 1. Therefore, the supply of mist gas MG1 is set to be effective by the mist gas effective control process of the flow regulator 5, and the supply of air gas AG1 is set to be effective by the air gas effective control process of the flow regulator 6.

[0142] Furthermore, when performing the cleaning object drying process after cleaning the surface 1s of the substrate 1, it is preferable to supply substrate supply gas MG3, which is only an air gas AG1, to the surface 1s of the substrate 1.Therefore, the supply of cleaning mist gas MG1 is set to invalid by the mist gas effective control processing of the flow regulator 5, and the supply of air gas AG1 is set to valid by the air gas effective control processing of the flow regulator 6.

[0143] In this way, the substrate cleaning apparatus 72 of Embodiment 2 can select any one of the three gas types as the substrate supply gas MG3 output, so the substrate supply gas MG3 can be used separately according to the cleaning purpose.

[0144] When both the supply of cleaning mist gas MG1 based on the mist gas effective control processing and the supply of air gas AG1 based on the air gas effective control processing are set to valid, the substrate cleaning apparatus 72 of Embodiment 2 has the following additional effects.

[0145] That is, Embodiment 2 has the following additional effects: the flow rate VM1 of cleaning mist gas MG1 can be adjusted by the flow regulator 5, and the flow rate VA1 of air gas AG1 can be adjusted by the flow regulator 6, so that the substrate supply gas MG3 is output as a whole from the opening of the gas output surface F25.

[0146] Furthermore, as a first variation of the mist gas supply control unit, a first on / off valve may be used instead of the flow regulator 5. In the case of the first variation, by setting the first on / off valve to the "open" / "closed" state, a mist gas efficiency control process that controls whether or not the cleaning mist gas MG1 is supplied to the internal confluence nozzle 25 can be performed.

[0147] Similarly, as a second variation of the air gas supply control unit, a second on / off valve may be used instead of the flow regulator 6. In the case of the second variation, by setting the second on / off valve to the "open" / "closed" state, an air gas efficiency control process that controls whether or not the air gas AG1 is supplied to the internal confluence nozzle 25 can be performed.

[0148] <Other> In the above embodiment, an ultrasonic atomizer 11 that utilizes ultrasonic vibration is shown as the atomizer for generating the cleaning mist gas MG1, but other atomizers that generate the cleaning mist gas MG1 from the cleaning liquid by methods other than ultrasonic vibration may be used instead of the ultrasonic atomizer 11.

[0149] In the above embodiment, an internal confluence nozzle 25 with a cylindrical structure is shown, but the internal confluence nozzle may also be constructed from a conical structure with a circular bottom surface (gas output surface F25) and a hammer-shaped top surface, a prism structure with a polygonal top surface and bottom surface, or a pyramidal structure with a polygonal bottom surface and a hammer-shaped top surface. However, the following requirements for generating the substrate supply gas MG3 must be met.

[0150] Generation requirements: When cleaning mist gas MG1 and air gas AG1 are supplied together, the cleaning mist gas MG1 and air gas AG1 collide and merge within the gas containing space, and the substrate supply gas MG3, which is a mixture of cleaning mist gas MG1 and air gas AG1, diffuses downwards.

[0151] Furthermore, when the internal confluence nozzle is constructed from a conical structure and a pyramidal structure, the mist gas supply pipe 15 and the mist gas supply pipe 15 need to extend through the side of the internal confluence nozzle and be arranged within the gas containing space.

[0152] In addition, the spray plates 41 to 44 of the first to fourth forms shown in Figures 5 to 8 are respectively circular, but they can also be hemispherical or conical recessed three-dimensional structures. A hemispherical recessed three-dimensional structure refers to a hemispherical structure that is circular when viewed from above and whose center point is the uppermost point on the +Z direction side. A conical recessed structure refers to a conical structure that is circular when viewed from above and whose center point is the uppermost point on the +Z direction side.

[0153] Thus, instead of spray plates 41 to 44 that are actually circular, spray plates with a hemispherical three-dimensional structure or a conical three-dimensional structure that is recessed into a circle when viewed from above can be used. That is, the spray plate with a hemispherical concave three-dimensional structure (pages 11 / 12, CN 122161674 A) and the spray plate with a conical concave three-dimensional structure are circular when viewed from above, and have the same characteristics as spray plates 41 to 44.

[0154] In addition, in the above-described modified example, the shape is circular when viewed from above, but the shape can also be changed to a polygonal shape to form a pyramidal three-dimensional structure with a concave shape. A pyramidal concave three-dimensional structure refers to a pyramidal structure that is polygonal when viewed from above and whose center point is the uppermost point on the +Z direction side.

[0155] In addition, in the above embodiment, the substrate 1 is rotated by the rotating mechanism 30, but the substrate 1 to be cleaned can also be supplied with substrate supply gas MG3 from the internal confluence nozzle 25 while the substrate 1 is stationary.

[0156] Although the present disclosure has been described in detail, the above description is illustrative in all respects and the present disclosure is not limited thereto. It should be understood that numerous modifications not illustrated can be conceived without departing from the scope of the present disclosure.

[0157] Explanation of reference numerals 1 Substrate 11 Ultrasonic atomizer 13 Carrier gas supply piping 15 Mist gas supply piping 15a Mist gas outlet 16 Air gas supply piping 16a Air gas outlet 25 Internal confluence nozzle 30 Rotating mechanism 40-44 Spray plate 50-53 Spray hole F25 Gas output surface S25 Gas containment space Instruction manual 12 / 12 page 15 CN 122161674 A Figure 1 Instruction manual Figure 1 / 10 page 16 CN 122161674 A Figure 2 Instruction manual Figure 2 / 10 page 17 CN 122161674 A Figure 3 Instruction manual Figure 3 / 10 page 18 CN 122161674 A Figure 4 Instruction manual Figure 4 / 10 page 19 CN 122161674 A Figure 5 Instruction manual Figure 5 / 10 page 20 CN 122161674 A Figure 6 Figure 7 of the instruction manual, Figure 8 of the instruction manual, Figure 9 of the instruction manual, Figure 10 of the instruction manual, Figure 10 of the instruction manual, Figure 10 of the instruction manual, Figure 11 of the instruction manual, Figure 122161674 A, Page 21 of 6 / 10, CN 122161674 A, Page 22 of 6 / 10, CN 122161674 A, Page 25 of 6 / 10, CN 122161674 A.

Claims

1. A substrate cleaning device, comprising: The mist gas supply unit supplies cleaning mist gas, which includes cleaning liquid mist obtained by atomizing cleaning liquid, for cleaning the cleaning surface of the substrate. Air supply unit, supplying air; and The internal confluence nozzle has a gas containing space for containing the cleaning mist gas and the air gas. When the cleaning mist gas and the air gas are supplied into the gas containing space, the air gas and the cleaning mist gas are confluenced to generate a substrate supply gas. The substrate supply gas is output from the opening of the gas output surface facing the cleaning surface of the substrate.

2. The substrate cleaning apparatus according to claim 1, wherein, The mist gas supply unit includes a mist gas supply pipe that extends from the outside of the internal confluence nozzle into the gas receiving space, and supplies the cleaning mist gas into the gas receiving space. The air supply unit includes an air supply pipe that extends from the outside of the internal confluence nozzle into the gas receiving space and supplies air into the gas receiving space. The mist gas supply piping outputs the cleaning mist gas from the mist gas outlet. The air supply piping outputs the air from the air outlet. The mist gas outlet and the air gas outlet are arranged opposite each other, separated by the collision area within the gas containing space. The gas output surface is located below the collision area.

3. The substrate cleaning apparatus according to claim 1 or 2, wherein, The gas output surface has at least three first-type ejection holes, each of which is circular, and the opening of the gas output surface includes the at least three first-type ejection holes. The at least three first-type ejection holes are not on the same straight line when viewed from above.

4. The substrate cleaning apparatus according to claim 1 or 2, wherein, The gas output surface is circular when viewed from above. The gas output surface has a plurality of second-type ejection holes, each of which is a slit with a predetermined direction as its long side. The opening of the gas output surface includes the plurality of second-type ejection holes. The plurality of second-type ejector holes are arranged radially from the center of the gas output surface, with the predetermined direction of each of the second-type ejector holes aligned with the radial direction from the center of the gas output surface.

5. The substrate cleaning apparatus according to claim 1 or 2, wherein, The gas outlet surface appears circular when viewed from above. The gas output surface has a plurality of first-type ejection holes and a plurality of second-type ejection holes, and the opening of the gas output surface includes the plurality of first-type ejection holes and the plurality of second-type ejection holes. The plurality of first-type ejection holes are each circular and are classified into different predetermined groups according to a predetermined number. The plurality of second-type ejection holes are each in the shape of a slit with a specified direction as the long side. The plurality of first-type nozzles, in each of the specified number of groups, are arranged in a radial straight line from the center of the gas output surface when viewed from above, and the plurality of first-type nozzles are arranged radially from the center of the gas output surface in units of the specified number of groups. The plurality of second-type ejector holes are arranged radially from the center of the gas output surface, with the predetermined direction of each of the second-type ejector holes aligned with the radial direction from the center of the gas output surface.

6. The substrate cleaning apparatus according to claim 1 or 2, wherein, The gas outlet surface appears circular when viewed from above. The gas output surface has multiple third-type ejection holes, each of which is annular and varies in size. The opening of the gas output surface includes these third-type ejection holes. The plurality of third-type ejection holes are arranged such that the center of each of the plurality of third-type ejection holes coincides with the center of the gas output surface.

7. The substrate cleaning apparatus according to any one of claims 1 to 6, wherein, The mist gas supply unit includes a mist gas supply control unit, which performs mist gas effective control processing to control whether or not the cleaning mist gas is supplied to the internal confluence nozzle. The air supply unit includes an air supply control unit, which performs an air supply efficiency control process to control whether or not air is supplied to the internal confluence nozzle.

8. The substrate cleaning apparatus according to any one of claims 1 to 7, wherein, It also includes a rotating mechanism that performs a rotational action to rotate the substrate along the rotational direction.

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