Molding device and molding method

Abstract

A molding device includes a mold cavity defined by an upper mold, a lower mold and a middle mold being moveably attached to the lower mold; a position control mechanism configured to move the middle mold; and a gas discharging mechanism disposed adjacent to the mold cavity and including a gas conduit and a slit jointly defined by the upper mold and the lower mold when the molding device is closed, the slit is in communication with the mold cavity and the gas conduit. A molding method includes injecting a material into a mold cavity to form an article in the mold cavity; discharging at least a portion of a gas out of the mold cavity through a slit of a gas discharging mechanism adjacent to the mold cavity after the article is formed; disengaging a upper mold from a lower mold; and detaching the article from a middle mold.

Description

TECHNICAL FIELD

[0002] The present invention is related to a molding device and a molding methodthereof; in particular, to a molding device and a molding method thereof suitable for usein injection molding or extrusion molding.BACKGROUND

[0003] Foamed polymer articles have many advantages, such as high strength, lightweight, impact resistance, good sound insulation and thermal insulation, etc. The foamedpolymer article can be made into a molded article having a predetermined shape byinjection molding or extrusion molding. For example, after a polymeric material is meltedand mixed with a blowing agent in an extruding system to form a mixture, the mixture isinjected or extruded into a molding device to form the desired foamed polymer article.The properties and applications of foamed polymer articles can be altered by changingthe composition of the mixture and adjusting the molding method.BRIEF SUMMARY OF THE INVENTION

[0004] One purpose of the present invention is to provide a molding device and amolding method.

[0005] According to one embodiment of the present disclosure, a molding device isdisclosed. The molding device includes an upper mold, a lower mold disposed oppositeto the upper mold and a middle mold disposed between the upper mold and the lowermold, and being moveably attached to the lower mold. The molding device furtherincludes a position control mechanism attached to the middle mold and configured tomove the middle mold relative to the upper mold and the lower mold, and a gasdischarging mechanism disposed adjacent to a mold cavity defined by the upper mold,the middle mold and the lower mold. The gas discharging mechanism includes a gasconduit and a slit communicable with the mold cavity and the gas conduit and jointlydefined by the upper mold and the lower mold when the molding device is in a closedconfiguration.

[0006] According to one embodiment of the present disclosure, a molding method isdisclosed. The molding method includes: providing a lower mold and a middle moldmoveably attached to the lower mold; engaging an upper mold with the lower mold todefine an accommodating space and dispose the middle mold within the accommodatingspace, wherein the upper mold, the middle mold and the lower mold jointly define a firstmold cavity; injecting a molding material into the first mold cavity and at least partiallysurrounding the middle mold to form an article in the first mold cavity. The methodfurther includes after or during the formation of the article in the first mold cavity,discharging at least a portion of a gas out of the first mold cavity through a slit of a gasdischarging mechanism adjacent to the first mold cavity; disengaging the upper moldfrom the lower mold; and detaching the article from the middle mold.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Aspects of the present disclosure are best understood from the following detaileddescription when read with the accompanying figures. It should be noted that, inaccordance with the standard practice in the industry, various features are not drawn toscale. In fact, the dimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

[0008] FIG. 1 is a flowchart illustrating a molding method according to one embodimentof the present invention.

[0009] FIG. 2A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0010] FIG. 2B is a side view of the molding device of FIG. 2A.

[0011] FIG. 3A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0012] FIG. 3B is a side view of the molding device of FIG. 3A.

[0013] FIG. 4A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0014] FIG. 4B is a side view of the molding device of FIG. 4A.

[0015] FIG. 5 is a side view of a molding device at one or more manufacturing stagesof a molding method according to some embodiments of the present invention.

[0016] FIG. 6A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0017] FIG. 6B is a side view of the molding device of FIG. 6A.

[0018] FIG. 6C is a side view of a molding device at one or more manufacturing stagesof a molding method according to some embodiments of the present invention.

[0019] FIG. 7 is a side view of a molding device at one or more manufacturing stagesof a molding method according to some embodiments of the present invention.

[0020] FIG. 8A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0021] FIG. 8B is a side view of the molding device of FIG. 8A.

[0022] FIG. 9A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0023] FIG. 9B is a side view of the molding device of FIG. 9A.

[0024] FIGS. 10 and 11 are side views of a molding device at one or more manufacturingstages of a molding method according to some embodiments of the present invention.

[0025] FIG 12 is a schematic perspective view of the article according to someembodiments of the present invention.

[0026] FIG. 13A is a schematic perspective view of a molding device at one or moremanufacturing stages of a molding method according to some embodiments of the presentinvention.

[0027] FIG. 13B is a side view of the molding device of FIG. 13A.

[0028] FIGS. 14 to 20 are side views of a molding device at one or more manufacturingstages of a molding method according to some embodiments of the present invention.

[0029] FIG. 21 is a flow chart illustrating a molding method according to someembodiments of the present invention.

[0030] FIG. 22 is a schematic diagram of an extruding system used in a molding methodaccording to some embodiments of the present invention.

[0031] FIG. 23 is an enlarged view of a portion of an extruding system enclosed by adash line in FIG. 22 according to one embodiment of the present invention.

[0032] FIG. 24 is a chart illustrating the behavior of the amount of blowing agent in themixture versus the shortest distance according to one embodiment of the present invention.

[0033] FIG. 25 is a chart illustrating the behavior of the ratio of the blowing agent tothe polymeric material versus the ratio of the shortest distance to the diameter of themixing rotor according to one embodiment of the present invention.DETAILED DESCRIPTION

[0034] The following disclosure provides many different embodiments, or examples, forimplementing different features of the provided subject matter. Specific examples ofcomponents and arrangements are described below to simplify the present disclosure.These are, of course, merely examples and are not intended to be limiting. For example,the formation of a first feature over or on a second feature in the description that followsmay include embodiments in which the first and second features are formed in directcontact, and may also include embodiments in which additional features may be formedbetween the first and second features, such that the first and second features may not bein direct contact. In addition, the present disclosure may repeat reference numerals and / orletters in the various examples. This repetition is for the purpose of simplicity and clarityand does not in itself dictate a relationship between the various embodiments and / orconfigurations discussed.

[0035] Further, spatially relative terms, such as "beneath," "below," "lower," "above,""upper" and the like, may be used herein for ease of description to describe one elementor feature's relationship to another element(s) or feature(s) as illustrated in the figures.The spatially relative terms are intended to encompass different orientations of the devicein use or operation in addition to the orientation depicted in the figures. The apparatusmay be otherwise oriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpreted accordingly.

[0036] Notwithstanding that the numerical ranges and parameters setting forth the broadscope of the disclosure are approximations, the numerical values set forth in the specificexamples are reported as precisely as possible. Any numerical value, however, inherentlycontains certain errors necessarily resulting from the standard deviation found in therespective testing measurements. Also, as used herein, the term "about" generally meanswithin 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about"means within an acceptable standard error of the mean when considered by one ofordinary skill in the art. Other than in the operating / working examples, or unlessotherwise expressly specified, all of the numerical ranges, amounts, values andpercentages such as those for quantities of materials, durations of times, temperatures,operating conditions, ratios of amounts, and the likes thereof disclosed herein should beunderstood as modified in all instances by the term "about." Accordingly, unless indicatedto the contrary, the numerical parameters set forth in the present disclosure and attachedclaims are approximations that can vary as desired. At the very least, each numericalparameter should be construed in light of the number of reported significant digits andby applying ordinary rounding techniques. Ranges can be expressed herein as from oneendpoint to another endpoint or between two endpoints. All ranges disclosed herein areinclusive of the endpoints, unless specified otherwise.

[0037] In general, the appearance and physical properties of the foamed polymer articlesare directly affected by the forming process, and hence, the design of the mold mustconsider the gas discharging after the injection of the mixture into the mold cavity so thatthe mixture can be distributed in the mold cavity uniformly and rapidly and distributiondensity of bubble pores in the mixture is high and uniform so as to retain the originalphysical property.

[0038] FIG. 1 is a flowchart showing a molding method 100 in accordance with someembodiments of the present disclosure. In some embodiments, the method 100 is formanufacturing the article 60 shown in FIG. 12. In order to illustrate concepts and themethod 100 of the present disclosure, various embodiments are provided below. However,the present disclosure is not intended to be limited to specific embodiments. In addition,elements, conditions or parameters illustrated in different embodiments can be combinedor modified to form different combinations of embodiments as long as the elements,parameters or conditions used are not in conflict. Further, additional steps can be providedbefore, during, and after the steps shown in FIG. 1, and some of the steps described belowcan be replaced or eliminated in other embodiments of the method 100. The order of thesteps may be interchangeable. For ease of illustration, reference numerals with similar orsame functions and properties are repeated in different embodiments and FIGS. 2 to 12are schematic views illustrating exemplary operations for the molding method, e.g.,illustrated in FIG. 1, according to one embodiment of the present disclosure.

[0039] FIG. 2A is a schematic perspective view of a molding device 200 at operation101 of the molding method 100 according to some embodiments of the present invention.FIG. 2B is a side view of the molding device 200 of FIG. 2A. In some embodiments, themolding device 200 is provided. In some embodiments, the molding device 200 includesan upper mold 20, a lower mold 30, a middle mold 40, a position control mechanism 50,a tilt mechanism 70, and a gas discharging mechanism 19. Referring to FIGS. 2A and 2B,in some embodiments, in operation 101, the lower mold 30 and the middle mold 40moveably attached to the lower mold 30 are provided.

[0040] In some embodiments, the upper mold 20 is disposed opposite to the lower mold30. The upper mold 20 may be placed on and engaged with the lower mold 30. In someembodiments, the upper mold 20 and the lower mold 30 are complementary with andseparable from each other. The upper mold 20 may correspond to the lower mold 30 insome configurations such as dimension, shape or the like. In some embodiments, theupper mold 20 and the lower mold 30 are complementary with each other in order todefine a first mold cavity 14 shown in FIGA. 4A and 4B. In some embodiments, the uppermold 20 and the lower mold 30 are separated from each other during operation 101. Inthe embodiment illustrated in FIGS. 2A and FIG. 2B, the molding device 200 is in anopen configuration.

[0041] In some embodiments, the provision of the molding device 200 includesconveying the lower mold 30 towards the upper mold 20. As such, the lower mold 30would be disposed under the upper mold 20 for subsequent steps. In some embodiments,the upper mold 20 is aligned with the lower mold 30.

[0042] Referring to FIGS. 2A and 2B, in some embodiments, the upper mold 20 has atop surface 21 and a bottom surface 22 opposite to the top surface 21. In someembodiments, the upper mold 20 defines an upper mold cavity 23 and a feeding port 24.In some embodiments, the bottom surface 22 of the upper mold 20 faces the lower mold30 and the middle mold 40. In some embodiments, the upper mold cavity 23 of the uppermold 20 is indented from the bottom surface 22 of the upper mold 20. A configuration(e.g., dimension or shape) of the upper mold cavity 23 of the upper mold 20 maycorrespond to a configuration (e.g., dimension or shape) of the middle mold 40. In someembodiments, the upper mold cavity 23 of the upper mold 20 includes a first inner surface231 and a second inner surface 232. In some embodiments, the second inner surface 232extends between the first inner surface 231 and the bottom surface 22 of the upper mold20. In some embodiments, the first inner surface 231 and the second inner surface 232are conformal with the middle mold 40.

[0043] In some embodiments, the feeding port 24 extends through the upper mold 20.The feeding port 24 has an opening 241 disposed on the top surface 21 of the upper mold20. In some embodiments, the feeding port 24 is in communication with the upper moldcavity 23 of the upper mold 20 or the first mold cavity 14 when the molding device 200is in the closed configuration as shown in FIG. 4A and FIG. 4B. Alternatively, in someembodiments, the upper mold cavity 23 of the upper mold 20 is accessible through thefeeding port 24. For simplicity and clarity, only one feeding port 24 is illustrated, however,it can be understood that any suitable numbers of the feeding port 24 can be configuredat the upper mold 20. In some embodiments, the number of the feeding port 24 is identicalto the number of the upper mold cavity 23 of the upper mold 20. In some embodiments,the number of the upper mold cavity 23 of the upper mold 20 is more than the number ofthe feeding port 24. In some embodiments, the number of the feeding port 24 is more thanthe number of the upper mold cavity 23 of the upper mold 20.

[0044] In some embodiments, instead of configuring the feeding port 24 at the uppermold 20, the feeding port 24 is disposed at the lower mold 30 for accessing a lower moldcavity 33 of the lower mold 30 or the first mold cavity 14 when the molding device 200is in the closed configuration as shown in FIG. 4A and FIG. 4B. In some embodiments,the feeding port 24 is configured at a sidewall 35 of the lower mold 30, a bottom surface32 of the lower mold 30, or any other suitable positions as long as the feeding port 24 iscommunication with the first mold cavity 14 when the molding device 1 is in the closedconfiguration as shown in FIG. 4A and FIG. 4B.

[0045] Referring to FIGS. 2A and 2B, in some embodiments, the lower mold 30 isdisposed under the upper mold 20. The lower mold 30 includes a top surface 31 and abottom surface 32 opposite to the top surface 31, and defines a lower mold cavity 33 anda hole structure 34. In some embodiments, the top surface 31 of the lower mold 30 facesthe upper mold 20 and the middle mold 40. The lower mold cavity 33 of the lower mold30 is recessed from the top surface 31 of the lower mold 30. A configuration (e.g.,dimension or shape) of the lower mold cavity 33 of the lower mold 30 corresponds to aconfiguration (e.g., dimension or shape) of a bottom surface of the middle mold 40. Insome embodiments, the lower mold cavity 33 of the lower mold 30 is disposed right underthe middle mold 40. The lower mold cavity 33 of the lower mold 30 may be a portion ofthe first mold cavity 14 when the molding device 200 is in the closed configuration asshown in FIG. 4A and FIG. 4B.

[0046] Referring to FIGS. 2A and 2B, in some embodiments, the hole structure 34 isdisposed within the lower mold 30 and adjacent to the lower mold cavity 33 of the lowermold 30. Thus, the hole structure 34 may not be in communication with the lower moldcavity 33 of the lower mold 30. In some embodiments, the lower mold cavity 33 of thelower mold 30 may not be accessible through the hole structure 34. In some embodiments,the hole structure 34 may or may not extend through the lower mold 30.

[0047] In some embodiments, the hole structure 34 includes a first hole 341 and a secondhole 342 in communication with each other. The first hole 341 includes an opening onthe top surface 31 of the lower mold 30. The second hole 342 is disposed under the firsthole 341. In some embodiments, a size (e.g., width or diameter) of the second hole 342is smaller than a size (e.g., width or diameter) of the first hole 341, so as to form a stepstructure 343. In some embodiments, the size of the second hole 342 is smaller than thesize of the first hole 341. In some embodiments, the hole structure 34 further includes athird hole 344 disposed adjacent to the first hole 341 and the second hole 342. The thirdhole 344 may not be in communication with the first hole 341 and the second hole 342.

[0048] For simplicity and clarity, only the first hole 341, the second hole 342 and thethird hole 344 are illustrated, however, it can be understood that any suitable numbers ofthe holes can be configured at the lower mold 30. In some embodiments, the hole structure34 may be used for accommodating at a portion of the position control mechanism 50 andat least a portion of the tilt mechanism 70. Thus, the number of the holes may be equal tothe number of the position control mechanism 50 and the number of the tilt mechanism70. The number of the position control mechanism 50 may be two or three, which canbalance or uniformly support a downward press force applied on the position controlmechanism 50 and the middle mold 40 from the upper mold 20.

[0049] In some embodiments, a gas discharging mechanism 19 is disposed adjacent tothe first mold cavity 14. In some embodiments, the gas discharging mechanism 19 isdisposed within the upper mold 20 or the lower mold 30. In some embodiments, the gasdischarging mechanism 19 includes a gas conduit 192 disposed adjacent to the lower moldcavity 33 and extending within the lower mold 30, and a slit 191 jointly defined by theupper mold 20 and the lower mold 30 when the molding device 200 is in the closedconfiguration as shown in FIG. 4A and FIG. 4B, and the slit 191 is in communicationwith the first mold cavity 14 and the gas conduit 192. In some embodiments, the slit 191is disposed between the gas conduit 192 and the lower mold cavity 33. One end of theslit 191 is coupled to the lower mold cavity 33, and the other end thereof is coupled tothe gas conduit 192. In some embodiments, the slit 191 is indented from the top surface31 of the lower mold 30. In some embodiments, a height of the slit 191 is less than adiameter of the gas conduit 192. In some embodiments, the height of the slit 191 is greaterthan 0.01mm but less than 0.5mm. In some embodiments, the height of the slit 191 isgreater than 0.01mm but less than 0.2mm. In some embodiments, a width of the slit 191ranges between 3mm and 20mm. In some embodiments, the size and shape of the slit 191are in configurations that only gas or fluid are allowed to flow into the slit 191, whilesolids and liquids cannot enter the slit 191.

[0050] In some embodiments, one end of the gas conduit 192 is in communication withthe slit 191, and the other end thereof includes an opening formed on the lower mold 30and in communication with the external environment. In some embodiments, the gasconduit 192 is arranged between the lower mold cavity 33 and a sidewall 35 of the lowermold 30 or between the lower mold cavity 33 and the bottom surface 32 of the lower mold30.

[0051] In some embodiments, the gas discharging mechanism 19 includes a plurality ofthe gas conduits 192 surrounding the lower mold cavity 33 and spaced apart from eachother, and a plurality of the gas slits 191 in communication with the lower mold cavity33 and the corresponding gas conduit 192. The number and location of the plurality ofgas conduits 192 are not particularly limited; for example, they can be arranged betweenthe lower mold cavity 33 and a sidewall 35 of the lower mold 30 and / or between the lowermold cavity 33 and the bottom surface 32 of the lower mold 30; however, the presentinvention is not limited thereto.

[0052] In some embodiments, the middle mold 40 is disposed between the upper mold20 and the lower mold 30, and being moveably attached to the lower mold 30. In someembodiments, the middle mold 40 is moveably attached to the lower mold 30 and ismoveable between the upper mold 20 and the lower mold 30 due to the operation of theposition control mechanism 50 and / or the tilt mechanism 70.

[0053] In some embodiments, the position control mechanism 50 drives or actuates themiddle mold 40 to move between the upper mold 20 and the lower mold 30. It can beunderstood that a maximum displacement of the middle mold 40 is limited by the positioncontrol mechanism 50. In some embodiments, a gap G1 or distance between the middlemold 40 and the lower mold 30 is controlled by the position control mechanism 50.

[0054] In some embodiments, the middle mold 40 may include a main portion 41 and ashoe last 42. In some embodiments, the main portion 41 is connected to a back end of theshoe last 42. In some embodiments, the main portion 41 and the shoe last 42 may beformed integrally as a monolithic structure. In some embodiments, the main portion 41has a top surface 411 and a bottom surface 412 opposite to the top surface 411. In someembodiments, the shoe last 42 has a top surface 421, a bottom surface 422 opposite to thetop surface 421, and an outer surface 423 extending between the top surface 421 and thebottom surface 422. In some embodiments, the shoe last 42 defines at least one recess 43recessed from the outer surface 423. In some embodiments, the recess 43 of the middlemold 40 is a portion of the first mold cavity 14 when the molding device 200 is in theclosed configuration as shown in FIG. 4A and FIG. 4B. In some embodiments, a pluralityof recesses 43 are in communication with each other and extending to the bottom surface422 of the shoe last 42. In some embodiments, the shoe last 42 further defines at leastone bottom recess (not shown) recessed from the bottom surface 422 of the shoe last 42.In some embodiments, the middle mold 40 includes a first end 47 close to the main portion41 and away from the shoe last 42, and a second end 48 opposite to the first end 47. Thesecond end 48 of the middle mold 40 is close to the shoe last 42 and away from the mainportion 41. In some embodiments, the second end 48 of the middle mold 40 includes theshoe last 42.

[0055] In some embodiments, the top surface 421 of the shoe last 42 is substantiallyaligned with or coplanar with the top surface 411 of the main portion 41. In someembodiments, a top surface of the middle mold 40 includes the top surface 421 of theshoe last 42 and the top surface 411 of the main portion 41. Similarly, in someembodiments, the bottom surface 422 of the shoe last 42 is substantially aligned with orcoplanar with the bottom surface 412 of the main portion 41. In some embodiments, abottom surface of the middle mold 4 may include the bottom surface 422 of the shoe last42 and the bottom surface 412 of the main portion 41. As a result, in some embodiments,a maximum thickness of the shoe last 42 may be substantially equal to a maximumthickness of the main portion 41 and a maximum thickness of the middle mold 40.

[0056] In some embodiments, the position control mechanism 50 connects or attachesto the bottom surface 412 of the main portion 41 of the middle mold 40. In someembodiments, the position control mechanism 50 is configured to drive or actuate themiddle mold 40 to move upward so as to generate the gap G1 between the top surface 31of the lower mold 30 and the bottom surface 412 of the main portion 41 of the middlemold 40 when the molding device 200 is in an open configuration. In some embodiments,the position control mechanism 50 is configured to generate a relative movement betweenthe middle mold 40 and the lower mold 30. As shown in FIG. 2A and FIG. 2B, the moldingdevice 200 is in an open configuration, and the gap G1 reaches its maximum value. Insome embodiments, the gap G1 ranges between 45mm and 150mm.

[0057] In some embodiments, a portion of the position control mechanism 50 isaccommodated in the hole structure 34 of the lower mold 30. In some embodiments, aportion of the position control mechanism 50 is accommodated in the first hole 341 andthe second hole 342 of the lower mold 30. In some embodiments, when the moldingdevice 200 is in the closed configuration, the whole position control mechanism 50 isaccommodated in the hole structure 34 of the lower mold 30, and the bottom surface 412of the main portion 41 contacts the top surface 31 of the lower mold 30.

[0058] In some embodiments, the position control mechanism 50 includes a bar member51 and a biasing member 52. The bar member 51 may be a pin, a pillar, a post or a column,and may be used for guiding the moving direction of the middle mold 40. In someembodiments, an upper end of the bar member 51 connects or attaches to the bottomsurface 412 of the main portion 41 of the middle mold 40, and a lower end of the barmember 51 extends through the first hole 341 and the second hole 342 of the holestructure 34. The biasing member 52 is configured to control a movement of the barmember 51 or driving the bar member 51. The biasing member 52 may be a spring or anelastic body that surrounds the bar member 51. In some embodiments, an upper end ofthe biasing member 52 connects or attaches to the bottom surface 412 of the main portion41 of the middle mold 40, and a lower end of the biasing member 52 connects or attachesto the step structure 343 of the hole structure 34 of the lower mold 30. When a downwardforce is applied on the middle mold 40 to drive the middle mold 40 to move downwardto press the biasing member 52, an elastic potential energy is stored in the pressed biasingmember 52. Once the downward force is released, the elastic potential energy will pushthe middle mold 40 to move upward. It can be understood that the position controlmechanism 50 may be a piston or other suitable mechanism that has a compression phaseand a springback phase. In some embodiments, the biasing member 52 is omitted, and thelower end of the bar member 51 connects to a suitable actuator. Thus, the movement ofthe bar member 51 may not controlled by the elastic potential energy.

[0059] In some embodiments, the middle mold 40 is detachable from the lower mold 30and the position control mechanism 50. It can be understood that the size or appearanceof the article 60 (as show in FIG. 12) may correspond to the size or appearance of themiddle mold 40. Thus, in order to manufacture different articles 60 having different sizesor different appearances, different middle mold 40 having different sizes or differentappearances may be adopted into the molding device 200. When the middle mold 40 ischanged, the lower mold cavity 33 of the lower mold 30 and the upper mold cavity 23 ofthe upper mold 20 may be changed accordingly.

[0060] In some embodiments, the tilt mechanism 70 is attached to the middle mold 40and configured to incline the middle mold 40 relative to the lower mold 30. In someembodiments, the tilt mechanism 70 is disposed adjacent to the position controlmechanism 50. In some embodiments, the tilt mechanism 70 is attached to the first end47 of the middle mold 40. In some embodiments, the tilt mechanism 70 connects orattaches to the bottom surface 412 of the main portion 41 of the middle mold 40. In someembodiments, the tilt mechanism 70 is configured to tilt the middle mold 40 relative tothe lower mold 30 to move the second end 48 of the middle mold 40 higher than the firstend 47 of the middle mold 40. The middle mold 40 may be tilted when the molding device200 is in an open configuration; when the molding device 200 is in the closedconfiguration, the middle mold 40 cannot be tilted. The middle mold 40 may be tilted bythe tilt mechanism 70 when the gap G1 between the middle mold 40 and the lower mold30 is greater than or equal to zero. In some embodiments, before the middle mold 40 istilted, the bottom surface 422 of the shoe last 42 is parallel to the top surface 31 of thelower mold 30. In some embodiments, the tilt mechanism 70 is configured to generate arelative tilt between the middle mold 40 and the lower mold 30. In some embodiments,when the middle mold 40 is tilted (as shown in FIG. 10), an angle σ is generated betweenthe bottom surface 422 of the shoe last 42 and the top surface 31 of the lower mold 30.In some embodiments, the angle σ ranges between 0 and 90 degree. In someembodiments, the angle σ ranges between 20 and 70 degree.

[0061] In some embodiments, a portion of the tilt mechanism 70 is accommodated inthe hole structure 34 of the lower mold 30. In some embodiments, a portion of the tiltmechanism 70 is accommodated in the third hole 344 of the lower mold 30. In someembodiments, when the molding device 200 is in the closed configuration, the whole tiltmechanism 70 is accommodated in the hole structure 34 of the lower mold 30.

[0062] In some embodiments, the tilt mechanism 70 includes a fulcrum 71 for pivotingthe middle mold 40. The middle mold 40 can be rotated around the fulcrum 71 to tilt themiddle mold 40 relative to the lower mold 30. In some embodiments, the fulcrum 71attaches to a bar member 72 disposed in the third hole 344.

[0063] The bar member 72 may be a pin, a pillar, a post or a column, and may be usedfor moving the fulcrum 71 along with the middle mold 40. In some embodiments, the barmember 72 is disposed adjacent to the bar member 51 of the position control mechanism50. In some embodiments, an upper end of the bar member 72 connects or attaches to thebottom surface 412 of the main portion 41 of the middle mold 40, and a lower end of thebar member 72 extends through the third hole 344 of the hole structure 34. When theposition control mechanism 50 drives or actuates the middle mold 40 to move upwardand the gap G1 is generated between the top surface 31 of the lower mold 30 and thebottom surface 412 of the main portion 41 of the middle mold 4, the fulcrum 71 and thebar member 72 of moves upwardly. In some embodiment, a position of the fulcrum 71 iscontrolled by the position control mechanism 50.

[0064] FIG. 3A is a schematic perspective view of a molding device 200 according tosome embodiments of the present invention. FIG. 3B is a side view of the molding device200 of FIG. 3A. Referring to FIGS. 3A and 3B, a distance between the upper mold 20 andthe lower mold 30 is reduced gradually. As shown in FIGS. 3A and 3B, a relativemovement between the upper mold 20 and the lower mold 30 occurs. In someembodiments, the position of the upper mold 23 is fixed, and the lower mold 30 and themiddle mold 40 are moved together toward the upper mold 20. In some embodiments, thepositions of the lower mold 30 and the middle mold 40 are fixed, and the upper mold 20moves toward the lower mold 30 and the middle mold 40. In some embodiments, thelower mold 30 and the upper mold 20 are moved toward each other. At the stage illustratedin FIGS. 3A and 3B, the middle mold 40 is accommodated in the upper mold cavity 23and not yet disposed in the lower mold cavity 33. That is, the middle mold 40accommodates the upper mold 20 before the lower mold 30 accommodates the upper mold20. In some embodiments, the first inner surface 231 of the upper mold 20 contacts thetop surface of the middle mold 4 (including the top surface 421 of the shoe last 42 andthe top surface 411 of the main portion 41) at the stage illustrated in FIGS. 3A and 3B.The second inner surface 232 of the upper mold 20 contacts the outer surface 423 of themiddle mold 40. In some embodiments, the bottom surface of the middle mold 40(including the bottom surface 422 of the shoe last 42 and the bottom surface 412 of themain portion 41) is substantially coplanar with the bottom surface 22 of the upper mold20 at the stage illustrated in FIGS. 3A and 3B. Meanwhile, the gap G1 between the topsurface 31 of the lower mold 30 and the bottom surface of the middle mold 40 has notchanged. In some embodiments, at the stage illustrated in FIGS. 3A and 3B, the gap G1reaches its maximum value.

[0065] FIG. 4A is a schematic perspective view of a molding device 200 at operation102 of the molding method 100 according to some embodiments of the present invention.FIG. 4B is a side view of the molding device 200 of FIG. 4A. Referring to FIGS. 4A and4B, in some embodiments, in operation 102, the upper mold 20 is engaged with the lowermold 30 to jointly define an accommodating space 12 and the middle mold 40 is disposedwithin the accommodating space 12. In some embodiments, the upper mold 20, the middlemold 40 and the lower mold 30 jointly define the first mold cavity 14. In someembodiments, the relative movement between the upper mold 20 and the lower mold 30continues until the distance between the upper mold 20 and the lower mold 30 is reducedto zero. In some embodiments, the position of the upper mold 20 is fixed, the middlemold 40 accommodates in the upper mold 20, and the lower mold 30 moves toward theupper mold 20. In some embodiments, the position of the lower mold 30 is fixed, and theupper mold 20 and the middle mold 40 are moved together toward the lower mold 30. Insome embodiments, the lower mold 30 and the upper mold 20 are moved toward eachother. In some embodiments, the top surface 31 of the lower mold 30 is in contact withbottom surface of the middle mold 40. In some embodiments, the gap G1 between the topsurface 31 of the lower mold 30 and the bottom surface of the middle mold 40 has reducedto zero. The upper mold 20 applies a downward force to the middle mold 40, and themiddle mold 40 moves downwardly to press the biasing member 52. In someembodiments, an elastic potential energy is stored in the pressed biasing member 52 whenthe molding device 200 is in the closed configuration.

[0066] As shown in FIG. 4A and FIG. 4B, the molding device 200 is in a closedconfiguration, and the upper mold 20 is engaged with the lower mold 30. In someembodiments, the whole middle mold 40 is disposed and accommodated in theaccommodating space 12. In some embodiments, the upper mold 20, the middle mold 40and the lower mold 30 jointly defines a first mold cavity 14. The first mold cavity 14 isconfigured to accommodate a molding material (not shown) and to mold the moldingmaterial into the article 60 having predetermined shape. The feeding port 24 of the uppermold 20 is in communication with the first mold cavity 14.

[0067] In some embodiments, the method 100 further includes providing an extrudingsystem 10 configured to produce the molding material, and providing a dischargingchannel 10a communicable with the extruding system 10 and including an outlet 10bdisposed distal to the extruding system 10 and configured to discharge the moldingmaterial. In some embodiments, the feeding port 24 of the molding device 200 iscorrespondingly engageable with the outlet 10b. In some embodiments, the opening 241of the feeding port 24 is engage with the discharging channel 10a. In some embodiments,the extruding system 10 and the discharging channel 10a are disposed adjacent to thefeeding port 24 of the molding device 200. The molding device 200 is configured toreceive the molding material from the outlet 10b of the discharging channel 10a. In someembodiments, the discharging channel 10a may be extended into and be retracted fromthe molding device 200. In some embodiments, the discharging channel 10a and the outlet10b are overlapped with the feeding port 24 from a top view.

[0068] In some embodiments, the molding material includes a polymeric material suchas ethylene vinyl acetate (EVA), styrene-ethylene-butylene-styrene (SEBS),thermoplastic polyurethanes (TPU), thermoplastic polyester elastomer (TPEE) or the like.In some embodiments, the molding material includes a recyclable material. In someembodiments, the molding material further includes a blowing agent. In someembodiments, the blowing agent can be any type of chemical or physical blowing agentknown to those of ordinary skill in the art. In some embodiments, the blowing agent is asupercritical fluid. The supercritical fluid may include inert gas such as carbon dioxideor nitrogen in supercritical state. The technical details of mixing the polymeric materialand the blowing agent are known in the prior art, and description thereof is omitted herein.

[0069] In some embodiments, as shown in FIG. 4A and FIG. 4B, the first mold cavity14 includes a first portion 141 and a second portion 142 in communication with eachother. In some embodiments, the first portion 141 defines by the second inner surface 232of the upper mold 20 and the sidewalls of the recess 43 of the shoe last 42. In someembodiments, the first portion 141 of the first mold cavity 14 is substantially same as therecess 43 of the shoe last 42. In some embodiments, the second portion 142 defines bythe sidewalls of the lower mold cavity 33 of the lower mold 30, the bottom surface of themiddle mold 40 (including the bottom surface 422 of the shoe last 42 and the bottomsurface 412 of the main portion 41) and the bottom surface 22 of the upper mold 20. Insome embodiments, the second portion 142 of the first mold cavity 14 is substantiallysame as the lower mold cavity 33 of the lower mold 30.

[0070] FIG. 5 is a side view of a molding device at operation 103 of the molding method100 according to some embodiments of the present invention. In some embodiments,referring to FIG. 5, the method 100 further includes disposing the upper mold 20, themiddle mold 40 and the lower mold 30 over a platform 196, wherein the platform 196includes a first opening 196a extending through the platform 196. The platform 196 isconfigured to dispose the molding device 200.

[0071] In some embodiments, the extruding system 10 is disposed above the firstopening 196a. In some embodiments, the discharging channel 10a and the outlet 10b areoverlapped with the first opening 196a from a top view. In some embodiments, a chamber196b is disposed under the platform 196. The platform 196 and the outlet 10b are disposedabove the chamber 196b. In some embodiments, the molding device 200 is disposedbetween the extruding system 10 and the platform 196.

[0072] In some embodiments, a plunger 197 includes a base 197a and a rod 197b. Theplunger 197 is configured to provide a plunging force to the molding device 200 disposedover the platform 196. In some embodiments, the plunger 197 is a hydraulic plunger. Insome embodiments, the rod 197b is extendable through the first opening 196a toward themolding device 200 and retractable toward the base 197a. In some embodiments, the rod197b is movable vertically. In some embodiments, the plunger 197 can provide theplunging force in a range of about 30N to 80N. In some embodiments, the plunging forceis about 50N.

[0073] In some embodiments, the plunger 197 is movable relative to the platform 196.In some embodiments, the plunger 197 is separated from the chamber 196b, and may bemoved into the chamber 196b. In some embodiments, the plunger 197 is not movable andis initially fixed in the chamber 196b. In some embodiments, the plunger 197 is fixedlydisposed under the platform 196, and the rod 197b is vertically aligned with the firstopening 196a. In some embodiments, the plunger 197 is initially fixed in the chamber196b. In some embodiments, the plunger 197 is in a retracted configuration as shown inFIG. 5.

[0074] In some embodiments, the lower mold 30 further includes a second opening 36configured to receive at least a portion of the plunger 197. In some embodiments, thesecond opening 36 is overlapped with the first opening 196a from a top view. In someembodiments, a passage 196c including the first opening 196a and the second opening 36is formed after placing the molding device 200 on the platform 196. In some embodiments,the passage 196c extends through the platform 196. In some embodiments, the feedingport 24 is overlapped with the passage 196c from a top view.

[0075] FIG. 6A is a schematic perspective view of a molding device 200 at operation105 of the molding method 100 according to some embodiments of the present invention.FIG. 6B is a side view of the molding device 200 of FIG. 6A. Referring to FIGS. 6A and6B, in some embodiments, in operation 105, a molding material 60a is injected into thefirst mold cavity 14 and at least partially surrounding the middle mold 40 to form anarticle 60 in the first mold cavity 14.

[0076] In some embodiments, the molding material 60a is injected into the first moldcavity 14 through the opening 241 of the feeding port 24. In some embodiments, themolding material 60a is injected into the first mold cavity 14 when the molding device200 is in a closed configuration or when the upper mold 20 and the lower mold 30 areengaged with each other. In some embodiments, the molding material 60a a polymericmaterial such as ethylene vinyl acetate (EVA), styrene-ethylene-butylene-styrene(SEBS), thermoplastic polyurethanes (TPU), thermoplastic polyester elastomer (TPEE)or the like. In some embodiments, the molding material 60a further includes a blowingagent. In some embodiments, the molding material 60a may be foamable material or lessfoamable material. In some embodiments, the molding material 60a includes a recyclablematerial. In some embodiments, the molding material 60a may be non-foamable material.In some embodiments, the molding material 60a may fill up the first mold cavity 14(including the first portion 141 and the second portion 142).

[0077] In some embodiments, the molding material 60a is discharged from the outlet10b and includes a polymeric material. In some embodiments, the molding material 60ais flowable along the extruding system 10 and dischargeable from the outlet 10b. In someembodiments, the molding material 60a is flowable and formed by hot-melting or anyother suitable processes. The technical details of hot-melting are known in the prior art,and description thereof is omitted herein.

[0078] In some embodiments, an article 60 is integrally formed from the moldingmaterial 60a in the first mold cavity 14. In some embodiments, the article 60 is free fromadhesive. The article 60 may be a shoe such as a slipper, flip-flop, or a sandal. In someembodiments, the article 60 includes a base portion 62 (e.g., a sole portion) and at leastone upper portion 61 (e.g., a strap portion). In some embodiments, the upper portion 61of the article 60 is formed from a first portion of the molding material 60a disposed inthe first portion 141 of the first mold cavity 14. In some embodiments, the base portion62 of the article 60 is formed from a second portion of the molding material 60a disposedin the second portion 142 of the first mold cavity 14. In addition, an additional pin 63may be formed from a third portion of the molding material 60a disposed in the feedingport 24. The additional pin 63 may be connected to the upper portion 61 of the article 60.In some embodiments, since the gas slits 191 of the gas discharging mechanism 19 are incommunication with the first mold cavity 14, at least a portion of a gas is discharged outof the first mold cavity 14 through the slits 191 after the injection of the molding material60a. In some embodiments, due to a portion of the gas is discharged from the first moldcavity 14, there is room in the first mold cavity 14 for the molding material 60a to foam.

[0079] FIG. 6C is a schematic perspective view of a molding device 200 at operation106 of the molding method 100 according to some embodiments of the present invention.Referring to FIG. 6C, in some embodiments, in operation 106, a plunging force is appliedto the lower mold 30 and the upper mold 20 by extending the rod 197b through the firstopening 196a towards the lower mold 30 during the injection of the molding material 60ainto the first mold cavity 14. In some embodiments, the second opening 36 of the lowermold 30 is vertically aligned with the rod 197b of the plunger 197 during the applicationof the plunging force. In some embodiments, the rod 197b of the plunger 197 is alignedwith the passage 196c.

[0080] During the discharge of the molding material 60a from the extruding system 10into the first mold cavity 14, the discharging channel 10a and the outlet 10b areoverlapped with the feeding port 24, the passage 196c and the rod 197b from a top view.

[0081] In some embodiments, the rod 197b contacts the lower mold 30 during theapplication of the plunging force. In some embodiments, the rod 197b extends and passesthrough the passage 196c to contact the lower mold 30 and press the lower mold 30towards the upper mold 20. The plunging force is applied on the lower mold 30 towardsthe upper mold 20. In some embodiments, the upward plunging force is applied to themolding device 200. In some embodiments, the plunging force is in a range of about 30Nto about 80N. In some embodiments, the plunging force is about 50N. The lower mold 30and the upper mold 20 are tightly engaged with each other during the application of theplunging force. In some embodiments, the plunger 197 is in an extended configuration asshown in FIG. 6C.

[0082] In some embodiments, the molding material 60a is forced and pushed into thefirst mold cavity 14 through the outlet 10b by an injecting force. In some embodiments,a direction of the injecting force is from the discharging channel 10a towards the secondopening 36. In some embodiments, the direction of the injecting force is opposite to thedirection of the plunging force.

[0083] In some embodiments, in operation 107, after the article 60 is formed in the firstmold cavity 14, discharging at least a portion of a gas out of the first mold cavity 14through the slit 191 of the gas discharging mechanism 19 adjacent to the first mold cavity14. After the article 60 is formed in the first mold cavity 14, at least a portion of the gasis discharged out of the first mold cavity 14 to the gas conduit 192 of the gas dischargingmechanism 19 through the slit 191 between the first mold cavity 14 and the gas conduit192. In some embodiments, the injection of the molding material 60a raises a pressure ofthe first mold cavity 14, and the gas in the first mold cavity 14 enters the slits 191 due tothe positive pressure. In some embodiments, only the gas in the first mold cavity 14 entersthe slits 191, the molding material 60a remains in the first mold cavity 14. In someembodiments, the portion of the gas is discharged out of the molding device 200 throughthe gas conduits 192 of the gas discharging mechanism 19.

[0084] FIG. 7 is a schematic perspective view of a molding device 200 at operation 107of the molding method 100 according to some embodiments of the present invention.Referring to FIG. 7, in some embodiments, after the article 60 is formed in the first moldcavity 14, separating the upper mold 20 and the lower mold 30 to form a second moldcavity 14a and discharge at least a portion of a gas out of the second mold cavity 14a. Insome embodiments, a volume of the second mold cavity 14a is greater than the first moldcavity 14, and the molding device 200 having the second mold cavity 14a is maintainedin the closed configuration. In some embodiments, the second mold cavity 14a is formedby withdrawing the extruding system 10 and / or retracting the rod 197b towards the base197a of the plunger 197, and the volume of the second mold cavity 14a is slightly greaterthan that of the first mold cavity 14.

[0085] In some embodiments, when the injection of the molding material 60a into thefirst mold cavity 14 is accomplished, the extruding system 10 is withdrawn and movedaway from the molding device 200. In some embodiments, when the injection of themolding material 60a into the first mold cavity 14 is accomplished, the rod 197b isretracted towards the base 197a and the plunging force is withdrawn by retracting the rod197b. In some embodiments, when the injection of the molding material 60a into the firstmold cavity 14 is accomplished, the outlet 10b is disengaged from the feeding port 24,and the rod 197b is moved away from the molding device 200. The plunger 197 is backto he retracted configuration as shown in FIG.7.

[0086] In some embodiments, the method 100 includes retracting the rod 197b towardsthe base 197a after the injection of the molding material 60a to discharge at least a portionof the gas out from the first mold cavity 14. After the withdrawn of the plunging forceand / or the injection force, the molding device 200 is continuously maintained in theclosed configuration and the second mold cavity 14a is formed, and at least a portion ofthe gas is discharged from the second mold cavity 14a to the slits 191 of the gasdischarging mechanism 19. In some embodiments, the molding device 200 is disposed onthe platform 196 and is free from the gas discharging mechanism 19, after the withdrawnof the plunging force and / or the injection force, the upper mold 20 and the lower mold30 are no longer clamped by the plunging force and / or the injection force, and at least aportion of the gas is discharged through a space between the lower mold 30 and the uppermold 20.

[0087] FIG. 8A is a schematic perspective view of a molding device 200 at operation108 of the molding method 100 according to some embodiments of the present invention.FIG. 8B is a side view of the molding device 200 of FIG. 8A. Referring to FIGS. 8A and8B, in some embodiments, in operation 108, the upper mold 20 is disengaged from thelower mold 30.

[0088] In operation 108, in some embodiments, the relative movement between theupper mold 20 and the lower mold 30 occurs, and the distance between the upper mold20 and the lower mold 30 increases gradually. Meanwhile, the article 60 is held orattached on the middle mold 40, and the additional pin 63 is still attached on the article60. In some embodiments, the position of the upper mold 20 is fixed, and only the lowermold 30 is moved away from the upper mold 20. Meanwhile, the middle mold 40 issustained in the upper mold 20. In some embodiments, the relative movement betweenthe middle mold 40 and the lower mold 30 is achieved by a pushing force applied to themiddle mold 40 by the position control mechanism 50. Such pushing force is convertedfrom the elastic potential energy stored in the pressed biasing member 52 of FIG. 4A andFIG. 4B.

[0089] In some embodiments, the position of the lower mold 30 is fixed, and the uppermold 20 and the middle mold 40 may move away from the lower mold 30 simultaneously.Meanwhile, the middle mold 40 is sustained in the upper mold 20 and moved with theupper mold 20. In some embodiments, the relative movement between the middle mold40 and the lower mold 30 is achieved by a pushing force applied to the middle mold 40by the position control mechanism 50.

[0090] FIG. 9A is a schematic perspective view of a molding device 200 at operation109 of the molding method 100 according to some embodiments of the present invention.FIG. 9B is a side view of the molding device 200 of FIG. 9A. Referring to FIGS. 9A and9B, in some embodiments, in operation 109, the middle mold 40 and the article 60 arelifted from the lower mold 30 before tilting the middle mold 40, wherein the article 60 isheld by the middle mold 40. Referring to FIG. 9A and FIG. 9B, the relative movementbetween the upper mold 20 and the lower mold 30 continues so as to separate the uppermold 20 from the middle mold 40. Meanwhile, the article 60 remains on the middle mold40. In some embodiments, the position of the upper mold 20 is fixed, and the lower mold30 and the middle mold 40 move together away from the upper mold 20 since a maximumdisplacement of the middle mold 40 is limited by the position control mechanism 50attached to the lower mold 30. In some embodiments, the position of the lower mold 30is fixed, and the upper mold 20 is move away from the lower mold 30 and the middlemold 40. As shown in FIG. 9B, a distance between the middle mold 40 and the uppermold 20 is greater than a distance between the middle mold 40 and the lower mold 30. Insome embodiments, the gap G1 between the top surface 31 of the lower mold 30 and abottom surface the middle mold 40 is generated by the position control mechanism 50attached to the middle mold 40 and the lower mold 30.

[0091] FIG. 10 is a side view of a molding device 200 at operation 110 of the moldingmethod 100 according to some embodiments of the present invention. Referring to FIG.10, in some embodiments, in operation 110, the middle mold 40 and the article 60 are tiltrelative to the lower mold 30. In some embodiments, the middle mold 40 pivots about thefulcrum 71 to tilt the middle mold 40, and the middle mold 40 has an angle σrelative tothe lower mold 30. In some embodiments, the first end 47 of the middle mold 40 is lowerthan the second end 48 when the middle mold 40 is tilted. In some embodiments, themiddle mold 40 and the article 60 are tilted relative to the lower mold 30 when the gapG1 between the lower mold 30 and the middle 40 is equal to or greater than zero. In someembodiments, the middle mold 40 and the article 60 are tilted when the fulcrum 71 isdisposed within the lower mold cavity 33. In some embodiments, the middle mold 40 andthe article 60 are tilted when the fulcrum 71 is disposed above the lower mold 30.

[0092] FIG. 11 is a side view of a molding device 200 at operation 111 of the moldingmethod 100 according to some embodiments of the present invention. Referring to FIG.11, in some embodiments, in operation 111, after tilting the middle mold 40, the article60 is detached from the middle mold 40. In some embodiments, the article 60 is detachedfrom the second end 48 of the middle mold 40. In some embodiments, the tilted middlemold 40 and the gap G1 between the top surface 31 of the lower mold 30 and the bottomsurface of the middle mold 40 facilitates the detachment of the article 60.

[0093] In some embodiments, the additional pin 63 is removed from the article 60 so asto obtain the article 60 as shown in FIG. 12. In some embodiments, some of the moldingmaterial 60a enters the slit 191 and forms a flake (not shown) attaches to the article 60,the flakes is removed from the article 60.

[0094] FIG 12 is a schematic perspective view of the article 60 according to someembodiments of the present invention. In some embodiments, the article 60 includes abase portion 62 and at least one upper portion 61 connected to base portion 62. In someembodiments, the base portion 62 and the upper portion 61 are formed integrally andconcurrently. In some embodiments, there are no interface between the base portion 62and the upper portion 61.

[0095] FIGS. 13 to 20 illustrate a molding method for manufacturing an articleaccording to some embodiments of the present disclosure. In some embodiments, themethod is for manufacturing the article 60 shown in FIG. 12.

[0096] Referring to FIG. 13A, a molding device 300 is provided. The molding device300 includes an upper mold 20, a lower mold 30, a middle mold 40, a mold frame 37, aposition control mechanism 50, a tilt mechanism 70, and a gas discharging mechanism19. In the embodiment illustrated in FIG. 13A, the molding device 300 is in an openconfiguration. The upper mold 20, the middle 40, the position control mechanism 50, thetilt mechanism 70 of the molding device 300 illustrated in FIG. 13 is similar to themolding device 200 illustrated in FIG. 2A and FIG. 2B, except that the mold frame 37surrounds middle mold 40 and disposed between the upper mold 20 and the lower mold30, and the gas discharging mechanism 19 is arranged in the mold frame 37 and the lowermold 30.

[0097] In some embodiments, the upper mold 20 is placed on and engaged with the moldframe 37, and the mold frame 37 may be placed on and engaged with the lower mold 30.In some embodiments, the upper mold 20, the mold frame 37 and the lower mold 30 arecomplementary with and separable from each other. The upper mold 20 and the lowermold 30 may correspond to the mold frame 37 in some configurations such as dimension,shape or the like. In some embodiments, the upper mold 20, the mold frame 37 and thelower mold 30 are complementary with each other in order to define a mold cavity (notshown). In some embodiments, the upper mold 20, the mold frame 37 and the lower mold30 are separated from each other.

[0098] In some embodiments, the mold frame 37 includes a third opening 38, and thelower mold cavity 33 is defined by the third opening 38 of the mold frame 37 and the topsurface 31 of the lower mold 30 as shown in FIG. 14. In some embodiments, referring toFIG. 13A and FIG. 13B, the middle mold 40 is configured to dispose on the top surface31 of the lower mold 30, and a portion of the middle mold 40, a portion of the positioncontrol mechanism 50 and a portion of the tilt mechanism 70 are surrounded by the moldframe 37. In some embodiments, a portion of the top surface 31 of the lower mold 30configured to dispose the middle mold 40 over is coplanar with another portion of the topsurface 31 of the lower mold 30 configured to dispose the upper mold 20 over. In someembodiments, the mold frame 37 includes a top surface 371 and a bottom surface 372opposite to the top surface 371. The top surface 371 faces the upper mold 20 and thebottom surface 372 faces the lower mold 30.

[0099] Configuration (e.g., dimension or shape) of the upper mold cavity 23 of the uppermold 20 and the third opening 38 of the mold frame 37 may correspond to a configuration(e.g., dimension or shape) of the middle mold 40. In some embodiments, the hole structure34 is defined in the lower mold 30 and the mold frame 37. In some embodiments, the firsthole 341 includes an opening formed on the top surface 371 of the mold frame 37 andextends into the lower mold 30. In some embodiments, the biasing member 52 and thebar member 72 extend through the mold frame 37.

[00100] In some embodiments, the gas discharging mechanism 19 is disposed within themold frame 37 and the lower mold 30. The gas discharging mechanism 19 includes a gasconduit 192 disposed adjacent to the third opening 38 and defined by the mold frame 37and the lower mold 30, and a slit 191 jointly defined by the upper mold 20 and the moldframe 37 when the molding device 300 is in the closed configuration as shown in FIG.15. In some embodiments, the slit 191 is in communication with the third mold cavity14b and the gas conduit 192. In some embodiments, the slit 191 is indented from the topsurface 371 of the mold frame 37.

[00101] Referring to FIG. 14, the mold frame 37 is disposed on the lower mold 30, and adistance between the upper mold 20 and the mold frame 37 is reduced gradually. As shownin FIG. 14, a relative movement between the upper mold 20 and the mold frame 37 occurs.In some embodiments, the position of the upper mold 20 is fixed, and the mold frame 37,the lower mold 30 and the middle mold 40 are moved together toward the upper mold 20.In some embodiments, the positions of the mold frame 37, the lower mold 30 and themiddle mold 40 are fixed, and the upper mold 20 moves toward the mold frame 37, thelower mold 30 and the middle mold 40. At the stage illustrated in FIG. 14, the middlemold 40 is accommodated in the upper mold cavity 23 and not yet disposed in the lowermold cavity 33. That is, the middle mold 40 accommodates the upper mold 20 before themold frame 37 and the lower mold 30 accommodates the upper mold 20. In someembodiments, a gap G2 between the top surface 371 of the mold frame 37 and the bottomsurface of the middle mold 40 has not changed. In some embodiments, at the stageillustrated in FIG. 14, the gap G2 reaches its maximum value.

[00102] Referring to FIG. 15, in some embodiments, the upper mold 20 is engaged withthe mold frame 37 and the lower mold 30 to define an accommodating space 12 and themiddle mold 40 is disposed within the accommodating space 12, wherein the upper mold20, the middle mold 40, the mold frame 37 and the lower mold 30 jointly define a thirdmold cavity 14b. The third mold cavity 14b is configured to accommodate a moldingmaterial (not shown) and to mold the molding material into the article 60 havingpredetermined shape. The feeding port 24 of the upper mold 20 is in communication withthe third mold cavity 14b.

[00103] In some embodiments, the relative movement between the upper mold 20 and themold frame 37 continues until the distance between the upper mold 20 and the mold frame37 is reduced to zero. In some embodiments, the position of the upper mold 20 is fixed,the middle mold 40 accommodates in the upper mold 20, and the lower mold 30 and themold frame 37 move toward the upper mold 20. In some embodiments, the position of thelower mold 30 and the mold frame 37 are fixed, and the upper mold 20 and the middlemold 40 are moved together toward the mold frame 37 and the lower mold 30. In someembodiments, the top surface 31 of the lower mold 30 is in contact with bottom surfaceof the middle mold 40. In some embodiments, the gap G2 between the top surface 371 ofthe mold frame 37 and the bottom surface of the middle mold 40 has reduced to zero.

[00104] As shown in FIG. 15, the molding device 300 is in a closed configuration, andthe upper mold 20 is engaged with the mold frame 37, and the mold frame 37 is engagedwith the lower mold 30. In some embodiments, the bottom surface 22 of the upper mold20 contacts the top surface 371 of the mold frame 37, and the bottom surface 372 of themold frame 37 and the bottom surface 412 of the main portion 41 contacts the top surface31 of the lower mold 30. Thus, the upper mold 20, the mold frame 37 and the lower mold30 jointly define the accommodating space 12 for accommodating the middle mold 40.

[00105] The upper mold 20 applies a downward force to the middle mold 40, and themiddle mold 40 moves downwardly to press the biasing member 52. In someembodiments, an elastic potential energy is stored in the pressed biasing member 52 whenthe molding device 300 is in the closed configuration.

[00106] In some embodiments, an extruding system 10 configure to produce a moldingmaterial (not shown) is disposed over the molding device 300. In some embodiments, adischarging channel 10a communicable with the extruding system 10 and including anoutlet 10b disposed distal to the extruding system 10 and configured to discharge themolding material into the third mold cavity 14b is disposed over the molding device 300.The molding device 300 is configured to receive the molding material 60a from the outlet10b of the discharging channel 10a.

[00107] Referring to FIG. 16, is some embodiments, a molding material 60a is injectedinto the third mold cavity 14b and at least partially surrounding the middle mold 40 toform an article 60 in the third mold cavity 14b. In some embodiments, the opening 241of the feeding port 24 is engage with the discharging channel 10a. In some embodiments,the molding material 60a is injected into the third mold cavity 14b when the moldingdevice 300 is in a closed configuration or when the upper mold 20 is engaged with themold frame 37, and the mold frame 37 is engaged with the lower mold 30. In someembodiments, since the gas slits 191 of the gas discharging mechanism 19 are incommunication with the third mold cavity 14b, at least a portion of a gas is dischargedout of the third mold cavity 14b through the slits 191 after the injection of the moldingmaterial 60a. In some embodiments, due to a portion of the gas is discharged from thethird mold cavity 14b, there is room in the third mold cavity 14b for the molding material60a to foam.

[00108] In some embodiments, the molding device 300 is disposed over a platform 196having a first opening 196a as shown in FIG.6C. In some embodiments, a plunging forceprovided by a plunger 197 is applied to the molding device 300 during injection of themolding material 60a. The method of providing the plunger force to the molding device300 may be similar to the method of the application the plunging force to the moldingdevice 200 as shown in FIG. 6C.

[00109] In some embodiments, after the article 60 is formed in the third mold cavity 14b,discharging at least a portion of a gas out of the third mold cavity 14b through the slit191 of a gas discharging mechanism 19 adjacent to the third mold cavity 14b. After thearticle 60 is formed in the third mold cavity 14b, at least a portion of the gas is dischargedout of the third mold cavity 14b to the gas conduit 192 of the gas discharging mechanism19 through the slit 191 between the third mold cavity 14b and the gas conduit 192. Insome embodiments, the injection of the molding material 60a raises a pressure of the thirdmold cavity 14b, and the gas in the third mold cavity 14b enters the slits 191 due to thepositive pressure. In some embodiments, only the gas in the third mold cavity 14b entersthe slits 191, the molding material 60a remains in the third mold cavity 14b. In someembodiments, the portion of the gas is discharged out of the molding device 300 throughthe gas conduits 192 of the gas discharging mechanism 19.

[00110] Referring to FIG. 17, in some embodiments, the relative movement between theupper mold 20 and the mold frame 37 occurs, and the distance between the upper mold20 and the mold frame 37 increases gradually. Meanwhile, the article 60 is held orattached on the middle mold 40, and the additional pin 63 is still attached on the article60. In some embodiments, the position of the upper mold 20 is fixed, and the mold frame37 and the lower mold 30 is moved away from the upper mold 20. Meanwhile, the middlemold 40 is sustained in the upper mold 20. In some embodiments, the relative movementbetween the middle mold 40 and the mold frame 37 is achieved by a pushing force appliedto the middle mold 40 by the position control mechanism 50. Such pushing force isconverted from the elastic potential energy stored in the pressed biasing member 52 ofFIG. 16.

[00111] In some embodiments, the position of the mold frame 37 and the lower mold 30are fixed, and the upper mold 20 and the middle mold 40 move away from the mold frame37 and the lower mold 30 simultaneously. Meanwhile, the middle mold 40 is sustained inthe upper mold 20 and moved with the upper mold 20. In some embodiments, the relativemovement between the middle mold 40 and the mold frame 37 is achieved by a pushingforce applied to the middle mold 40 by the position control mechanism 50.

[00112] Referring to FIG. 18, in some embodiments, the middle mold 40 and the article60 are lifted from the lower mold 30 and over the mold frame 37 before tilting the middlemold 40, wherein the article 60 is held by the middle mold 40. In some embodiments, adistance between the middle mold 40 and the upper mold 20 is greater than a distancebetween the middle mold 40 and the mold frame 37. In some embodiments, a gap G2between the top surface 371 of the mold frame 37 and a bottom surface 412 of the middlemold 40 is generated by the position control mechanism 50 attached to the middle mold40 and the mold frame 37. In some embodiments, the gap G2 ranges between 45mm and150mm.

[00113] Referring to FIG. 19, in some embodiments, the middle mold 40 and the article60 are tilted relative to the lower mold 30 and the mold frame 37. In some embodiments,the middle mold 40 rotates around the fulcrum 71 to tilt the middle mold 40, and themiddle mold 40 has an angle σrelative to the lower mold 30 and the mold frame 37. Theangle σ ranges between 0 and 90 degree. In some embodiments, the angle σ rangesbetween20 and 70 degree. In some embodiments, the middle mold 40 and the article 60are tilted relative to the lower mold 30 and the mold frame 37 when the gap G2 betweenthe mold frame 37 and the middle 40 is equal to or greater than zero. In someembodiments, the middle mold 40 and the article 60 are tilted when the fulcrum 71 isdisposed within the lower mold cavity 33 and surrounded by the mold frame37. In someembodiments, the middle mold 40 and the article 60 are tilted when the fulcrum 71 isdisposed over the lower mold 30 and the mold frame37.

[00114] Referring to FIG. 20, in some embodiments, after tilting the middle mold 40, thearticle 60 is detached from the middle mold 40. In some embodiments, the article 60 isdetached from the second end 48 of the middle mold 40. In some embodiments, the tiltedmiddle mold 40 and the gap G2 between the top surface 371 of the mold frame 37 andthe bottom surface 412 of the middle mold 40 facilitates the detachment of the article 60.In some embodiments, the additional pin 63 is removed from the article 60 so as to obtainthe article 60 as shown in FIG. 8.

[00115] FIG. 21 is a flowchart showing a molding method 900 in accordance with someembodiments of the present disclosure. In some embodiments, the method 900 is formanufacturing the article 60 shown in FIG. 12. The method 900 includes severaloperations: (901) providing a lower mold and a middle mold moveably attached to thelower mold; (902) engaging an upper mold with the lower mold to define anaccommodating space and dispose the middle mold within the accommodating space,wherein the upper mold, the middle mold and the lower mold jointly define a first moldcavity; (903) injecting a molding material into the first mold cavity and at least partiallysurrounding the middle mold to form an article in the first mold cavity; (904) after orduring the formation of the article in the first mold cavity, discharging at least a portionof a gas out of the first mold cavity through a slit of a gas discharging mechanism adjacentto the first mold cavity; (905) disengaging the upper mold from the lower mold; and (906)detaching the article from the middle mold.

[00116] In some embodiments, the method 100 includes injecting the molding material60a from the extruding system 10 into the discharging channel 10a. FIG. 22 is a schematicdiagram of the extruding system 10 according to aspects of the present disclosure in someembodiments. The extruding system 10 includes a melting unit 120 and a mixing unit 130.In some embodiments, the extruding system 10 includes the melting unit 120, the mixingunit 130, a blowing agent supply unit 140, an injection unit 150, a first flow controlelement 161, a second flow control element 162, and a monitoring module 180.

[00117] In some embodiments, referring to FIG. 22, the melting unit 120 is configuredto convey the polymeric material. In some embodiments, the melting unit 120 includes apressing cartridge 121, a first feeding passage 122, a first discharging passage 123, anda pushing member 124. In some embodiments, the melting unit 120 further includes afeeding hopper 125.

[00118] In some embodiments, the first feeding passage 122 and the first dischargingpassage 123 are respectively disposed at two ends of the pressing cartridge 121. In someembodiments, the first feeding passage 122 communicates with an inner space 1211 ofthe pressing cartridge 121, and the first discharging passage 123 communicates with anexternal space of the pressing cartridge 121, wherein the first feeding passage 122 isconfigured to deliver the polymeric material to the inner space 1211 of the pressingcartridge 121. In some embodiments, the feeding hopper 125 is configured to deliver apolymeric material to the inner space 1211 of the pressing cartridge 121 through the firstfeeding passage 122.

[00119] The pushing member 124 is configured to convey the polymeric material fromthe first feeding passage 122 to the first discharging passage 123. In some embodiments,the pushing member 124 is disposed in the inner space 1211 of the pressing cartridge 121.In some embodiments, the pushing member 124 is disposed in the inner space 1211 of thepressing cartridge 121 between the first feeding passage 122 and the first dischargingpassage 123, and is used to force the polymeric material toward the first dischargingpassage 123. In some embodiments, the pushing member 124 is rotatable relative to thepressing cartridge 121. In some embodiments, the polymeric material is conveyed fromthe first feeding passage 122 to the first discharging passage 123 by rotation of thepushing member 124. In some embodiments, the pushing member 124 is immovable in adirection parallel to the longitudinal axis of the pressing cartridge 121.

[00120] In some embodiments, a length of the pushing member 124 extends along alength of the pressing cartridge 121, and a ratio of a shortest distance D1 between aninner sidewall 1212 of the pressing cartridge 121 and the pushing member 124 and adiameter D2 of the pushing member 124 is in a range of about 1:1500 to about 1:4500,and the polymeric material melted by the melting unit 120 may be uniformed. In someembodiments, a shortest distance D1 between an inner sidewall 1212 of the pressingcartridge 121 and the pushing member 124 is substantially equal to or less than 0.3 mm.In some embodiments, the shortest distance D1 between the inner sidewall 1212 of thepressing cartridge 121 and the pushing member 124 ranges between 0.01 and 0.05 mm.

[00121] The mixing unit 130 is configured to receive the polymeric material from themelting unit 120 and configured to mix the polymeric material with a blowing agent andto form a mixture of the polymeric material and the blowing agent. The mixing unit 130includes a hollow mixing cartridge 131, a second feeding passage 132, a seconddischarging passage 133, and a mixing rotor 134.

[00122] The second feeding passage 132 and the second discharging passage 133 arerespectively disposed at two ends of the mixing cartridge 131. In some embodiments, thesecond feeding passage 132 is configured to deliver the polymeric material. In someembodiments, the second discharging passage 133 is configured to discharge the mixture.

[00123] The mixing rotor 134 is configured to mix the polymeric material with theblowing agent to form a mixture in the mixing cartridge 131. In some embodiments, themixing rotor 134 is disposed in the mixing cartridge 131. In some embodiments, themixing rotor 134 is disposed in the mixing cartridge 131 between the second feedingpassage 132 and the second discharging passage 133, so as to agitate the mixture in themixing cartridge. The mixing rotor 134 is rotatable to mix the polymeric material withthe blowing agent and to convey the mixture of the polymeric material and the blowingagent from the second feeding passage 132 to the second discharging passage 133. Insome embodiments, the mixing rotor 134 is immovable in a direction parallel to thelongitudinal axis of the mixing cartridge 131.

[00124] In some embodiments, a length of the mixing rotor 134 extends along a lengthof the hollow mixing cartridge 131, and a ratio of a shortest distance D3 between an innersidewall 1311 of the hollow mixing cartridge 131 and the mixing rotor 134 and a diameterD4 of the mixing rotor 134 is in a range of about 1:1500 to about 1:4500, and the mixtureprepared by the extruding system 10 may be even and uniformed. In some embodiments,the mixture may be divided in to a plurality of portions, and a ratio of the blowing agentto the polymeric material of each portion of the mixture prepared by the extruding system10 is substantially constant. In some embodiments, a ratio of the polymeric material tothe blowing agent in a first portion of the mixture is substantially equal to a ratio of thepolymeric material to the blowing agent in a second portion of the mixture. In someembodiments, the shortest distance D3 between the inner sidewall 1311 of the hollowmixing cartridge 131 and the mixing rotor 134 is substantially equal to or less than 0.3mm. In some embodiments, the shortest distance D3 between the inner sidewall 1311 ofthe hollow mixing cartridge 131 and the mixing rotor 134 ranges between 0.01 and 0.09mm. In some embodiments, the diameter D2 of the pushing member 124 and the diameterD4 of the mixing rotor 134 may be same or different. In some embodiments, accordingto the different properties of the polymeric material and the mixture, the diameter D2 ofthe pushing member 124 is different from the diameter D4 of the mixing rotor 134.

[00125] FIG. 23 is an enlarged view of a portion of the extruding system according toaspects of the present disclosure in some embodiments. To enable the melted polymericmaterial and the blowing agent to mix uniformly in the mixing cartridge 131, in someembodiments, referring to FIGS. 22 and 23, the mixing rotor 134 further includes acolumn-like body 1341 in a cylindrical shape and rotatably disposed in the mixingcartridge 131, and a groove portion 1342 annularly arranged on the periphery of thecolumn-like body 1341. Therefore, when the column-like body 1341 rotates, thepolymeric material and the blowing agent are agitated by the groove portion 1342, so asto achieve a desired mixing effect. In some embodiments, the shortest distance D3 is ashortest distance between the groove portion 1342 and the inner sidewall 1311 of thehollow mixing cartridge 131.

[00126] In some embodiments, when the shortest distance D3 is a shortest distancebetween the groove portion 1342 and the inner sidewall 1311 of the hollow mixingcartridge 131, the shortest distance D3 ranges between 0.01 and 0.09 mm. In someembodiments, the diameter D4 of the mixing rotor 134 ranges between the 45 to 75 mm.Table 1 lists the shortest distance D3, the diameter D4 and the corresponding ratio of thea shortest distance D3 distance between the groove portion 1342 and the inner sidewall1311 of the hollow mixing cartridge 131 and a diameter D4 of the mixing rotor 134.

[00127] Table 1

[00128] In some embodiments, when the shortest distance D3 is substantially less than0.01mm, the blowing agent in a predetermined amount of the mixture is substantiallygreater than 0.8 per cm^3, as shown in FIG. 24. In some embodiments, if the blowing agentin the predetermined amount of the mixture is substantially greater than 0.8 per cm3, abubble density in the predetermined amount of the mixture after foaming is substantiallygreater than 180000 per cm^3.

[00129] In some embodiments, when the ratio of the shortest distance D3 to the diameterD4 ranges between 1:1500 and 1:4500, an evenness of the blowing agent to the polymericmaterial is optimized. In other words, a mixing of the blowing agent and the polymericmaterial by the mixing rotor 134 is even and uniform. In some embodiments, when theratio of the shortest distance D3 to the diameter D4 ranges between 1:1500 and 1:4500, aratio of the blowing agent to the polymeric material in a predetermined amount of themixture ranges between 4:1 to 3:1 as shown in FIG. 25. In some embodiments, the ratioof the blowing agent to the polymeric material in the predetermined amount of the mixtureis about 1:1. In some embodiments, if the ratio of the blowing agent to the polymericmaterial in the predetermined amount of the mixture ranges between 4:1 and 3:1 ratio ofbubbles to the polymeric material in the predetermined amount of the mixture afterfoaming also ranges between 4:1 and 3:1. In some embodiments, the ratio of the bubblesto the polymeric material in the predetermined amount of the mixture after foaming isabout 4:1.

[00130] In some embodiments, referring back to FIG. 22, the melting unit 120 includes ahollow pressing cartridge 121 configured to accommodate the polymeric material andhaving a first pressure, and the mixing unit 130 includes a hollow mixing cartridge 131having a second pressure. In some embodiments, in order to prevent backflow, the firstpressure is greater than the second pressure. In some embodiments, the polymericmaterial is drawn from the melting unit 120 toward the mixing unit 130 by the differencebetween the first pressure and the second pressure.

[00131] The blowing agent supply unit 140 is connected to the mixing unit 130 andconfigured to convey the blowing agent into the mixing unit 130. In some embodiments,the blowing agent supply unit 140 is positioned between the first flow control element161 and the second flow control element 162. In some embodiments, the blowing agentsupply unit 140 is positioned between the second feeding passages 132 and seconddischarging passage 133. In some embodiments, the blowing agent supply unit 140 isdisposed proximal to the first flow control element 161 and distal to the second flowcontrol element 162. In some embodiments, the blowing agent supply unit 140 is disposedproximal to the second feeding passage 132 and distal to the second discharging passage133.

[00132] In some embodiments, a blowing agent source (not shown) is connected to theblowing agent supply unit 140 and is configured to supply any type of blowing agentknown to those of ordinary skill in the art. In some embodiments, the blowing agent is inthe supercritical fluid state after being introduced into the mixing unit 130 by the blowingagent supply unit 140.

[00133] In some embodiments, the first flow control element 161 is disposed at a firstport 171 that connects the melting unit 120 to the mixing unit 130. The first port 171 isconfigured to introduce the polymeric material from the melting unit 120 into the mixingunit 130. The first port 171 is located between the melting unit 120 and the mixing unit130. In some embodiments, the first port 171 is configured to introduce the polymericmaterial from the pressing cartridge 121 of the melting unit 120 into the mixing cartridge131 of the mixing unit 130. In some embodiments, the polymeric material can beconveyed and / or drawn from the melting unit 120 to the mixing unit 130 through the firstport 171 by a pressure difference between the first pressure and the second pressure.

[00134] In some embodiments, the first flow control element 161 is disposed between themelting unit 120 and the mixing unit 130 and is configured to control flow of thepolymeric material from the melting unit 120 to the mixing unit 130. The first flowcontrol element 161 may be a valve, a movable cover or the like.

[00135] In some embodiments, the first flow control element 161 is configured to switchbetween an open configuration and a closed configuration. The open configuration of thefirst flow control element 161 allows the polymeric material to flow from the meltingunit 120 into the mixing unit 130, and the closed configuration of the first flow controlelement 161 prevents the polymeric material from flowing from the mixing unit 130 backto the melting unit 120.

[00136] In some embodiments, the first flow control element 161 is configured tomaintain a pressure difference between the melting unit 120 and the mixing unit 130. Insome embodiments, the first flow control element 161 is configured to maintain a pressuredifference between the melting unit 120 and the mixing unit 130 by switching betweenthe open configuration and the closed configuration, so that the polymeric material is notable to flow from the mixing cartridge 131 of the mixing unit 130 back to the pressingcartridge 121 of the melting unit 120. In some embodiments, the first flow control element161 is configured to adjust the first pressure and / or the second pressure in order tomaintain the pressure difference between the first pressure and the second pressure. Insome embodiments, the first flow control element 161 is in the closed configuration whenthe first pressure is similar to the second pressure.

[00137] In some embodiments, the injection unit 150 is configured to receive the mixturedischarged from the second discharging passage 133 of the mixing unit 130 and todischarge the mixture out of the injection unit 150. In some embodiments, the injectionunit 150 is configured to inject the mixture, and the discharging channel 10a iscommunicable with the injection unit 150.

[00138] In some embodiments, the injection unit 150 includes a hollow meteringcartridge 151 configured to accommodate the mixture. The metering cartridge 151 has ahollow inner space 1511, wherein the inner space 1511 is in communication with thesecond discharging passage 133 and configured to accommodate the mixture. Theinjection unit 150 further includes a connecting passage 152 in communication with theinner space 1511 of the metering cartridge 151 and a discharging member 153 slidablydisposed in the inner space 1511 of the metering cartridge 151 and configured todischarge the mixture out of the metering cartridge 151 through an outlet 154. In someembodiments, the mixture is flowed from the injection unit 150 into the dischargingchannel 10a.

[00139] In some embodiments, the discharging channel 10a is a mold of the moldingdevice 200, 300 is connected to the outlet 154. In some embodiments, the dischargingmember 153 is movable in a direction parallel to the longitudinal axis of the meteringcartridge 151 to inject the mixture accumulated in the metering cartridge 151 into themold through the outlet 154. The mixture is injected from the metering cartridge 151 intothe molding device 200, 300 or the discharging channel 10a by a pushing force from thedischarging member 153. In some embodiments, the discharging member 153 is notrotatable relative to the metering cartridge 151.

[00140] In some embodiments, the metering cartridge 151 has a third pressure. In someembodiments, in order to prevent backflow, the second pressure of the mixing cartridge131 is greater than the third pressure.

[00141] In some embodiments, the second flow control element 162 is disposed at asecond port 172 that connects the mixing unit 130 to the injection unit 150. The secondport 172 is configured to introduce the mixture from the mixing unit 130 into the injectionunit 150. The second port 172 is located between the mixing unit 130 and the injectionunit 150. In some embodiments, the second port 172 is configured to introduce themixture from the mixing cartridge 131 of the mixing unit 130 into the metering cartridge151 of the injection unit 150. In some embodiments, the mixture can be conveyed and / ordrawn from the mixing unit 130 to the injection unit 150 through the second port 172 bya pressure difference between the second pressure and the third pressure.

[00142] In some embodiments, the second flow control element 162 is disposed betweenthe mixing unit 130 and the injection unit 150 and is configured to control flow of themixture from the mixing unit 130 to the injection unit 150. The second flow controlelement 162 may be a valve, a movable cover or the like.

[00143] In some embodiments, the second flow control element 162 is configured toswitch between an open configuration and a closed configuration, wherein the openconfiguration allows the mixture to flow from the mixing unit 130 into the injection unit150 and the closed configuration prevents the mixture from flowing from the injectionunit 150 back to the mixing unit 130.

[00144] In some embodiments, the second flow control element 162 is configured tomaintain a pressure difference between the mixing unit 130 and the injection unit 150. Insome embodiments, the second flow control element 162 is configured to maintain apressure difference between the mixing unit 130 and the injection unit 150 by switchingbetween the open configuration and the closed configuration, so that the mixture is notable to flow from the metering cartridge 151 of the injection unit 150 back to the mixingcartridge 131 of the mixing unit 130. In some embodiments, the second flow controlelement 162 is configured to adjust the second pressure and / or the third pressure in orderto maintain the pressure difference between the second pressure and the third pressure.

[00145] In some embodiments, the blowing agent supply unit 140 is positioned betweenthe first port 171 and second port 172. In some embodiments, the blowing agent supplyunit 140 is disposed proximal to the first port 171 and distal to the second port 172.

[00146] The monitoring module 180 is configured to monitor the extruding system 10 inreal time. In some embodiments, the monitoring module 180 includes a central processor181 and a sensor 182 electrically connected to or communicable with the central processor181. In some embodiments, a plurality of sensors 182 are placed throughout the extrudingsystem 10 and configured to sense at least one processing condition (e.g., a flow rate orviscosity of the polymeric material along the melting unit 120, an amount of the mixtureaccumulated in the injection unit 150, the first pressure inside the melting unit 120, thesecond pressure inside the mixing unit 130, the third pressure inside the injection unit150, the pressure difference between the first pressure and the second pressure, thepressure difference between the second pressure and the third pressure, temperatures ateach unit, rotational speeds of the pushing member 124 and the mixing rotor 134, or flowrate and amount of the blowing agent through the blowing agent inlet 140) at apredetermined position of the extruding system 10 (e.g., the melting unit 120, the mixingunit 130, the injection unit 150, the blowing agent inlet 140, the first port 171, the secondport 172, the outlet 154, or the first and second flow control elements 161, 162). Forexample, at least one sensor 182 is installed at each unit for sensing the processingcondition at the corresponding unit. In some embodiments, the sensor 182 is configuredto detect the processing condition and transmit a signal or data based on the processingcondition detected to the central processor 181 for further analysis. The number of sensors182 may be adjusted according to requirements.

[00147] In some embodiments, the monitoring module 180 can automatically monitor andinstantly adjust the processing conditions at the corresponding positions of the extrudingsystem 10 in accordance with the processing conditions sensed by the sensors 182 and / orthe analysis of the central processor 181. The sensor 182 is not limited to any particulartype, as long as it can sense the processing condition and provide information aftersensing. The central processor 181 changes the processing condition with the information,so as to adjust the processing condition in each unit, in such a manner that the mixturethus obtained has the desired predetermined property.

[00148] An aspect of this disclosure relates to a molding device. The molding deviceincludes an upper mold; a lower mold disposed opposite to the upper mold; a middle molddisposed between the upper mold and the lower mold, and being moveably attached tothe lower mold; a position control mechanism attached to the middle mold and configuredto move the middle mold relative to the upper mold and the lower mold; and a gasdischarging mechanism disposed in the lower mold, the gas discharging mechanismincludes a gas conduit disposed adjacent to a mold cavity and defined by the lower mold,and a slit jointly defined by the upper mold and the lower mold when the molding deviceis in a closed configuration, and the slit is in communication with the mold cavity andthe gas conduit.

[00149] In some embodiments, the middle mold includes a first end and a second endopposite to the first end, the tilt mechanism is attached to the first end of the middle mold,and configured to incline the middle mold whereby the second end is higher than the firstend. In some embodiments, the second end of the middle mold includes a shoe last. Insome embodiments, the position control mechanism attaches to the first end of the middlemold and includes bar member connected to the middle mold and a biasing member forcontrolling a movement of the bar member. In some embodiments, the molding devicefurther includes a tilt mechanism attached to the middle mold and configured to tilt themiddle mold relative to the lower mold. In some embodiments, the tilt mechanismincludes a fulcrum for pivoting the middle mold. In some embodiments, the slit isindented from a top surface of the lower mold. In some embodiments, a height of the slitis less than a diameter of the gas conduit. In some embodiments, the molding devicefurther includes a platform disposed under the lower mold, wherein the platform includesa first opening extending through the platform; and a plunger disposed under the platform,wherein the plunger includes a base and a rod, the rod is extendable through the firstopening toward the molding device and retractable toward the base. In someembodiments, the lower mold includes a second opening configured to receive at least aportion of the rod, and the second opening is overlapped with the first opening from a topview.

[00150] An aspect of this disclosure relates to a molding method. The molding methodincludes providing a lower mold and a middle mold moveably attached to the lower mold;engaging an upper mold with the lower mold to define an accommodating space anddispose the middle mold within the accommodating space, wherein the upper mold, themiddle mold and the lower mold jointly define a first mold cavity; injecting a moldingmaterial into the first mold cavity and at least partially surrounding the middle mold toform an article in the first mold cavity; after the article is formed in the first mold cavity,discharging at least a portion of a gas out of the first mold cavity through a slit of a gasdischarging mechanism adjacent to the first mold cavity; disengaging the upper moldfrom the lower mold; and detaching the article from the middle mold.

[00151] In some embodiments, the method further includes lifting the middle mold andthe article from the lower mold before tilting the middle mold, wherein the article is heldby the middle mold. In some embodiments, the method further includes tilting the middlemold and the article relative to the lower mold. In some embodiments, the middle moldincludes a first end and a second end opposite to the first end, and the first end is lowerthan the second end when the middle mold is tilted. In some embodiments, the article isdetachable from the second end of the middle mold. In some embodiments, the methodfurther includes after the article is formed in the first mold cavity, separating the uppermold and the lower mold to form a second mold cavity and discharge at least a portion ofa gas out of the second mold cavity. In some embodiments, the method further includesafter the article is formed in the first mold cavity, discharging at least a portion of thegas out of the first mold cavity to a gas conduit of the gas discharging mechanism throughthe slit between the first mold cavity and the gas conduit.

[00152] In some embodiments, the method further includes disposing the upper mold, themiddle mold and the lower mold over a platform including a first opening extendingthrough the platform; disposing a plunger under the lower mold and the platform, whereinthe plunger includes a base and a rod extendable toward the lower mold and retractabletoward the base; and applying a plunging force to the lower mold and the upper mold byextending the rod through the first opening towards the upper mold during the injectionof the molding material into the first mold cavity. In some embodiments, the methodfurther includes retracting the rod towards the base after the injection of the moldingmaterial to discharge at least a portion of a gas out from the first mold cavity. In someembodiments, the rod contacts the lower mold during the application of the plungingforce.

[00153] The foregoing outlines features of several embodiments so that those skilled inthe art may better understand the aspects of the present disclosure. Those skilled in theart should appreciate that they may readily use the present disclosure as a basis fordesigning or modifying other processes and structures for carrying out the same purposesand / or achieving the same advantages of the embodiments introduced herein. Thoseskilled in the art should also realize that such equivalent constructions do not depart fromthe spirit and scope of the present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spirit and scope of thepresent disclosure.

[00154] Moreover, the scope of the present application is not intended to be limited tothe particular embodiments of the process, machine, manufacture, composition of matter,means, methods and steps described in the specification. As one of ordinary skill in theart will readily appreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps, presentlyexisting or later to be developed, that perform substantially the same function or achievesubstantially the same result as the corresponding embodiments described herein, may beutilized according to the present invention. Accordingly, the appended claims areintended to include within their scope such processes, machines, manufacture,compositions of matter, means, methods and steps.

Claims

1. A molding device, comprising: an upper mold; a lower mold disposed opposite to the upper mold; a middle mold disposed between the upper mold and the lower mold, and being moveably attached to the lower mold; a position control mechanism attached to the middle mold and configured to move the middle mold relative to the upper mold and the lower mold; and a gas discharging mechanism disposed adjacent to a mold cavity defined by the upper mold, the middle mold and the lower mold, wherein the gas discharging mechanism includes a gas conduit and a slit communicable with the mold cavity and the gas conduit and jointly defined by the upper mold and the lower mold when the molding device is in a closed configuration.

2. The molding device of claim 1, wherein the position control mechanism attaches to the first end of the middle mold and includes bar member connected to the middle mold and a biasing member for controlling a movement of the bar member.

3. The molding device of claim 1, further comprising: a tilt mechanism attached to the middle mold and configured to tilt the middle mold relative to the lower mold.

4. The molding device of claim 3, wherein the middle mold includes a first end and a second end opposite to the first end, the tilt mechanism is attached to the first end of the middle mold, and configured to incline the middle mold whereby the second end is higher than the first end.

5. The molding device of claim 1, wherein the slit is indented from a top surface of the lower mold.

6. A molding method, comprising: providing a lower mold and a middle mold moveably attached to the lower mold; engaging an upper mold with the lower mold to define an accommodating space and dispose the middle mold within the accommodating space, wherein the upper mold, the middle mold and the lower mold jointly define a first mold cavity; injecting a molding material into the first mold cavity and at least partially surrounding the middle mold to form an article in the first mold cavity; after or during the formation of the article in the first mold cavity, discharging at least a portion of a gas out of the first mold cavity through a slit of a gas discharging mechanism adjacent to the first mold cavity; disengaging the upper mold from the lower mold; and detaching the article from the middle mold.

7. The method of Claim 6, further comprising: lifting the middle mold and the article from the lower mold before tilting the middle mold, wherein the article is held by the middle mold.

8. The method of Claim 6, further comprising: tilting the middle mold and the article relative to the lower mold.

9. The method of Claim 6, wherein the middle mold includes a first end and a second end opposite to the first end, and the first end is lower than the second end when the middle mold is tilted.

10. The method of claim 6, further comprising: after or during the formation of the article in the first mold cavity, discharging at least a portion of the gas out of the first mold cavity to a gas conduit of the gas discharging mechanism through the slit between the first mold cavity and the gas conduit.