PLANT AND METHOD FOR PROCESSING SLABS

Description

DESCRIPTION of the Italian Patent for Industrial Invention entitled: “PLANT AND METHOD FOR PROCESSING SLABS” on behalf of BMR SPA with headquarters in 40026 IMOLA (BO). 5 * * * * * TECHNICAL FIELD The present invention relates to the field of processing ceramic slabs, such as ceramic slabs, porcelain stoneware, natural stone slabs and similar. 10 In particular, the invention relates to a method of controlling a plant for the sheet processing and related equipment. PRE-EXISTING TECHNIQUE There are known plants for the processing of ceramic slabs (slabs of ceramic material) 15 mico, porcelain stoneware, natural stone slabs and similar), for example for the finishing of the same, which generally include at least one transporter capable of provide a support surface for the plates, which is movable along a predetermined direction of advance, and one or more tools each of which is capable of intercepting to cut the plate, using a respective working head placed under pressure in contact 20 with a surface of the plate itself, in order to carry out the necessary processing ria. These systems generally end with a polishing machine, which is configured to deliver a treatment product (e.g. a so-called “wax”) which, spread by the mechanical friction action of the tools (equipped with appropriate 25 pads), solidifying by thermal effect, it adheres permanently to the surface of the slabs, helping to increase their shine (i.e. the degree of gloss) and, at the same time, occluding any open porosities and protecting the la- ceramics themselves from chemical-physical attacks. These treatment products each have a predetermined temperature range. 5. The maximum permitted shelf life declared by the manufacturer within which the product must be brought to treatment (due to the aforementioned friction) so that it solidifies / polymerizes rizzi in an optimal way. In fact, if the temperature reached during the processing phase is not sufficient, the pro- treatment duct does not solidify properly, if instead the temperature 10 exceeds a maximum value then the treatment product may solidify sooner over time and / or its colour may vary (for example it turns yellow) making the ineffective and / or unsatisfactory treatment. A need felt in the sector is to allow for control of the work increasingly accurate, so as to be able to compensate for any labour variables 15 processing and alterations with respect to the expected behavior of the treated product ment that can occur for various reasons during processing. It is an object of the present invention to meet such (and other) needs. of the known art, within the scope of a simple, rational and cost-effective solution content. DISCLOSURE OF THE INVENTION This aim is achieved by the features of the invention reported in the claims. independent claims. Dependent claims outline preferred and / or particularly advantageous of the invention. 25 The invention, in particular, provides a method for the processing of plates comprising of: - advance a plate along a feed direction; - dispense a quantity of a treatment product, preferably in its original state fluid, on the surface of the plate; 5 - carry out a polishing process on the said surface of the metal plate during a tool, during the advancement of the plate and after / during the erosion treatment product ration; - detect a temperature value of the surface of the plate during the la- processing of the same during the polishing process of the same; 10 - check that the detected temperature value remains within a reference range, between a minimum and a maximum value, where the reference range is pre-set based on the type and / or composition of the treatment product delivered (or more precisely check at least one operating parameter of the tool and / or pro- 15 treatment induced so that the detected temperature value remains within within a reference range, between a minimum value and a minimum value maximum, where the reference range is pre-set based on the type- (logy and / or composition of the treatment product supplied); - detect / obtain at least one map or image or matrix of at least para- 20 meters indicative of the morphology and / or quality of surface processing of the plate following the polishing process carried out by the tool; and - change the reference range if in the map or image or matrix it is detected vata is identified as a manufacturing defect attributable to the manufacturing process of polishing and / or treatment product. 25 Thanks to this solution, it is possible to allow control of the processing increasingly accurate, so as to be able to compensate for any work variables tion and alterations with respect to the expected behavior of the treatment product which can occur for various reasons during processing. In fact, it has been observed that, if the reference range of the product being treated 5 ment is not correct or, for various reasons (environmental conditions and / or system and / or of the tools used), the treatment product solidifies / polymerizes within the range different thermal than those indicated by the manufacturer, the treatment product solidifies in patches on the surface of the plate leaving raised spots / spots on of it. 10 Changing / adjusting the reference range if this defect is found allows you to pre- to come / limit the formation and / or repetition of such defects on the batch of sheets in la- processing, increasing the overall efficiency of the plant and / or method. Advantageously, the aforementioned control phase may include: - compare the detected temperature value with the reference range (e.g. 15 example which is updated / modified as needed); and - operate an adjustment of at least one operating parameter of the tool and / or the treatment product, if said detected temperature value is outside the reference range. In particular, the method allows to regulate the functioning of the working tool 20 ration both when the detected temperature is too high, so as to pre- damage to the tool itself and therefore the production of non-corresponding plates to the required quality standards, both when the temperature is too low, an indication of ineffective processing which would also lead to the creation of slabs that have not been processed correctly and should therefore be discarded. 25 Another aspect of the invention provides that said processing can be carried out plan to: - place the tool in motion, preferably rotating and / or rotating translation, in contact with the surface of the plate on which the product was dispensed treatment product, at a given working pressure value. 5 Thanks to this solution the method allows to obtain a surface finish of the plate in a controlled manner. In particular, this surface finishing process allows to obtain an effect polishing (gloss) of the surface of the plate, for example a top surface or in view of the same, and a protection of the same from stains and in general from 10 chemical attack. Again, another aspect of the invention provides that said regulation is operated may include at least one of the following phases: - vary the quantity of product dispensed on the surface of the plate (for example maybe within an operating range between a minimum threshold value 15 and a maximum threshold value); and / or - vary the working pressure value of the tool head (for example within an operating range between a lower threshold value (a higher threshold value). Thanks to this solution, the method allows to operate the alternative regulation- 20 mind or in combination of several tool machining parameters, so as to allow for versatile adjustment of the work carried out based on the temp- detected perforation. In particular, the method can involve varying one of the quantities of pro- delivered duct and the working pressure value if the detected temperature value, 25 is higher than the maximum value, and the difference between the detected value and the value maximum is less than or equal to a predetermined value, or it can provide for vary both the quantity of product dispensed and the working pressure value if the detected temperature value is higher than the maximum value and the difference between the detected value and the maximum value is higher than said predetermined value. 5 Similarly, the method can involve varying one of the quantities of product dispensed and the working pressure value if the detected temperature value is less than the minimum value, and the difference between the detected value and the minimum value is less than or equal to a predetermined value, or may be expected to vary both the quantity of product dispensed and the working pressure value if the value 10 of the detected temperature is lower than the minimum value, and the difference between the detected value value and the minimum value is greater than said predetermined value. A further aspect of the invention provides that the method may include further rather than waiting a predetermined period of time between one operation and adjustment and a subsequent adjustment operation. 15 Thanks to this solution, the method allows the temperature to be adjusted machined surface once the adjustment operation has been performed before even- currently make a subsequent adjustment if the temperature is still cora outside the reference range. Furthermore, a further aspect of the invention provides that said regulation is operated 20 can be expected to vary the value of the working pressure within the range operating if the quantity of product dispensed is equal to the maximum threshold value. Thanks to this solution, the method allows to operate initially exclusively by regulating the quantity of product dispensed, and only subsequently to adjust the working pressure if the detected temperature is 25 continues to be outside the reference range, so as to react with a single adjustment operation at a time. Another aspect of the invention provides that said regulation can be pre- see to vary the quantity of product dispensed on the surface of the plate inside within the operating range if the working pressure value of the tool head 5 is equal to the upper threshold value. Thanks to this solution, the method allows to operate initially exclusively by adjusting the working pressure value, and only subsequently- mind to operate a variation in the quantity of product dispensed, so as to try where possible to minimize the quantity of product dispensed (avoiding squeezing 10 chi) and therefore the processing costs. Advantageously, the method may comprise analyzing the map or image or matrix detected to identify any manufacturing defects, in which each di- manufacturing defect is a defect localized on one or more areas of the map or image analyzed matrix or matrix, preferably traceable to a localization machine 15 embossed and / or with a polishing level lower than a predetermined value of reference clarity (in which a crystallization of the treatment product is observed) chin on the upper surface of the plate). Again, to change the reference range one can mean to decrease the said maximum value of the reference range. 20 For the same purposes set out above, the invention further makes available an im- plant for the processing of slabs which includes: - a conveyor equipped with a support surface movable in one direction of advancement, wherein said support plane is configured to support at least one plate; 25 - a dispensing device configured to dispense a specified quantity of a treatment product, preferably in a fluid state, on the surface of the slab; - at least one tool suitable for carrying out a polishing operation on a surface of the plate during the advancement of the plate along the direction 5 of progress; - at least one sensor device configured to detect one of the surfaces of the slab; - at least one detection device configured to detect at least one map or image or matrix of at least one parameter indicative of the morphology 10 quality and / or surface finish of the slab following la- polishing process performed by the tool; and - an electronic control apparatus configured to perform the method so- as described. Thanks to this solution, the invention allows the processing of sheets, 15 at the same time monitoring the correct operation of the system in order to correct to carry out the work in progress in order to avoid both damage to the tool and the reaction processing of slabs that do not comply with the required quality standards and therefore to be discarded tare. Another aspect of the invention provides that the tool may comprise the uten- 20 sile includes a head equipped with polishing pads and suitable to be in contact with the surface of the plate, the head being rotatable around an axis of rotation action and / or revolution orthogonal to the support plane and / or mobile in translation along a direction orthogonal to the support plane and orthogonal to the direction of progress. 25 For example, the dispensing device can be arranged in tool proximity / match. For example, the tool can be movable along an approach / aft direction distance from the support plane substantially orthogonal to the support plane gio, by means of an actuator operated by a pressure regulator device. 5 Yet, another aspect of the invention provides that the detector device temperature may include a laser pyrometer. Thanks to this solution, the system is equipped with a non-contact temperature detector contact, and also particularly effective and robust. A further aspect of the invention provides that the system can further 10 including a temperature sensing device protection apparatus. Thanks to this solution, the temperature detector device is protected from powders or waxes that are usually created during the processing of plate and which could otherwise alter or completely compromise it the operation. 15 Advantageously, the detection device may comprise at least one of a scanner and a glossmeter, and is configured to map the entire surface of the plate advancing along the direction of advance and generate a map or image or matrix of at least one parameter indicative of the morphology and / or the degree of polishing of the surface of the slab. BRIEF DESCRIPTION OF THE DRAWINGS Further features and advantages of the invention will become apparent from reading of the following description provided by way of example and not limitation, with the au- silence of the figures illustrated in the attached tables. 25 Figure 1 is a schematic front view from above of a system according to the invention. Figure 2 is a schematic sectional view along line II-II of Figure 1. Figure 3 is a schematic sectional view along line III-III of Figure 1. Figure 4 is a block diagram view of the system. DETAILED DESCRIPTION With particular reference to these figures, a global figure of 10 has been indicated plant for the processing of T-slabs, such as ceramic T-slabs, tiles (e.g. porcelain stoneware), natural stone slabs and similar, indicated glo- 10 balmente with the letter. Preferably, the system 10 is configured to perform a finishing process. continuous surface treatment, such as polishing, of said T plates. In particular, this surface finishing process (polishing) can be used to obtain the polishing of the T plate and at the same time the protection of the 15 itself from stains and from chemical agents in general, for example by applying application of a treatment product (also called wax) to be spread evenly on a surface (previously mechanically sanded and / or lapped). Each T plate essentially has the shape of a parallelepiped with high height (thickness) and with a substantially quadrangular base (in plan), 20 rectangular or square example, that is, presenting two opposing surfaces larger of which a lower surface and an upper surface S or in view, and four connecting sides between the upper surface and the lower surface of of which two first flanks are opposite and substantially parallel and two second flanks adjacent to the first flanks and opposite each other and substantially parallel. 25 The plant 10 comprises at least one polishing machine 100, which is configured to polish (applying a treatment product, as best as will be described below) a surface, for example the upper surface S, of the T plate. For example, the system 10 – as known to the technician in the sector – comprises one or 5 more sanding and / or lapping machines, for example placed upstream of the machine polishing with respect to a direction of advancement of the plates T along the line of production of plant 10, which are suitable for smoothing and / or lapping, with appropriate tuni abrasive tools, the surface, for example the upper surface S, of the plate T intended to be then polished by the polishing machine 100. 10 For example, between the sanding and / or lapping machine(s) and the polishing machine datura 100 can be present a pickling machine (chemical), configura- installment for pickling (for example with alcoholic substances) the upper surface S, of the T plate intended to be polished by the polishing machine 100. The plant 10, in particular the polishing machine 100, comprises first of all 15 a conveyor 15, which is equipped with a support frame and an ap- support, for example substantially horizontal, on which can be arranged one or more T plates are supported. For example, the support frame can be defined by two lateral sides, parallel lele and mutually opposed, between which the plan of 20 support. The conveyor 15 further comprises a drive assembly (not illustrated) with- figured in such a way as to move the support surface, and therefore advance one or more plates T arranged on it, along a parallel direction of advancement A to the support plane, for example substantially horizontal, and parallel to the sides 25 side frames of the support frame. For example, the conveyor 15 may be a belt or belt conveyor 15. gravel / eo, alternatively, a 15 roller conveyor or other. The drive unit may comprise one or more electric motors capable of putting into operation rotation of the rollers or pulleys around which the said tape or belt(s) is wound 5 ghia / e. The T-slabs are then arranged with their lower (or laying) surface in support and in contact with the support surface itself and the opposing surface upper S (or in sight) facing upwards and, for example, with the first sides parallel to the direction of travel A. 10 The plant 10, in particular the polishing machine 100, further comprises al- minus a tool 20, preferably a plurality of tools, e.g. arranged in succession to each other along the direction of travel A, each of the which is suitable for carrying out a polishing process on a surface of the slab T, for example a surface finishing (polishing) process of the surface 15 upper S (or in view) of the T plate. For example, the plant 10, in particular the polishing machine 100, comprises a plurality of tools 20 which are fixed to a longitudinal beam 25, (having longitudinal axis) parallel to the direction of advancement A, which maintains the various 20 tools suspended on the support surface, superimposed in plan on the work surface 20 support at a non-zero distance from it, at an adjustable height, for example in manual or automated mode, depending on the thickness of the sheet T to be worked rare. The longitudinal beam 25 is also movably associated with the supporting frame, e.g. pio move in oscillation / swinging horizontal translation in one direction of 25 horizontal and orthogonal oscillation to the direction of advancement A from at least a suitable motor, for example variable speed and / or adjustable in function of the desired surface finish on the T-plate. Each tool 20 is adapted to come into contact with said surface of the plate T (for example the so-called upper surface S) during the advancement of the same 5 along the feed direction A so as to perform the machining of the light- necessary dating. For example, each tool 20 is adapted to come into contact with the surface su- upper S (in view) of the plate T in order to carry out a finishing operation superficial. 10 Each tool 20 comprises a linear actuator having an associated body to the supporting frame, i.e. rigidly fixed to the longitudinal beam 25, and of one stem movable along a transverse direction, for example orthogonal, to the plane of support. At one end of the movable stem distal to the actuator body 15 linear tore is connected a work head, for example a polishing head, the which is rotated around a transverse axis, for example substantially orthogonally to the support plane by means of a respective group of movements mention itself known and not described in detail. The work head is equipped with a plurality of pads, for example made of te- 20 suto (non-abrasive), configured to polish (by friction) the upper surface S of the plate T advancing along the direction of advance A. The movable stem of the linear actuator, moving along the said orthogonal direction at the support surface, moves the work head towards / away from the support surface from the support surface of the conveyor 15, so as to place it in contact with the plate 25 T advancing along the advancing direction A and pressing on the upper surface S of the same for the creation of the so-called surface finish. Each tool 20 is also equipped with a pressure regulator device 30, of known to the expert in the field and therefore not described in detail, which, ac- by moving the linear actuator, it allows you to adjust a working pressure value of the 5 work head of tool 20 on plate T resting on the support surface. In other words, the pressure regulator varies the working pressure by varying the thrust (along the said direction orthogonal to the support plane in the direction of approach (mind to the same) that the linear actuator imparts, by means of the actuator stem linear, to the work head towards the support plane and then against the surface 10 of the T plate to be worked (finished) (for example the upper surface S). More precisely, by increasing the working pressure value, you get a thrust greater, decreasing the working pressure value results in less thrust. The system 10, in particular the polishing machine 100, and / or one or more of the tools sili 20 (preferably each tool 20) further comprises an ero- 15 gator 35 of a treatment product, which is configured to deliver a quan- predetermined quantity of said treatment product, for example in the fluid state (a room temperature), on the surface to be worked of the T plates resting on the support surface and workpiece under the work head. For example, said treatment product is a chemical product in the fluid state, 20 preferably liquid, which – once spread, solidified and polished – still remains in irreversibly to the upper surface S of the plate T and generates a gloss effect (polishing) on ​​the machined surface of the plate T, for example called surface su- upper (or visible) S, also acting as protection from stains and from attack by chemical agents in general. 25 The treatment product dispensed on the upper surface S of the plate T is there applied (spread evenly), so as to form a thin veil / layer that covers over the entire upper surface S of the plate T (e.g. uniformly or from fill any morphological defects of the same), for example due to the effect of rubbing mechanical (non-abrasive) movement of the tools 20 on the upper surface S 5 of the plate T in the relative motion between them and the plate T. Each dispensing device 35 comprises a connected pumping unit to a tank of said treatment product and configured to draw said predetermined amount of treatment product. The pumping unit is also configured to inject said quantity of pro- 10 treatment duct in an inflow channel ending in a delivery mouth, which is placed near the work head (for example inside the space surrounded by the same pads), which defines a nozzle from which the direct treatment product (e.g. orthogonally) on the surface to be la- working on the T plate. 15 The dispensing mouth is for example placed in a central position, preferably coaxially, with respect to the axis of rotation of the work head. The increase in temperature of the treated product, caused by friction caused by the tools 20 on the upper surface S of the plate T, in the action of application of the treatment product on the upper surface of the same, 20 causes – for example due to polymerization of the treatment product – the solidification cation of the treatment product itself, for example of the treatment product veil coating that covers the entire upper surface S of the plate T, thus the product of solidified treatment adhering immovably and permanently to the surface upper surface S of the plate T which covers completely. 25 At the same time, the polishing effect of the treatment product thus spread by the tools 20 (and solidified and / or polished in situ) brings the upper surface S of the T plate with gloss / shininess values ​​lower than 70 GLOSS (before processing) above mentioned application of the treatment product using the tools 20) to va- Gloss / shine levels above 95 GLOSS, for example between 95 GLOSS 5 and 100 GLOSS, (after the above mentioned process of applying the treatment product) ment using the tools 20). Plant 10, in particular polishing machine 100, further comprises at least one sensor device P, for example associated with one of the tools 20 or in any case placed above the support surface on which the slabs pass 10 T, which is configured to detect (values ​​of) a surface temperature upper S of the plate T during the processing phase carried out by one or more than 20 tools. In practice, the P-sensor device is configured to detect (and measure) the tempera- surface of the upper surface S of the plate T, which temperature (is higher 15 of the ambient temperature e) rises due to the rubbing (friction) between (the pads of) the tools 20 and the upper surface S of the plate T (with interpos- position of the aforementioned treatment product). Preferably, the plant 10, in particular the polishing machine 100, com- takes a plurality of sensor devices P each of which is associated with a 20 respective tool 20 of the plurality of tools 20, e.g. at least one device P detector for each tool 20. Each P sensor device is configured to detect a respective temperature of the upper surface S of the plate T during the processing carried out by the respective tive tool 20 (i.e. raised by the rubbing of the respective tool 20 on the 25 same). Each P-sensor device is preferably configured to detect the temperature surface treatment of the plate T without contact (with it), i.e. re- being placed at a non-zero distance from it. For example, each P-sensor device can be configured to detect the 5 temperature of the upper surface S of the plate T remaining at a distance (along a direction substantially orthogonal to the upper surface S same) from the same up to 1200 mm or even higher. Furthermore, each P-sensor device can be configured to detect a temp- operating in a temperature range between -30°C and 1000°C. 10 Preferably, each sensor device P comprises (or consists of) a laser pyrometer, preferably arranged so that the emitted laser beam strikes substantially orthogonally to the support plane (i.e. to the super-surface (upper S of plate T). Each P-sensor device is, for example, arranged at / near 15 mity of a respective tool 20, superimposed in plan on the mobile support plane and overlooking it (at a non-zero distance from the support surface). For example, each P-sensor device can be fixed to the longitudinal cross-member tudinal (and mobile with it) in correspondence / proximity to a respective tool 20. 20 Furthermore, each sensor device P is preferably arranged at a distance from the support plane, with respect to a direction orthogonal to the support plane same, less than or equal to 500 mm. The system 10 also comprises a device protection apparatus 40 sen- P-sensor, configured to avoid the possibility of processing waste (such as dust) 25 or splashes of treatment product), which are normally generated during the processing of the T plate, may disturb / disturb the P sensor device and alter and / or compromise its correct functioning. For example, the plant 10, in particular the polishing machine 100, comprises a plurality of protection devices (one for each P sensor device) each 5 of which is associated with a respective sensor device P of the plurality of devices positive P sensors. Each protective apparatus 40 may comprise a casing, selectively connectable to the P-sensor device, for example by means of screwing means, suitable for at least partially accommodating the P sensor device. 10 More precisely, the protection apparatus 40 is designed to accommodate at least the port position of the P detector device facing the support surface. Each protective device 40 may have, for example, a cavity pass- sante that allows the sensor device P to face the upper surface higher S of the plate T to be worked in order to detect its temperature, for example 15 so as to allow the laser beam emitted by the sensor device P to affect on the support surface, i.e. on the upper surface S (being worked on) of the T plate resting on it. Each protection apparatus 40 then comprises associated pneumatic means to the casing and configured to introduce a flow of air inside it 20 compressed, preferably a continuous flow, which, when placed inside the envelope profit and exiting through the cavity, allows to avoid the deposit processing waste on the P-sensor device, for example at a pyrometer lens through which the laser beam is emitted. The system 10 further comprises a detection device 50 configured to 25 detect at least one map (or image) or matrix of at least one indicative parameter of the morphology and / or quality of processing of the surface of the slab afterwards to the processing performed by the tool. The detection device 50 is, for example, arranged downstream of the machine polishing 100 in the direction of advancement of the plates T in the direction of advancement 5 chin A. The detection device 50 is, for example, a device for detecting polishing defects on a moving plate (i.e. essentially a scan- ner), for example as described in Italian patent application no. 102022000019575 which is hereby incorporated by reference, and / or a device 10 for the measurement of a parameter indicative of a degree of polishing of a slab in movement (i.e. essentially a glossmeter), for example like the one de- written in the Italian patent application no. 102021000028331 which is intended here incorporated by reference. For example, the detection device 50, of the type of a device for detecting 15 polishing defect detection, is configured to detect an image (or map) of the entire upper surface S of the plate T which passes under it (along the direction of advance A), when with a detection device arranged to a predetermined (fixed) distance from the upper surface S of the plate T in transit on the support surface (i.e. at a height above the support surface 20 21 variable depending on the thickness of the T plates in transit on it). In practice, the detection apparatus of such detection device 50 is configured designed to detect an image or map of the entire L1 (illuminated) surface of the plate T, both in width and length, while plate T passes under it during the relative motion between plate T (in motion on the support plane) and the apparatus 25 detection 40. The detection device 50 is equipped, for example, with a processing module tor, such as a microprocessor or processor, and a me- moria, which is preferably configured to detect polishing defects on a qua- any (and each) upper surface S of the plate T in transit on the plane of 5 support (and scanned by the detection apparatus), for example in the image or map obtained by scanning the entire upper surface S of the plate T. In particular, the electronic processing module for each T plate is configured to receive / acquire, from the detection apparatus, as input, an image or map of the (entire) upper surface S; and analyze (each) image or 10 received map, for example with an appropriate image analysis software and / or maps. In practice, the processor module is configured to identify (at least) one defect of processing (attributable to the processing and / or treatment product on the upper surface S of the plate T), for example a defect selected in the com- group 15 taking or consisting of scratches, nicks, grooves, holes, depressions (or reliefs), shadows or similar, in the detected image or map. For example, the manufacturing defect is represented in the image or map. vata by means of one or more pixels or areas having a chromatic parameter (for example color or intensity or other) different from the background (prevalent color). 20 Of the detected manufacturing defect, the processing module can be configured to determine / calculate / measure shape, dimensions (for example one or more of the di- dimensions between length, width, area or other) and intensity (which is a parameter indicative of the depth / height of the defect detected) and / or location (on a system virtual XY Cartesian of the image and, therefore, of the surface L1 of the plate T). 25 Again, the identify phase may include a discriminate / recognize a surface defect, as defined above, of the surface upper surface S between a defect of the upper surface of the plate T (such as scratches or holes or similar) from a defect in the treatment product (such as depressions, yellowing elements, reliefs having shapes and dimensions typical of machines or deposits 5 located on the upper surface S of the plate T). For example, to discriminate / recognize defects present in the image and / or map purchase, the processor module can be programmed by an al- artificial intelligence algorithm (e.g. machine learning, i.e. a previously appropriately trained machine learning algorithm. 10 For example, the sensing device 50, of the type of a measuring device of a parameter indicative of a degree of polishing of a moving plate, is configured to determine the values ​​(Gloss, preferably Gloss 60) of the parameter indicative of the degree of polishing of the upper surface S of the plate T for the in- tera dimension of the upper surface S of the plate T. 15 In particular, the detection device 50 (with its own measuring apparatus, of the type of one or more glossmeters), for each plate T, is configured to receive, from the app- measuring set, as input the measurement values ​​(of the intensity I of the light beam reflection and the reference values ​​of intensity I of the emitted light beam) and provide as output an image / map or heat map (two-dimensional or three-dimensional), 20 in which the values ​​(Gloss, preferably Gloss 60) of the indicative parameter are reported of the degree of polishing of the upper surface S of the plate T for the entire size of the same. At each value range (Gloss, preferably Gloss 60) of the indicative parameter the degree of polishing in the image / map can be associated with a relative co- 25 reference lore. The detection device 50 is equipped, for example, with a processing module tor, such as a microprocessor or processor, and a me- moria, which is preferably configured to detect polishing defects on a qua- any (and each) upper surface S of the plate T in transit on the plane of 5 support (and scanned by the detection device), for example in the image / map obtained by scanning the entire upper surface S of the plate T. In particular, the electronic processing module for each T plate is configured to receive / acquire, from the detection apparatus, as input, an image or map of the (entire) upper surface S; and analyze (each) image 10 gine / map received, for example with an appropriate image analysis software and / or maps. In practice, the processor module is configured to identify (at least) one defect of processing (attributable to the processing and / or treatment product on the upper surface S of the plate T), for example a defect selected in the com- group 15 taking or consisting of scratches, nicks, grooves, holes, depressions (or reliefs), shadows or similar, in the detected image or map, defined in the map as a area with a (much) lower degree of localized polishing (Gloss) (compared to the average of the other parts). For example, the manufacturing defect is represented in the image or map. 20 vata through one or more pixels or areas having a chromatic parameter (for example color or intensity or other) different from the background (prevalent color). Of the detected manufacturing defect, the processing module can be configured to determine / calculate / measure shape, dimensions (for example one or more of the di- dimensions between length, width, area or other) and intensity (which is a parameter 25 indicative of the depth / height of the defect detected) and / or position (on a system virtual XY Cartesian of the image and, therefore, of the surface L1 of the plate T). Again, the identify phase may include a discriminate / recognize phase. to detect a surface defect, as defined above, of the upper surface S between a defect on the upper surface of the T-plate (such as scratches or holes or similar) from 5 a defect in the treatment product (such as depressions, yellowing, reliefs having typical shapes and sizes of the machines or of the marks deposited on the surface upper S of the T plate). For example, to discriminate / recognize defects present in the image and / or map purchase, the processor module can be programmed by an al- 10 artificial intelligence algorithms (e.g. machine learning, i.e. a previously appropriately trained machine learning algorithm. The system 10 also comprises a control apparatus 60 (electronic) configured device to command and control the operation (automatic or semi-automatic) of the plant 10. 15 The control apparatus 60 comprises first of all an electronic control unit (of the type of a suitably programmed processor), equipped with a unit of memory, which is operationally connected to the system 10 and configured for check the operation of the system 10 itself as it will appear better in the se- followed. 20 In particular, the electronic control unit of the control apparatus 60 is operati- connected to the conveyor drive unit 15, each device positive sensor P, to each tool 20, i.e. to each linear actuator to each dispensing device 35 to each work head movement group and to each pressure regulator device 30 of each tool 20 (and to any- 25 any other actuator and / or motor and / or sensor possibly connected to the tool 20), to the at least one motor that moves the longitudinal beam 25, to each app- protective cover 40 (or to the pneumatic means thereof), as well as to any any other actuator and / or motor and / or sensor that may be present. Furthermore, the electronic control unit of the control apparatus 60 is operationally 5 connected to the sensing device 50 (i.e. its processing module). A temperature range can be stored / set in the control unit 60 (initial), between a minimum and a maximum value, based on the type and / or composition of the treatment product to be used for processing. 10 For example, the initial (or theoretical) temperature range is the one that is indicated for the specific treatment product from the relevant manufacturer (within which it is theoretically possible- optimal solidification / polymerization of the treatment product). Furthermore, a predefined quantity can be stored / set in the control apparatus 60. determined treatment product to be used for the specific process. 15 At this point, the control apparatus 60 can command and / or control the operation operation of the plant 10 (i.e. the polishing machine 100), to perform the said processing on the upper surface S of the plate T. In particular, by commanding and / or controlling the advancement of the T plates on the plane of support, along the direction of advancement A, is commanded – at the same time 20 poranea – the movement of the tools 20 (placed in rubbing contact on the upper surface S of the plate T) and the delivery of the predetermined quantity of a treatment product on the surface S of the plate T. During processing, the electronic control unit of the control apparatus is configured to detect / measure (for each tool 20) a temperature value 25 (via the respective sensor device P), i.e. the current temperature of the upper surface S of plate T (in progress). Furthermore, the electronic control unit of the control apparatus 60 is configured to check that the detected temperature value remains within the re- injury (initially set). 5 In particular, the electronic control unit of the control apparatus 60 compares the temperature value detected with the reference range (extremes included) and, if the detected temperature value is outside the reference range, i.e. lower at the minimum value or greater than the maximum value, then the electronic control unit control of the control apparatus 60 is configured to operate an al- 10 minus an operating parameter of the tool 20 and / or the product being treated chin. In particular, the electronic control unit can be configured to, alternatively or in combination, vary (increase or decrease by a predetermined amount) born and preset or pre-settable in the memory unit, starting / stopping 15 the dispensing of the dispensing device 35), starting from the initial quantity (or previous set), the quantity of product dispensed on the surface (in working tion, for example the upper surface S) of the plate L within a range operating between a minimum threshold value and a maximum threshold value (preset or pre-settable in the memory unit) and / or to vary (by an increment) 20 predetermined and pre-set or pre-settable decrease or decrease in the unit of memory) the working pressure value of the tool head 20 (by means of the pressure regulator device 30 which operates the linear actuator), starting from a predetermined initial (or previously set) pressure value and preset or pre-settable in the memory unit of the electronic control unit 25 control, within an operating range between a threshold value lower and an upper threshold value (predetermined and pre-set or pre-set stable in the memory unit). More in detail, when a T plate to be worked reaches a tool 20, the electronic control unit is configured to operate the tool 20 5 through the pressure regulator device 30 so as to place the head of the tool 20 in contact with the surface of the plate to be worked at the pressure value initial (or set) work session. At the same time, the electronic control unit is configured to operate the di- dispenser device 35 which will start to dispense the treatment product until 10 reach said initial (or set) quantity. If during the processing of the surface of the plate L the electronic control unit control detects a temperature value of the surface using the sensor device P upper surface S of the plate L less than the minimum value, then it can be configured figure to stop the dispensing device 35 to terminate (preventively) 15 the delivery of the treatment product, so as to deliver overall on the upper surface S of the plate L a quantity of treatment product less than the initial (or previously set) quantity. Alternatively or in combination, if during the processing of the super- higher S of the T plate, the electronic control unit detects by means of the device 20 sensor P a temperature value of the upper surface S of the lower plate T higher than the minimum value, then it can be configured to increase the value of working pressure (of the head) of the tool 20 (via the regulating device of pressure 30) so as to operate it at a higher pressure value of the initial (or previously set) pressure value. 25 On the contrary, if during the processing of the upper surface S of the plate L the electronic control unit detects, via the P sensor device, a value of temperature of the upper surface S of the plate L above the maximum value, then it can be configured to activate the dispensing device 35 by extending the delivery (or in any case increasing the delivery) of the treatment product in 5 so as to deliver a total of 500 ml of water onto the upper surface of the plate T. quantity of treatment product greater than the initial quantity (or previous- mind set). Alternatively or in combination, if during the surface processing of the plate, the electronic control unit detects a value using the sensor device P 10 hours of temperature of the upper surface S of the plate L higher than the value maximum, then it can be configured to decrease the working pressure value (by means of the pressure regulator device 30) of the tool 20 so as to actuate to operate at a working pressure value lower than the pressure value initial (or previously set). 15 For example, whenever the detected temperature value is outside the range of reference, i.e. lower than the minimum value or higher than the maximum value, the electronic control unit can be configured to operate one operation of predetermined and preset adjustment in the memory unit, at your choice (alter- native) between the variation in the quantity of treatment product dispensed and the varia- 20 working pressure (head) setting of the tool 20. That is, the electronic control unit can be configured (programmed) to operate only the variation of the quantity of treatment product, each whenever the detected temperature value is outside the reference range. Or, the electronic control unit can be configured (programmed) to 25 operate only the variation of the working pressure (of the head) of the tool 20 whenever the detected temperature value is outside the range of reference. Again, the electronic control unit, if the detected value is lower than the mi- nimo, can be configured to calculate the difference (possibly in modulus) 5 between the detected temperature value and the minimum value. The electronic control unit can also be configured to compare said difference between the detected temperature value and the minimum value with a first reference quantity (predetermined and preset or pre-settable in the unit (electronic control unit memory). 10 For example, the first reference quantity may be less than or equal to 30 °C, preferably equal to 10°C. The electronic control unit can therefore be configured to vary alternati- the quantity of product dispensed or the working pressure value, if the difference between the detected temperature value is equal to or lower than the said first 15 reference quantities (predetermined and preset or pre-settable in the unit (electronic control unit memory). In particular, if the detected temperature value is lower than the minimum value, and the difference (possibly in modulus) between the detected temperature value and the value minimum is equal to or less than said first reference quantity, the electronic unit 20 control can be configured to alternately decrease (by an amount predetermined and preset or pre-settable in the memory unit) the quantity of treatment product delivered or increase (by a predetermined increment and preset or pre-settable in the memory unit) the pressure value of tool (head) work 20. 25 Alternatively, the electronic control unit 45 can be configured to vary both the quantity of product dispensed and the working pressure value if the value of detected temperature is lower than the minimum value and the difference between the value of detected temperature and the minimum value is greater than the said first reference quantity. chin. 5 In particular, if the detected temperature value is lower than the minimum value, and the difference (possibly in modulus) between the detected temperature value and the value minimum is greater than said first reference quantity, the electronic control unit control can be configured to simultaneously decrease (by a pre-defined amount) determined and preset or pre-settable in the memory unit) the quantity of 10 treatment product delivered and increase (by a predetermined increment and preset or pre-settable in the memory unit) the pressure value of tool head work 20. Similarly, the electronic control unit, if the detected value is greater than the maximum value, can be configured to calculate the difference (possibly 15 in module) between the detected temperature value and the maximum value. The electronic control unit can also be configured to compare said difference between the detected temperature value and the maximum value with a second reference quantity (predetermined and preset or pre-settable in the unit (electronic control unit memory). 20 For example, said second reference quantity may be less than or equal to 30 °C, preferably equal to 10°C. The electronic control unit 45 can then be configured to vary alterna- essentially one between the quantity of product dispensed and the working pressure value if the difference between the detected temperature value and the maximum value is equal 25 or less than the second reference quantity (predetermined and preset or pre-settable in the memory unit of the electronic control unit) In particular, if the detected temperature value is higher than the maximum value and the difference (possibly in modulus) between the detected temperature value and the va- maximum value is less than or equal to said second reference quantity, the unit 5 control electronics can be configured to alternatively increase (by a predetermined and preset or pre-settable quantity in the storage unit ria) the quantity of treatment product delivered or decrease (by a decrease predetermined and preset or pre-settable in the memory unit) the value of working pressure of the tool head 20. 10 Otherwise if the detected temperature value is higher than the maximum value, and the difference between the detected temperature value and the maximum value is greater of said second reference quantity, the electronic control unit can be configured to vary both the quantity of treatment product dispensed and the working pressure value. 15 In particular, if the detected temperature value is higher than the maximum value, and the difference (possibly in modulus) between the detected temperature value and the va- maximum value is greater than said second reference quantity, the electronic unit control can be configured to simultaneously increase (by a certain amount) predetermined and preset or pre-settable quantity in the memory unit) 20 quantity of treatment product dispensed and decrease (by a predetermined decrease) mined and preset or pre-settable in the memory unit) the pressure value working position of the tool head 20. Alternatively, it is possible to provide that the electronic control unit can be configured to repeat (every time the temperature value is outside the 25 reference range) the same adjustment operation between the variation of quantity of treatment product and the variation of the working pressure value of the tool head 20 and, once the respective maximum threshold value has been reached or upper threshold value, continue to adjust the tool operation 20 (whenever the temperature value is outside the reference range) ope- 5 by varying the other between the quantity of product dispensed and the pressure value working position of the tool head 20. For example, it is possible to foresee that the electronic control unit can be configured to vary (increase) the value of the working pressure of the head of the tool 20 within the operating range if, that is, only from the moment 10 where the detected temperature value is lower than the minimum value and the quantity of product supplied is equal to the minimum threshold value. Or, it is possible to foresee that the electronic control unit can be con- figurative to vary (decrease) the value of the working pressure of the head of the tool 20 within the operating range if, that is, only from the moment 15 where the detected temperature value is greater than the maximum value and the quantity of product dispensed is equal to the maximum threshold value. Furthermore, it is possible to foresee that the electronic control unit can be con- figurative to vary (decrease) the quantity of product dispensed on the surface of the plate T within the operating range if, or only from the moment in which, the value 20 of detected temperature is lower than the minimum value and the working pressure value of the work head of tool 20 is equal to the upper threshold value. Or, it is possible to foresee that the electronic control unit can be con- figurative to vary (increase) the quantity of product dispensed on the surface of the T plate within the operating range if, that is, only from the moment in which, the 25 detected temperature value is higher than the maximum value and the value of working pressure of tool head 20 is equal to the lower threshold value. The electronic control unit can be further configured to wait a predetermined period of time between a regulation operation and an op- subsequent adjustment ration. 5 In fact, once the first adjustment has been made, the temperature value will not vary instantly but there will be some latency before it can change and possibly fall within the reference range. The electronic control unit can also be configured to save (write) (e.g. in a database) each regulation operation 10 action performed. In particular, the electronic control unit can be configured to save (write) to the memory unit, every time the detected temperature value re- result outside the reference range, said detected temperature value. The electronic control unit can also be configured to save (write) 15 in the memory unit, the amount of treatment product dispensed and the value of working pressure of the tool head 20 corresponding to said temperature value detected outside the reference range (associating them with the same, for example) (e.g. in an organized database saved on the storage device). The electronic control unit (whenever the detected temperature value is 20 outside the reference range), can also be configured to save (write (to have) in the memory unit the adjustment operation that has been carried out, or true if the quantity of treatment product dispensed has been changed (by the quantity predetermined and preset or pre-settable in the memory unit) and / or if it is been changed (by the predetermined and pre-set or pre-defined increment or decrement) 25 (settable in the memory unit) the working pressure of the tool head 20. When the electronic control unit detects a temperature value outside the reference range, using the P detector device, can also be configured figure to compare the said detected temperature value with the tempera- values ​​outside the reference range previously detected and saved in the unit of measurement 5 deaths. If the electronic control unit detects a match, then it can be con- figuratively to repeat the same adjustment operation that has been performed when this temperature value outside the reference range has been detected the previous time. 10 The electronic control unit can also be configured to, whenever performs a regulation operation, calculates the value of the change in value of temperature that was obtained following this regulation operation, for example example as the difference (possibly in modulus) between the temperature value detected after a predetermined period of time (preset or pre-settable) 15 in the memory unit) from the moment the said re-operation was performed regulation and the temperature value outside the range that led to the execution of this regulation operation. The electronic control unit can then be configured to write (save) in the memory unit the value of the variation of the detected temperature value 20 which was obtained following this regulation operation. The electronic control unit can, furthermore, be configured to compare said value of the variation of the temperature value obtained with a value of reference variation (predetermined and pre-set or pre-settable in the memory unit of the electronic control unit). 25 In the event that, upon detection of a temperature value outside the range of reference, the regulation operation consisted of an alternative variation of one between the quantity of treatment product dispensed and the pressure value of tool 20, if the variation of the temperature value is less than said reference change value, the electronic control unit can be configured 5 gurata for, when it detects said temperature value again outside the reference range, operate the other between the variation of the quantity of treatment product delivered and the variation of the tool pressure value 20 or to operate both the variation of the quantity of treatment product delivered and the variation of the pressure value of the tool. 10 In other words, the electronic control unit can be configured to check a correspondence between a detected reference value outside the range and the values detected outside the range previously detected and saved in the memory unit. If a match is detected, the electronic control unit can be configured to check which adjustment operation has been performed. 15 If the adjustment operation carried out consisted of an alternative variation of one between the quantity of treatment product dispensed and the pressure value of the tool 20, then the electronic control unit can be configured to compare the value of the variation of the detected temperature value obtained at following this adjustment operation with the reference variation value. 20 If the variation value is less than this reference variation value, then the electronic control unit can be configured to operate the other between the variation in the quantity of treatment product dispensed and the variation in the va- pressure value of the tool 20 or to operate both the variation of the quan- quantity of treatment product delivered and the variation of the pressure value 25 of tool 20. In particular, the electronic control unit of the control apparatus 60 is con- figured to detect (through the detection device 50) the map or image gine or matrix of the parameter indicative of the morphology and / or quality of processing of the surface of the plate following the processing carried out by the tool. 5 If a workmanship defect is identified in the detected map or image or matrix ration attributable to the processing and / or the treatment product, as described above, then the electronic control unit of the control apparatus 60 is configured installment to change the reference range (of temperature) that had been in pre- set yield, i.e. modify / vary the minimum value and / or the maximum value 10 of the reference range (on which to carry out the above-described check). In practice, the electronic control unit defines a new reference range (to overwrite the one previously set) for the given product of treatment chin (to correct, by carrying out a retraction control, the manufacturing defect found in subsequent processes with the same treatment product). 15 Preferably, the electronic control unit of the control apparatus 60 pre- sees to decrease, for example by a range or a predefined value (for example of a few degrees °C), the maximum value of the reference range, in fact decreasing the maximum temperature to which the treatment product is subjected during the processing, to avoid that this could be excessive and therefore reduce the 20 risk of solidification / polymerization (premature and massive) of the product treatment. For example, the electronic control unit can be configured to store this new reference range (to be uniquely matched to the treatment product) chin in use). 25 The electronic control unit can also be operationally connected to a control apparatus interface 70, and configured to output signals per- perceptible by an operator, as visual signals (for example via a screen) and / or auditory or other. For example, interface 70 may comprise or consist of a PC 5 with monitor or be of the type of mobile device supplied to an operator plant operator 10. In particular, the electronic control unit can be configured to generate an alarm signal (transmitted and emitted) via interface 70, when at the same time the detected temperature value is outside the reference range, 10 the quantity of treatment product is equal to the minimum threshold value or the threshold value maximum, and the tool pressure value 20 is equal to the lower threshold value or at the upper threshold value. More precisely, the electronic control unit can be configured to gene- rare said alarm signal (transmitted and emitted) via the interface 70, 15 when at the same time the detected temperature value is lower than the mi- nimo, the quantity of treatment product is equal to the minimum threshold value and the value tool pressure 20 is equal to the upper threshold value. Furthermore, the electronic control unit can be configured to generate said alarm signal (transmitted and emitted) via interface 70, when con- 20 textually the detected temperature value is higher than the maximum value, the amount of treatment product is equal to the maximum threshold value and the value of tool pressure 20 is equal to the lower threshold value. For example, such an alarm signal may be an electrical signal transmitted from the electronic control unit to the interface 70 and switched by this in a se- 25 audio or video or audio / video signal. Furthermore, by means of the interface 70, the electronic control unit can be configured figured to receive, as input to start work (i.e. as initial setting), a plurality of operating parameters of the system 10. For example, via the interface 70, the electronic control unit can receive 5 input the standard pressure value of the tool head 20 and / or the quantity standard of treatment product to be delivered and / or the quantity of which it is to be changed in a regulation operation the quantity of treatment product emitted gato and / or the increment / decrement by which the working pressure is to be varied of the head in an adjustment operation and / or the first reference quantity and / or 10 the second reference quantity and / or the minimum value and the maximum value that define the reference range and / or the minimum threshold value and the threshold value maximum and / or lower threshold value and upper threshold value and / or the value of reference variation and / or possibly said single predetermined operation of adjustment to be performed between the variation of the quantity of treatment product 15 delivered and the variation of the working pressure of the tool head 20 and / or any other operating parameter of the system 10. Furthermore, it is possible to provide that by means of the interface 70 the electronic unit of control makes available information relating to the modified reference range cato (i.e. updated). 20 Downstream of the tools 20, along the feed direction A, the system 10 and / or the polishing machine 100 may further comprise a washing apparatus of the T plates. The invention thus conceived is susceptible to numerous modifications and variations all falling within the scope of the inventive concept. 25 Furthermore, all details are replaceable by other technically equivalent elements. In practice the materials used, as well as the contingent shapes and dimensions, po- can be any depending on the needs without leaving the am- protection of the following claims.

Claims

CLAIMS 1. A method for processing plates (T) comprising: - advancing a plate (T) along a direction of advancement (A); - dispensing a quantity of a treatment product, preferably in a fluid state, onto the surface (S) of the plate (T); - performing a polishing operation on said surface (S) of the plate (T) using a tool (20), during the advancement of the plate and after / during the dispensing of the treatment product; - detecting a temperature value of the surface (S) of the plate (T) during the polishing operation thereof; - controlling at least one operating parameter of the tool and / or of the treatment product so that the detected temperature value remains within a reference range, between a minimum value and a maximum value, in which the reference range is pre-set on the basis of the type and / or composition of the treatment product dispensed;- detect at least one map, image, or matrix of at least one parameter indicative of the morphology and / or processing quality of the slab surface following the polishing process performed by the tool; and - modify the reference range if a processing defect attributable to the polishing process and / or the treatment product is identified in the detected map, image, or matrix.

2. The method according to claim 1, wherein the control comprises: - comparing the detected temperature value with the reference range; and - operating an adjustment of said at least one operating parameter of the tool (20) and / or of the treatment product, if said detected temperature value is outside the reference range.

3. The method according to claim 1, in which said polishing operation is carried out, involves: - arranging the tool (20) in movement, preferably in rotation and / or roto-translation, in contact with the surface (S) of the plate (T) on which the treatment product has been dispensed, at a specific working pressure value.

4. The method according to claim 2, in which said adjustment is carried out, involves at least one of the following phases: - varying the quantity of product dispensed on the surface (S) of the plate (T); and / or - varying the working pressure value of the tool head (20).

5. The method according to claim 1, which comprises analyzing the detected map or image or matrix to identify any processing defects, wherein each processing defect is a defect localized on one or more areas of the analyzed map or image or matrix, preferably attributable to a machine located in relief and / or with a degree of polishing lower than a predetermined reference gloss value.

6. The method according to claim 1 or 5, wherein modifying the reference range comprises decreasing said maximum value of the reference range.

7. A system (10) for processing sheets (T) comprising: - a conveyor (15) equipped with a support surface movable along a direction of advancement (A), wherein said support surface is configured to support at least one sheet (T); - a dispensing device (35) configured to dispense a given quantity of a treatment product, preferably in a fluid state, onto the surface (S) of the sheet (T); - at least one tool (20) suitable for carrying out a polishing operation on said surface (S) of the sheet (T) during the advancement of the sheet (T) along the direction of advancement (A) and after / during the dispensing of the treatment product; - at least one sensor device (P) configured to detect a temperature of the surface (S) of the sheet (T);- at least one detection device (50) configured to detect at least one map or image or matrix of at least one parameter indicative of the morphology and / or quality of processing of the surface of the plate following the polishing process performed by the tool; and - an electronic control apparatus (60) configured to perform the method according to any of the preceding claims.; 8. The system (10) according to claim 7, wherein the tool (20) comprises a head equipped with polishing pads and suitable for being in contact with the surface (S) of the plate (T), the head being rotatable around an axis of rotation and / or revolution orthogonal to the support plane and / or movable in translation along a direction orthogonal to the support plane and orthogonal to the direction of advancement.

9. The system according to claim 7, wherein the dispensing device (35) is arranged in proximity / correspondence to the tool (20).

10. The system according to claim 7, the tool (20) is movable along a direction of approach / departure from the support plane substantially orthogonal to the support plane, by means of an actuator operated by a 59672 pressure regulator device (30).

11. The system (10) according to claim 7, wherein the sensor device (P) comprises a laser pyrometer.

12. The system according to claim 7, wherein the detection device (60) 5 comprises at least one of a scanner and a glossmeter and is configured to map the entire surface of the advancing plate along the advancing direction and generate a map or image or matrix of at least one parameter indicative of the morphology and / or degree of polishing of the plate surface.