Anti-vibration tilt sensor

Description

I0207686 / MM Owner: Gefran SpA “Anti-vibration tilt sensor” DESCRIPTION 5

[0001] . Field of the invention

[0002] . The present invention relates to sensor techniques that can be used in applications heavy industrial and mobile hydraulics for measurement of the inclination of a heavy vehicle and of hydraulics 10 mobile or a mechanical component of such a vehicle, such as a telescopic arm, in particular to a sensor of anti-vibration inclination.

[0003] . Technological background of the invention

[0004] . Tilt sensors are widely 15 widespread in mobile hydraulic vehicles such as lifts telescopic handlers, aerial platforms and excavators.

[0005] . In a telescopic handler, the sensors of inclination contributes to the safety function anti-tipping by monitoring the lifting angle of the 20 telescopic arm.

[0006] . In a wheeled aerial platform, the sensors of inclination control the leveling of the basket and of the vehicle axle.

[0007] . In an excavator, the inclination sensors 25 mounted on the articulated arm allow you to reconstruct the excavation profile.

[0008] . Typically inclination sensors implement transduction principles based on the acceleration of gravity. For example, the sensors of 5 accelerometer-based tilt sensors, detect the acceleration of gravity (+ / -1g) and, using formulas trigonometric, produce the inclination measurement with respect to the ground, considered as zero or plane of reference. 10

[0009] . Considering typical movement speeds of mobile hydraulic means, the bandwidth of the gravitational acceleration signal of interest for the production of the inclination angle ranges from continuous component in the order of ten Hertz. 15

[0010] . The most common sources of vibration associated to the typical operation of a mobile hydraulic vehicle they are: on-board motor; on-board pump; movement of mechanical organs controlled by cylinders hydraulic systems such as stabilizers, telescopic arms or 20 articulated forks and related accessories (forks, shovels, clamps, drills, tire changers, and so on); rolling of the vehicle on the ground by tires or tracks; fall of rocks and debris on the vehicle.

[0011] . These vibrations can produce two types of 25 effects: acceleration peaks in the order of hundreds of g; broad-spectrum vibrations up to a few kilohertz with average amplitude in the order of tens of g e RMS peaks near the resonance of structures or orders motor. 5

[0012] . In this context it appears that acceleration transduced by inclination sensors (inclinometers) based on accelerometers is composed of:

[0013] . - a first relative component to the acceleration of gravity which has amplitude + / - 1g and 10 frequency range of interest in the order of tens of Hertz, identified as the true signal of measure,

[0014] . – a second broad-spectrum component that acts as noise with respect to the first component, with 15 profile characterized by the application of hydraulics mobile, and which has amplitude and bandwidth of two orders of magnitude greater than the signal.

[0015] . As far as the inclination sensors are concerned, based on accelerometers seem to be an unsuitable solution 20 to the application on mobile hydraulic vehicles, the good standard proposes filtering techniques both at the mechanical that at the data processing level measure, such as to make these products sufficiently accurate for the application in question. 25

[0016] . Mechanical filtering techniques include to mount the tilt sensor to the element of which you want to measure the inclination by decoupling the two parts with anti-vibration supports.

[0017] . This prevents vibrations from 5 reach the accelerometer and then be transduced as noise compared to the gravity signal.

[0018] . Anti-vibration mounts work well at high frequencies, so it is necessary to size them geometry and hardness correctly to be able to remove 10 as much low noise component as possible frequency.

[0019] . This sizing involves the use of very large and soft anti-vibration supports which, if on the one hand, they offer better vibration isolation, 15 reducing the amplitude of the vibrations transmitted to the system and have better damping properties, dissipating the energy of the vibrations in a more effective, on the other hand, unfortunately, they can lead to more significant deformations under load, which can 20 negatively affect measurement accuracy.

[0020] . Furthermore, such very large anti-vibration mounts and soft ones can deform and degrade more quickly over time compared to rigid ones.

[0021] . Another aspect to take into consideration is 25 relating to the fact that to protect the sensor from impacts with the material being handled and the environment in which it is located to operate the mobile hydraulic means, typically the Tilt sensors are installed in tight places as inside the hollow trunk of the telescopic arm, 5 under a metal cap when exposed to the outdoors of articulated arms, in the crossmember under the axle.

[0022] . Typically the available volume is just sufficient for the installation of the sensor alone inclination but it is not at all compatible with 10 the additional space required by the anti-vibration supports.

[0023] . Therefore, the application of supports anti-vibration mounts to a finished tilt sensor require a dedicated and additive procedure compared to the one alone tilt sensor installation procedure, 15 therefore more time for the installer and suitable tools to tighten the tilt sensor fixing screws and the anti-vibration support without damaging the damping material.

[0024] . For this reason, in order to also reduce the 20 dimensions, sensors are known in the state of the art that they integrate anti-vibration components within them.

[0025] . In this regard, WO 2012 / 062509 A1 describes a orientation sensor for motorcycle comprising a housing inside which, in addition to the elements 25 orientation detection, a anti-vibration mount that can dampen movement vibratory to which the housing is subjected.

[0026] . This anti-vibration support comprises a external rectangular structure, a structure 5 internal rectangular and a plurality of bridges that they connect the internal structure to the external structure, where each little bridge is arranged like a beam that resists to the inclination of the internal structure with respect to the external structure. 10

[0027] . EP3056883B1 refers to a sensor with damping elements comprising a housing in which sensor components are housed inside so that there is a gap between the housing and the components of the sensor and a material for damping the 15 vibrations arranged within that space for dampen vibrations of the sensor components compared to to the housing.

[0028] . The vibration damping material includes damping grains, where each damping grain 20 damping has a respective internal cable defined by a pass-through channel.

[0029] . Both solutions require the use of rather complex anti-vibration elements that increase, on the one hand, the assembly and maintenance times of the 25 sensor, the risks of assembly errors and, on the other hand, the costs for both the initial assembly and the maintenance and correction of any errors assembly.

[0030] . Summary 5

[0031] . The object of the present invention is to to devise and make available a sensor of anti-vibration inclination that allows to avoid at least partially to the inconveniences complained about above with reference to the known art and that, in particular, it is 10 easy to design, has assembly times and reduced maintenance, ensures high reliability with low dimensions and costs.

[0032] . This goal is achieved by means of a sensor in agreement with claim 1. 15

[0033] . Further advantageous embodiments are subject of the dependent claims.

[0034] . Brief description of the figures

[0035] . Additional features and benefits of the sensor according to the invention will result from the description of 20 below are some of the favorite examples of implementation, data for indicative and non-limiting purposes, with reference to to the attached figures, in which:

[0036] . - figure 1 shows a schematic view in perspective of an anti-vibration tilt sensor 25 in accordance with an embodiment of this invention;

[0037] . – Figure 2 shows a schematic view in perspective of an exploded view of the inclination sensor anti-vibration of figure 1; 5

[0038] . – Figure 3 shows a schematic view exploded view of a tilt sensor anti-vibration in accordance with a further form of realization;

[0039] . - figure 4 shows a schematic view in 10 section of an anti-vibration tilt sensor in agreement to a form of embodiment of this invention;

[0040] . - figure 5 shows a schematic view in cross-section of an anti-vibration tilt sensor in 15 agreement to a further form of implementation of the present invention;

[0041] . - figure 6 shows a schematic view in cross-section of an anti-vibration tilt sensor in agreement to a further embodiment of the 20 present invention;

[0042] . - figure 7 shows schematically, by means of a block diagram, a tilt sensor anti-vibration according to one embodiment of the present invention; 25

[0043] . - figure 8 shows schematically, by means of a block diagram, a tilt sensor anti-vibration in accordance with a further form of embodiment of the present invention;

[0044] . - figure 9 shows schematically, by means of 5 a block diagram, a tilt sensor anti-vibration according to one embodiment of the present invention.

[0045] . - figure 10 shows schematically, by means of a block diagram, a tilt sensor 10 anti-vibration according to one embodiment of the present invention.

[0046] . Please note that in the figures the elements are equal or similar ones will be indicated with the same references numeric or alphanumeric. 15

[0047] . Detailed description

[0048] . With reference to the above figures, it is now described an anti-vibration tilt sensor 1 in according to the present invention, hereinafter also referred to as sensor of inclination or simply sensor, to determine 20 a value of inclination with respect to a plane of reference to a mechanical component to which said Anti-vibration tilt sensor 1 is applicable.

[0049] . The mechanical component (not shown in the figures) can be part of any industrial vehicle 25 heavy having mobile hydraulics such as a lift telescopic, a truck-mounted or crawler crane, a tractor more generally an agricultural vehicle, an excavator, a aerial platform, which needs to be monitored, the note, of the inclination of an axle of the vehicle 5 industrial or telescopic arm.

[0050] . The reference plane, not shown in the figures, with respect to which the inclination sensor 1 anti-vibration is used to determine the value of inclination of the mechanical component is for example 10 represented by the support surface of the industrial vehicle, or the ground on which it rests.

[0051] .Returning generally to the present invention, with particular reference to figure 1, sensor 1 comprises a first portion 2 extending along an axis 15 of longitudinal development L, shown with a line dashed in the figures.

[0052] . The first portion 2 is designed to accommodate its inside an electronic circuitry 3, described in more detail detail below, configured to determine the 20 inclination value requested to said sensor 1 of anti-vibration tilt.

[0053] . The first portion 2 has a respective face lower 2nd transverse to the development axis longitudinal L of the first portion 2. 25

[0054] . In accordance with the present invention, the sensor 1 It also includes a second portion 5 extending along called longitudinal development axis L.

[0055] . The second portion 5 is distinct and separated from said first portion 2. 5

[0056] . The second portion 5 comprises connections CM mechanics configured to allow you to connect mechanically the anti-vibration tilt sensor 1 to the mechanical component for which it is necessary to determine the inclination value and CE electrical connections 10 configured to allow you to electrically connect the Single-unit anti-vibration tilt sensor 1 remote control electronics.

[0057] . The second portion 5 has a respective face upper 5th transverse to the development axis 15 longitudinal L of the second portion 5.

[0058] . The upper face 5a of the second portion 5 is facing the lower face 2a of the first portion 2.

[0059] . In accordance with the present invention, the sensor 1 20 anti-vibration tilt includes a component anti-vibration 4 interposed, along the development axis longitudinal L of the first portion 2 and of the second portion 5, between the first portion 2 and the second portion 5 and fixed in contact with the lower face 2a of the 25 first portion 2 and the upper face 5a of the second portion 5 in order to advantageously guarantee a structural adhesion and a mechanical insulation to the propagation of vibrations between the first portion 2 and the second portion 5. 5

[0060] . In one embodiment, shown in the figures, the first portion 2, preferably made in plastic material, includes a housing, preferably tub-shaped, delimited by a respective 2' side wall which develops in height 10 along the longitudinal development axis L and from a wall 2” bottom whose external face corresponds to the face lower 2a of the first portion 2.

[0061] . This side wall 2' defines a respective upper face of the first portion 2, opposite the 15 respective lower face 2a, having an opening such as facilitate insertion into the first portion 2 of the electronic circuitry 3 (preferably, a electronic board, as shown in the figures).

[0062] . In one embodiment, in combination 20 with any of the above and shown in the figures, the first portion 2 comprises a plurality of elements E- S of electronic circuitry support 3 which is extend along the longitudinal development axis L a starting from the lower face 2a towards the inside of the 25 first portion 2.

[0063] . As shown in the figures, each element of support of said plurality ES of support elements is preferably a threaded hollow cylindrical element for receive and retain after screwing a 5 respective VT screw suitable to pass through a respective hole present in the electronic circuitry 3 (for example in a corner of the circuit board) and fix the circuitry electronics inside the first portion 2.

[0064] . A plurality of VT screws for fixing the 10 electronic circuitry 3 at the first portion 2 is shown in figure 2.

[0065] . In one embodiment, in combination with any of the above, the first portion 2 It includes a resin 7 inside which is used to fill 15 essentially the internal volume defined by the first portion 2.

[0066] . Such resin 7, for example two-component epoxy, advantageously allows you to protect from solid and liquid bodies, electronic circuitry and 20 any other components present inside the first portion 2 and increase the mass of the first portion 2 helping to reduce the amplitude of vibrations.

[0067] . In one embodiment, in combination with any of the above and shown in the figures, 25 the second portion 5, preferably made in plastic material, includes a housing, preferably tub-shaped, delimited by a respective 5' side wall which develops in height along the longitudinal development axis L and from a wall 5 upper 5” whose external face corresponds to the face upper 5th of the second portion 5.

[0068] . In one embodiment, in combination the previous, the mechanical connections CM of the second portion 5 includes respective defined through holes 10 from a fixed conformation of the second portion 5.

[0069] . In more detail, the second portion 5 is shaped in such a way that these through holes have longitudinal development parallel to the development axis longitudinal L and are distributed externally to the base 15 of the side wall 5' of the second portion 5.

[0070] . In more detail, each of these holes past is configured to receive and hold, subsequently screw-on, a respective screw so as to connect mechanically the anti-vibration tilt sensor 1 20 to the mechanical component for which it is necessary to determine the inclination value.

[0071] . In one embodiment, in combination with any of the above, the second portion 5 It includes a 7' resin inside to fill 25 essentially the internal volume defined by the second portion 5.

[0072] . Such resin 7', for example two-component epoxy, advantageously allows you to protect from solid and liquid bodies the components present inside 5 of the second portion 5 and increase the mass of the second portion 5 helping to reduce the width of the vibrations.

[0073] . In one embodiment, in combination with any of the above, sensor 1 includes 10 components 6 of electrical communication operationally connected between the electronic circuitry 3 housed inside the first portion 2 and the connections CE electric cars available in the second portion 5.

[0074] . In one embodiment, in combination 15 with the previous one when in combination with any where the 2” back wall of the first is foreseen portion 2 and in which the upper wall 5” is provided of the second portion 5, shown in figures 1-4, the 6 electrical communication components include cables 20 13 of electrical communication to enable a direct wiring between the electronic circuitry 3 and the CE electrical connections available on the second floor portion 5.

[0075] . In this embodiment, the wall of 25 bottom 2” of the first portion 2 includes a through hole 10 placed substantially in the centre and designed to allow the passage of said electrical communication cables 13 between the electronic circuitry 3 and the electrical connections EC which the second portion 5 has. 5

[0076] . In this embodiment, the component anti-vibration 4 includes a respective through hole 11 placed substantially in the centre and designed to allow the passage of electrical communication cables 13 between the electronic circuitry 3 and CE electrical connections 10 of which the second portion 5 has.

[0077] . In this embodiment, the wall upper 5” of the second portion 5 includes a respective through hole 12 placed substantially in the center and suitable to allow the passage of cables 13 of 15 electrical communication between the electronic circuitry 3 and the CE electrical connections available on the second portion 5.

[0078] . In one embodiment, in combination with the previous one in which the through hole 10 is present 20 and resin 7 is expected inside the first portion 2, this through hole 10 has an interference such that prevent resin 7 from leaking out of through hole 10 while filling the first portion 2.

[0079] . In one embodiment, in combination 25 with the previous one in which the through hole 12 is present and the 7' resin is foreseen inside the second portion 5, this through hole 12 has an interference so as to prevent the 7' resin from leaking out of the hole passerby 12 while filling the second portion 5 5.

[0080] . According to one embodiment, in combination with any of the above, the CE electrical connections include connectors electrical such as, for example, M12 connectors, standard for 10 heavy industrial applications, or connectors Deutsch type or a cable outlet with cable gland, typical for mobile hydraulics applications.

[0081] . According to one embodiment, in alternative to any of the above where the 15 components 6 electrical communication include cables 13 of electrical communication to allow a direct wiring between the electronic circuitry 3 and the CE electrical connections available on the second floor portion 5, shown in figure 6, the second portion 5 20 is designed to accommodate a further one inside it electronic circuitry 30 (preferably, a board electronics, as shown in the figures).

[0082] . In this embodiment, the components 6 of electrical communication include first 14 cables of 25 electrical communication devices for direct connection between their electronic circuitry 3 housed in the first portion 2 and the additional circuitry 30 housed in the second portion 5.

[0083] . In this embodiment, the first cables 14 5 electrical connection are suitable to pass through the through hole 10 present in the 2” back wall of the first portion 2, the through hole 11 present in the component 4 anti-vibration and the through hole 12 present in the upper wall 5” of the second portion 5, already 10 described above with reference to a form of realization referred to figures 1-4.

[0084] . In this embodiment, the components 6 of electrical communication include second cables 15 of electrical communication devices for directly connecting 15 of them the additional 30 circuitry housed in the second portion 5 and the CE electrical connections it has the second portion 5.

[0085] . In one embodiment, in combination with any of the above, the circuitry 20 electronics 3 comprises a sensitive element 3a and is configured to determine the tilt value required to said anti-vibration tilt sensor 1 based on the electrical signal provided by the element sensitive 3rd. 25

[0086] . The sensitive element 3a will be described in more detail. details below.

[0087] . In one embodiment, in combination with the previous one when the additional circuitry is foreseen electronics 30, shown for example in figure 6 and in 5 figure 9, the further electronic circuitry 30 comprises a further sensitive element 30a which, once that sensor 1 is installed on the mechanical component of the which is necessary to determine the inclination value, is integral with the mechanical component of which it is 10 It is necessary to determine the inclination value.

[0088] . The additional sensing element 30a installed on the further electronic circuitry 30, it will be described in more detail below.

[0089] . In this embodiment, the further 15 electronic circuitry 30 is configured to determine the inclination value required by said sensor 1 of anti-vibration inclination based on the signal electric supplied by the additional sensitive element 30a.

[0090] . In this embodiment, it is provided 20 therefore a redundancy of electrical components (circuitry electronics and sensing element) configured for the determining the component's inclination value mechanical to which sensor 1 can be installed.

[0091] . This redundancy allows for the possibility 25 to determine a tilt value in the event of a failure of one of the two electronic circuits and / or elements sensitive and able to obtain a tilt value more precise given by the combination (for example, the average) of the inclination values ​​determined by the circuitry 5 electronics 3 and the additional electronic circuitry 30.

[0092] . According to one embodiment, in combination with the previous one, the determination of the The required inclination value at sensor 1 can be obtained as a combination of the determined inclination values 10 from the electronic circuitry 3 and the further electronic circuitry 30.

[0093] . Such determination obtainable from such combination can be performed, for example, by electronic circuitry 3 or from electronic circuitry 15 30 or from the remote control unit to which the sensor 1 is operationally connectable.

[0094] . In accordance with a further form of realization, in combination with the previous one when additional electronic circuitry 30 is planned with 20 the additional sensitive element 30a, shown as an example in figure 10 (described in more detail in the followed), the electronic circuitry 3 is configured to determine the tilt value required by the sensor 1 combining the electrical signal provided by the element 25 sensitive 3a with the electrical signal provided from the additional sensitive element 30a.

[0095] . Such a combination of electrical signals, such as will be described in more detail later, it is obtainable preferably by using a technique of 5 Kalman filter of electrical signals.

[0096] . According to one embodiment, in alternative to any of the above where the 6 electrical communication components include cables of electrical communication to allow wiring 10 direct between the electronic circuitry 3 and the connections CE electric cars available in the second portion 5, shown in figure 5, or a direct wiring between the electronic circuitry 3 and further circuitry electronics 30, electrical communication components 6 15 include a first data communication antenna 16a installed on the electronic circuitry 3.

[0097] . In this embodiment, the second portion 5 is designed to house a further one inside it electronic circuitry 30. 20

[0098] . In this embodiment, the components 6 of electrical communication also include a second 16b data communication antenna installed on the additional electronic circuitry 30.

[0099] . The second data communication antenna 16b is 25 configured to transmit wirelessly power supply to the first antenna 16a of data communication.

[0100] . The first data communication antenna 16a and the second 16b data communication antenna are configured 5 to communicate data with each other wirelessly.

[0101] . In this embodiment, the components 6 electrical communication also include further 17 electrical communication cables suitable for connecting directly between them the further circuitry 30 10 housed in the second portion 5 and the connections CE electric cars available in the second portion 5.

[0102] . In this embodiment, no holes pass-through is therefore necessary in the back wall 2” of the first portion 2, in the anti-vibration component 4 and in the 15 upper wall 5” of the second portion 5 and it is not not even the passage of any cable was foreseen electrical communication or other mechanical component between the first portion 2, the anti-vibration component 4 and the second portion 5 along the longitudinal development axis 20 L.

[0103] . In this way it is possible to obtain an additional mechanical insulation of the first portion 2 with respect to the vibrations of the mechanical component which is needed determine the inclination value via the sensor 25 1.

[0104] . In one embodiment, in combination with any of the above where it is provided the additional electronic circuitry 30, the second portion 5 comprises a further plurality of elements E- 5 S' support for additional electronic circuitry 30 which extend along the longitudinal development axis L starting from the upper face 5a towards the inside of the second portion 5.

[0105] . As shown in the figures, each element of 10 support of said further plurality E-S' of elements of support is preferably a hollow cylindrical element threaded to receive and retain after screwing a respective screw (not shown in the figures) capable of passing through a respective existing hole 15 in the further electronic circuitry 30 (e.g. in a corner of the electronic board) and fix the additional 30 electronic circuitry inside the second portion 5.

[0106] . In one embodiment, in combination 20 with any of the above, shown as a example in figure 5, the sensor 1 comprises a portion of damping 9 with tuned mass mounted, along the axis of longitudinal development L, above the first portion 2, then on top of sensor 1. 25

[0107] . The damping portion 9 is fixed to the first portion and resin 7 (if present) so structural.

[0108] . The tuned mass damping portion 9 comprises a mass 9a capable of oscillating to counteract 5 vibrations to which the sensor 1 is subject.

[0109] . The tuned mass damping portion 9 It also comprises a spring 9b one fixed end of which is fixed to the base of the damping portion 9 while mass 9a is fixed to one free end. 10

[0110] . The spring 9b is configured to provide a force of recall necessary to maintain the mass 9a in oscillation.

[0111] . The tuned mass damping portion 9 also includes a 9c damper configured for 15 dissipate the energy of the oscillations of the mass 9a, reducing the amplitude of the vibrations to which the sensor 1.

[0112] . When the mechanical component you want to determine the inclination vibrates at a frequency close to 20 at the resonant frequency of sensor 1, the mass 9a of the damping portion 9 with tuned mass oscillates as opposed to vibration.

[0113] . The spring 9b of the damping portion 9 a tuned mass stores elastic energy, while the 25 damping portion 9 tuned mass dissipates energy kinetics, reducing the amplitude of the oscillations of the sensor 1.

[0114] . In more detail, as features general sizing guidelines for the damping portion 5 9 with tuned mass, it is necessary to consider:

[0115] . – the natural frequency of the portion of damping 9 with tuned mass, which must be tuned to the resonant frequency of sensor 1;

[0116] . - weight of mass 9a of the portion of 10 damping 9 with tuned mass, which must be sufficient to significantly influence the vibrations, but not so large as to compromise the sensor structure 1;

[0117] . - characteristics of the spring 9b and of the 15 damper 9c, which must be selected for get the right balance between elasticity and damping.

[0118] . In one embodiment, in combination with any of the above, sensor 1 includes also a light indicator 8, for example an LED, 20 electrically connected to the electronic circuitry 3 in so as to be facing and be optically connected to the anti-vibration component 4, for example via a respective through hole obtained on the back wall 2” of the first portion 2. 25

[0119] . In this embodiment, component 4 anti-vibration is made of transparent material to act as guide for the light emitted by the indicator light 8.

[0120] . This advantageously allows for an effective transmission of light indications outside the 5 sensor and realize a distinctive feature of sensor design 1.

[0121] . In one embodiment, in combination with any of the above, the component anti-vibration 4 comprises at least one layer of material 10 silicone.

[0122] . This layer of silicone material is preferably shaped so as to represent a silicone mat.

[0123] . In one embodiment, as an alternative to the 15 above and in combination with any of the others previous, the anti-vibration component 4 includes a multilayer structure in which each layer is made of material silicone.

[0124] . This multilayered structure of material 20 silicone is preferably shaped so as to represent a silicone mat.

[0125] . According to one embodiment, in alternative to the previous one and in combination with one any of the above, shown for example 25 in figure 3, the anti-vibration component 4 comprises a 20 layer base of silicone material.

[0126] . In this embodiment, component 4 anti-vibration also includes a plurality of elements 21 anti-vibration pads made of silicone material, for example 5 discs, fixed and distributed on and extending along the longitudinal development axis L starting from the said base layer 20.

[0127] . This embodiment, thanks to the plurality of 21 anti-vibration elements, allows 10 advantageously to obtain, with the same size with the anti-vibration component 4 comprising a single layer anti-vibration or a multi-layer anti-vibration structure, a less rigid 4-component anti-vibration mount.

[0128] . In fact, given the same size and thickness, the 15 plurality of elements 21 anti-vibration has an area of lower contact than the single layer anti-vibration or multilayer structure anti-vibration, as contact with the face lower 2a of the first portion 2 (or with the face 20 upper 5' of the second portion 5) is limited to only points where the 21 anti-vibration elements are present of said plurality of anti-vibration elements 21, therefore the anti-vibration component 21 consequently has a lower stiffness than the embodiment 25 where the only anti-vibration layer is present or the multilayer anti-vibration structure which features full contact with the lower face 2a of the first portion 2 and with the upper face 5a of the second portion 5. 5

[0129] . In one embodiment, in combination with the previous one and those that provide that the components 6 electrical communication cables include electrical communication, the basic layer 20 comprises a respective 20' through hole, preferably placed at the 10 center, designed to facilitate the passage of said cables electrical communication.

[0130] . ​​Referring now to Figure 7, it is now described from a circuitry point of view electronics 3, an anti-vibration tilt sensor 1 15 in accordance with an embodiment of this invention.

[0131] . This embodiment is in combination with any of the above where the 6 components of electrical communication include cables 13 of 20 electrical communication devices to enable wiring direct between the electronic circuitry 3 and the connections CE electric cars available in the second portion 5, the indicator light 8.

[0132] . In this embodiment, the circuitry 25 electronics 3 comprises the sensitive element 3a, suitable for generate electrical signals related to the value of inclination of the object being measured.

[0133] . The sensitive element 3a comprises for example a or more capacitive or thermal MEMS type accelerometers. 5

[0134] . According to another example, the element sensitive 3a includes one or more six-axis inertial stations or nine degrees of freedom, composed of accelerometers, gyroscopes and magnetometers.

[0135] . The electronic circuitry 3 also comprises 10 a data processing unit 3b configured to perform logical-mathematical operations necessary for management of the sensitive element 3a, to the determination of the value of inclination, and to the determination of the data representative of the inclination value determined by 15 supply via a 3c fieldbus transmitter.

[0136] . The data processing unit 3b is, for example, a microcontroller, a microprocessor, or an FPGA.

[0137] . The electronic circuitry 3 also comprises 3D temperature sensor element, to enable the 20 compensation of the thermal drift of the sensitive element 3rd.

[0138] . The 3d temperature sensor element is, for example, example, a contact-junction temperature sensor semiconductor integrated inside the chip that makes 25 the data processing unit 3b or the same element sensitive 3rd.

[0139] . According to another example, the sensor element 3d temperature sensor includes one or more thermoresistors which, since they cannot be integrated into the sensitive element 3a, they are 5 places near the sensitive element 3a.

[0140] . The electronic circuitry 3a further comprises a 3e power management module, configured to regulate the supply voltage electricity coming from the electrical system of the 10 mechanical component to which sensor 1 is installed, through the electrical connector 5b and the cables 13 of electrical communication, to power the electronic circuitry 3, so all the components on it it installed. 15

[0141] . The 3e power management module is, for example, a linear voltage regulator or switching.

[0142] . The electronic circuitry 3 also comprises the indicator light 8, operationally connected to 20 controlled by the data processing unit 3b so as to provide light indications on the operating status of sensor 1.

[0143] . As mentioned above, the indicator light 8 It could be, for example, an LED. 25

[0144] . The electronic circuitry 3 also comprises the 3c fieldbus transmitter, already introduced in previously, configured to interface electrically the data processing unit 3b to the electronic unit remote control, intended for the control of the 5 mechanical component.

[0145] . The 3c fieldbus transmitter is, for example, example, a CAN driver in the case of bus communication digital CANbus, or a 4 - 20 mA transmitter in case of an analog bus. 10

[0146] . Referring now to figure 8, it is now described from an electronic circuitry point of view 3 and the additional electronic circuitry 30, a sensor 1 of anti-vibration inclination according to a shape of carrying out the present invention. 15

[0147] . This embodiment is in combination with any of the above where the 6 components of electrical communication include the first antenna 16a arranged on the electronic circuitry 3 housed in the first portion 2 and the second antenna 16b arranged 20 on the additional electronic circuitry 30 housed inside the second portion 5, the additional cables 17 of electrical communication to allow a direct wiring between the additional electronic circuitry 30 and the CE electrical connections available to the 25 second portion 5, the sensitive element 3a.

[0148] . The electronic circuitry 3 therefore comprises the sensitive element 3a, previously described with reference to the embodiment of Figure 7.

[0149] . The electronic circuitry 3 also comprises 5 a data processing unit 3b which, in addition to the determination of the inclination value and the data representative of the determined inclination value, is configured to handle communication in mode wireless with an additional 30b data processing unit 10 arranged on the further electronic circuitry 30.

[0150] . A 3d temperature sensor element, described previously with reference to the embodiment of figure 7.

[0151] . The electronic circuitry 3 also comprises the 15 first antenna 16a, suitable for receiving, as mentioned in precedence, power supply from the second antenna 16b present on the additional electronic circuitry 30, capable of exchanging data wirelessly with the second 16b antenna to enable data communication, in 20 wireless modes, including 3 electronic circuitry and the additional electronic circuitry 30.

[0152] . The first antenna 16a is, for example, an antenna for wireless data communication in technology NFC or RFID. 25

[0153] . In this embodiment, the further electronic circuitry 30, directly connected to the CE electrical connections available on the second floor portion 5 via the additional communication cables 17 electric, includes a 3e management module 5 power supply, already described above with reference to the embodiment of Figure 7.

[0154] . In addition, the additional electronic circuitry 30 includes a 30c fieldbus transmitter, also already described above with reference to the form of 10 realization of figure 7.

[0155] . The further electronic circuitry 30 comprises a data processing unit 30b configured to communicate wirelessly with the processing unit data 3b of electronic circuitry 3, providing the data 15 representative of the determined inclination value via the 30c fieldbus transmitter.

[0156] . The further electronic circuitry 30 comprises the second antenna 16b, configured to transmit power supply to the first 16a antenna and swap 20 with it data.

[0157] . The second antenna 16b is, for example, an antenna for wireless data communication in technology NFC or RFID.

[0158] . Referring now to Figure 9, it is now 25 described from a circuitry point of view electronics 3 and additional electronic circuitry 30, an anti-vibration tilt sensor 1 in accordance to an embodiment of the present invention.

[0159] . The electronic circuitry 3 of the form of 5 realization of figure 9 is the same as the circuitry electronics 3 of the embodiment of figure 8 to whose previous description we refer without repeating here, for brevity.

[0160] . The further electronic circuitry 30 of the 10 embodiment of figure 9 is substantially equal to the additional electronic circuitry 30 of the embodiment of figure 8, the description of which previous one is referred to without repeating here, for brevity, except that, in this embodiment, 15 as shown in figure 9, the further circuitry electronics 30 also includes a further element sensitive 30a, capable of generating correlated electrical signals to the inclination value being measured.

[0161] . The further sensitive element 30a comprises for example 20 example one or more capacitive MEMS type accelerometers or thermal.

[0162] . According to another example, the further sensing element 30a comprises one or more stations inertial with six or nine degrees of freedom, composed of 25 accelerometers, gyroscopes and magnetometers.

[0163] . Referring now to Figure 10, it is now described from a circuitry point of view electronics 3 and additional electronic circuitry 30, an anti-vibration tilt sensor 1 in accordance 5 to an embodiment of the present invention.

[0164] . In accordance with this embodiment, the 6 electrical communication components include cables 14' of electrical communication to allow a direct wiring between electronic circuitry 3 and 10 additional electronic circuitry 30 and additional cables 15' of electrical communication to allow the direct wiring between the electronic circuitry 3 and the CE electrical connections available on the second floor portion 5. 15

[0165] . In this embodiment, the circuitry electronics 3 comprises the sensitive element 3a, suitable for generate electrical signals related to the value of inclination of the object being measured.

[0166] . The sensitive element 3a comprises for example a 20 or more capacitive or thermal MEMS accelerometers.

[0167] . According to another example, the element sensitive 3a includes one or more six-axis inertial stations or nine degrees of freedom, composed of accelerometers, gyroscopes and magnetometers. 25

[0168] . The electronic circuitry 3 also comprises a data processing unit 3b configured to perform logical-mathematical operations necessary for management of the sensitive element 3a, to the determination of the value of inclination, and to the determination of the data 5 representative of the inclination value determined by supply via a 3c fieldbus transmitter.

[0169] . The data processing unit 3b is, for example, a microcontroller, a microprocessor, or an FPGA.

[0170] . The electronic circuitry 3 also comprises 10 3d temperature sensor element, to enable the compensation for thermal drift of the sensitive element 3rd.

[0171] . The 3d temperature sensor element is, for example, example, a contact-junction temperature sensor 15 semiconductor integrated inside the chip that realizes the data processing unit 3b or the same element sensitive 3rd.

[0172] . According to another example, the sensor element 3d temperature sensor includes one or more thermoresistors which, 20 as they cannot be integrated into the sensitive element 3a, they are placed near the sensitive element 3a.

[0173] . The electronic circuitry 3a further comprises a 3e power management module, configured to regulate the supply voltage 25 electric coming from the electrical system of the mechanical component to which sensor 1 is installed, through the electrical connector 5b and the cables 13 of electrical communication, to power the electronic circuitry 3, so all the components on it 5 it installed.

[0174] . The 3e power management module is, for example, a linear voltage regulator or switching.

[0175] . In this embodiment, the further 10 electronic circuitry 30 includes an additional element sensitive 30a, capable of generating correlated electrical signals to the inclination value being measured.

[0176] . The further sensitive element 30a comprises for example for example one or more capacitive MEMS type accelerometers or 15 thermals.

[0177] . According to another example, the further sensitive element 3a comprises one or more stations inertial with six or nine degrees of freedom, composed of accelerometers, gyroscopes, and magnetometers. 20

[0178] . In this embodiment, the unit of data processing 3b of electronic circuitry 3 is configured to determine the tilt value combining (for example, by applying a filtering technique (of Kalman) the electrical signals coming from both 25 sensitive elements: the 3rd sensitive element of the electronic circuitry 3 and the additional sensitive element 30a of the additional electronic circuitry 30.

[0179] . The further electronic circuitry 30 comprises plus an additional 30d temperature sensor element, 5 to enable thermal drift compensation of the additional sensitive element 30a.

[0180] . The additional temperature sensor element 30d is, for example, a contact-junction temperature sensor integrated semiconductor of the additional sensing element 10 30a.

[0181] . According to another example, the further 30d temperature sensor element comprises one or more thermoresistors which, as they cannot be integrated in the additional sensitive element 30a, are placed in 15 proximity of the additional sensitive element 30a.

[0182] . As can be seen, the purpose of this invention is fully achieved as the sensor of anti-vibration inclination in accordance with this The invention substantially maintains the original dimensions 20 of the sensor once installed on the mechanical component, does not require additional time for assembly anti-vibration component, does not require an increase in components required for installing the sensor itself; therefore there are no additional costs and there is no compromise 25 the original reliability of the sensor, both the connections electrical CE and mechanical CM connections of which the sensor has mechanically decoupled and isolated from vibrations with respect to the sensitive element usable for determining the value of 5 inclination of the mechanical component to which the sensor is attached It is installable.

[0183] . These advantages are obtainable due to the fact that, in the anti-vibration tilt sensor, the component anti-vibration is placed along the development axis 10 longitudinal of the sensor, between the first portion comprising electronic circuitry for determining the inclination value and the second portion including electrical connections and connections mechanics to the mechanical component you want to 15 measure the inclination value with respect to the plane of reference, thus effectively creating a configuration in a stack that exploits the swinging of the structure to effectively filter vibrations.

[0184] . Furthermore, the anti-vibration component is 20 advantageously a structural component and essential to the structure of the sensor itself.

[0185] . In fact, without the anti-vibration component the sensor would not be producible because the first portion and the second portion would not be joined together. 25

[0186] . Furthermore, the anti-vibration component can have different shapes so as to present to different people vibration rejection characteristics depending on of the needs of the context, without having to change the overall form factor of the sensor. 5

[0187] . In fact, the anti-vibration component can be made as a single component, of thickness and shape different, having a single layer or structure multilayer, or with a base layer and a plurality of anti-vibration elements, separated from each other, so as to 10 check the overall stiffness of the component anti-vibration based on their distribution and number.

[0188] . In addition, the connection for communication electrical between the electronic circuitry housed in the 15 first portion and the electrical connections present in the second portion of the sensor can be made by one or more soft, flexible cables capable of sliding through the appropriate passage holes present, respectively, in the first portion, in the component 20 anti-vibration and in the second portion of the sensor or, to further increase the mechanical insulation between the first portion and the second portion, in mode wireless, e.g. based on communication protocol in NFC or RDID technology. 25

[0189] . Again, the anti-vibration component can be made of transparent silicone material and act as from light guide to provide light indications, to the advantage of an attractive aesthetic factor, in case the electronic circuitry housed in the first portion 5 also includes a light indicator.

[0190] . Finally, one embodiment provides that the second portion also houses additional circuitry electronics comprising an additional sensitive element, in addition to the sensitive element present in the circuitry 10 electronics housed in the first portion, and that the additional data processing unit present in the further electronic circuitry determine the value of inclination by combining (for example, mathematically) the electrical signals coming from both elements 15 sensitive.

[0191] . In a further embodiment it provides instead of the first portion housing the circuitry electronics with the sensitive element and the second portion electronics houses additional electronic circuitry 20 including a further sensitive element, and that the data processing unit present in the circuitry electronics housed in the first portion determines the tilt value by combining (for example, applying (a Kalman filter technique) electrical signals 25 from both sensitive elements.

[0192] . For example, combining electrical signals into a Kalman filter can offer significant benefits in terms of noise rejection and time improvement in response. 5

[0193] . The additional sensitive element 30a is integral with the mechanical component whose value you want to determine of inclination, therefore, presents a rapid response to movements of the mechanical component.

[0194] . In fact, being directly connected to the 10 mechanical component, captures its immediate variations of acceleration.

[0195] . On the other hand, the unfiltered vibrations of the mechanical component translates into an electrical signal and louder. 15

[0196] . The sensitive element 3a, however, presents noise reduced, thanks to the anti-vibration component 4 designed to filter high frequency vibrations, producing a cleaner and stronger electrical signal.

[0197] . However, its response time is slower, 20 as mechanical filtering introduces delays, smoothing out rapid changes in acceleration.

[0198] . The difference between the two electrical signals in the time can be used to estimate the noise value e(t) associated with the additional sensitive element 30a 25 rigidly mounted on the mechanical component: e(t) = y (t) – y (t) 1 2

[0199] . The difference e(t) represents largely the noise value and high frequency vibrations that are present in the electrical signal y(t) but not in the signal 5 electric y (t).

[0200] . The covariance matrix of the measurement noise R reflects the uncertainties of the element measurements sensitive.

[0201] . If we consider the electrical signal y1(t) and the 10 electrical signal y2(t) as the measurements provided by the two sensitive elements, it is possible to define R as: O 0 𝑅 = [ ] 0 O 2 2

[0202] . where σ and σ are the noise variances for the 1 2 rigidly mounted accelerometers (additional element 15 sensitive 30a) and suspended (sensitive element 3a), respectively.

[0203] . Using the difference between the signals e(t), it is it is possible to estimate the noise variance for the further rigidly mounted 30a sensing element, e.g. 20 calculating the variance of the recorded difference e(t) for a significant period of time. σ = Var(e(t)) And

[0204] . Assuming that the noise σ in the element sensitive 3a suspended from the anti-vibration component both 25 negligible or known from the spectral density of noise declared by the manufacturer, it is possible approximate: 2 2 σ = σ 1 and

[0205] . With the estimation of the noise variance, it is 5 possible to update the noise covariance matrix measurement in the Kalman filter: O 0 𝑒 𝑅 = [ ] 0 O

[0206] . Using the difference between electrical signals of the two accelerometers as an approximate measure of the 10 noise associated with the accelerometer rigidly connected to the mechanical component is a strategy that allows you to characterize noise more accurately and define a measurement noise covariance matrix plus realistic for the Kalman filter, thus improving 15 the quality of the slope value estimates.

[0207] . The application of this methodology is implementable due to the fact that the tilt sensor the object of the present invention integrates within it the anti-vibration component, and therefore has accessibility 20 mechanics both from the second rigidly connected portion to the mechanical component whose value you want to measure of inclination, both from the first mechanical portion dampened, and integrates within it all the resources of sensitive and computational elements to produce in 25 autonomy an advanced and more reliable measure of the inclination value.

[0208] . Furthermore, the embodiment in which they are the sensitive element 3a and the further element are present Sensitive 30a allows you to implement advanced strategies 5 diagnostics, such as:

[0209] . - constantly monitor the extent of the vibrations that characterize the mechanical component of whose inclination you want to measure. For example, it is it is possible to signal to the remote electronic unit if the 10 sensor, as designed for applications subject to vibrations, whether actually within its limits of operation or if application conditions exist so it cannot produce measurement data in accordance to the accuracy declared on the respective technical data sheet. 15

[0210] . - check the integrity of the component anti-vibration. For example, if, in the absence of vibrations and in stationary conditions, should there be a difference in inclination detected by the element sensitive 3rd compared to that detected by the element 20 sensitive 30a, it could mean that the component anti-vibration has become deformed, or has come off the first portion 2 and / or second portion 5 of the sensor.

[0211] . To embodiments of the sensor of anti-vibration inclination described above, a technician 25 of the branch, to meet contingent needs, will be able to make changes, adjustments and replacements of elements with other functionally equivalent ones, without fall outside the scope of the following claims.

[0212] . Each of the characteristics described as 5 belonging to a possible embodiment can be achieved independently of other forms of realization described.

Claims

1. Anti-vibration tilt sensor (1) for determining a tilt value with respect to a reference plane of a mechanical component to which said anti-vibration tilt sensor (1) is applicable, said anti-vibration tilt sensor (1) comprising: - a first portion (2) extending along a longitudinal development axis (L), said first portion (2) being adapted to house within it an electronic circuitry (3) configured to determine the tilt value required of said anti-vibration tilt sensor (1), said first portion (2) having a respective lower face (2a) transverse with respect to the longitudinal development axis (L) of the first portion (2);- a second portion (5) extending along said longitudinal development axis (L), said second portion (5) being distinct and separate from said first portion (2), said second portion (5) comprising mechanical connections (CM) configured to allow the anti-vibration tilt sensor (1) to be mechanically connected to the mechanical component whose tilt value is to be determined and electrical connections (CE) configured to allow the anti-vibration tilt sensor (1) to be electrically connected to a remote electronic control unit, said second portion (5) having a respective upper face (5a) transversal to the longitudinal development axis (L) of the second portion (5), the upper face (5a) of the second portion (5) facing the lower face (2a) of the first portion (2);- an anti-vibration component (4) placed along the longitudinal development axis (L) of the first portion (2) and the second portion (5), between the first portion (2) and the second portion (5) and fixed in contact with the lower face (2a) of the first portion (2) and the upper face (5a) of the second portion (5) so as to guarantee structural adhesion and mechanical isolation from the propagation of vibrations between the first portion (2) and the second portion (5).; 2. Sensor (1) according to claim 1, wherein the first portion (2) comprises a housing delimited by a respective side wall (2') which develops in height along the longitudinal development axis (L) and by a bottom wall (2”) whose external face corresponds to the lower face (2a) of the first portion (2), said side wall (2') defining a respective upper face of the first portion (2), opposite the respective lower face (2a), having an opening such as to facilitate the insertion of the electronic circuitry (3) inside the first portion (2).

3. Sensor (1) according to claim 2, wherein the first portion (2) comprises a plurality of elements (ES) supporting the electronic circuitry (3) which extend along the longitudinal development axis (L) starting from the lower face (2a) towards the inside of the first portion (2).

4. Sensor (1) according to any of the preceding claims, wherein the first portion (2) comprises within it a resin (7) suitable for substantially filling the internal volume defined by the first portion (2).

5. Sensor (1) according to any of the preceding claims, wherein the second portion (5) comprises a housing delimited by a respective side wall (5') which develops in height along the longitudinal development axis (L) and by an upper wall (5”) whose external face corresponds to the upper face (5a) of the second portion (5).

6. Sensor (1) according to claim 5, wherein the mechanical connections (CM) of the second portion (5) comprise respective through holes defined by a given conformation of the second portion (5), the second portion (5) being shaped in such a way that such through holes have a longitudinal development parallel to the longitudinal development axis (L) and are distributed externally to the base of the side wall (5') of the second portion (5), each of such through holes is configured to receive and retain, following screwing, a respective screw in order to mechanically connect the anti-vibration inclination sensor (1) to the mechanical component whose inclination value needs to be determined.

7. Sensor (1) according to any of the preceding claims, wherein the second portion (5) comprises within it a resin (7') suitable for substantially filling the internal volume defined by the second portion (5).

8. Sensor (1) according to any of the preceding claims, comprising electrical communication components (6) operatively connected between the electronic circuitry (3) housed inside the first portion (2) and the electrical connections (CE) available in the second portion (5).

9. Sensor (1) according to claim 8 when dependent on claims 2 and 5, wherein the electrical communication components (6) comprise electrical communication cables (13) capable of allowing direct wiring between the electronic circuitry (3) and the electrical connections (CE) provided by the second portion (5), the back wall (2”) of the first portion (2) comprising a through hole (10) placed substantially in the centre and capable of allowing the passage of said electrical communication cables (13) between the electronic circuitry (3) and the electrical connections (CE) provided by the second portion (5), the anti-vibration component (4) comprising a respective through hole (11) placed substantially in the centre and capable of allowing the passage of the electrical communication cables (13) between the electronic circuitry (3) and the electrical connections (CE) provided by the second portion (5),the upper wall (5”) of the second portion (5) includes a respective through hole (12) placed substantially in the centre and designed to allow the passage of the electrical communication cables (13) between the electronic circuitry (3) and the electrical connections (CE) available in the second portion (5).

10. Sensor (1) according to claim 8 when dependent on claims 2 and 5, wherein the second portion (5) is adapted to house within it a further electronic circuitry (30), the electrical communication components (6) comprising first electrical communication cables (14) adapted to directly connect together the electronic circuitry (3) housed in the first portion (2) and the further circuitry (30) housed in the second portion (5), the first electrical connection cables 14 being adapted to pass through the through hole (10) present in the bottom wall (2”) of the first portion (2), the through hole (11) present in the anti-vibration component (4) and the through hole (12) present in the upper wall (5”) of the second portion (5),the electrical communication components (6) include second electrical communication cables (15) suitable for directly connecting the additional circuitry (30) housed in the second portion (5) and the electrical connections (CE) available in the second portion (5).

11. Sensor (1) according to any of the preceding claims, wherein the electronic circuitry (3) comprises a sensing element (3a) and is configured to determine the required tilt value of said anti-vibration tilt sensor (1) based on the electrical signal provided by the sensing element (3a).

12. Sensor (1) according to claim 11 when dependent on claim 10, wherein the further electronic circuitry (30) comprises a further sensitive element (30a) which, once the sensor (1) is installed on the mechanical component of which it is necessary to determine the inclination value, is integral with the mechanical component of which it is necessary to determine the inclination value, the further electronic circuitry (30) being configured to determine the inclination value required of said anti-vibration inclination sensor (1) on the basis of the electrical signal provided by the further sensitive element (30a).

13. Sensor (1) according to claim 12, wherein the determination of the inclination value required by the sensor (1) is achievable as a combination of the inclination values ​​determined by the electronic circuitry (3) and by the further electronic circuitry (30).

14. Sensor (1) according to claim 12, wherein the electronic circuitry (3) is configured to determine the inclination value required of the sensor (1) by combining the electrical signal provided by the sensing element (3a) with the electrical signal provided by the further sensing element (30a).

15. Sensor (1) according to claim 8, wherein the electrical communication components (6) comprise a first data communication antenna (16a) installed on the electronic circuitry (3), the second portion (5) being adapted to house within it further electronic circuitry (30), the electrical communication components (6) further comprising a second data communication antenna (16b) installed on the further electronic circuitry (30), the second data communication antenna (16b) being configured to wirelessly transmit electrical power to the first data communication antenna (16a), the first data communication antenna (16a) and the second data communication antenna (16b) being configured to wirelessly communicate data with each other,the electrical communication components (6) also include further electrical communication cables (17) suitable for directly connecting the further circuitry (30) housed in the second portion (5) and the electrical connections (CE) available in the second portion (5).

16. Sensor (1) according to any of the preceding claims, comprising a tuned mass damping portion (9) mounted, along the longitudinal development axis L, above the first portion (2), the tuned mass damping portion (9) comprising: - a mass (9a) adapted to oscillate to counteract the vibrations to which the sensor (1) is subject; - a spring (9b) one fixed end of which is fixed to the base of the damping portion (9) while the mass (9a) is fixed to a free end, the spring (9b) being configured to provide a restoring force necessary to keep the mass (9a) in oscillation; - a damper (9c) configured to dissipate the energy of the oscillations of the mass (9a), reducing the amplitude of the vibrations to which the sensor (1) is subject.

17. Sensor (1) according to any preceding claim, further comprising a light indicator (8) electrically connected to the electronic circuitry (3) so as to face and be optically connected to the anti-vibration component (4), the anti-vibration component (4) being made of transparent material to act as a guide for the light emitted by the light indicator (8).

18. Sensor (1) according to any of the preceding claims, wherein the anti-vibration component (4) comprises at least one layer of silicone material.

19. Sensor (1) according to any of the preceding claims 1 to 17, wherein the anti-vibration component (4) comprises a multilayer structure 5 wherein each layer is made of silicone material.

20. Sensor (1) according to any of the preceding claims 1 to 17, wherein the anti-vibration component (4) comprises a base layer (20) of silicone material, the anti-vibration component (4) 10 further comprising a plurality of anti-vibration elements (21) of silicone material, fixed and distributed on and extending along the longitudinal development axis (L) starting from said base layer (20).