Additive manufacturing method of electronic device and printing support for additive manufacturing

Abstract

To provide an additive manufacturing method of an electronic device.SOLUTION: A system includes providing a printing support 200 with an electric circuitry 210 embedded in a dielectric encapsulation 220 and at least one supply terminal 230a, 230b connected to the electric circuitry. A method further includes an additive printing of an electronic device on the printing support by forming a conductive structure 110 embedded in a dielectric base material 120 and at least one device terminal 130a, 130b exposed on a surface 105 of an electronic device 100, wherein the at least one supply terminal of the printing support is arranged to electrically contact the at least one device terminal. The method further includes applying electric signals from the at least one supply terminal to the at least one device terminal to measure an electric characteristic of the conductive structure during the process of additive printing of the electronic device.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for additive manufacturing of electronic devices and printing supports for additive manufacturing, in particular to control and property adjustment during printing of additively manufactured electronics (AME). [Background technology]

[0002] In conventional additive manufacturing tools, every print job is performed on a polymer layer that is the interface between the printer table itself and the device being printed. This polymer layer is non-conductive and only transfers the heat load from the print table to the AME device to support the curing or self-fusing process inside the AME device. This prevents monitoring of electrical properties such as conductivity or impedance of the AME device during the build-up phase inside the AME printer. The properties of the AME device could only be measured after the printing process.

[0003] Furthermore, additive manufacturing processes are performed within certain tolerances, and these tolerances result in manufacturing variations in the manufactured AME devices, which ultimately creates the risk that the manufactured AME devices will have electrical characteristics that deviate from the target specifications. Summary of the Invention [Problem to be solved by the invention]

[0004] Thus, there is a need for improved control over additive manufacturing processes, particularly for AME devices. [Means for solving the problem]

[0005] At least some of the above mentioned problems are overcome by a method for additive manufacturing according to claim 1, a printing support according to claim 8 and an additive manufacturing tool according to claim 9. The dependent claims relate to further advantageous realizations for the subject matter of the independent claims.

[0006] The present invention relates to a system for additive manufacturing of electronic devices (AME-devices), the method comprising: - providing the printing support with an electric circuit embedded in a dielectric encapsulant and with at least one supply terminal connected to the electric circuit; - additively printing the electronic device on the printing support by forming conductive structures embedded in the dielectric base material and at least one device terminal exposed on a surface of the electronic device, the at least one supply terminal of the printing support being configured to be in electrical contact with the at least one device terminal; - applying an electrical signal from at least one supply terminal to at least one device terminal for measuring an electrical characteristic of the conductive structure during the process of additively printing the electronic device; Includes.

[0007] The electrical circuitry in the printing support may be a single wire connecting the supply terminals and the external terminals to provide signals through the printing support to the device terminals. Alternatively or additionally, the circuitry may include passive or active electrical components that shape or modify the electrical signals applied during the printing process. The surface exposing the device terminals may face the printing support.

[0008] Optionally, the electrical signal applied to the at least one supply terminal is adapted to measure at least one of the following characteristics of the electronic device: resistance, capacitance, inductance or impedance. For example, the electrical signal can be a DC (direct current) signal for measuring resistance, or an AC signal for measuring capacitance or inductance. For this purpose, the voltage or current level or frequency of the AC signal can be adjusted according to the circuit.

[0009] Optionally, the additive printing steps are modified based on the measured electrical properties to achieve target electrical properties for the manufactured electronic device.

[0010] Optionally, the modified additive printing step comprises: - modifying a cross-section of a conductive line at one or more locations of the conductive structure (e.g. to modify the resistance); - modifying the form or shape of a conductive line to modify the capacitance or inductance of a conductive structure; - modifying the composition of a dielectric or conductive printing material used in the additive printing process; Includes one or more of the following:

[0011] Optionally, the step of applying the electrical signal to measure the electrical property is repeated during the step of additively printing to allow continuous monitoring of the printing process of the electronic device. For example, the electronic device may be additively printed in successive layers and the electrical signal may be applied after a predefined number of printed layers, which may depend on the conductive structures. For example, the conductive structures may be error prone, so monitoring of the electrical property may be performed more frequently in critical areas thereof.

[0012] Optionally, the additional printing step is ink jet printing, which includes printing a dielectric ink and printing a conductive ink.

[0013] The method may also be implemented as software, a computer program product or a software module in a control unit.Accordingly, the embodiments also relate to a computer readable storage device or a computer program product having a program code for controlling a control unit to perform the method, when the computer program is executed on a processor.

[0014] Further embodiments relate to a printing support configured for additive manufacturing of an electronic device, the electronic device including at least one device terminal exposed on a surface of the electronic device. The printing support comprises an electrical circuit embedded in a dielectric encapsulant and at least one supply terminal exposed on the support surface and connected to the electrical circuit. The at least one supply terminal is configured to contact at least one device terminal of the electronic device to enable continuous monitoring of at least one electrical characteristic of the electronic device during its additive manufacturing. For example, the supply terminal may be formed at a predetermined location such that it is capable of contacting the device terminal. Alternatively or additionally, the supply terminal structure is formed with a number of terminals that can be activated or deactivated based on the electronic device being printed.

[0015] According to a further embodiment, an additive manufacturing tool comprises a printing support as described above and a control unit adapted to cause continuous monitoring of at least one electrical characteristic of the electronic device during additive manufacturing by application of electrical signals at the device terminals, the printing support may be connected to an external signal generating circuit that is controlled by the control unit to apply electrical signals suitable for the particular electronic device.

[0016] Compared to a conventional printing table, the embodiment replaces the used polymer layer of the conventional printing table with an interface layer as a printing support that includes a number of electrical contacts and wires configured inside the polymer layer. The printing support provides exposed terminals (contacts) at the surface on which additive manufacturing is performed. These contacts are overprinted with a conductive ink that is representative of a portion of the AME device. The printing support allows for measuring electrical properties (e.g., conductivity) of electrical structures inside the additively manufactured AME device during the printing process.

[0017] Various embodiments of the present invention are now described, by way of example only, and with reference to the accompanying drawings in which: [Brief description of the drawings]

[0018] [Figure 1] 1 is a schematic flow chart of a method for additive manufacturing of electronic devices (AME devices), according to an embodiment. [Diagram 2] 1 is an illustration of an AME device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Various examples will now be described more fully with reference to the accompanying drawings, in which several examples are illustrated.

[0020] Thus, while the embodiments are susceptible to various modifications and alternative forms, illustrative embodiments in the drawings are described in detail herein. It should be understood, however, that there is no intention to limit the embodiments to the particular forms disclosed, but rather, the embodiments are expected to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure. Like reference numerals refer to like and similar elements throughout the description of the various figures.

[0021] When an element is referred to as being "connected" or "coupled" to another element, the element can be directly connected or coupled to the other element, or there may be intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other words used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.).

[0022] The terminology used herein is for the purpose of describing illustrative examples only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to imply the plural as well, unless the context clearly indicates otherwise. It will be further understood that terms such as "comprises," "comprising," "includes," and / or "including," when used herein, specify the presence of stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0023] Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as would be understood by one of ordinary skill in the art to which the examples pertain. For example, terms as defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0024] FIG. 1 illustrates a schematic flow chart of a method for additively manufacturing an electronic device, the method comprising: - a step S110 of providing a printing support with an electric circuit embedded in a dielectric encapsulant and with at least one supply terminal connected to the electric circuit; - a step S120 of additively printing the electronic device on the printing support by forming conductive structures embedded in the dielectric base material and at least one device terminal exposed on a surface of the electronic device, the at least one supply terminal of the printing support being configured to be in electrical contact with the at least one device terminal; - a step S130 of applying an electrical signal from at least one supply terminal to at least one device terminal in order to measure an electrical characteristic of the conductive structure during the process of additively printing the electronic device; Includes.

[0025] According to further embodiments, all features of the print support described herein may be implemented as further optional method steps.

[0026] Those skilled in the art will readily recognize that various of the above-described method steps may be performed by a programmed computer. Thus, the method may also be a computer-implemented method. The embodiments also cover a program storage device, such as a digital data storage medium, that is machine or computer readable and that encodes a machine-executable or computer-executable program of instructions that, when executed by a computer or processor, perform some or all of the operations of the above-described method.

[0027] FIG. 2 illustrates diagrammatically the resulting AME device 100 fabricated on a print support 200, according to an embodiment.

[0028] The electronic device 100 comprises one or more device terminals 130a, 130b which are additively manufactured on the surface 205 of the printing support 200 and exposed on the surface 105 of the electronic device 100. The printing support 200 comprises an electronic circuit 210 made up of one or more electrical traces 210 which can be connected to an external control unit (not shown) for supplying certain measurement signals. For this purpose, the printing support 200 further comprises one or more supply terminals 230a, 230b for contacting the one or more device terminals 130a, 130b. According to a further embodiment, the printing support 200 further comprises one or more external terminals 240a, 240b providing contacts for connecting the printing support 200 to an external control unit.

[0029] The traces 210 are embedded in an encapsulation material 220, which may be the same polymer material used in conventional printing tables. Supply terminals 230a, 230b may be formed at locations where the AME device 100 has device terminals 130a, 130b exposed at the surface 105. These device terminals 130a, 130b can be used to measure electrical characteristics inside the AME device 100.

[0030] According to the embodiment shown, there is only one electrical trace 110 connecting two device terminals 130a, 130b. The electrical trace 110 is encapsulated in an encapsulation material 120 that provides electrical insulation for the embedded electrical trace 110. The electrical trace 110 may for example constitute an antenna, in which case the device terminals 130a, 130b provide ground and signal terminals.

[0031] According to further embodiments, more complex circuits can be formed by additive manufacturing inside the encapsulation material 120. Using additive manufacturing processes, complete three- or two-dimensional conductive structures 110 can be formed, including, inter alia, capacitors, coils, resistors, or other active or passive components. For this purpose, for example, inkjet technology can be used, where a conductive ink can be used to form conductive tracks or structures inside the dielectric encapsulation material, which has also been printed with a separate dielectric ink.

[0032] According to an embodiment, the AME device 100 can be printed layer by layer by ejecting either dielectric or conductive ink. The printing process can be constantly monitored by applying electrical signals received from external terminals 240a, 240b by the print support 200 using supply terminals 230a, 230b. Thus, the print support 200 can be formed as a layer or interface that is placed on top of a conventional printing table of a 3D printing tool.

[0033] For example, by using an external control unit connected to the external terminals 240a, 240b, the electrical properties of the AME device 100 can be continuously monitored during the additive manufacturing process. Based on this monitoring, the additive manufacturing process is adjusted or corrected. These adjustments include, for example, changes in the cross-section of the electrical traces, which allows for modification of resistance, capacitance, inductance, etc. For example, by changing the orientation, shape, or form of the electrical traces, the capacitance or inductance of the AME device can be created or modified as desired. Inductance can be created, for example, by intentionally printing additional curved portions, or by configuring the electrical traces 110 as straight lines rather than forming curved areas (to reduce inductance).

[0034] Thus, the embodiment provides the possibility to modify the electrical properties of the electrical device by adjusting the printing process already during the printing itself. In particular, it is possible for the electronic control unit to directly modify the printing process without the need to stop the printing process. For example, the respective software can already be configured to allow certain modifications that can be made during the printing process based on the measured properties.

[0035] Aspects of the embodiment can also be summarized as follows.

[0036] The printing support 200 can be realized, for example, by a printing substrate having a number of conductive structures thereon and terminals on which a 3D printing process can be performed. Thus, in contrast to a conventional printing support (formed, for example, as a glass or polymer material), an embodiment uses a printing support with a number of predefined terminals 130a, 130b having electrical structures integrated therein and adjusted according to the printed device 100. The device terminals 130a, 130b can also be artificial terminals that are only used for monitoring the printing process to ensure that the printed device 100 has predefined electrical properties. These device terminals 130a, 130b can be removed afterwards. Of course, it is also possible to use already available device terminals 130a, 130b (i.e. terminals that the resulting device will have) for the monitoring process during printing.

[0037] Although the AME device varies with respect to its electrical properties due to variations in thickness, width and distance and / or orientation of the conductive structures inside the AME device, such variations, including their tolerances, are already known during the printing process. Thus, already when the AME device 100 is being printed, it is possible to determine the quality of the resulting AME device 100. Furthermore, embodiments allow in-process control or direct adjustment of the electrical properties during the printing process. There is no need to wait until the end of the manufacturing of the AME device to determine those electrical properties. This in-process control and adjustment is particularly interesting in terms of personal matters or cybersecurity issues.

[0038] The description and drawings are merely illustrative of the principles of the disclosure, and thus it will be understood that those skilled in the art can devise various arrangements which embody the principles of the disclosure and are within its scope, even if not explicitly described or shown herein.

[0039] Furthermore, while each embodiment may stand on its own as a separate example, it should be noted that in other embodiments the defined features may be combined in different ways, i.e., a particular feature described in one embodiment may also be realized in other embodiments, and such combinations are covered by the present disclosure unless it is expressly stated that a particular combination is not intended.

[0040] Although the present invention has been illustrated and described in detail by the preferred embodiment, the present invention is not limited by the disclosed embodiment, and those skilled in the art can make other variations therefrom without departing from the scope of the present invention. Thus, it is clear that there are multiple possible variations. It is also clear that the embodiments described by the embodiments are merely illustrative, which are not to be considered as limiting the scope, applicability or configuration of the present invention in any way. In fact, the above description and the drawings enable those skilled in the art to realize the exemplary embodiments in a specific manner, and in that case, by knowing the disclosed inventive concept, those skilled in the art can contemplate various modifications, for example, in the function or configuration of individual elements described in the exemplary embodiment, as further described herein, without departing from the scope of the present invention defined by the claims and their legal equivalents. [Explanation of symbols]

[0041] 100 Electronic Devices 105 Surface of electronic device (e.g., first printed layer) 110 Conductive structures 120 Dielectric Basic Materials 130a, 130b Device terminals 200 Printing Support 205 Support Surface 210 Electrical Circuits 220 Dielectric sealing material 230a, 230b supply terminal 240a, 240b external terminal

Claims

1. A method for additive manufacturing of an electronic device (100), The steps include providing a printing support (200) with an electrical circuit (210) embedded in a dielectric encapsulant (220) and at least one supply terminal (230a, 230b) connected to the electrical circuit (210), A step of additionally printing an electronic device (100) on a printing support (200) by forming a conductive structure (110) embedded in a dielectric base material (120) and at least one device terminal (130a, 130b) exposed on the surface (105) of the electronic device (100), wherein the at least one supply terminal (230a, 230b) of the printing support (200) is configured to electrically contact the at least one device terminal (130a, 130b), In order to measure the electrical properties of the conductive structure (110) during the process of additionally printing the electronic device (100), the steps include applying an electrical signal from at least one supply terminal (230a, 230b) to at least one device terminal (130a, 130b), Methods that include...

2. The method according to claim 1, wherein the electrical signal applied to the at least one supply terminal (230a, 230b) is adapted to measure at least one of the following characteristics of the electronic device (100): resistance (R), capacitance (C), inductance (L), or impedance.

3. The method according to claim 2, wherein the additional printing step is modified based on the measured electrical characteristics to achieve a target electrical characteristic for the manufactured electronic device (100).

4. The aforementioned modified additional printing step is: The steps include changing the cross-section of the conductive line at one or more locations of the conductive structure (110), The steps include changing the form or shape of the conductive line in order to correct the capacitance or inductance of the conductive structure (110), The additional step of changing the composition of the dielectric or conductive printing material used in the printing process, The method according to claim 3, comprising one or more of the above.

5. The method according to claim 1, wherein the step of applying an electrical signal to measure the electrical characteristics is repeated between steps of additional printing to enable continuous monitoring of the printing process of the electronic device (100).

6. The method according to claim 1, wherein the additional printing step is inkjet printing, which includes printing a dielectric ink and printing a conductive ink.

7. A print support (200) for additive manufacturing of an electronic device (100) including at least one device terminal (130a, 130b) exposed on a surface (105), An electrical circuit (210) embedded in a dielectric encapsulant (220), At least one supply terminal (230a, 230b) is exposed on the support surface (205) and connected to the electrical circuit (210), Equipped with, A print support (200) wherein at least one supply terminal (230a, 230b) is configured to contact at least one device terminal (130a, 130b) of the electronic device (100) to enable continuous monitoring of at least one electrical characteristic of the electronic device (100) during the additive manufacturing of the electronic device (100).

8. It is an additive manufacturing tool, The print support (200) described in claim 7, A control unit configured to continuously monitor the at least one electrical characteristic of the electronic device (100) during additive manufacturing by causing an electrical signal to be applied to the at least one device terminal (130a, 130b), Additive manufacturing tools equipped with these features.

9. A computer-readable storage device having program code for controlling a control unit of an additive manufacturing tool according to claim 8, so as to perform the method according to any one of claims 1 to 6, when a computer program is executed on a computer or processor.

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