Photosensitive resin composition, photosensitive element, and method for manufacturing laminate

JP2026095511APending Publication Date: 2026-06-11RESONAC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2026-03-26
Publication Date
2026-06-11

AI Technical Summary

Benefits of technology

【0008】 本開示の一側面によれば、ライン幅の実測値を低減しつつ、不具合なく形成されたライン部分及びスペース部分を有する硬化物パターンを得ることが可能な感光性樹脂組成物を提供することができる。本開示の他の一側面によれば、当該感光性樹脂組成物を用いた感光性エレメントを提供することができる。本開示の他の一側面によれば、上述の感光性樹脂組成物又は上述の感光性エレメントを用いた積層体の製造方法を提供することができる。本開示の他の一側面によれば、レジストパターンの形成への感光性樹脂組成物又は感光性エレメントの応用を提供することができる。本開示の他の一側面によれば、配線基板の製造への感光性樹脂組成物又は感光性エレメントの応用を提供することができる。

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Abstract

The present invention provides a photosensitive resin composition that can reduce the measured line width while obtaining a cured product pattern having line portions and space portions formed without defects. [Solution] A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a tetrazole compound, wherein the monomer content of the styrene compound in the binder polymer exceeds 30% by mass, and the content of the tetrazole compound is 0.01 parts by mass or more per 100 parts by mass of the total of the binder polymer and the photopolymerizable compound.
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Claims

[Claim 1] It contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a tetrazole compound. The content of monomer units of the styrene compound in the binder polymer exceeds 30% by mass. A photosensitive resin composition in which the content of the tetrazole compound is 0.01 parts by mass or more per 100 parts by mass of the total of the binder polymer and the photopolymerizable compound.