Laser processing equipment, laser processing method

JP2026096287APending Publication Date: 2026-06-15SUMITOMO HEAVY IND LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SUMITOMO HEAVY IND LTD
Filing Date
2024-12-03
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

Existing laser processing technologies face issues with incomplete equalization of energy distribution, leading to adverse effects on the annealing process due to residual intensity unevenness.

Method used

A laser processing apparatus that irradiates a workpiece with multiple lasers having different two-dimensional energy density distributions multiple times, reducing irregularities through cumulative irradiation to achieve a uniform energy distribution.

Benefits of technology

This approach allows for appropriate laser processing by effectively reducing energy density distribution irregularities, ensuring consistent and uniform treatment of the workpiece.

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Abstract

To provide a laser processing device that can appropriately perform laser processing on an object to be processed. [Solution] A laser annealing apparatus 1 that performs annealing on a semiconductor wafer 3 by irradiating it with a laser L includes a laser overlap irradiation unit 311 that irradiates a common irradiation area IR on the semiconductor wafer 3 with multiple lasers L having different two-dimensional energy density distributions. The laser overlap irradiation unit 311 includes a laser overlap driving unit 3111 that drives the laser L in at least two directions intersecting the irradiation direction so that the first irradiation spot and the second irradiation spot overlap with a shift in the first direction, the second irradiation spot and the third irradiation spot overlap with a shift in the second direction intersecting the first direction, and the third irradiation spot and the first irradiation spot overlap with a shift in the third direction intersecting the first and second directions.
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