Wiring board

The wiring board design addresses light reflectivity and heat dissipation issues in LED lighting by using a high-thermal conductivity first plate and high-reflectivity second plate with geometric fits or diffusion bonding, enhancing brightness and durability.

JP2026096317APending Publication Date: 2026-06-15NITERRA CO LTD
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Patent Information

Application Number
JP2024210058
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

Existing LED lighting devices face challenges in improving light reflectivity, heat dissipation, and suppressing damage due to thermal expansion coefficient differences between substrate and reflective materials.

Method used

A wiring board design featuring a first metal plate with high thermal conductivity and a second metal plate with high reflectivity, where the light-emitting elements are placed within through-holes in the second plate, which also acts as a reflector, and the plates are joined using geometric fits or diffusion bonding to minimize thermal stress.

Benefits of technology

Enhances light extraction, improves heat dissipation, and reduces damage from thermal expansion coefficient differences, resulting in higher brightness and durability of LED lighting sources.

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Abstract

This improves the reflectivity of the light emitted from the light-emitting element, enhances the heat dissipation rate of the light-emitting element, and suppresses damage caused by the difference in thermal expansion coefficients between the substrate on which the light-emitting element is mounted and the reflective material. [Solution] The wiring board on which the light-emitting element is arranged comprises a first metal plate in the shape of a flat plate formed mainly of a first metal, and a second metal plate formed mainly of a second metal different from the first metal, having a flat plate shape with through holes formed in the thickness direction through which the light-emitting element is arranged, and arranged on the first metal plate, wherein the thermal conductivity of the first metal plate is higher than that of the second metal plate, and the reflectance of the second metal plate is higher than that of the first metal plate.
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Citation Information

Patent Citations

  • LED illumination light source

    JP2006041323A

  • led package

    JP2008544488A