Non-pneumatic tire, tire and wheel assembly, method for manufacturing a non-pneumatic tire, and method for manufacturing a tire and wheel assembly
The non-pneumatic tire design addresses high electrical resistance by incorporating a conductive path member and adhesive layer to discharge static electricity, reducing resistance and preventing charge buildup.
JP2026096852APending Publication Date: 2026-06-15BRIDGESTONE CORP
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- BRIDGESTONE CORP
- Filing Date
- 2024-12-03
- Publication Date
- 2026-06-15
AI Technical Summary
Technical Problem
Conventional non-pneumatic tires exhibit high electrical resistance, leading to a risk of static charge buildup during driving.
Method used
A non-pneumatic tire design featuring a resin case body with a conductive path member extending along its surface, connected through an adhesive layer and tread member, allowing for the discharge of static electricity to the road surface.
Benefits of technology
Reduces electrical resistance and suppresses static charge buildup by facilitating the flow of electricity through the tire structure, enhancing safety and efficiency.
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Smart Images

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Abstract
The present invention provides a non-pneumatic tire, a tire and wheel assembly, a method for manufacturing a non-pneumatic tire, and a method for manufacturing a tire and wheel assembly that can reduce electrical resistance. [Solution] A non-pneumatic tire 1 comprises a resin case body 16, a tread member 14 disposed on the outer circumference side of the case body 16, an adhesive layer 5 that adheres the case body 16 and the tread member 14 together and is conductive, and a conductive path member 4 which is conductive. The case body 16 has an inner cylinder portion 11, an outer cylinder portion 12 disposed on the outer circumference side of the inner cylinder portion 11, and a connecting portion 13 that connects the inner cylinder portion 11 and the outer cylinder portion 12 to each other. The conductive path member 4 extends on the surface of the case body 16 and has a first portion 4b that is in contact with the adhesive layer 5.
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