Semiconductor device and method for manufacturing the same

Abstract

To provide a semiconductor device and a method for manufacturing the same, which improve the completeness of the laminated structure of the variable resistance layer by directly depositing a variable resistance layer on the upper part of the first conductive line, and which allows for sufficient wet cleaning during the patterning of the second conductive line by forming a second conductive line on the upper part of the selector layer, thereby improving electrical short circuits between the second conductive lines. [Solution] The semiconductor device of this embodiment comprises a first conductive line including the upper portion of a carbon-based thin film, a variable resistor layer disposed on the first conductive line, a selector layer disposed on the variable resistor layer with a carbon-based thin film disposed on top of it, and a second conductive line disposed on the selector layer.