Moisture-curing polyurethane hot-melt resin composition, adhesive, and laminate

The moisture-curing polyurethane hot melt resin composition achieves balanced drop impact and heat creep resistance by optimizing storage modulus ratios and using specific polyols and polyisocyanates, ensuring effective adhesion and flexibility.

JP2026096938APending Publication Date: 2026-06-15DIC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DIC CORP
Filing Date
2025-11-25
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

Moisture-curable polyurethane hot melt adhesives face challenges in achieving both drop impact resistance and heat creep resistance simultaneously, as improving one property often compromises the other.

Method used

A moisture-curing polyurethane hot melt resin composition with specific ratios of storage modulus at different temperatures, thixotropy index, and use of polyols and polyisocyanates to enhance phase separation, resulting in a composition that balances impact resistance and heat creep resistance.

Benefits of technology

The composition exhibits excellent resistance to drop impact and heat creep, maintaining adhesive strength and flexibility.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

This disclosure provides a moisture-curing polyurethane hot-melt resin composition that exhibits excellent drop impact resistance and heat creep resistance. [Solution] A moisture-curing polyurethane hot melt resin composition comprising a urethane prepolymer (i) having an isocyanate group, made from a polyol (A) and a polyisocyanate (B), wherein the ratio of the storage modulus E'(25) at 25°C to the storage modulus E'(60) at 60°C [E'(25) / E'(60)] of the cured product of the moisture-curing polyurethane hot melt resin composition is in the range of 1.0 to 10.0.
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