Semiconductor module

Abstract

This prevents semiconductor modules with potential defects in the wires from being released to the market. [Solution] The semiconductor module (10) comprises a lead frame (1), a semiconductor element (2) mounted on the lead frame (1), a first wire (3) connected to the semiconductor element (2) or the lead frame (1) and contributing to the operation of the semiconductor element (2), a second wire (3d) connected to the lead frame (1) and being a dummy wire that does not contribute to the operation of the semiconductor element (2), and a sealing resin (4) that seals a part of the lead frame (1), the semiconductor element (2), the first wire (3), and the second wire (3d). The second wire (3d) has a smaller wire diameter or elastic modulus than the first wire (3).

Claims

1. Lead frame and, The semiconductor element mounted on the lead frame, A first wire connected to the semiconductor element or the lead frame and contributing to the operation of the semiconductor element, A second wire, which is a dummy wire connected to the lead frame and does not contribute to the operation of the semiconductor element, A sealing resin that seals a part of the lead frame, the semiconductor element, the first wire, and the second wire, Equipped with, The second wire has a smaller diameter or elastic modulus than the first wire. Semiconductor module.

2. The system comprises multiple lead frames, Each of the lead frames includes at least one dummy frame that does not contribute to the operation of the semiconductor element. The second wire is connected between the dummy frame and the lead frame, or between two of the dummy frames. The semiconductor module according to claim 1.

3. The sealing resin has a recess located near the second wire, The second wire is positioned between the resin injection hole of the sealing resin and the recess. The semiconductor module according to claim 1.

4. In a plan view, the vertex of the second wire is located on the straight line connecting the resin injection mark and the recess. The semiconductor module according to claim 3.

5. The second wire is positioned near the resin injection mark of the sealing resin. A semiconductor module according to any one of claims 2 to 4.

6. The second wire is positioned near the surface opposite to the surface where the resin injection mark of the sealing resin is located. The semiconductor module according to claim 1.

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