Resin composition and method for manufacturing the same, as well as element and electronic device.

Abstract

To provide a siloxane-based resin composition with a small rate of viscosity change over time and excellent handling properties. [Solution] A resin composition comprising an organosilicon compound having structures represented by formulas (A) and (B), wherein the proportion of the organosilicon compound having a structure represented by formula (B) with m=2 is greater than the proportion of the structure represented by formula (B) with m=1. TIFF2026104764000036.tif71167

Description

[Technical Field]

[0001] This invention relates to a resin composition and a method for producing the same, as well as to an element and an electronic device. [Background technology]

[0002] Organosilicon compounds containing a silsesquioxane skeleton are attracting attention from various fields because they have a unique structure based on siloxane bonds (Si-O-Si) with high bond energy, and because of the unique effects that can be expected from this structure. Among such organosilicon compounds containing a silsesquioxane skeleton, silicon-based polymers with a silsesquioxane skeleton as the main chain are known. These silicon-based polymers are particularly expected to be useful in semiconductor devices due to their excellent heat resistance and electrical insulation properties, in lenses due to their excellent transparency, and in adhesives due to their excellent adhesion properties, and further research is being conducted to enhance their functionality. For example, Patent Document 1 discloses a silicon-based polymer that can produce a silicone film with excellent heat resistance. Furthermore, studies have also been conducted on compositions using silicon-based polymers along with other components, and Patent Document 2 discloses a composition that can form a cured product with excellent heat resistance by using a silicon-based polymer along with a compound containing a specific element. Furthermore, Patent Document 3 discloses a technique for obtaining a laminate for semiconductor devices and the like that has high electrical connection reliability by using a film obtained using a silicon-based polymer as an insulating film. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2010-116464 [Patent Document 2] International Publication No. 2022 / 215759 [Patent Document 3] International Publication No. 2021 / 261403 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] As mentioned above, organosilicon compounds containing a silsesquioxane skeleton have primarily been studied for their heat resistance and electrical insulation properties, given their intended applications. However, organosilicon compounds containing a silsesquioxane skeleton are not known for their ease of handling, and further improvements in terms of handling during manufacturing have been needed when used in resin compositions containing these compounds. One indicator of ease of handling is the rate of change in viscosity over time, but little research has been conducted on the rate of change in viscosity over time for resin compositions containing the above-mentioned organosilicon compounds, leaving room for further investigation. Therefore, the object of the present invention is to provide a resin composition containing an organosilicon compound, having a low rate of viscosity change over time, and excellent handling properties. [Means for solving the problem]

[0005] As a result of diligent research, the inventors discovered that the above problem can be solved by controlling the number of two specific structures in the entire compound containing a specific silsesquioxane skeleton in the resin composition, and thus completed the present invention.

[0006] In other words, the gist of this invention is as follows: Item 1. Contains organosilicon compounds having structures represented by the following formulas (A) and (B): The aforementioned organosilicon compound, The proportion of structures represented by the following formula (B) where m=2 is, The proportion of structures represented by the following formula (B) where m=1 is greater than the proportion of structures represented by the formula (B) below. Resin composition. [ka] (In the above formula (A), R 1 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms;2 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; In the above formula (B), R 3 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer of 1 to 30; R 1 and R 2 and R 3 when at least any one of them is an alkyl group having 1 to 40 carbon atoms, the alkyl group having 1 to 40 carbon atoms may be independently replaced by at least one hydrogen atom independently by a halogen atom, a cycloalkyl group A having 5 or 6 carbon atoms 12 or an aryl group A having 6 to 20 carbon atoms 14 and at least one -CH2- may be independently replaced by -O-, -CO-, a cycloalkylene group A having 5 or 6 carbon atoms 13 or an arylene group A having 6 to 20 carbon atoms 15 ; R 1 and R 2 and R 3 when at least any one of them is a cycloalkyl group having 5 or 6 carbon atoms, the cycloalkyl group having 5 or 6 carbon atoms may be independently replaced by at least one hydrogen atom independently by a halogen atom, an alkyl group A having 1 to 40 carbon atoms 21 a cycloalkyl group A having 5 or 6 carbon atoms 22 or an aryl group A having 6 to 20 carbon atoms 24 and at least one -CH2- may be independently replaced by -O- or -CO-; R 1 and R 2 and R 3 when at least any one of them is an aryl group having 6 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms may be independently replaced by at least one hydrogen atom independently by a halogen atom, an alkyl group A having 1 to 40 carbon atoms 31 a cycloalkyl group A having 5 or 6 carbon atoms 32, or an aryl group A having 6 to 20 carbon atoms 34 It can be replaced with; Alkyl group A 21 and alkyl group A 31 The group may independently have at least one hydrogen atom replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may independently have -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A 12 , cycloalkylene group A 13 cycloalkyl group A 22 and cycloalkyl group A 32 The hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, or aryl group A 14 , Arylene group A 15 aryl group A 24 and aryl group A 34 (Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.)

[0007] Section 2. The organosilicon compound consists of a compound represented by the following formula (1): It includes at least the structure represented by the following formula (3): The proportion of structures represented by the following formula (3) where n=2 is, The proportion of structures represented by the following formula (3) where n=1 is greater than the proportion of structures where n=1. The resin composition described in item 1. [ka] (In the above formula (1), X includes one or more structures represented by the above formula (2), and does not include any other structures; when X includes two or more structures represented by the above formula (2), the two or more structures may be the same or different; Y 1 This is a single bond or a structure represented by formula (3) above; In equation (2) above, R 1 R in formula (A) is independent of the above. 1 It is synonymous with; R 2 R in formula (A) is independent of the above. 2 It is synonymous with; Y 2 This is a single bond or a structure represented by formula (3) above, and Y 1 It may be the same as or different from; In equation (3) above, R 3 R in formula (B) is independent of the above. 3 This is equivalent to; n is an integer between 1 and 30.

[0008] Item 3. The resin composition according to item 1 or 2, further comprising a compound having a functional group that can chemically bond with the organosilicon compound. Item 4. The resin composition according to Item 3, wherein the compound having the functional group is a compound having two or more of one or more groups represented by the following formulas (F-1) to (F-8). [ka] (In the above equations (F-1) to (F-8), R 4 (* represents a bond site.)

[0009] Item 5. The resin composition according to Item 4, wherein the compound having the functional group comprises one or more silicon compounds selected from hydrolyzable organosilane compounds represented by the following formula (10) and partially hydrolyzed condensates of said hydrolyzable organosilane compounds. R 5 4-a SiZ a (10) (In the above equation (10), R 5 (i) is independently a C1-C20 alkyl group, a C3-C6 cycloalkyl group, or a C6-C20 aryl group, in which at least one hydrogen atom may be independently substituted with a halogen atom; Z is independently one of the groups represented by formulas (F-1) to (F-8); and a is an integer from 2 to 4.

[0010] Item 6. The resin composition according to Item 5, wherein formula (10) is formula (11) shown below. R 6 4-b Si(OR) 7 ) b (11) (In the above equation (11), R 6 R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom; 7 (b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.)

[0011] Item 7. A resin composition according to any one of items 1 to 6, further comprising a curing catalyst.

[0012] Item 8. The resin composition according to Item 7, wherein the curing catalyst has one or more elements selected from Zr, Ti, Al, S, I, N, and P.

[0013] Item 9. A cured product of any one of the resin compositions described in items 1 to 8.

[0014] Item 10. An element having a layer containing the cured product described in Item 9.

[0015] Item 11. Electronic equipment having the elements described in Item 10.

[0016] Item 12. A method for producing a resin composition, comprising a compound manufacturing step of reacting a compound represented by the following formula (4) with at least one of the compounds represented by the following formula (5) and the following formula (6) at a temperature of 20°C or higher and 70°C or lower to obtain a silicon compound. [ka] (In the above equation (4), R A1 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; A2 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; A7 These are, independently, hydrogen atoms, or -(Si(R B3 )2-O) p -Si(R B3 )2-OH(p independently represents 0 or an integer from 1 to 30); R B3 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In equation (5) above, R A3 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n A1 is an integer between 1 and 30; In the above equation (6), R A4 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n A2is an integer between 1 and 30; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. B2 , or an aryl group A having 6 to 20 carbon atoms B4 It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. B3 , or an arylene group A having 6 to 20 carbon atoms B5 It can be replaced with; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C5 or C6 cycloalkyl groups is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1-C40 alkyl group A C1 , a cycloalkyl group A with 5 or 6 carbon atoms C2 , or an aryl group A having 6 to 20 carbon atoms C4 It may be replaced by, and at least one -CH2- may be independently replaced by -O- or -CO-; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. D1 , a cycloalkyl group A with 5 or 6 carbon atoms D2 , or an aryl group A having 6 to 20 carbon atoms D4 It can be replaced with; Alkyl group A C1and alkyl group A D1 is independently such that at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A B2 cycloalkylene group A B3 cycloalkyl group A C2 and cycloalkyl group A D2 is independently such that at least one hydrogen atom may be independently replaced by a halogen atom, an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may be independently replaced by -O-, -CO-; aryl group A B4 arylene group A B5 aryl group A C4 and aryl group A D4 is independently such that at least one hydrogen atom may be independently replaced by a halogen atom, an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms.)

Advantages of the Invention

[0017] According to the present invention, it is possible to provide a resin composition containing an organosilicon compound, having a small viscosity change rate over time, and excellent handling properties.

Embodiments for Carrying Out the Invention

[0018] The present invention will be described in detail below. The following descriptions of constituent elements may be based on representative embodiments or specific examples, but the present invention is not limited to such embodiments. In this specification, numerical ranges represented by "~" mean a range that includes the numbers written before and after "~" as the lower and upper limits. Also, in this specification, "hydrogen" in the description of structural formulas means "hydrogen atom (H)". Similarly, "carbon atom (C)" may be referred to as "carbon". In this specification, "adjacent groups" means two groups each bonded to one atom, or two groups each bonded to two adjacent atoms in the structural formula (two atoms directly bonded by a covalent bond). Furthermore, in this specification, the expression "A or B" may be read as "at least one selected from the group consisting of A and B." Furthermore, in this specification, when considering the structure "ABC", the structure in which B is a single bond refers to the structure "AC".

[0019] Compounds represented by formula (1) are sometimes abbreviated as compound (1). At least one compound selected from the group of compounds represented by formula (1) is sometimes abbreviated as compound (1). "Compound (1)" means one compound represented by formula (1), a mixture of two compounds, or a mixture of three or more compounds. These rules also apply to compounds represented by other formulas. In the chemical formula of a compound, substituent R X1 The symbol was used for several compounds. In these compounds, any two R X1 The two groups represented by may be the same or different. For example, R of compound (2-1) X1 The group is a phenyl group, and the R of compound (2-2) X1 In some cases, it is a phenyl group. R of compound (2-1) X1 The group is a phenyl group, and the R of compound (2-2) X1 In some cases, it is a cyclohexyl group. This rule is R X2 , R X3This also applies to symbols such as the following. Furthermore, in the chemical formula of a compound, the repeating unit n 5 The symbol was used for several compounds. In these compounds, any two n 5 The two numbers represented by may be the same or different. This rule applies to j 3 , k 2 This also applies to symbols such as these. The expression "at least one 'A'" means that the number of 'A's is arbitrary. The expression "at least one 'A' may be replaced by a 'B'" means that when there is one 'A', its position is arbitrary, and when there are two or more 'A's, their positions can be chosen without restriction. This rule also applies to the expression "at least one 'A' has been replaced by a 'B'". The expression "at least one 'A' may be replaced by a 'B', 'C', or 'D'" means that any 'A' is replaced by a 'B', any 'A' is replaced by a 'C', any 'A' is replaced by a 'D', and moreover, multiple 'A's are replaced by at least two of 'B', 'C', and / or 'D'. However, it does not include cases where two consecutive -CH2- are replaced by -O- to become -OO-. Alkyl groups that have a methyl group (-CH2-H) replaced by an O- to form an OH group are not included. Alkyl and alkylene groups may be straight-chain or branched. This also applies when any hydrogen atom in these groups is replaced by a halogen or a cyclic group, or when any -CH2- is replaced by an O-, -CO-, a cycloalkylene group, an arylene group, etc. In this specification, "R 1 , R 2 , and R 3 The expression "at least one of the following" is used for multiple R 1 , multiple R 2 , and multiple R 3 This indicates that it is at least one of the following, and specifically, the object is, for example, multiple R 1 One of the R1 It is acceptable to use only that. Halogen atoms refer to fluorine atoms, chlorine atoms, bromine atoms, or iodine atoms. Furthermore, although this specification describes multiple embodiments, various conditions in each embodiment can be applied to each other to the extent applicable.

[0020] <Resin composition> A resin composition according to one embodiment of the present invention (hereinafter also simply referred to as "resin composition") contains an organosilicon compound having structures represented by the following formulas (A) and (B), wherein the proportion of the organosilicon compound having a structure represented by the following formula (B) with m=2 is greater than the proportion of the structure represented by the following formula (B) with m=1. In this specification, a composition containing the above-mentioned organosilicon compound is referred to as a resin composition.

[0021] [Organosilicon compound (component A)] (Aspect 1) The organosilicon compounds described below will be explained using formulas (A) and (B), and the embodiments of the organosilicon compounds described in this section will also be referred to as "Embodiment 1". While numerous embodiments of organosilicon compounds are shown in this specification, the conditions in these embodiments can be arbitrarily combined with each other to the extent applicable.

[0022] [ka]

[0023] In this specification, "organosilicon compounds having structures represented by formulas (A) and (B)" is a concept consisting of a group of organosilicon compounds having structures represented by multiple formulas (A) and (B). In this specification, the "organosilicon compounds having structures represented by formulas (A) and (B)" included in the resin composition may be one type or two or more types. Furthermore, the structure represented by formula (B) with m=2 refers to the "structure represented by formula (B) with m=2" included in all of the above organosilicon compounds included in the resin composition. Similarly, the structure represented by formula (B) with m=1 refers to the "structure represented by formula (B) with m=1" included in all of the above organosilicon compounds included in the resin composition. Furthermore, the organosilicon compound includes at least the structure represented by formula (B), specifically at least the structure represented by formula (B) where m=2, but the structure represented by formula (B) may be sandwiched between the structures represented by formula (A) or may be not sandwiched between the structures represented by formula (A).

[0024] In this specification, the structure represented by the above formula (B) with m=2 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 2. In other words, (-O-Si(-R 3 A structure in which )2-) is linked three times in a row includes a structure represented by formula (B) where m=1 or 2, but is treated as a structure represented by formula (B) where m=3. Similarly, a structure represented by the above formula (B) where m=1 is treated as (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 1. In other words, (-O-Si(-R 3 A structure in which )2-) is repeated is not treated as a structure represented by equation (B) where m=1.

[0025] The inventors conducted thorough research and found that the resin composition containing the above-mentioned organosilicon compound exhibits a small rate of viscosity change over time. The inventors speculate on the reason for this as follows: If the proportion of structures represented by equation (B) with m=2 is greater than the proportion of structures represented by equation (B) with m=1, aggregation of organosilicon compounds can be suppressed, and the rate of change in viscosity over time can be reduced. Therefore, the above resin composition not only yields molded articles with excellent heat resistance and insulation properties because it contains a compound with a silsesquioxane skeleton, but also has excellent storage properties as a resin composition because its viscosity changes over time at a low rate.

[0026] In equation (A), R 1 From the standpoint of ease of synthesis, and from the standpoint of being able to adjust various properties such as heat resistance, refractive index, mechanical properties, and optical properties (hereinafter collectively referred to as "the standpoint of ease of synthesis and adjustment of various properties"), the carbon number (number of carbon atoms) of 1 to 40 was determined independently. It is an alkyl group, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; R 2 This is the R mentioned above. 1 From a similar viewpoint, these are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups.

[0027] In the above formula (B), R 3 This is the R mentioned above. 1 From a similar viewpoint, they are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In the above formula (B), m is an integer from 1 to 30, but is preferably from 2 to 25, and more preferably from 2 to 20, from the viewpoint of ease of composition.

[0028] R 1 When R is an aryl group, the following effects can be obtained: improved heat resistance, improved refractive index, and improved rigidity (allowing for adjustment of mechanical properties). 1 When the alkyl group is used, a moderate and well-balanced refractive index is easily obtained (it is possible to lower the refractive index compared to when it is an aryl group), and toughness is easily improved (mechanical properties can be adjusted). For the effects obtained when these aryl or alkyl groups are used, see R 2 or R 3 The same applies when it is an aryl group or an alkyl group.

[0029] Below, R 1 , R 2 , and R 3 The substituents that can be present are described below, and these groups make it easier to ensure ease of synthesis while maintaining a small rate of change in viscosity over time when used in a resin composition.

[0030] R 1 , R 2 , and R 3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. 12 , or an aryl group A having 6 to 20 carbon atoms 14 It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. 13 , or an arylene group A having 6 to 20 carbon atoms 15 It can be replaced with this.

[0031] R 1 , R 2 , and R 3 If at least one of the C5 or C6 cycloalkyl groups is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1-C40 alkyl group A 21 , a cycloalkyl group A with 5 or 6 carbon atoms 22 , or an aryl group A having 6 to 20 carbon atoms 24 It may be replaced by -CH2-, and at least one -CH2- may be independently replaced by -O- or -CO-.

[0032] R 1 , R 2 , and R 3 If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. 31, a cycloalkyl group A with 5 or 6 carbon atoms 32 , or an aryl group A having 6 to 20 carbon atoms 34 It can be replaced with this.

[0033] Alkyl group A 21 and alkyl group A 31 Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a carbon-5 or carbon-6 cycloalkyl group, or a carbon-6 to carbon-20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, a carbon-5 or carbon-6 cycloalkylene group, or a carbon-6 to carbon-20 arylene group. Cycloalkyl group A 12 , cycloalkylene group A 13 cycloalkyl group A 22 and cycloalkyl group A 32 The hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently て can be replaced with -O- or -CO-. Aryl group A 14 , Arylene group A 15 aryl group A 24 and aryl group A 34 The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.

[0034] Furthermore, organosilicon compounds having the structures represented by formulas (A) and (B) above are preferably free of vinyl groups or alkenyl groups, from the viewpoint of minimizing the risk of polymerization reactions occurring and affecting viscosity.

[0035] Furthermore, organosilicon compounds must contain at least one structure represented by formula (B) with m=2, while they may or may not contain one structure represented by formula (B) with m=1. If no structure represented by formula (B) with m=1 is included, the proportion of such structures will be 0%.

[0036] [Aspect 2] The organosilicon compound according to the above-described embodiment 1 comprises a compound represented by the following formula (1), and contains at least a structure represented by the following formula (3), wherein the proportion of structures represented by the following formula (3) with n=2 is greater than the proportion of structures represented by the following formula (3) with n=1. This embodiment is also referred to as "embodiment 2". The proportion of structures with n=1 or n=2 represents the ratio of the number of structures represented by the above formula (B) with m=1 or m=2 to the total number of structures represented by the above formula (B).

[0037] [ka]

[0038] In the above formula (1), X includes one or more structures represented by the above formula (2), and does not include any other structures; when X includes two or more structures represented by the above formula (2), the two or more structures may be the same or different; Y 1 This is a single bond or a structure represented by formula (3) above; In equation (2) above, R 1 R in equation (A) above is independent of R 1 It is synonymous with; R 2 R in equation (A) above is independent of R 2 It is synonymous with; Y 2 This is a single bond or a structure represented by formula (3) above, and Y 1 It may be the same as or different from; In equation (3) above, R 3 R in equation (B) above is independent of the others. 3This is synonymous; from the viewpoint of ease of composition, n is an integer from 1 to 30, but is preferably an integer from 2 to 25, and more preferably an integer from 2 to 20. Furthermore, organosilicon compounds contain two or more structures represented by the above formula (2) where X is and two or more Y 2 The structure may be represented by the above formula (3).

[0039] In this specification, the structure represented by the above formula (3) with n=2 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 2. In other words, (-O-Si(-R 3 A structure in which )2-) is linked three times in a row includes a structure represented by equation (3) where n=1 or 2, but it is treated as a structure represented by equation (3) where n=3. Similarly, the structure represented by the above equation (3) where n=1 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 1. In other words, (-O-Si(-R 3 A structure in which )2-) is repeated is represented by equation (3) and is not treated as a structure where n=1.

[0040] (Aspect 3) The organosilicon compound according to Embodiment 1 or 2 described above is preferably further satisfied with the following conditions. This embodiment is also referred to as "Embodiment 3".

[0041] R 1 From the viewpoint of ease of synthesis and the ability to obtain various properties such as optical properties, these are independently an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. R 2 R 1 From a similar viewpoint, they are independently C1-C20 alkyl groups, cyclohexyl groups, or phenyl groups. R 3 R 1 From a similar viewpoint, they are independently alkyl groups having 1 to 20 carbon atoms, or cyclohexyl groups.

[0042] From the viewpoint of maintaining a small rate of change in viscosity over time when used in a resin composition, and ensuring ease of synthesis, the following substituents are preferred among the substituents in the above embodiment 1 or 2.

[0043] R 1 , R 2 , and R 3 If at least one of the C1-C20 alkyl groups is an alkyl group having 1 to 20 carbon atoms, then the alkyl group having 1 to 20 carbon atoms may independently have at least one hydrogen atom independently replaced by a fluorine atom, and at least one -CH2- may independently have at least one -O- or -CO- atom replaced by a -O- or -CO-.

[0044] R 1 , R 2 , and R 3 If at least one of the groups is a cyclohexyl group, the cyclohexyl group may be independently replaced by at least one hydrogen atom with a fluorine atom, or by a C1-C20 alkyl group (where at least one hydrogen atom in the alkyl group may be replaced by a fluorine atom, and at least one -CH2- may be independently replaced by -O- or -CO-), or by at least one -CH2- may be independently replaced by -O- or -CO-.

[0045] R 1 , and R 2 If at least one of the groups is a phenyl group, the phenyl group may be independently replaced by at least one hydrogen atom independently of a fluorine atom, or by a C1-C20 alkyl group (where at least one hydrogen atom in the alkyl group may be replaced by a fluorine atom, and at least one -CH2- may be independently replaced by -O- or -CO-).

[0046] (Aspect 4) The organosilicon compound according to Embodiment 3 described above is preferably further satisfied with the following conditions. This embodiment is also referred to as "Embodiment 4".

[0047] R 1From the viewpoint of ease of synthesis and the ability to obtain various properties such as optical properties, the group is an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. R 2 R 1 From a similar perspective, alkyl groups having 1 to 20 carbon atoms, cyclohexyl groups, or is a phenyl group. R 3 R 1 From a similar perspective, it is an alkyl group having 1 to 20 carbon atoms, or a cyclohexyl group.

[0048] From the viewpoint of maintaining a small rate of change in viscosity over time when used in a resin composition, while also ensuring ease of synthesis, the following substituents are preferred among the substituents in the above embodiment 3.

[0049] R 1 , R 2 , and R 3 If at least one of the groups is an alkyl group having 1 to 20 carbon atoms, then at least one of the alkyl groups having 1 to 20 carbon atoms may be independently replaced by an O- group.

[0050] R 1 , R 2 , and R 3 If at least one of the groups is a cyclohexyl group, the cyclohexyl group may be independently replaced by an alkyl group having 1 to 20 carbon atoms in which at least one -CH2- in the alkyl group may be independently replaced by -O-, and at least one -CH2- may be independently replaced by -O-.

[0051] R 1 , and R 2 If at least one of the groups is a phenyl group, the phenyl group may be independently replaced by at least one hydrogen atom of an alkyl group having 1 to 20 carbon atoms (at least one -CH2- in the alkyl group may be independently replaced by -O-).

[0052] (Aspect 5) The organosilicon compound according to the above-described embodiment 4 is preferably further satisfied with the following conditions. This embodiment is also referred to as "embodiment 5".

[0053] R 1 This is a phenyl group that may be a cyclohexyl group or in which at least one hydrogen atom is replaced by an alkyl group having 1 to 20 carbon atoms, from the viewpoint of ease of synthesis and adjustment of various properties. R 2 This is the R mentioned above. 1 From a similar viewpoint, the phenyl group may be an alkyl group having 1 to 20 carbon atoms, or at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms. R 3 This is the R mentioned above. 1 From a similar perspective, these are alkyl groups with 1 to 20 carbon atoms.

[0054] (Aspect 6) The organosilicon compound according to Embodiment 5 described above is preferably further satisfied with the following conditions. This embodiment is also referred to as "Embodiment 6".

[0055] R 1 This is a phenyl group in which, from the viewpoint of ease of synthesis and adjustment of various properties, at least one hydrogen atom may be replaced with an alkyl group having 1 to 20 carbon atoms. R 3 This is the R mentioned above. 1 From a similar perspective, these are alkyl groups with 1 to 20 carbon atoms.

[0056] (Aspect 7) The organosilicon compound according to the above-described embodiment 6 is preferably further satisfied with the following conditions. This embodiment is also referred to as "embodiment 7".

[0057] R 2 and R 3 From the viewpoint of ease of synthesis and adjustment of various properties, it is an alkyl group having 1 to 6 carbon atoms.

[0058] (Pattern 8) The organosilicon compound according to the above-described embodiment 7 is preferably further satisfied with the following conditions. This embodiment is also referred to as "embodiment 8".

[0059] R 1 From the viewpoint of ease of synthesis and adjustment of various properties, it is a phenyl group. R 2 and R 3 From the viewpoint of ease of synthesis and adjustment of various properties, it is a methyl group. The above describes embodiments 1 to 8.

[0060] The structure of organosilicon compounds is, 1 This can be identified by 1H-NMR analysis. This identification also allows for the analysis of the proportion of structures represented by formula (B) above with m=2 (in the case of embodiment 2, the proportion of structures represented by formula (3) with n=2) and the proportion of structures with m=1 (in the case of embodiment 2, the proportion of structures represented by formula (3) with n=1). For example, the proportion of structures represented by formula (B) with m=2 is the proportion when the proportion of all structures represented by formula (B) is set to 100%. In other words, the denominator of this proportion is the total number of structures represented by formula (B) with different numbers of m when an organosilicon compound having structures represented by formulas (A) and (B) is composed of multiple types of organosilicon compounds with different numbers of m. The same applies to the proportion of structures with m=1, and also to the proportion of structures with n=2 and n=1 in embodiment 2.

[0061] When considering the structure represented by formula (B) in the entirety of all organosilicon compounds having structures represented by formulas (A) and (B) contained in the resin composition, the proportion of structures represented by formula (B) with m=2 should be greater than the proportion of structures represented by formula (B) with m=1. The ratio of the proportion of structures represented by formula (B) where m=2 (m=2 / m=1) to the proportion of structures represented by formula (B) where m=1 (m=2 / m=1) is not particularly limited as long as it is greater than 1. However, when the proportion of all structures represented by formula (B) is taken as 100%, from the viewpoint of minimizing the rate of change in viscosity over time when it is made into a resin composition, it is preferable that the proportion of structures where m=1 is 30% or less and m=2 / m=1 is 1.05 or more, and more preferably that the proportion of structures where m=1 is 25% or less and m=2 / m=1 is 1.1 or more. Furthermore, the upper limit of this ratio may be 9.0 or less.

[0062] The ratio of the number of structures represented by formula (B) with m=1 to the total number of structures represented by formula (B) is not particularly limited, but from the viewpoint of ensuring a small rate of change in viscosity over time when made into a resin composition, it is preferably 25% or less, more preferably 23% or less, and even more preferably 20% or less. The proportion of the structure represented by formula (B) with m=2 to the entire structure represented by formula (B) is not particularly limited, but from the viewpoint of ensuring a small rate of change in viscosity over time when it is made into a resin composition, it is preferably 20% or more, more preferably 23% or more, and even more preferably 25% or more. The proportion of structures represented by formula (B) above with m=1 and the proportion of structures represented by formula (B) above with m=2 can be achieved by adjusting the reaction temperature, reaction time, amount of catalyst, solid content concentration, etc.

[0063] Furthermore, if there are multiple types of organosilicon compounds with different structures, as represented by formulas (A) and (B), the "proportion of structures represented by formula (B) with m=2" refers to the proportion of structures with m=2 included in the total number of organosilicon compounds. The same applies to the "proportion of structures represented by formula (B) with m=1".

[0064] There are no particular restrictions on how to make the proportion of structures represented by the above formula (B) with m=2 greater than the proportion of structures represented by the above formula (B) with m=1, but this can be achieved, for example, by adjusting synthesis conditions such as reaction temperature, reaction time, amount of catalyst, and solid content concentration. Specifically, for example If the reaction temperature is too high or the reaction time is too long, the cleavage of siloxane bonds will proceed, and the proportion of structures with m=1 will tend to increase. Conversely, if the reaction temperature is too low or the reaction time is too short, the starting materials will remain, and the amount of organosilicon compound obtained will decrease.

[0065] The organosilicon compounds having the structures represented by the above formulas (A) and (B) are, more specifically, organosilicon compounds having the structure represented by the following formula (1-1), The structure includes at least the structure represented by the following formula (1-2), The proportion of the structure represented by the following formula (1-2) is, The proportion of structures represented by the following formula (1-3) is greater than the proportion of structures represented by the above formula (1-3). It may be an organosilicon compound.

[0066] [ka]

[0067] In the above equations (1-1), (1-2), and (1-3), R X1 , R X2 , and R X3 These are, independently, the R mentioned above. 1 , R 2 , and R 3 It is synonymous with [the above]. n 1 Independently, from the viewpoint of ease of composition, is 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. n 2Independently, from the viewpoint of ease of composition, is 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. n 3 Independently, from the viewpoint of ease of composition, is 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. j 1 These are independently either 0 or 1. j 2 These are independently either 0 or 1. j 1 +j 2 It is either 1 or 2. k 1 This represents an integer between 1 and 1,000. n in equation (1-1) above 1 , n 2 , or n 3 If it is 2, then these symbols correspond to (-O-Si(-R X3 The structure represented by )2-) is given by equation (1-2), n 1 , n 2 , or n 3 If it is 1, then these symbols correspond to (-O-Si(-R X3 The structure represented by )2-) is given by equation (1-3). In this specification, the structure represented by the above formula (1-2) is (-O-Si(-R X 3 This refers to a structure where the number of consecutive structures represented by )2-) is 2. In other words, (-O-Si(-R X3 A structure in which )2-) is linked three times in a row includes the structure represented by formula (1-3) or (1-2), but is not treated as a structure represented by formula (1-3) or (1-2). Similarly, the structure represented by the above formula (1-3) is (-O-Si(-R X3 This refers to a structure where the number of consecutive structures represented by )2-) is 1. In other words, (-O-Si(-R X3 Structures consisting of consecutive )2-) are not treated as structures represented by equation (1-3).

[0068] The organosilicon compound having the structure represented by the above formula (1-1) more specifically includes an embodiment containing one or more compounds selected from the group consisting of the compounds represented by the following formulas (2-1), (2-2) and (2-3). Similarly in this case, it contains at least the structure represented by the above formula (1-2), and the ratio of the structure represented by the above formula (1-2) is larger than the ratio of the structure represented by the above formula (1-3).

[0069]

Chemical formula

[0070]

Chemical formula

[0071]

Chemical formula

[0072] In the above formulas (2-1), (2-2) and (2-3), R X1 [[ID=an]] X2 and R X3 are each independently synonymous with R X1 X2 and R X3 4 in the above formulas (1-1), (1-2) and (1-3), respectively. n 4 n 5 n 6 j 3 j 4 and k 2 The conditions of can each independently apply the conditions of n 1 n 2 n 3 j 1 j 2 and k 1 in the above formula (1

[0073] ​​The embodiment comprising one or more compounds selected from the group consisting of compounds represented by the above formulas (2-1), (2-2), and (2-3) may more specifically be, for example, an embodiment comprising one or more compounds selected from the group consisting of compounds represented by the above formulas (2-2) and (2-3).

[0074] Furthermore, organosilicon compounds having the structures represented by formulas (A) and (B) above may be, for example, compounds represented by the following formula (1'). In this case as well, the compound contains at least the structure represented by formula (B) above, and the proportion of structures represented by formula (B) with m=2 is greater than the proportion of structures represented by the following formula (B) with m=1.

[0075] [ka]

[0076] In the above equation (1'), R P1 , R P2 , and R P3 These are, independently, the R mentioned above. 1 , R 2 , and R 3 It is synonymous with n. P1 Independently, from the viewpoint of ease of synthesis, the above-mentioned n 1 It is synonymous with n P2 The above n is independent of the above 1 It is synonymous with [the above]. In equation (1') above, k represents an integer between 1 and 1,000. Note that when specifying the structure of organosilicon compounds, the weight-average molecular weight or number-average molecular weight shown below may be used instead of k.

[0077] The weight-average molecular weight of the organosilicon compound is not particularly limited, but is preferably 3,000 to 700,000, more preferably 5,000 to 600,000, and even more preferably 7,000 to 500,000. When the weight-average molecular weight is within the above range, the resin composition containing the organosilicon compound can be adjusted to a viscosity that facilitates stirring and coating. The weight-average molecular weight can be adjusted by the reaction temperature, the amount of raw materials, the amount of catalyst used if one is used, etc.

[0078] The weight-average molecular weight mentioned above can be measured by gel permeation chromatography (GPC) analysis. An example of specific measurement conditions for GPC analysis is shown below. (Example of measurement conditions for GPC analysis) Columns: Two Shodex KF805L and Shodex KF804L columns (manufactured by Resona Co., Ltd.) connected in series. Mobile phase: THF Flow rate: 1.0ml / min Temperature: 40℃ Detector: RI Molecular weight standard sample: Polystyrene with known molecular weight

[0079] [NMR (Nuclear Magnetic Resonance Spectrum)] As mentioned above 1 For 1H-NMR measurements, for example, the JNM-ECZ500R manufactured by JEOL Ltd. can be used. 1 In 1H-NMR measurements, the sample is dissolved in a deuterated solvent such as deuterated acetone (manufactured by Wako Pure Chemical Industries, Ltd.), and measurements can be performed at room temperature, 500 MHz, and with 16 integration cycles. 1 From the integration ratio of the H-NMR spectrum, the proportion of structures represented by equation (B) with m=2 and the proportion of structures represented by equation (B) with m=1 can be calculated.

[0080] [Viscosity measurement] The viscosity of the resin composition containing the above compound can be measured using, for example, an E-type rotational viscometer manufactured by Toki Sangyo Co., Ltd. This measurement can be performed, for example, under conditions of 25°C and 20 rpm.

[0081] [Method for Producing Organosilicon Compound] The method for producing the organosilicon compound described above is not particularly limited. An example of the production method is shown below, but it is not limited thereto.

[0082] An example of the method for producing an organosilicon compound includes a step of reacting a compound represented by the following formula (4) (a compound containing a silsesquioxane skeleton) with at least one of a compound represented by the following formula (5) and a compound represented by the following formula (6) at 0°C or higher and lower than 80°C. Specifically, it is preferably produced by subjecting each of the above components to a polymerization reaction in the presence of a catalyst. From the viewpoint of the weight-average molecular weight of the resulting organosilicon compound and the viewpoint that the ratio of the structure with n = 2 to the ratio of the structure with n = 1 is likely to exceed 1, the reaction temperature is preferably 20°C or higher and 70°C or lower.

[0083] [Chemical formula]

[0084] R in the above formula (4) A1 and R A2 can be applied under the same conditions as R 1 and R 2 in the above formula (A) respectively. Also, R in the above formula (5) and A3 R A4 in formula (6) can be applied under the same conditions as R 3 in the above formula (B) independently, and n A1 and n A2 in the above formula (5) and formula (6) can be applied under the same conditions as m in the above formula (B) independently. That is, R A1 R A2 R A3 R A4 n A1 and n A2 are respectively R 1 R 2, R 3 , R 3 The following conditions are met: , m, and m.

[0085] In equation (4) above, R A1 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; A2 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; A7 These are, independently, hydrogen atoms, or -(Si(R B3 )2-O) p -Si(R B3 )2-OH(p independently represents 0 or an integer from 1 to 30); R B3 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In equation (5) above, R A3 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n A1 It is an integer between 1 and 30, preferably between 1 and 6, and more preferably between 1 and 4, from the viewpoint of availability; In the above equation (6), R A4 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n A2 is an integer between 1 and 30; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. B2 , or an aryl group A having 6 to 20 carbon atoms B4It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. B3 , or an arylene group A having 6 to 20 carbon atoms B5 It can be replaced with; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C5 or C6 cycloalkyl groups is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1-C40 alkyl group A C1 , a cycloalkyl group A with 5 or 6 carbon atoms C2 , or an aryl group A having 6 to 20 carbon atoms C4 It may be replaced by, and at least one -CH2- may be independently replaced by -O- or -CO-; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. D1 , a cycloalkyl group A with 5 or 6 carbon atoms D2 , or an aryl group A having 6 to 20 carbon atoms D4 It can be replaced with; Alkyl group A C1 and alkyl group A D1 The group may independently have at least one hydrogen atom replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may independently have -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A B2 , cycloalkylene group A B3 cycloalkyl group A C2 and cycloalkyl group AD2 The group A may be independently replaced by at least one hydrogen atom with a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, etc. B4 , Arylene group A B5 aryl group A C4 and aryl group A D4 Independently, at least one hydrogen atom is independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group. That's fine.

[0086] Furthermore, R A1 , R A2 , R A3 , R A4 , R B3 , n A1 , and n A2 The conditions of not only Embodiment 1 described above, but also Embodiments 2 to 7, which are limited embodiments of Embodiment 1, can be applied in the same way.

[0087] The order in which the reaction is carried out is not restricted. The reaction may be carried out by heating a mixture containing all the raw materials, or by adding and mixing each raw material as it is added.

[0088] The ratio of the total amount of at least one of the compounds represented by formula (5) and formula (6) to the total amount of the compound represented by formula (4) is not particularly limited, but it is preferably 0.3 or more, more preferably 0.5 or more, even more preferably 0.7 or more, and preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less in molar ratio. If the ratio is above the lower limit of the above range, it is easier to obtain an organosilicon compound with flexibility. If the ratio is below the upper limit of the above range, it is easier to obtain an organosilicon compound with high heat resistance.

[0089] The compound represented by formula (4) above can be obtained, for example, by reacting the compound represented by formula (7) below with the compound represented by formula (8) below and hydrolyzing them, as described in Japanese Patent Publication No. 2006-222207. Here, X represents a halogen atom or a hydrogen atom. The compound represented by formula (7) can also be obtained by hydrolyzing and condensing the compound represented by formula (9) in the presence of sodium hydroxide and water, as described in Japanese Patent Publication No. 2006-222207.

[0090] [ka]

[0091] In equations (7) to (9) above, R A1 and R A2 These are R in equations (4) to (6) above, respectively. A1 and R A2 It is synonymous with [the above].

[0092] The reactions of the compounds represented in (4) to (6) above typically use acids or bases as catalysts. In the method for producing the organosilicon compounds described above in this embodiment, an acid is preferred as a catalyst, considering the stability of the silsesquioxane reaction. Examples of acid catalysts include hydrochloric acid, phosphoric acid, toluenesulfonic acid, methanesulfonic acid, trifluoromethanesulfonic acid, sulfuric acid, fluorosulfuric acid, nitric acid, acetic acid, activated clay, or sulfonic acid-based ion exchange resins (commercial products include RCP-160M ​​(strong acid cation exchange resin, manufactured by Mitsubishi Chemical Corporation), etc.) and other cation exchange resins. Among these, sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, activated clay, or cation exchange resins are preferred, with sulfuric acid being more preferred. Furthermore, the shape of the catalyst is not particularly limited, but from the viewpoint of reaction rate, it is preferable to be liquid rather than solid. The amount of catalyst used (or its content in a mixture) is not particularly limited, as long as it is sufficient to promote the polymerization reaction. From the viewpoint of promoting the reaction, the amount of catalyst is preferably 0.5% by mass or more, more preferably 0.7% by mass or more, and even more preferably 0.9% by mass or more, relative to the total mass of the raw materials of the organosilicon compound. Furthermore, from the viewpoint of cost-effectiveness and polymerization stability, it is preferably 40% by mass or less, preferably 20% by mass or less, and more preferably 10% by mass or less.

[0093] The above reaction is preferably carried out using a solvent. The solvent is not particularly limited as long as it is capable of dissolving the compound represented by formula (4) above, as well as at least one of the compounds represented by formula (5) above and the compound represented by formula (6) above, and does not react with the catalyst when a catalyst is used. Examples of such solvents include hydrocarbon solvents such as butane, hexane, heptane, octane, or cyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, xylene, mesitylene, or anisole; ether solvents such as diethyl ether, diisopropyl ether, 1,2-dimethoxyethane, tetrahydrofuran (THF), 2-methyltetrahydrofuran (2MTHF), 4-methyltetrahydropyran (MTHP), cyclopentyl methyl ether (CPME), or dioxane; halogenated hydrocarbon solvents such as methylene chloride, chloroform, or carbon tetrachloride; ester solvents such as ethyl acetate; glycol ester solvents such as propylene glycol monomethyl ether acetate (PGMEA); sulfur-containing or nitrogen-containing solvents such as dimethylformamide (DMF), dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), or pyridine; alcohol solvents such as methanol, ethanol, isopropanol, or butanol; and ketone solvents such as acetone or methyl ethyl ketone. Among these, toluene, xylene, mesitylene, anisole, THF, 2MTHF, MTHP, or CPME are preferred, and toluene, MTHP, or CPME are more preferred. The solvent may be a single solvent or two or more solvents. The amount of solvent used is not particularly limited and may be set appropriately depending on the size of the reactor used and the amount of components to be dissolved. However, for example, the total content of the compound represented by formula (4) above, and at least one of the compounds represented by formula (5) above and formula (6) below is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and even more preferably 40 to 60% by mass.

[0094] Furthermore, the reactions of the compounds represented by (4) to (6) above may be carried out with the addition of water.

[0095] The reactions of the compounds represented by (4) to (6) above may be carried out using other components, as long as they allow for the production of the organosilicon compounds described above.

[0096] The reaction temperature is chosen from the viewpoint that the proportion of structures represented by formula (B) with m=2 in the target product group can be greater than the proportion of structures represented by formula (B) with m=1. The temperature should be between 0°C and 80°C, but preferably between 10°C and 75°C, more preferably between 15°C and 70°C, and even more preferably between 20°C and 70°C.

[0097] The reaction time is not particularly limited; for example, it may be between 0.5 hours and 48 hours, between 1 hour and 40 hours, or between 2 hours and 30 hours.

[0098] The reaction atmosphere is not particularly limited; for example, the reaction may be carried out in the atmosphere or in the presence of an inert gas such as nitrogen or argon.

[0099] For more specific methods of synthesizing organosilicon compounds, refer to the methods described in, for example, Japanese Patent Publication No. 2010-116464 and Japanese Patent Publication No. 2020-90572.

[0100] The content of organosilicon compounds in the resin composition is not particularly limited, but it is preferably 5% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 85% by mass or less, and even more preferably 15% by mass or more and 80% by mass or less, based on 100% by mass of the resin composition. To obtain the desired film thickness after coating, it is preferable that the content is above the lower limit of the above range. Also, from the viewpoint of solubility, it is preferable that the content is below the upper limit of the above range.

[0101] The resin composition may also contain components other than the organosilicon compounds described above, such as a compound (component B) having a functional group that can chemically bond with component A, which will be described later.

[0102] [Compounds having functional groups that can chemically bond with organosilicon compounds] The resin composition may contain components other than the organosilicon compound (component A) described above. For example, the resin composition may contain a compound (component B) having a functional group that can chemically bond with component A. In particular, if component B has two or more functional groups that can chemically bond with component A, component B acts as a crosslinking agent, so that a crosslinked product (siloxane polymer) of component A bonded via component B can be obtained. Component B may be used alone or in combination of two or more types.

[0103] Component B, which has a functional group that can chemically bond with component A, is a compound having two or more of one or more of the groups represented by the following formulas (F-1) to (F-8).

[0104] [ka]

[0105] In the above equations (F-1) to (F-8), R 4is independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom; * represents a bonding site. Of the above groups, groups that can take on either a linear or branched chain structure may take either a linear or branched chain structure.

[0106] R 4 The functional group is not particularly limited as long as it is independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom. However, from the viewpoint of reactivity with component A, it is preferably a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a butyl group, and is particularly preferably a hydrogen atom, a methyl group, or an ethyl group. Of the above functional groups, the propyl group or butyl group may have either a linear or branched structure.

[0107] From the viewpoint of curability and viscosity change rate over time, among the groups represented by the above formulas (F-1) to (F-8), one or more groups represented by (F-1) to (F-6) are preferred, and one or more groups represented by (F-2) and (F-6) are particularly preferred.

[0108] The following describes the more specific structure of component B. Component B can take on either a linear or branched structure, and may also have a ring structure.

[0109] From the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, component B preferably contains one or more silicon compounds from among the hydrolyzable organosilane compounds represented by the following formula (10) and the partially hydrolyzed condensates of said hydrolyzable organosilane compounds. In this specification, the expression "compound X includes compound Y and compound Z" may also be expressed as "compound X includes compound Y and compound Z". R 5 4-a SiZ a (10) In the above equation (10), R 5 This is an alkyl group having 1 to 20 carbon atoms, in which at least one hydrogen atom may be independently substituted with a halogen atom, and at least one hydrogen atom A is a cycloalkyl group having 3 to 6 carbon atoms, which may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms, which may have at least one hydrogen atom independently substituted with a halogen atom; Z is independently one of the groups represented by the formulas (F-1) to (F-8); and a is an integer from 2 to 4.

[0110] R 5 The group is not particularly limited as long as it is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom. However, from the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, it is preferable that the group is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and is particularly preferable that the group is an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms.

[0111] Furthermore, from the viewpoint of reactivity with component A, the above formula (10) is preferably the following formula (11). R 6 4-b Si(OR) 7 )b (11) In the above equation (11), R 6 R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom; 7 b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.

[0112] R 6 The group is not particularly limited as long as it is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom. However, from the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, it is preferable that the group is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and is particularly preferable that the group is an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms.

[0113] R 7 The elements are not particularly limited as long as they are a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, but from the viewpoint of reactivity with component A, an alkyl group having 1 to 6 carbon atoms is particularly preferred.

[0114] Furthermore, component B may be a compound having one or more structural units of the following formulas (B-1) to (B-4).

[0115] [ka]

[0116] In formulas (B-1) to (B-4), R B1Independently, each of the above formulas (F-1) to (F-8) represents any of the groups, or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, for example, any of chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, or cyanoethyl groups, where * represents a bonding site. Note that among the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure.

[0117] Component B can be obtained, for example, by using at least one compound of the following formulas (B-5) and (B-6) by known methods such as ring-opening polymerization and hydrolysis condensation, or by the method described in International Publication No. 2014 / 098189.

[0118] [ka]

[0119] In formula (B-5), R B2These are independently any of the groups represented by the above formulas (F-1) to (F-8), or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure.

[0120] R in equation (B-6) B4 These are independently any of the groups represented by the above formulas (F-1) to (F-8), or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure.

[0121] In formulas (B-5) and (B-6), b 1 is an integer between 3 and 6, and b 2 It is 0 or an integer from 1 to 9.

[0122] More specifically, examples of component B include 1,3-dimethoxytetramethyldisiloxane, 1,5-dimethoxyhexamethyltrisiloxane, polydimethylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain, and polydiphenylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain. , molecular chains with methyldimethoxysiloxy sealed dimethylsiloxane / dimethoxysiloxane copolymer, molecular chains with methyldimethoxysiloxy sealed methylphenylsiloxane / dimethoxysiloxane copolymer, molecular chains with methyldimethoxysiloxy sealed diphenylsiloxane / dimethoxysiloxane copolymer, molecular chains with methyldimethoxysiloxy sealed polydimethylsiloxane, molecular chains with trimethoxysiloxy sealed polymethylphenylsiloxane, molecular chains with trimethoxysiloxy sealed polydiphenylsiloxane, molecular chains with trimethoxysiloxy sealed dimethylsiloxane / dimethoxysiloxane copolymer, molecular chains with trimethoxysiloxy sealed methylphenylsiloxane / dimethoxysiloxane copolymer, or molecular chains with trimethoxysiloxy sealed diphenylsiloxane / dimethoxysiloxane copolymer;

[0123] 1,3-Diethoxytetramethyldisiloxane, 1,5-Diethoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain Body, molecular chain with dimethylethoxysiloxy sealed at both ends: methylphenylsiloxane / diethoxysiloxane copolymer, molecular chain with dimethylethoxysiloxy sealed at both ends: diphenylsiloxane / diethoxysiloxane copolymer, molecular chain with methyldiethoxysiloxy sealed at both ends: polydimethylsiloxane, molecular chain with methyldiethoxysiloxy sealed at both ends: polymethylphenylsiloxane, molecular chain with methyldiethoxysiloxy sealed at both ends: polydiphenylsiloxane Nylsiloxane, dimethylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, triethoxysiloxane Sisiloxy-bound polymethylphenylsiloxane, triethoxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, triethoxysiloxy-bound dimethylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain, triethoxysiloxy-bound methylphenylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain, or triethoxysiloxy-bound diphenylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain;

[0124] 1,3-Dihydroxytetramethyldisiloxane, 1,5-Dihydroxyhexamethyltrisiloxane, 1,5-Dihydroxyhexaphenyltrisiloxane, Polydimethylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / Dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Diphenylsiloxane / Dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polydimethylsiloxane with methyldihydroxysiloxy sealed at both ends of the molecular chain, Polymer Tylphenylsiloxane, polydiphenylsiloxane with methyldihydroxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydroxysiloxane copolymer with methyldihydroxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydroxysiloxane copolymer with methyldihydroxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / dihydroxysiloxane copolymer with methyldihydroxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with trihydroxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with trihydroxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with trihydroxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydroxysiloxane copolymer with trihydroxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydroxysiloxane copolymer with trihydroxysiloxy sealed at both ends of the molecular chain The body, or a molecular chain trihydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer;

[0125] 1,1,3,3-Tetramethyldisiloxane, 1,1,3,3,5,5-Hexamethyltrisiloxane, Polydimethylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Molecular dimethylhydrogensiloxy-bound methylphenylsiloxane / dihydrogensiloxane copolymer, dimethylhydrogensiloxy-bound diphenylsiloxane / dihydrogensiloxane copolymer, methyldihydrogensiloxy-bound polydimethylsiloxane, methyldihydrogensiloxy-bound polymethylphenylsiloxane, methyldihydrogensiloxy-bound polydiphenylsiloxane, methyldihydrogensiloxy-bound polydiphenylsiloxane, methyldihydrogensiloxy-bound dimethylsiloxane / dihydrogensiloxane copolymer, methyldihydrogensiloxy-bound methylphenylsiloxane / dihydrogensiloxane copolymer, methyldihydrogensiloxy-bound diphenylsiloxane / dihydrogensiloxane copolymer, trihydrogensiloxy-bound polydimethylsiloxane, trihydro Polymethylphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain; polydiphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain; dimethylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; methylphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; or diphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain;

[0126] 1,3-Diacetoxytetramethyldisiloxane, 1,5-Diacetoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / Diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Diphenylsiloxane / Diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Polydimethylsiloxane with methyldiacetoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with methyldiacetoxysiloxy sealed at both ends of the molecular chain Phenylsiloxane, dimethylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxy sealed at both ends of the molecular chain, polydimethylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain;

[0127] 1,3-Diethylmethylketoximetetramethyldisiloxane, 1,5-Diethylmethylketoximehexamethyltrisiloxane, Polydimethylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Symsiloxy-bound polydiphenylsiloxane, molecular chain with dimethylethylmethylketoximesiloxane-bound dimethylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with dimethylethylmethylketoximesiloxane-bound methylphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with dimethylethylmethylketoximesiloxane-bound diphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with methyldiethylmethylketoximesiloxane-bound polydimethylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane-bound polymethylphenylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane-bound polydiphenylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane-bound dimethylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with methyldiethyl Tylketoximesiloxy-sealed methylphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with both ends methyldiethylmethylketoxime-sealed diphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with both ends triethylmethylketoximesiloxane-sealed polydimethylsiloxane, molecular chain with both ends triethylmethylketoximesiloxane-sealed polymethylphenylsiloxane, molecular chain with both ends triethylmethylketoximesiloxane-sealed polydiphenylsiloxane, molecular chain with both ends triethylmethylketoximesiloxane-sealed dimethylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with both ends triethylmethylketoximesiloxane-sealed methylphenylsiloxane / diethylmethylketoximesiloxane copolymer, or molecular chain with both ends triethylmethylketoximesiloxane-sealed diphenylsiloxane / diethylmethylketoximesiloxane copolymer;

[0128] (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OCH3)SiO 2 / 2Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units; (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OC2H5)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0129] (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OH)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OH)SiO1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units; (CH3)2(CH=CH2)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(CH=CH2)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(CH=CH2)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(CH=CH2)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0130] (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)HSiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2Copolymers consisting of units, and in each of these exemplary compounds, some or all of the methyl groups are substituted with ethyl groups, other alkyl groups such as propyl groups, or aryl groups such as phenyl groups;

[0131] Methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, glycidyltrimethoxysilane, mercaptotrimethoxysilane, mercaptotriethoxysilane, aminopropyltriethoxysilane, tetramethoxysilane, partially condensed tetramethoxysilane, tetraethoxysilane, partially condensed tetraethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, isobutyltrimethoxysilane, ethyltrimethoxysilane, vinyltriethoxysilane, phenyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, methyltriacetate Examples include toxysilane, vinyltriacetoxysilane, ethyltriacetoxysilane, dibutoxydiacetoxysilane, phenyl-tripropionoxysilane, methyltris(methylethylketoxymo)silane, vinyl-tris-methylethylketoxymosilane, methyltris(methylethylketoxyimino)silane, methyltris(isopropeneoxy)silane, vinyltris(isopropeneoxy)silane, ethyl polysilicate, n-propyl orthosilicate, ethyl orthosilicate, dimethyltetraacetoxydisiloxane, oximesilane, acetoxysilane, acetonoxymesilane, or enoxysilane.

[0132] Furthermore, compounds having one or more structural units of the above formulas (B-1) to (B-4) also include the compounds listed below. 1,6-Bis(trimethoxysilyl)hexane, bis(trialkoxysilylalkyl)amine, bis(dialkoxyalkylsilylalkyl)amine, bis(trialkoxysilylalkyl)N-alkylamine, bis(dialkoxyalkylsilylalkyl)N-alkylamine, bis(trialkoxysilylalkyl)urea, bis(dialkoxyalkylsilylalkyl)urea, bis(3-trimethoxysilylpropyl)amine, bis(3-triethoxysilylpropyl)amine, bis(4-trimethoxysilylbutyl)amine, bis(4-triethoxysilylbutyl)amine, bis(3-trimethoxysilylpropyl)N-methylamine, bis(3-triethoxysilylpropyl)N-methylamine, bis(4-trimethoxysilylbutyl)N-methylamine, bis(4-triethoxysilylbutyl)N-methylamine, bis(3-trimethoxysilylpropyl)urea, bis(3-triethoxysilylpropyl)urea, bis(4-trimethoxysilylbutyl)urea, bis(3-trimethoxysilylpropyl)urea, bis(4-trimethoxysilylbutyl)urea, bis (4-triethoxysilylbutyl)urea, bis(3-dimethoxymethylsilylpropyl)amine, bis(3-diethoxymethylsilylpropyl)amine, bis(4-dimethoxymethylsilylbutyl)amine, bis(4-diethoxymethylsilylbutyl)amine, bis(3-dimethoxymethylsilylpropyl)N-methylamine, bis(3-diethoxymethylsilylpropyl)N-methylamine, bis(4-dimethoxymethylsilylbutyl)N-methylamine, bis(4-diethoxymethyl (Silylbutyl)N-methylamine, bis(3-dimethoxymethylsilylpropyl)urea, bis(3-diethoxymethylsilylpropyl)urea, bis(4-dimethoxymethylsilylbutyl)urea, bis(4-diethoxymethylsilylbutyl)urea, bis(3-dimethoxyethylsilylpropyl)amine, bis(3-diethoxyethylsilylpropyl)amine, bis(4-dimethoxyethylsilylbutyl)amine, bis(4-diethoxyethylsilylbutyl)amine, bis(3-dimethoxyethyl (Lucilylpropyl)N-methylamine, bis(3-diethoxyethylsilylpropyl)N-methylamine, bis(4-dimethoxyethylsilylbutyl)N-methylamine, bis(4-diethoxyethylsilylbutyl)N-methylamine, bis(3-dimethoxyethylsilylpropyl)urea, bis(3-diethoxyethylsilylpropyl)urea, bis(4-dimethoxyethylsilylbutyl)urea, and / or bis(4-diethoxyethylsilylbutyl)urea; bis(triethoxysilylpropyl)amine, bis(trimethoxysilylpropyl)amine, bis(trimethoxysilylpropyl)urea, bis(triethoxysilylpropyl)urea Compounds containing an organic group in the main chain, such as bis(diethoxymethylsilylpropyl)N-methylamine; di- or trialkoxysilane-terminated polydialkylsiloxanes, di- or trialkoxysilyl-terminated polyarylalkylsiloxanes, di- or trialkoxysilyl-terminated polypropylene oxides, polyurethanes, or polyacrylates; polyisobutylene; di- or triacetoxy-terminated polydialkyl; polyarylalkylsiloxane; di- or trioxyiminosilyl-terminated polydialkyl; polyarylalkylsiloxane; or di- or triacetonoxy-terminated polydialkyl, or polyarylalkyl, etc.

[0133] Examples of commercially available products containing component B include the Cyraplane FM11 series, Cyraplane FM88 series, Cyraplane FM99 series, and Cyraplane FM08 series (all product names) manufactured by JNC Corporation, the SR series (product name) manufactured by Konishi Chemical Industry Co., Ltd., MKC Silicate MS57 (product name), MKC Silicate MS51 (product name) (average tetramethoxysilane pentamer), MKC Silicate MS56, and MS56S (all product names) manufactured by Mitsubishi Chemical Corporation, and Methyl Silicate 51 (average tetramethoxysilane tetramer), Methyl Silicate 53 (average tetramethoxysilane heptomer), Ethyl Silicate 40 (average tetraethoxysilane pentamer), or Ethyl Silicate 48 (average tetraethoxysilane decaper) manufactured by Colcoat Co., Ltd.

[0134] Specifically, a preferred example of component B is having one or more of the structures of the above formulas (B-1) to (B-4), and having at least two or more R in the same formula. B1 However, it is preferable that it be one of the above formulas (F-1) to (F-8).

[0135] More specifically, examples of preferred component B include 1,3-dimethoxytetramethyldisiloxane, 1,5-dimethoxyhexamethyltrisiloxane, polydimethylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, and dimethylmethylsiloxy sealed at both ends of the molecular chain. Tylmethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer, trimethoxysiloxy-bound polydimethylsiloxane at both ends of the molecular chain, trimethoxysiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, trimethoxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, trimethoxysiloxy-bound dimethylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, trimethoxysiloxy-bound methylphenylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, or trimethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain;

[0136] 1,3-Diethoxytetramethyldisiloxane, 1,5-Diethoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethyl Ethereum-bound methylphenylsiloxane / diethoxysiloxane copolymer, dimethylethoxysiloxane-bound diphenylsiloxane / diethoxysiloxane copolymer, methyldiethoxysiloxane-bound diphenylsiloxane / diethoxysiloxane copolymer, triethoxysiloxane-bound polydimethylsiloxane, triethoxysiloxane-bound polymethylphenylsiloxane, triethoxysiloxane-bound polydiphenylsiloxane, triethoxysiloxane-bound dimethylsiloxane / diethoxysiloxane copolymer, triethoxysiloxane-bound methylphenylsiloxane / diethoxysiloxane copolymer, or triethoxysiloxane-bound diphenylsiloxane / diethoxysiloxane copolymer;

[0137] 1,3-Dihydroxytetramethyldisiloxane, 1,5-Dihydroxyhexamethyltrisiloxane, 1,5-Dihydroxyhexaphenyltrisiloxane, Polydimethylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, both ends of the molecular chain Dimethylhydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer, trihydroxysiloxy-bound polydimethylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound dimethylsiloxane / dihydroxysiloxane copolymer, trihydroxysiloxy-bound methylphenylsiloxane / dihydroxysiloxane copolymer at both ends of the molecular chain, or trihydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer at both ends of the molecular chain;

[0138] 1,1,3,3-Tetramethyldisiloxane, 1,1,3,3,5,5-Hexamethyltrisiloxane, Polydimethylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / Dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Dimethylhydrogensiloxy sealed at both ends of the molecular chain Diphenylsiloxane / dihydrogensiloxane copolymer, polydimethylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain;

[0139] Methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, tetramethoxysilane, partially condensed tetramethoxysilane, tetraethoxysilane, or partially condensed tetraethoxysilane;

[0140] (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OCH3)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO2 / 2 units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units; (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OC2H5)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0141] (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OH)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0142] (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)HSiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 Examples include copolymers composed of units.

[0143] Since component A has hydroxyl groups, component B can be, for example, a condensation-crosslinkable compound having three or more groups or atoms that undergo a condensation reaction with the hydroxyl groups in component A. Specifically, examples of compounds having three condensation-reactive groups include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, glycidyltrimethoxysilane, mercaptotrimethoxysilane, mercaptotriethoxysilane, aminopropyltriethoxysilane, methyltris(isopropeneoxy)silane, or vinyltris(isopropeneoxy)silane; examples of compounds having four condensation-reactive groups include tetramethoxysilane or tetraethoxysilane; and examples of compounds having five or more condensation-reactive groups include the partial hydrolysis condensates of the above compounds. When these are used, for example, the resin composition can be crosslinked with component A by placing it in a water-containing atmosphere such as ordinary air at room temperature and under light irradiation or heating conditions.

[0144] The content ratio of component B in the resin composition is not particularly limited, but it is preferably 0.1 parts by mass or more and 50 parts by mass or less, more preferably 0.3 parts by mass or more and 40 parts by mass or less, and even more preferably 0.5 parts by mass or more and 30 parts by mass or less, per 100 parts by mass of component (A). If the content ratio is above the lower limit of the above range, a cured film with excellent heat resistance can be obtained. If the content ratio is below the upper limit of the above range, a resin composition and cured film with excellent solubility and toughness can be obtained.

[0145] [Other ingredients] The resin composition may contain components other than components A and B (other components), for example, organopolysiloxanes other than components A and B, curing catalysts, solvents, fillers, ions Examples include additives, surfactants, flame retardants, UV absorbers, light stabilizers, antioxidants, pigments, inorganic oxides, ion adsorbents, photosensitizers, curing retarders, curing inhibitors, organic resins, or heat dissipation fillers. Examples of other components are shown below.

[0146] (curing catalyst) The resin composition may contain a curing catalyst (component C). The catalyst can, for example, promote the chemical reaction between crosslinkable functional groups in component A when chemically reacting components A together, or, when component B is used, promote the chemical reaction between component A and component B. Component C may be used alone or in combination of two or more types. Furthermore, when a solvent is used, it is preferable that component C is soluble in the solvent from the viewpoint of reaction efficiency.

[0147] From the viewpoint of curability, the curing catalyst (component C) preferably contains one or more elements from among tin (Sn), zirconium (Zr), titanium (Ti), aluminum (Al), sulfur (S), iodine (I), nitrogen (N), phosphorus (P), platinum (Pt), iron (Fe), zinc (Zn), cobalt (Co), and rhodium (Rh), more preferably contains one or more elements from among Zr, Ti, Al, S, I, N, and P, and particularly preferably contains the elements Zr, Ti, S, I, N, and P.

[0148] Examples of Sn-containing compounds include dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin diacetate, dioctyltin diacetate, dibutyltin maleate, dioctyltin maleate, or 2-ethylhexanoate.

[0149] Examples of Zr-containing compounds include n-propyl zirconate, n-butyl zirconate, zirconium tetraacetylacetonate, or zirconium monoacetylacetonate.

[0150] Examples of Ti-containing compounds include tetraisopropyl titanate, tetran-butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethylacetoacetate, titanium dodecylbenzenesulfonate compounds, titanium phosphate ester complexes, titanium octylene glycolate, titanium ethylacetoacetate, titanium lactate ammonium salt, titanium lactate, or titanium triethanolamine.

[0151] Examples of Al-containing compounds include aluminum secondary butoxide, aluminum trisacetylacetonate, aluminum bisethylacetoacetate monoacetylacetonate, or aluminum trisethylacetoacetate.

[0152] S-containing compounds include 2-butenyldimethylsulfonium, 2-butenyltetramethylenesulfonium, 3-methyl-2-butenyldimethylsulfonium, 4-hydroxyphenylcinnamylmethylsulfonium, α-naphthylmethyltetramethylenesulfonium, cinnamyldimethylsulfonium, cinnamyltetramethylenesulfonium, biphenylmethyldimethylsulfonium, biphenylmethyltetramethylenesulfonium, [biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium, and phenylmethyldimethylsulfonium. Nium, phenylmethyltetramethylenesulfonium, fluorenylmethyldimethylsulfonium, fluorenylmethyltetramethylenesulfonium, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium, bis[4-(diphenylsulfonio)phenyl]sulfide, diphenyl[4-(phenylthio)phenyl]sulfonium, triphenylsulfonium, bis[4-(di(4-(2-hydroxyethoxy))phenylsulfonio)phenyl]sulfide, benzylmethyl Cations such as phenylsulfonium, benzyl(4-hydroxyphenyl)methylsulfonium, (4-hydroxyphenyl)methyl(2-methylbenzyl)sulfonium, (4-hydroxyphenyl)methyl(4-methylbenzyl)sulfonium, (4-hydroxyphenyl)methyl(1-naphthyl)sulfonium, dibenzyl-4-hydroxyphenylsulfonium, 4-acetoxyphenylbenzylsulfonium, 4-acetoxyphenyldimethylsulfonium, or 4-acetoxyphenylmethyl(2-methylbenzyl)sulfonium, and tris(pentafluoroethyl)trifluorophosphate, trifluorotris(pentafluoroethyl)phosphate, Examples include sulfonium salts consisting of anions such as xafluorophosphate, tetrafluoroborate, tetrakis(pentafluorophenyl)borate, hexafluoroantimonate, p-toluenesulfonate, dodecylbenzenesulfonate, trifluoromethanesulfonate, perfluorobutanesulfonate, bis(trifluorosulfonyl)imide, trifluoromethanesulfonate, perfluorobutanesulfonate, methanesulfonate, or camphor sulfonate, or TA-90, TA-100, TA-100FG, TA-120, TA-160, CPI-200K, CPI-210S, or LW-S1 from Sunapro Co., Ltd.

[0153] Compounds containing I include diphenyliodonium chloride, diphenyliodonium trifluoromethanesulfate, diphenyliodonium mesylate, diphenyliodonium tosylate, diphenyliodonium bromide, diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluoroarsenate, bis(p-tert-butylphenyl)iodonium hexafluorophosphate, bis(p-tert-butylphenyl)iodonium mesylate, and bis(p-tert-butylphenyl)iodonium. Examples include iodonium salts such as t-butylphenyl)iodonium tosylate, bis(p-tert-butylphenyl)iodonium trifluoromethanesulfonate, bis(p-tert-butylphenyl)iodonium tetrafluoroborate, bis(p-tert-butylphenyl)iodonium chloride, bis(p-chlorophenyl)iodonium chloride, (4-isopropylphenyl)(p-tolyl)iodonium trifluorotris(perfluoroethyl)phosphate, or bis(p-chlorophenyl)iodonium tetrafluoroborate.

[0154] Examples of N-containing compounds include silazanes such as trimethylsilylamine, bis(trimethylsilyl)amine, tris(trimethylsilyl)amine, methyldiphenylsilylamine, bis(methyldiphenylsilyl)amine, or tris(methyldiphenylsilyl)amine. Cyclic silazanes such as hexamethylcyclotrisilazane, octamethylcyclotetrasilazane, decamethylcyclopentasilazane, trimethyltriphenylcyclotrisilazane, tetramethyltetraphenylcyclotetrasilazane, pentamethylpentaphenylcyclopentasilazane, hexaphenylcyclotrisilazane, octaphenylcyclotetrasilazane, or decaphenylcyclopentasilazane; Inorganic polysilazanes such as perhydropolysilazanes, or organic polysilazanes such as methylpolysilazanes; Organic guanidines such as aminoguanidine, 1,1,3,3-tetramethylguanidine, n-dodecylguanidine, methylolguanidine, dimethylolguanidine, 1-phenylguanidine, 1,3-diphenylguanidine, 1,3-di-o-tolylguanidine, triphenylguanidine, or 1-benzyl-2,3-dimethylcyanoguanidine, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidium=2-(3-benzoylphenyl)propionate, 1,2-dicyclohexyl-4,4,5,5-tetramethylbiguanidium=n-butyltriphenylborate, (Z)-{[bis(dimethylamino)methylidene]amino}-N-cyclohexyl(cyclohexylamino)methaneiminium=tetrakis(3-fluorophenyl)borate; N,N-diethylcarb Carbamates such as 9-anthrylmethyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl methyl carboxylate; Amides such as dicyandiamide, (E)-1-piperidino-3-(2-hydroxyphenyl)-2-propen-1-one; Alkylimidazoles such as 2-ethyl-4-methylimidazole, 1-methylimidazole, 1,2-dimethylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, and 2-isopropylimidazole; carbamylalkyl-substituted imidazoles such as 1-(2-carbamylethyl)imidazole; cyanoalkyl-substituted imidazoles such as 1-cyanoethyl-2-methylimidazole; aromatic-substituted imidazoles such as 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl-2-methylimidazole; alkenyl-substituted imidazoles such as 1-vinyl-2-methylimidazole; or allyl-substituted imidazoles such as 1-allyl-2-ethyl-4-methylimidazole; or polyimidazoles; Ureas such as 1,1'-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea) or 3-{3-[(3,3-dimethylureido)methyl]-3,5,5-trimethylcyclohexyl}-1,1-dimethylurea; Amines such as bis(2-morpholinoethyl) ether and 1,1'-[[3-(dimethylamino)propyl]imino](2-propanol); Ammonium such as 2-ethylhexane salt of triethylmethylammonium;

[0155] Furthermore, examples include 1,5,7-triazabicyclo[4.4.0]deca-5-ene 2-(9-oxoxanthene-2-yl)propionic acid, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), the phenol salt of DBU, the 2-ethylhexanoate of DBU, the formate of DBU, the o-phthalate of DBU, the p-toluenesulfonate of DBU, the phenol novolac resin salt of DBU, the trimellitate of DBU, the tetraphenylborate salt of a benzyl modified form of DBU, the 2-ethylhexanoate of DBN, the phenol resin salt of DBN, or the biphenyl-type phenol resin salt of DBN.

[0156] Other examples include ketimines, which are reaction products of polyamines and carbonyl compounds. Examples of polyamines include diamines such as ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, 1,3-diaminobutane, 2,3-diaminobutane, pentamethylenediamine, 2,4-diaminopentane, hexamethylenediamine, p-phenylenediamine, and p,p'-biphenylenediamine; polyhydramines such as 1,2,3-triaminopropane, triaminobenzene, tris(2-aminoethyl)amine, or tetra(aminomethyl)methane; polyalkylene polyamines such as diethylenetriamine, triethylenetriamine, or tetraethylenepentamine; or polyoxyalkylene polyamines. Carbonyl compounds include a Examples include aldehydes such as cetaldehyde, propionaldehyde, n-butyraldehyde, isobutyraldehyde, diethylacetaldehyde, glyoxal, or benzaldehyde; cyclic ketones such as cyclopentanone, trimethylcyclopentanone, cyclohexanone, or trimethylcyclohexanone; aliphatic ketones such as acetone, methyl ethyl ketone, methyl propyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, diethyl ketone, dipropyl ketone, diisopropyl ketone, dibutyl ketone, or diisobutyl ketone; or β-dicarbonyl compounds such as acetylacetone, methyl acetoacetate, ethyl acetoacetate, dimethyl malonate, diethyl malonate, methyl ethyl malonate, or dibenzoylylmethane.

[0157] Examples of P-containing compounds include benzyltriphenylphosphonium bromide and ethyltriphenylphosphonium methanesulfonate.

[0158] Examples of Pt-containing compounds include platinum powder, platinum black, platinum-supported silica powder, platinum-supported activated carbon, chloroplatinic acid, an alcoholic solution of chloroplatinic acid, platinum olefin complexes, or platinum alkenylsiloxane complexes. Examples of these alkenylsiloxanes include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, alkenylsiloxanes in which some of the methyl groups of these alkenylsiloxanes are replaced with ethyl groups, phenyl groups, etc., and alkenylsiloxanes in which the vinyl groups of these alkenylsiloxanes are replaced with allyl groups, hexenyl groups, etc.

[0159] Commercially available products containing component C include TA-90, TA-100, TA-100FG, TA-120, TA-160, CPI-200K, CPI-210S, CPI-101A, CPI-110A, CPI-100B, CPI-100P, CPI-110, CPI-110B, CPI-110P, CPI-310B, and CPI-310F, all manufactured by Sunapro Co., Ltd. G, CPI-410B, CPI-410S, ES-1B, VC-1S, VC-1FG, HS-1, HS-1A, HS-1P, HS-1N, HS-1TF, HS-1NF, HS -1MS, HS-1CS, LW-S1, LW-S1NF, IK-1, IK-2, IK-1FG, NP-TM2, NA-CS1, NP-SE10, PURECAT (registered trademark) TX-1, DBU (registered trademark), DBN, NP-TM2, NP-SE10, NA-CS1, U-CAT881, U-CAT SA1, U-CAT SA102, U-CAT SA603, U-CAT SA810, U-CAT SA506, U-CAT SA841, U-CAT SA851, U-CAT SA838A, U-CAT5002, U-CAT891, U-CAT1102, U-CAT881, U-CAT891, U-CAT5003, U-CAT5050, U-CAT3512T, U-CAT3513N, U-CAT660M, U-CAT2024, or U-CAT18X etc.; or SAN-AID SI-45, SAN-AID SI-60, SAN-AID SI-80, SAN-AID manufactured by Sanshin Chemical Industry Co., Ltd. SI-100, SAN-AID SI-150, SAN-AID SI-300, SAN-AID SI-360, SAN-AID SI-110, SAN-AID SI-B2A, SAN-AID SI-B7, SAN-AID SI-B3A, SAN-AID SI-B3, SAN-AID SI-B4, or SAN-AID SI-B5, etc.; or TA-8, TA-21, TA-23, TA-30, TC-100, TC-401, TC-710, TC-810, TC-1040, TC-245, TC-750, TC-300, TC-310, TC-400, TA-12, TA-80, TA-90, TC-120, TC- Examples include 230, TC-800, TC-315, TC-335, TC-500, TC-510, ZA-45, ZA-65, ZC-150, ZC-162, ZC-540, ZC-700, ZC-580, ZC-200, ZC-320, ZC-126, ZC-300, AL-3001, AL-3100, AL-3200, etc.

[0160] Among these, dibutyltin dilaurate, n-propyl zirconate, n-butyl zirconate, zirconium tetraacetylacetonate, zirconium monoacetylacetonate, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethyl acetoacetate, aluminum trisacetylacetonate, aluminum bis-ethyl acetoacetate monoacetylacetonate, aluminum tris-ethyl acetoacetate, Benzyl(4-hydroxyphenyl)methylsulfonium tris(pentafluoroethyl)trifluorophosphate, TA-100FG, (4-isopropylphenyl)(p-tolyl)iodonium trifluorotris(perfluoroethyl)phosphate, IK- 1, IK-1FG, SAN-AID SI-B7, SAN-AID SI-B3A, SAN-AID SI-B3, SAN-AID SI-B4, SAN-AID SI-B5, diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate, diphenyl[4-(phenylthio)phenyl]sulfonium trifluorotris(pentafluoroethyl)phosphate, diphenyl[4-(phenylthio)phenyl]sulfonium tetrakis(pentafluorophenyl)borate, biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium tetrakis(pentafluorophenyl)borate, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium trifluorotris(pentafluoroethyl)phosphate, 9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium tetrakis(pentafluorophenyl)borate, 1,2-Diisopropyl-3-[bis(dimethylamino)methylene]guanidium=2-(3-benzoylphenyl)propionate, o-phthalate of the above DBU, p-toluenesulfonate of the above DBU, and phenol novolac resin salt of the above DBU are preferred.

[0161] The content of component C in the resin composition is not particularly limited, but the content of the catalyst relative to 100 parts by mass of the total of components A and B is preferably, for example, 0.00001 parts by mass or more and 20 parts by mass or less, more preferably 0.00002 parts by mass or more and 15 parts by mass or less, and even more preferably 0.00004 parts by mass or more and 10 parts by mass or less.

[0162] (solvent) The resin composition may further contain a solvent. The solvent is preferably capable of dissolving components A and B, and does not condense with components A and B; more preferably, it is a solvent that is inactive with all of the components. One solvent may be used alone, or two or more solvents may be used in combination.

[0163] Examples of solvents include aliphatic hydrocarbons, aromatic hydrocarbons, ethers, halogenated hydrocarbons, or ester solvents. More specifically, methanol, ethanol, propanol, isopropanol, butanol, t-butyl alcohol, tetrahydrofuran, 2-methyltetrahydrofuran, 4-methyltetrahydropyran, cyclopentyl methyl ether, methyl ethyl ketone, methyl isobutyl ketone, acetonitrile, propionitrile, benzonitrile, ethyl acetate, isobutyl acetate, butyl acetate, butyl propionate, ethyl lactate, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, ethyl methoxyacetate, ethyl methoxyacetate, ethyl methoxyacetate, ethyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-hydroxypropionate, ethyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-hydroxyisobutyrate, 2-hydroxy Methyl propionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, methyl xysobutyrate, acetylacetone, dioxane, ethylene glycol, diethyl ether, diethylene glycol, propylene glycol, dipropylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, Polypropylene glycol monophenyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monophenyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monophenyl ether, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, cyclohexanol, 1,4-butanediol, triethylene glycol, tripropylene glycol, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether acetate, dipro Pyrene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, hexane, heptane, cyclohexane, benzene, toluene, xylene, anisole, benzaldehyde, benzonitrile, 1,3-dimethoxybenzene, acetophenone, 4'-methoxyacetophenone, 4'-ethoxyacetophenone, phenyl acetate, 3-methoxyphenol, 1,2-methylenedioxybenzene, 2-phenoxyethanol, diethylene glycol monophenyl ether, 1,2,4-trimethoxybenzene, 2'-hydroxyacetophenone, 1,4-diethoxybenzene, 1,3,Examples include 5-trimethoxybenzene, t-butyl benzoate, benzyl alcohol, 1,4-dimethoxybenzene, 1,2,3-trimethoxybenzene, 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,5-dimethylanisole, thioanisole, 4-ethylanisole, t-butylbenzene, 4-t-butyltoluene, 2-phenylanisole, t-anethole, 3,4-dimethoxytoluene, γ-butyrolactone, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, N-methyl-2-pyrrolidone, dimethylimidazolidinone, dimethyl sulfoxide, methylene chloride, chloroform, or carbon tetrachloride.

[0164] Among these, from the viewpoint of solubility in resin compositions, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, isobutyl acetate, butyl acetate, methyl 3-methoxypropionate, acetylacetone, propylene glycol monomethyl ether acetate, toluene, anisole, benzaldehyde, benzonitrile, tetrahydrofuran, diethylene glycol ethyl methyl ether, tetraethylene glycol dimethyl ether, diethylene glycol dimethyl ether, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, 1,3-dimethoxybenzene, acetophenone, 4'-methoxyacetophenone, 4'-ethoxyacetophenone, phenyl acetate 3-Methoxyphenol, 1,2-Methylenedioxybenzene, 2-Phenoxyethanol, 1,2,4-Trimethoxybenzene, 2'-Hydroxyacetophenone, 1,4-Diethoxybenzene, 1,3,5-Trimethoxybenzene, Benzyl alcohol, 1,4-Dimethoxybenzene, 1,4-Diethoxybenzene, 1,2,3-Trimethoxybenzene, 2-Methoxytoluene, 3-Methoxytoluene, 4-Methoxytoluene, 2,5-Dimethylanisole, Thianisole, 4-Ethylanisole, t-Butylbenzene, 4-t-Butyltoluene, 2-Phenylanisole, 3,4-Dimethoxytoluene, N,N-Dimethylacetamide, N,N-Dimethylformamide, N,N-Diethylformamide , or dimethyl sulfoxide is preferred.

[0165] The solvent content in the resin composition is not particularly limited, but it is preferably 5 to 80% by mass, more preferably 10 to 75% by mass, and even more preferably 15 to 70% by mass, based on 100% by mass of the resin composition.

[0166] (Compounds containing specific elements) The resin composition may further contain a compound having one or more of the elements Ce, La, Pr, Nd, Y, and Fe (hereinafter also referred to as a "specific element-containing compound").

[0167] The valencies of Ce, La, Pr, Nd, Y, and Fe can range from divalent to tetravalent.

[0168] The compound containing a specific element may contain one or more of the elements Ce, La, Pr, Nd, Y, and Fe.

[0169] A specific element-containing compound having one or more of the elements Ce, La, Pr, Nd, Y, and Fe may be in hydrate or non-hydrate form.

[0170] Examples of specific element-containing compounds having one or more elements from Ce, La, Pr, Nd, Y, and Fe include cerium(IV) oxide, cerium(III) bromide, cerium(III) acetylacetonate, cerium(IV) methoxyethoxide, cerium(IV) isopropoxide, tris(isopropylcyclopentadienyl)cerium, tris(cyclopentadienyl)cerium, cerium silicide, diammonium cerium(IV) nitrate, cerium(IV) hydroxide, cerium(III) acetate, cerium(III) tungstate, cerium(III) oxalate, cerium(III) perchlorate, cerium(III) bromide, and tetrakis(2,2,6,6-tetramethyl-3,5- Cerium compounds such as heptanedionatocerium(IV), tris(1,2,3,4-tetramethyl-2,4-cyclopentadienyl)cerium(III), 2,4-pentanedionatocerium(III), trifluoroacetylacetonatecerium(III), cerium fluoride(III), cerium sulfide(III), cerium phosphate(III), cerium stearate(III), cerium 2-ethylhexanoate(III), cerium trifluoromethanesulfonate(III), cerium chloride(III), cerium fluoride(IV), cerium sulfate(IV), cerium iodide(III), cerium nitrate(III), cerium carbonate(III), cerium trifluoromethanesulfonate(IV), etc.

[0171] Yttrium(III) oxide, yttrium(III) isopropoxide, yttrium(III) hexafluoroacetylacetonate, tris(cyclopentadienyl)yttrium, tris(butylcyclopentadienyl)yttrium, tris(methylcyclopentadienyl)yttrium, tris(n-propylcyclopentadienyl)yttrium, tris[N,N-bis(trimethylsilyl)amide]yttrium(III), yttrium(III) perchlorate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)yttrium(III), yttrium(I II) Yttrium compounds such as acetylacetonate, yttrium(III) chloride, yttrium(III) oxalate, yttrium(III) acetate, yttrium(III) fluoride, yttrium(III) iodide, yttrium(III) 2-ethylhexanoate, yttrium(III) nitrate, yttrium(III) sulfide, yttrium(III) bromide, yttrium(III) trifluoromethanesulfonic acid, yttrium(III) neodecanoate, yttrium(III) phosphate, yttrium(III) carbonate, yttrium(III) sulfate, yttrium(III) naphthenate, etc.

[0172] Lanthanum(III) oxide, lanthanum(III) isopropoxide, lanthanum tris(hexamethyldisilazide), lanthanum(III) ethoxide, tris(cyclopentadienyl)lanthanum, tris[N,N-bis(trimethylsilyl)amide]lanthanum, tris(isopropylcyclopentadienyl)lanthanum, lanthanum carbonate, tris(6,6,7,7,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)lanthanum(III), lanthanum(III) perchlorate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)lanthanum(III), tris[N,N-bis(trimethyl Compounds containing lanthanum, such as silyl)amide lanthanum(III), lanthanum(III) acetylacetonate, lanthanum chloride, lanthanum sulfate(III), 2-ethylhexanoate lanthanum(III), lanthanum fluoride(III), lanthanum chloride, lanthanum iodide(III), lanthanum boride, lanthanum sulfide(III), lanthanum bromide(III), lanthanum nitride(III), lanthanum trifluoromethanesulfonic acid(III), lanthanum nitrate(III), lanthanum carbonate(III), lanthanum acetate(III), tris(N,N'-di-i-propylformamidinate)lanthanum(III), lanthanum phosphate(III), etc.

[0173] Praseodymium(III) oxide, praseodymium(IV) oxide, praseodymium(III) hexafluoroacetylacetonate, praseodymium(III) hexafluoro-2,4-pentanedione, praseodymium(III) acetylacetonate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)praseodymium(III), tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)praseodymium(III), tris(isopropyl Praseodymium compounds such as cyclopentadienyl(III)praseodymium(III), isopropoxypraseodymium(III), praseodymium chloride(III), praseodymium fluoride(III), praseodymium acetate(III), praseodymium sulfate(III), praseodymium bromide(III), praseodymium iodide(III), praseodymium phosphate(III), praseodymium carbonate(III), praseodymium trifluoromethanesulfonic acid(III), praseodymium nitrate(III), praseodymium perchlorate(III), etc.

[0174] Neodymium(III) oxide, neodymium(III) isopropoxide, trifluoroacetylacetonate neodymium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionate)neodymium, tris(tetramethylcyclopentadienyl)neodymium, trifluoroacetylacetonate neodymium, tris(isopropylcyclopentadienyl)neodymium, neodymium(III) trifluoromethanesulfonate, neodymium fluoride, tris(cyclopentadienyl)neodinium, neodymium(III) perchlorate, neodymium(III) fluoride, 2,4-pentanedione neodymium(III), tris[N,N-bis(trimethylsilyl) Neodymium compounds such as neodymium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionato)neodymium(III), tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)neodymium(III), neodymium(III) hexafluoroacetylacetonate, neodymium(III) 2-ethylhexanoate, neodymium(III) chloride, neodymium(III) titanate, neodymium(III) bromide, neodymium(III) iodide, neodymium(III) nitride, neodymium(III) acetate, neodymium(III) nitrate, neodymium carbonate, neodymium(III) sulfate, neodymium(III) oxalate, etc.

[0175] Iron(II) oxide, iron(III) oxide, iron(III) acetylacetonate, iron(III) ethoxide, iron(III) isopropoxide, iron(III) 2,4-pentanedione, iron(III) trifluoroacetylacetonate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato) iron(III), tris(hexafluoroacetylacetonate) iron(III), iron(III) sulfate, iron(II) hexacyanoate, iron(III), Examples of iron compounds include iron(III) lylate, ethylenediaminetetraacetic acid, iron(III)-sodium salt, ammonium iron(III) citrate, triammonium iron(III) trioxalate, iron(III) tri(2-ethylhexanoate), iron(III) phosphate, iron(III) fluoride, iron(III) chloride, iron(III) oxyhydroxide, iron(III) bromide, iron(III) trifluoromethanesulfonate, iron(III) tetraphenylporfin chloride, iron(III) ammonium hexacyanoferrate(II), iron(III) nitrate, potassium hexacyanoferrate(III), sodium pentacyanonitrosylferrate(III), iron(III) citrate, iron(III) diphosphate, iron(III) perchlorate, potassium iron(III) trioxalate, iron(III) 1,3,5-benzenetricarboxylate, and iron(III) phosphate.

[0176] In addition to the compounds listed above, compounds containing one or more elements from Ce, La, Pr, Nd, Y, and Fe, into which a siloxane skeleton has been introduced, can also be used. For example, in the case of compounds containing cerium, a reaction product of a cerium carboxylate and a siloxane compound having a carboxylate can be used, as described in Japanese Patent Publication No. 2020-132789.

[0177] Among these, cerium(III) acetylacetonate, cerium(III) nitrate, cerium(III) 2-ethylhexanoate, tris(cyclopentadienyl)cerium, yttrium(III) (acetylacetonate), yttrium(III) nitrate, yttrium(III) 2-ethylhexanoate, tris(cyclopentadienyl)yttrium, lanthanum(III) acetylacetonate, lanthanum(III) 2-ethylhexanoate, tris(C) Clopentadienyl)lanthanum, praseodymium(III) nitrate, neodymium(III) nitrate, neodymium(III) 2-ethylhexanoate, tris(cyclopentadienyl)neodinium, iron(III) acetylacetonate, iron(III) 2,4-pentanedione, tris(2,2,6,6-tetramethyl-3,5-heptanedionate)ferric acidate, iron(III) acrylate, tris(2-ethylhexanoate)ferric acidate, and iron(III) nitrate are preferred.

[0178] As a compound containing specific elements, commercially available products such as the trade name "Octope R" (manufactured by Hope Pharmaceutical Co., Ltd.) may be used.

[0179] The content of the compound containing the specific element is not particularly limited, but in terms of the balance between heat resistance and solubility, it is preferably 5 ppm or more and less than 5,000 ppm, more preferably 7 ppm or more and less than 3,000 ppm, and even more preferably 10 ppm or more and less than 2,000 ppm, based on the total mass of the resin composition excluding the solvent.

[0180] (Organopolysiloxanes other than components A and B) The resin composition may further contain organopolysiloxanes other than components A and B. These other organopolysiloxanes may be used individually or in combination of two or more. Other organopolysiloxanes are compounds having at least one of the structures shown in the following formulas (E-1) to (E-4), and do not contain any groups that crosslink with component A.

[0181] [ka]

[0182] In formulas (E-1) to (E-4), R E These include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl groups, which can be independently substituted; aryl groups such as phenyl, tolyl, xylyl, and naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure. Also, in equations (E-1) to (E-4), * represents a bonding site.

[0183] Other organopolysiloxane structures may be linear, partially branched, or cyclic. Commercially available products include KF-96L, KF-96A, KF-96, KF-96H, KF-50, KF-54, KF-965, KF-968, KF-410, KF-412 (all product names) from Shin-Etsu Chemical Co., Ltd., TSF451-0.65, TSF451-5A, TSF451-10, TSF451-100 (all product names) from Momentive Corporation, and WACKER® SILICONE FLUID AK0.65~10, WACKER® SILICONE FLUID AK20~5,000, WACKER® SILICONE FLUID AS100, WACKER® L053, WACKER® L060, or WACK Examples include ER(registered trademark) MQ803 (both are product names), etc.

[0184] The content of other organopolysiloxanes is 0.1 to 30 parts by mass, preferably 0.5 to 25 parts by mass, and more preferably 1 to 20 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0185] (Curing retarder) The resin composition may further contain a curing retarder from the viewpoint of storage stability. The curing retarder may be used alone or in combination of two or more types.

[0186] As curing retarders, for example, known ones used in hydrosilylation reactions can be used. Specifically, these include compounds containing two or more alkenyl groups, compounds containing aliphatic unsaturated bonds, organophosphorus compounds, or tin compounds and organic peroxides.

[0187] Compounds containing two or more alkenyl groups include disiloxanes and trisiloxanes containing vinyl or allyl at both ends, such as 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3-diallyl-1,1,3,3-tetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, and 1,3-divinyl-1,1,3,3-tetraphenyldisiloxane, or vinyl-containing cyclic siloxanes such as 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane.

[0188] Examples of compounds containing aliphatic unsaturated bonds include propargyl alcohols such as 3-methyl-1-dodecine-3-ol, 3,5-dimethyl-1-hexyn-3-ol, or 1-ethynyl-1-cyclohexanol, or en-yne compounds, maleic anhydride, or maleic acid esters such as dimethyl maleate.

[0189] Examples of organophosphorus compounds include triorganophosphines, diorganophosphines, organophosphons, or triorganophosphites. Examples of tin compounds include stannous halide dihydrate and stannous carboxylate. Examples of organic peroxides include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, or t-butyl perbenzoate.

[0190] Of these, 1,3-divinyldisiloxane, 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane, or 1-ethynyl-1-cyclohexanol are preferred.

[0191] The content of the curing retarder is 10 to 200,000 times the content (mass) of component C, preferably 20 to 100,000 times, and more preferably 30 to 50,000 times.

[0192] (Adhesion-enhancing agent) The resin composition according to this embodiment may contain an adhesion promoter from the viewpoint of adhesion. The adhesion promoter may be used alone or in combination of two or more types.

[0193] Preferably, the adhesion promoter is an organosilicon compound having a hydroxyl group, a hydrogen atom bonded to Si, or an alkoxy or epoxy bonded to Si, and more preferably one or more alkoxys bonded to Si. Such a compound can crosslink with other components in the resin composition while bonding with components such as the substrate on which the resin composition is laminated, thereby improving the adhesion of the resulting cured product. Furthermore, the adhesion promoter is From the viewpoint of heat resistance and other factors, it is more preferable that the material has a silsesquioxane structure. Examples of such suitable adhesion promoters include compounds represented by the following formula (Z). Note that the adhesion promoter having a hydroxyl group, a hydrogen atom bonded to Si, or an alkoxy bonded to Si may also function as component B. In this case, any component that overlaps with component B is treated as component B.

[0194] [ka]

[0195] In formula (Z), R G0 R in equation (2) above is independent of the others. 1 This is synonymous with R. G1 Independently, R in equation (3) above 3 This is synonymous with Q being an independent group represented by the following formulas (Z1), (Z31), (Z32), (Z33), or (Z41), and may include formula (Z2) as a linking group.

[0196] R G1 Preferably, the group is an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, with methyl groups and phenyl groups being more preferred.

[0197] [ka]

[0198] In equations (Z1), (Z2), (Z31), (Z32), (Z33), and (Z41), * represents a bonding site, as described above.

[0199] In formula (Z2), R G2 R is independently an alkyl group having 1 to 6 carbon atoms, a cyclopentyl group, a cyclohexyl group, or a phenyl group. g is an average value satisfying 1 to 20. G2 A methyl group or a phenyl group is preferred as the element.

[0200] In formula (Z41), R G3 R is independently a methyl group, an ethyl group, a butyl group, or an isopropyl group. G3 A methyl group or an ethyl group is preferred.

[0201] The amount of adhesion promoter added is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 9 parts by mass, and even more preferably 0.5 to 8 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0202] (Filler) The resin composition may further contain fillers from the viewpoint of heat resistance, optical properties, thixotropy, etc. One type of filler may be used alone, or two or more types may be used in combination.

[0203] There are no particular limitations on the filler material; known materials can be used. Furthermore, the structure of the filler material may be amorphous or crystalline. The combination of fillers is also not limited.

[0204] As fillers, for example, various phosphors and metal oxides can be suitably used.

[0205] Phosphors include various types such as those that emit green light, blue light, yellow light, or red light. Specific examples of phosphors include known phosphors such as organic phosphors, inorganic phosphors, fluorescent pigments, and fluorescent dyes. Examples of organic phosphors include allyl sulfonamide-melamine formaldehyde cocondensation dyes and perylene-based phosphors, with perylene-based phosphors being preferred due to their long-term usability. Inorganic phosphors are a preferred fluorescent substance. Inorganic phosphors will be described below.

[0206] Examples of phosphors that emit green light include [SrAl2O4:Eu], [Y2SiO5:Ce,Tb], and [MgAl 11 O 19 :Ce,Tb],[Sr7Al 12 O 25 Examples include :Eu] or [(at least one of Mg, Ca, Sr, Ba)Ga2S4:Eu].

[0207] Examples of phosphors that emit light in blue include, for example, [Sr5(PO4)3Cl:Eu], [(SrCaBa)5(PO4)3Cl:Eu], [(BaCa)5(PO4)3Cl:Eu], [(at least one of Mg, Ca, Sr, Ba)2B5O9Cl:Eu,Mn], or [(at least one of Mg, Ca, Sr, Ba)(PO4)6Cl2:Eu,Mn], etc.

[0208] Examples of phosphors that emit light from green to yellow include at least yttrium-aluminum oxide phosphors activated with cerium, at least yttrium-gadolinium-aluminum oxide phosphors activated with cerium, at least yttrium-aluminum garnet oxide phosphors activated with cerium, or at least yttrium-gallium-aluminum oxide phosphors activated with cerium, etc. (so-called YAG-based phosphors). Specifically, [Ln3M5O 12 :R (Ln is at least one selected from Y, Gd, La, M contains at least one of Al and Ca, and R is a lanthanoid series .)], or [(Y1-xGax)3(Al1-yGay)5O 12 :R (R is at least one selected from Ce, Tb, Pr, Sm, Eu, Dy, Ho, 0 < Rx < 0.5, 0 < y < 0.5).] can be used.

[0209] Examples of phosphors that emit light in red include, for example, [Y2O2S:Eu], [La2O2S:Eu], [Y2O3:Eu], or [Gd2O2S:Eu].

[0210] Also, examples of phosphors that emit light corresponding to blue LEDs include YAG-based phosphors such as [Y3(Al,Ga)5O 12 :Ce,(Y,Gd)3Al5O 12 :Ce,Lu3Al5O 12 :Ce,Y3Al5O 12 :Ce], TAG-based phosphors such as [Tb3Al5O 12 :Ce], [(Ba,Sr)2SiO4:Eu]-based phosphors, [Ca3Sc2Si3O 12[Ce] phosphors, silicate phosphors such as [(Sr,Ba,Mg)2SiO4:Eu], nitride phosphors such as [(Ca,Sr)2Si5N8:Eu], [(Ca,Sr)AlSiN3:Eu], [CaSiAlN3:Eu], [Cax(Si,Al) 12 (O,N) 16 Oxynitride phosphors such as [Eu], as well as [(Ba,Sr,Ca)Si2O2N2:Eu] phosphors, [Ca8MgSi4O 16 Cl2:Eu] phosphor, or [SrAl2O4:Eu,Sr4Al 14 O 25 Examples of phosphors include [Eu].

[0211] Among these, YAG-based phosphors, TAG-based phosphors, or silicate-based phosphors are preferred in terms of luminescence efficiency and brightness. In addition, other known phosphors can be used depending on the application and the desired emission color.

[0212] The phosphor content is preferably 1 to 90 parts by mass, and more preferably 2 to 50 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0213] Next, we will explain the case where the filler is a metal oxide. Suitable metal oxides include silica, alumina, yttrium oxide, zinc oxide, magnesium oxide, antimony oxide, titanium oxide, or zirconium oxide.

[0214] The content of metal oxides in the resin composition is preferably 1 to 95 parts by mass, more preferably 1 to 90 parts by mass, and even more preferably 1 to 85 parts by mass, based on 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0215] When titanium dioxide or aluminum oxide is used, it can be suitably used as a reflector material. Polyphthalamide resin is widely used as a reflector material. However, it has been pointed out that polyphthalamide resin is prone to degradation, particularly discoloration, with long-term use, and this resin composition can solve that problem.

[0216] In the case of silica, finely ground naturally occurring silica (natural silica) may be used, or industrially synthesized silica (synthetic silica) may be used. Natural silica has a crystalline axis because it is crystalline. Therefore, optical characteristics derived from the crystal can be expected, but its specific gravity is slightly higher than that of synthetic silica, which may affect its dispersion in the resin composition. Also, when obtained by crushing natural materials, the particles may have an irregular shape or a wide particle size distribution.

[0217] Synthetic silica can be wet-processed or dry-processed, but there are no particular limitations on its use. However, synthetic silica may contain crystal water regardless of the manufacturing method, and if this crystal water may have any effect on the resin composition, cured product, or various application components using them, it is preferable to select the synthetic silica while considering the number of crystal waters.

[0218] Synthetic silica is amorphous rather than crystalline, and therefore lacks a crystalline axis, meaning it doesn't exhibit the optical characteristics often associated with crystals. However, it offers advantages such as control over particle size distribution and the ability to create extremely small particles. In particular, fumed silica has nano-order particle sizes and exhibits excellent thixotropy.

[0219] Furthermore, silica generally has a large surface area and is a hydrophilic material (hydrophilic silica) due to the effect of silanols present on its surface, but it can also be made hydrophobic silica through chemical modification.

[0220] For example, from the viewpoint of being able to dissipate the heat generated when the resin composition is used as an element, it is preferable that the resin composition contains a heat dissipation filler as a filler. The heat dissipation filler may be used alone or in combination of two or more types.

[0221] Examples of heat dissipation fillers include alumina (Al2O3), boron nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), magnesium oxide (MgO), zinc oxide (ZnO), and aluminum hydroxide (Al(OH)3).

[0222] (Ion scavenger) The resin composition may further contain an ion-scavenging agent from the viewpoint of insulation reliability. The ion-scavenging agent may be used alone or in combination of two or more types.

[0223] There are no particular restrictions on the ion trapper, and examples include anion trappers, cation trappers, or both ion trappers. Examples include DHT-4A, manufactured by Kyowa Chemical Industry Co., Ltd., and the IXE300 series, IXEPLAS-A series, or IXEPLAS-B series, manufactured by Toagosei Co., Ltd. The average particle size of the ion trapper is preferably 0.1 to 3.0 μm, and the maximum particle size is preferably 10 μm or less.

[0224] The content of the ion scavenger is preferably 0.1 to 10 parts by mass, and more preferably 0.3 to 9 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0225] (Surfactants) The resin composition may further contain a surfactant for the purpose of controlling its wettability to the substrate. One type of surfactant may be used alone, or two or more types may be used in combination.

[0226] Specific examples of surfactants include Polyflow No. 45, Polyflow KL-245, Polyflow No. 75, Polyflow No. 90, Polyflow No. 95 (all product names, manufactured by Kyoeisha Chemical Industry Co., Ltd.), Disperbyk 161, Disperbyk 162, Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 170, Disperbyk 180, Disperbyk 181, Disperbyk 182, BYK-300, BYK-306, BY K-310, BYK-320, BYK-330, BYK-342, BYK-344, BYK-346 (all product names, manufactured by Big Chemie Japan Co., Ltd.), KP-341, KP-358, KP-368, KF-96-50CS, KF-50-100CS (all product names, manufactured by Shin-Etsu Chemical Co., Ltd.), Surflon SC-101, Surflon KH-40 (both product names, manufactured by Seimi Chemical Co., Ltd.), Futergent 222F, Futergent 251, FTX-218 (all product names, manufactured by Neos Co., Ltd.), TEGO Rad2100, 2200N, 2250, 2500, 2600, 2700 (product names, manufactured by Evonik Japan Co., Ltd.) EFTOP EF-351, EFTOP EF-352, EFTOP EF-601, EFTOP EF-801, EFTOP EF-802 (product names, manufactured by Mitsubishi Materials Corporation), Megafac F-171, Megafac F-177, Megafac F-475, Megafac F-477, Megafac F-556, Megafac R-08, Megafac R-30 (product names, manufactured by DIC Corporation) (Manufactured by) Fluoroalkylbenzenesulfonates, fluoroalkyl carboxylates, fluoroalkyl polyoxyethylene ethers, fluoroalkylammonium iodides, fluoroalkyl betaines, fluoroalkyl sulfonates, diglycerin tetrakis(fluoroalkyl polyoxyethylene ethers), fluoroalkyltrimethylammonium salts, fluoroalkylaminosulfonates, polyoxyethylene nonylphenyl ethers, polyoxyethylene octylphenyl ethers, polyoxyethylene lauryl ethers, polyoxyethylene oleyl ethers, polyoxyethylene tridecyl ethers, polyoxyethylene cetyl ethers, polyoxyethylene Examples include ethylene stearyl ether, polyoxyethylene laurate, polyoxyethylene oleate, polyoxyethylene stearate, polyoxyethylene laurylamine, sorbitan laurate, sorbitan palmitate, sorbitan stearate, sorbitan oleate, sorbitan fatty acid ester, polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan palmitate, polyoxyethylene sorbitan stearate, polyoxyethylene sorbitan oleate, polyoxyethylene naphthyl ether, alkylbenzene sulfonate, alkyldiphenyl ether disulfonate, or polyether-modified polydimethylsiloxane.

[0227] When the surfactant content is 0 to 3 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent, the wettability to the substrate tends to be excellent.

[0228] (Flame retardant) The resin composition may further contain a flame retardant from the viewpoint of flame retardancy. The inclusion of a flame retardant in the resin composition is preferable because it enhances the flame retardancy of the resulting cured film. The flame retardant is not particularly limited as long as it is a compound capable of imparting flame retardancy, but organophosphorus flame retardants are preferred from the viewpoint of low toxicity, low pollution, and safety. The flame retardant may be used alone or in combination of two or more types.

[0229] Examples of organophosphorus flame retardants include triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresylphenyl phosphate, 2-ethylhexyldiphenyl phosphate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, or condensed 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

[0230] The flame retardant content is preferably 0 to 50 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0231] (UV absorbers, light stabilizers) The resin composition may contain an ultraviolet absorber or a light stabilizer (HALS) to prevent degradation by light. These components may be used individually or in combination of two or more types.

[0232] Examples of UV absorbers include benzotriazole compounds such as 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)benzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole, or 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole; triazine compounds such as 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[(hexyl)oxy]phenol; benzophenone compounds such as 2-hydroxy-4-n-octyloxybenzophenone; and oxalic acid anilide compounds such as 2-ethoxy-2'-ethyloxalic acid bisanilide. Examples include objects, etc.

[0233] Examples of light stabilizers (HALS) include TINUVIN® 5100, TINUVIN 292 (compound name: bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, methyl(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate), and TINUVIN 152 (compound name: 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6-teto [3,5-Bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl butylmalonate], TINUVIN144 (Compound name: Bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate), TINUVIN123 (Compound name: Decandiolic acid, Bis(2,2,6,6-Te Reaction product of tramethyl-1-(octyloxy)-4-piperidinyl) ester (in the presence of 1,1-dimethylethyl hydroperoxide and octane), TINUVIN111FDL (approximately 50%, TINUVIN622, compound name: (butanedioic acid polymer (4-hydroxy-2,2,6,6-tetramethylpiperidinyl-yl) in the presence of ethanol), approximately 50%, CHIMASSORB119, compound name: N-N'-N''-N'''-tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidine-4-yl)amino)triazine-2-yl)-4,7-diazadecane-1,10-diamine), (all manufactured by BASF), Adeka Stab LA series (manufactured by Adeka Corporation), specifically LA-52, LA-57, LA-62, or LA-67, etc.

[0234] The amount of each ultraviolet absorber or light stabilizer is preferably 0 to 20 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0235] (Antioxidant) The resin composition may further contain antioxidants to prevent oxidation of the resulting cured film, etc. The antioxidant may be used alone or in combination of two or more types.

[0236] Examples of antioxidants include dibutylhydroxytoluene, 2,6-t-butylphenol, 2,2'-methylenebis(6-t-butyl-4-ethylphenol, tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl isocyanurate), tris(3,5-t-butyl-4-hydroxybenzyl isocyanurate), 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, and 4,4'-butyllidenebis(6-t-butyl -m-cresol), 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate stearyl, tetrakis[3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]pentaerythritol, 2,2'-dimethyl-2,2'-(2,4,8,10-tetraoxaspiro[5,5]undecane-3,9-diyl)dipropane-1,1'-diyl=bis[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propanoate] ], 2,4,6-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)mesitylene, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], triethylene glycol-bis-[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl- Hindered phenol compounds such as 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate or 3,5-di-t-butyl-4-hydroxybenzylphosphonate diethyl ester; amine compounds such as dinonyldiphenylamine, octylbutyldiphenylamine, n-butylamine, triethylamine, or diethylaminomethyl methacrylate; bis(dibutyldithiocarbamate)methylene, pentaerythritol tetrakis[3- Sulfur compounds such as urylthiopropionate, phenothiazine, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, or distearyl-3,3'-thiodipropionate; or triphenyl phosphite, diphenylisodecyl phosphite, phenyldiisodecyl phosphite, tris(nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(octadecyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butylphenyl) phosphite, cyclic Examples of phosphorus compounds include neopentanetetrayl(2,4-di-t-butyl-4-methylphenyl) phosphite, bis[2-t-butyl-6-methyl-4-{2-(octadecyloxycarbonyl)ethyl}phenyl]hydrogen phosphite, and oxaphosphaphenanthrene oxides (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, or 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide).

[0237] The antioxidant content is preferably 0 to 10 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0238] (Organic resin) The resin composition may further contain an organic resin. By selecting the type of organic resin, further improvements in functionality can be achieved. One type of organic resin may be used alone, or two or more types may be used in combination.

[0239] Examples of organic resins include acrylic resins, epoxy resins, polyimide resins, cyanate resins, maleimide resins, benzooxazine resins, phenoxy resins, unsaturated polyester resins, phenolic resins, melamine resins, urethane resins, or silicone resins. Among these, resins that harden with a curing agent, such as epoxy resins, are preferably included together with the curing agent. Examples of curing agents for epoxy resins include acid anhydride compounds, phenolic compounds, amine compounds, heat or photoacid generators such as sulfonium salts or iodonium salts, photosensitizers, or active ester compounds.

[0240] (Photosensitizer) The resin composition may further contain a sensitizer. Further improvements in functionality can be achieved by selecting the type of sensitizer. One type of sensitizer may be used alone, or two or more types may be used in combination. Examples of sensitizers include anthracene compounds, thioxanthone compounds, cyanine compounds, merocyanine compounds, coumarin compounds, benzylidene ketone compounds, squarium compounds, (thia)pyrillium compounds, porphyrin compounds, coumarin compounds, pyrarisone compounds, oxazole compounds, thiophene type, naphthalene type, and the like. Examples of commercially available products include the Anthracure UVS series such as Anthracure UVS-1331, Anthracure UVS-1101, Anthracure UVS-581, or Anthracure UVS-2171 manufactured by Air Water Performance Chemical Co., Ltd., and NF-CO-01, NF-CO-02, NF-CO-02-AC, NF-CO-05, NF-CO-06, NF-PY-01, NF-PY-02, NF-TH-01, NF-NA-01, NF-py-A, NF-py-B, NF-py-C, NF-Ox-A, and NF-Co-A manufactured by Nippon Chemical Industrial Co., Ltd. The amount of each photosensitizer is preferably 0.001 to 40 parts by mass per 100 parts by mass of the total mass of component C, which is an optional component in the resin composition.

[0241] <Method for producing resin compositions> The method for producing the resin composition described above is not particularly limited, and can be obtained, for example, by mixing each component using a known mixer. For example, a method is to mix a predetermined amount of component A, as well as optional components B, C, and other components, at room temperature or under heating, using a mixing machine such as a stirrer, homodisper, homomixer, universal mixer, planetary mixer, kneader, three-roll mixer, or bead mill.

[0242] Alternatively, the resin composition may be manufactured by preparing and mixing individual components, such as a two-component or three-component type.

[0243] Another embodiment of the present invention provides a method for producing a resin composition using an organosilicon compound produced by the method for producing organosilicon compounds described above. Specifically, the method for producing a resin composition includes a compound production step of reacting a compound represented by formula (4) described above (a compound containing a silsesquioxane skeleton) with at least one of the compounds represented by formula (5) described above and the compound represented by formula (6) described above at a temperature of 20°C or higher and 70°C or lower to obtain a silicon compound. This embodiment may include steps other than the compound production step. Steps other than the compound production step may include, for example, a mixing step of mixing each component constituting the resin composition.

[0244] Furthermore, another embodiment of the present invention is a resin composition obtained by the manufacturing method described above. The conditions for this resin composition can be similarly applied to those for the resin composition described above.

[0245] <Cured product> Another embodiment of the present invention is a cured product obtained by curing the resin composition described above. The curing method for obtaining the cured product is not particularly limited and can be carried out by known methods, such as heating or light irradiation.

[0246] Since the viscosity change rate over time of the resin composition using component A is small, it is preferable to cure the above-mentioned resin composition in the form of a film to obtain a cured product as a silicone film. The film of the resin composition can be formed by known methods of coating it onto a substrate or sheet. Furthermore, the curing of the resin composition film can be determined based on conditions such as crosslinking. For example, a silicone film can be formed by heating the resin composition or its film. The following is an example of a curing method, but it is not limited to this method.

[0247] [Curing method] A cured product can be obtained, for example, by applying the above-mentioned resin composition to the surface of a substrate using a desired printing method (screen printing, letterpress printing, intaglio printing, planographic printing, inkjet printing, etc.), a dispenser, or spin coating, drying as necessary to form a coating film (coating film formation step), and then performing a heating step on the obtained coating film to cure it.

[0248] [Coating film formation process] In the coating film formation process, a resin composition is applied to the surface of the substrate to form a coating film. Examples of substrates include semiconductor substrates such as aluminum or glass substrates, copper substrates, copper alloy substrates, polyimide substrates, ceramic substrates, printed circuit boards, stainless steel substrates, and fiber-reinforced substrates such as CFRP or GFRP.

[0249] In the case of resin compositions containing a solvent, a drying treatment may be performed to remove the solvent before curing. Depending on the composition of the resin composition, the drying temperature is usually 50 to 250°C; the drying time is usually 5 to 120 minutes. Such a drying treatment allows for the formation of a coating film on the substrate that can maintain its shape.

[0250] [Heating process] After the coating film is formed, it is usually heat-treated at 70-350°C for 10-200 minutes.

[0251] Furthermore, a cured product is defined as any product in which crosslinking reactions or similar processes have occurred in at least some of the components of a resin composition, resulting in reduced fluidity; it is not limited to products that are completely cured. In other words, cured products include those that are elastic or viscous, or those that soften or melt when heated.

[0252] The cured product may be a B-stage cured product. A B-stage cured product refers to a cured product in a semi-cured state. Specifically, it is preferable that the B-stage cured product is solid at 25°C and has a softening point in the range of 50°C to 200°C. A B-stage cured product can be obtained by heating the resin composition, for example, in a temperature range of 100 to 350°C for 1 to 5 hours.

[0253] The shape of the cured product is not particularly limited and may be a shape formed by curing the resin composition in the form of a film, or a molded article formed by curing the resin composition to a predetermined shape using a mold or the like. The shape of the cured product is not particularly limited and may be, for example, a film, a sheet, a powder, granules, or a plate.

[0254] <Application> The uses of the above-mentioned compositions and cured products are not particularly limited, but because the above-mentioned organosilicon compounds have a structure derived from compounds containing a silsesquioxane skeleton, excellent effects in various physical properties such as heat resistance, electrical insulation, transparency, adhesion, solubility, mechanical strength, gas permeability, dielectric constant, flame retardancy, and processability, as well as their use in a wide range of applications, can be expected.

[0255] Specifically, the cured product described above has excellent heat resistance and insulation properties, and can therefore be suitably used in applications such as electrical and electronic materials. Specifically, it can be suitably used as a coating film for substrates that form metal elution prevention films, gas barrier films, or anti-reflective films; an insulating film, a encapsulant, a light-emitting diode encapsulant, a fouling prevention film, a component of an element such as a microlens, a light guide plate, a wavelength conversion layer, a light reflector, a buffer material, a sealant, an optical waveguide material, a planarization film, a protective film, an underfill material, or a die attach material; an optical resin; an optical film; a contact lens, etc. When used as an insulating film in an element, the insulating film may be, for example, an insulating film that covers a chip or element, or an insulating film for rewiring. Furthermore, because the cured product has excellent transparency, it can be suitably used as a lens, optical filter, or cover glass, including various lenses, in the above-mentioned applications. The above-described compositions can be used as materials for forming the various components mentioned above.

[0256] Furthermore, the above-mentioned composition has excellent adhesive properties and can therefore be suitably used as an adhesive.

[0257] When the above-described compositions and cured products are used as components of an element, the type of element is not particularly limited and can include semiconductor elements, integrated circuit devices, actuator elements (such as piezoelectric elements like MEMS), etc. It can be used as an optical element, a thermoelectric element, or a passive element (capacitor, inductor, resistor, etc.). Examples of applications in which the element is used include devices for moving in at least one area selected from the group consisting of land, underground, air, space, sea, and underwater. Specific examples of such devices include vehicles, ships, and aircraft, which may be manned or unmanned (drones). Other examples of applications in which the element is used include electronic devices selected from the group consisting of home appliances, information equipment, video equipment, audio equipment, and amusement equipment, as well as hybrid devices thereof.

[0258] The types of semiconductor devices are not particularly limited, and examples include power semiconductor devices, various transistors such as junction field-effect transistors (JFETs), various diode devices such as light-emitting diodes, metal-oxide-semiconductor field-effect transistors (MOSFETs), Schottky source / drain MOSFETs, avalanche photovoltaic devices, solar cell devices, sensor devices, touch sensor devices, switching devices, resistive random-access memory, power conversion devices, or display devices.

[0259] Furthermore, as described above, the compositions and cured products described above have excellent transparency and are therefore suitable as materials for constituting all or part of an optical component. In this specification, "optical component" is used as a general term for components having optical functions. Optical components are broadly classified into single optical elements, which have the function of changing the properties of light on their own, and electro-optical elements, which perform a predetermined function through interaction with electrons.

[0260] Single optical elements have the function of changing the transmission or reflection characteristics of incident light, and specific examples of their functions include polarization adjustment, light intensity adjustment, color tone adjustment, or optical path adjustment. Specific examples of single optical elements include polarizing members, coloring members, dimming members, wavelength conversion members, light shielding members, light-reducing members, reflective members, lenses, or mirrors. Electro-optical elements have the function of changing the characteristics of incident light based on electrical signals, or the function of converting optical signals into electrical signals or emitting light based on electrical signals based on photoelectric conversion. Specific examples of elements with the former function include electrochromic elements and liquid crystal elements. Specific examples of elements with the latter function include light-emitting elements such as LEDs and OLEDs.

[0261] Furthermore, since the compositions and cured products described above are transparent and adhesive, they can be suitably used as protective or bonding members placed on or near the optical path, similar to conventional optical transparent adhesives. Conventional optical transparent adhesive films (OCAs) are basically made of adhesive materials and therefore do not easily have high heat resistance, but the compositions and cured products described above also have excellent heat resistance, so they can be suitably used in applications with a large amount of transmitted light, such as large projectors for projection mapping. If the cured product is a B-Stage cured product, the cured product described above or a resin-containing member containing the cured product may be usable as a substitute material for conventional OCAs.

[0262] Furthermore, from the viewpoint of transparency, it can be suitably used as a lens, optical filter, or cover glass, and from the viewpoint of adhesion, it can be suitably used as an adhesive.

[0263] Another example of the use of the cured material described above is when a composite member comprising a resin-containing member containing the cured material and another member (first member) provided in contact with the resin-containing member constitutes part of an electrical element. As the cured material described above has excellent properties as mentioned above, the resin-containing member may be composed solely of the cured material, but other materials may be included to obtain the desired properties. Such materials include hard or soft resin materials and non-resin materials such as inorganic fillers.

[0264] Specific examples of electrical elements include integrated circuit devices, power elements, switching elements, sensor elements, actuator elements such as MEMS, the aforementioned electro-optical elements, energy storage elements such as capacitors, inductors such as choke coils and transformers, and resistors. Examples of applications in which such electrical elements are used include devices for moving in at least one area selected from the group consisting of land, underground, air, space, sea, and underwater. Specific examples of such devices include vehicles, ships, and aircraft, which may be manned or unmanned (drones). Other examples of applications in which electrical elements are used include electrical equipment selected from the group consisting of home appliances, information equipment, video equipment, audio equipment, amusement equipment, and hybrid equipment thereof.

[0265] One example of the application of the resin-containing component in the composite component described above is as a protective film covering at least a portion of the first component. Specific examples of the first component include semiconductor substrates such as Si, GaN, and SiC; metal-based substrates such as copper-based materials, aluminum-based materials, and steel materials such as stainless steel; ceramic substrates such as alumina; glass substrates; and resin-based substrates. The resin-containing component containing the cured product described above has excellent adhesion to such substrates and can therefore be suitably used as a protective film.

[0266] In particular, the cured products described above contain siloxane bonds (Si-O-Si), such as silsesquioxane groups and siloxane groups, and therefore have superior heat resistance compared to resin-based materials that do not have such bonds, resulting in particularly excellent adhesion to glass substrates, semiconductor substrates, and metal-based substrates. Furthermore, because the cured products described above contain siloxane bonds (Si-O-Si) in a predetermined proportion, they produce less greenhouse gas per unit weight compared to resin cured products that do not contain such bonds (epoxy resin being a specific example).

[0267] The first component may be a wiring board in which wiring is provided on a base material. In this case, the protective film made of the resin-containing material including the cured product described above preferably has insulating properties, and in this case, it becomes an insulating film that covers the wiring. Since the cured product described above also has excellent insulating properties, it can function appropriately as a protective film even when the resin-containing material is composed of the cured product.

[0268] In this case, wiring may be further provided on the protective film, forming a laminated wiring structure. In this case, the resin-containing material including the cured product described above is positioned as a planarizing film, a rewiring insulating film, or an interlayer insulating film in a member having a multilayer wiring structure.

[0269] The first component may be a base material on which an integrated circuit is formed. In this case as well, it is preferable that the protective film made of resin-containing material has insulating properties, and in this case, the protective film is positioned as a buffer coat covering the integrated circuit.

[0270] Another specific example of the application of resin-containing components in the composite components described above is that they can be used as sealing materials, taking advantage of their adhesion. In this case, specific examples of the first component include integrated circuit devices, power elements, switching elements, and sensor elements. Because resin-containing components have excellent heat resistance, they can be used as a substitute material for sealing materials conventionally made of epoxy resin, and are particularly suitable for high-temperature environments.

[0271] The composite member described above may include a second member that is different from the first member and is in contact with the resin-containing member. In this case, the resin-containing member has a bonding function that joins the first member and the second member. The specific example of the first member described above also corresponds to the specific example of the second member.

[0272] One specific example of the application of resin-containing components that focus on bonding function is the first component and the second component. One example is a filler material placed in the gap between the material. Because the cured material described above has high adhesion to the first and second members, the resin-containing member containing the cured material can maintain an appropriate gap between the first and second members even when subjected to external force. An example of a filler material is an underfill material. Underfill materials may contain silica particles as a filler, but because the cured material described above has siloxane bonds (Si-O-Si), it also has excellent adhesion to silica particles. Therefore, underfill materials containing silica particles are a particularly suitable example for use in resin-containing members.

[0273] Another specific example of a resin-containing member that focuses on bonding function is a sealing material provided to cover the gap between a first member and a second member. The cured material described above has high adhesion to the first member and the second member, as well as flexibility. Therefore, the resin-containing member containing the cured material can maintain contact with the first member and the second member even when subjected to external force.

[0274] In applications where a resin-containing component performs a bonding function, the first component may be a mounting substrate, and the second component may be an electrical element equipped with electrodes. Electrical elements may generate heat or vibrate when energized, but the cured material described above has excellent heat resistance, excellent adhesion, and high flexibility, making it possible to properly maintain the holding of the electrical element to the mounting substrate. One example of such an application is a die attach material.

[0275] Furthermore, in recent years, there has been an increasing demand for higher power output and higher density mounting of electrical components, requiring higher heat resistance in mounting technologies. The resin-containing components containing the aforementioned cured material can meet this demand. One mounting technology that addresses this increased heat resistance is Power Overlay (POL) technology, and the resin-containing components containing the aforementioned cured material can be suitably used as bonding members in this application.

[0276] In one example of POL technology, an adhesive layer is formed on a substrate made of a heat-resistant resin such as polyimide, and the electrode side of the electrical element is brought into contact with this adhesive layer to fix the electrical element on the substrate. Then, the substrate is drilled from the side opposite to the side on which the electrical element is placed (front side) (back side) (through-hole formation by removal process) to expose the electrode surface. The through-hole is then filled with a conductive material such as copper, and a wiring pattern is formed on the back side using plating technology or the like. After the back side with the wiring pattern is covered with an insulating film, a portion of the insulating film is removed to form external electrodes that connect to the wiring pattern. In addition, the front side is sealed with a resin-based material to cover the electrical element, and a heat dissipation member is attached as needed.

[0277] The resin-containing material containing the cured product described above has excellent adhesion and high heat resistance, making it suitable for use as an adhesive layer formed on the surface of a substrate. It can also be used as a resin-based material to cover electrical elements that generate heat when energized. In this case, it may be preferable to use a resin-containing material in which a material with high thermal conductivity, such as alumina, is dispersed, taking advantage of the excellent heat resistance and adhesion of the cured product described above. [Examples]

[0278] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0279] [Synthesis of organosilicon compounds] (Synthesis of organosilicon compound 1-1) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (170g), octamethylcyclotetrasiloxane (compound A-2) (63.8g), toluene (193g), and 4-methyltetrahydropyran (MTHP) (48.1g) were placed in a reactor and heated at 55°C. Then, sulfuric acid (7.39 g) was added dropwise and the mixture was stirred for 24 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 5:1, by weight) to obtain organosilicon compound (1-1) (178 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 98,000 and a number-average molecular weight of 38,000. 1 From 1H-NMR analysis, the mean value of n in the following formula was 4.1, with 18% of structures having n=1 and 23% having n=2. The proportion of structures with n=1 or n=2 represents the ratio of the number of structures corresponding to m=1 or m=2 in formula (B) to the total number of structures represented by formula (B), respectively. This is also true for the following examples and comparative examples.

[0280] [ka]

[0281] (Synthesis of comparative organosilicon compound P-1) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (300 g), octamethylcyclotetrasiloxane (compound A-2) (125 g), toluene (350 g), and 4-methyltetrahydropyran (87.6 g) were placed in a reactor and heated at 85°C. Sulfuric acid (13.2 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene:ethyl acetate = 21:3:1, by weight) to obtain organosilicon compound (P-1) (326 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 96,000 and a number-average molecular weight of 36,000. 1From 1H-NMR analysis, in the following equation (P-1), the mean value of n was 4.2, with 23% of the structures having n=1 and 22% having n=2.

[0282] [ka]

[0283] (Synthesis of organosilicon compounds 1-2) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (150 g), octamethylcyclotetrasiloxane (compound A-2) (54.4 g), toluene (43.9 g), and 4-methyltetrahydropyran (176 g) were placed in a reactor and heated at 50°C. Sulfuric acid (15.1 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-2) (157 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 37,000 and a number-average molecular weight of 20,000. 1 From 1H-NMR analysis, in the following equation (1-2), the mean value of n was 4.1, with 19% of the structures having n=1 and 22% having n=2.

[0284] [ka]

[0285] (Synthesis of organosilicon compounds 1-3) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (150 g), octamethylcyclotetrasiloxane (compound A-2) (54.4 g), toluene (110 g), and 4-methyltetrahydropyran (110 g) were placed in a reactor and heated at 50°C. Sulfuric acid (15.1 g) was added dropwise, and the mixture was stirred for 24 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-3) (157 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 54,000 and a number-average molecular weight of 26,000. 1 From 1H-NMR analysis, in the following equation (1-3), the average value of n was 4.4, with 15% of the structures having n=1 and 20% having n=2.

[0286] [ka]

[0287] (Synthesis of comparative organosilicon compound P-2) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (450 g), octamethylcyclotetrasiloxane (compound A-2) (163 g), toluene (330 g), and 4-methyltetrahydropyran (330 g) were placed in a reactor and heated at 90°C. Sulfuric acid (45.4 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (P-2) (440 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 39,000 and a number-average molecular weight of 22,000. 1From 1H-NMR analysis, in the following equation (P-2), the mean value of n was 4.3, with 21% of the structures having n=1 and 19% having n=2.

[0288] [ka]

[0289] (Synthesis of organosilicon compounds 1-4) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (15.0 g), octamethylcyclotetrasiloxane (compound A-2) (3.4 g), toluene (9.8 g), and 4-methyltetrahydropyran (9.8 g) were placed in a reactor and heated at 55°C. Sulfuric acid (1.2 g) was added dropwise, and the mixture was stirred for 7 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-4) (13.9 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 57,000 and a number-average molecular weight of 26,000. 1 From 1H-NMR analysis, in the following equation (1-4), the mean value of n was 3.0, with 23% of structures having n=1 and 26% having n=2.

[0290] [ka]

[0291] (Synthesis of organosilicon compounds 1-5) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (30.0 g), octamethylcyclotetrasiloxane (compound A-2) (6.8 g), toluene (20.9 g), and 4-methyltetrahydropyran (20.9 g) were placed in a reactor and heated at 55°C. Sulfuric acid (5.0 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was treated with toluene. Extraction was performed. The combined organic layers were washed with water, sodium bicarbonate aqueous solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-5) (25.9 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 60,000 and a number-average molecular weight of 30,000. 1 From 1H-NMR analysis, in the following equations (1-5), the mean value of n was 3.2, with 20% of the structures having n=1 and 27% having n=2.

[0292] [ka]

[0293] (Synthesis of organosilicon compounds 1-6) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (30.0 g), octamethylcyclotetrasiloxane (compound A-2) (6.8 g), toluene (22.1 g), and 4-methyltetrahydropyran (22.1 g) were placed in a reactor and heated at 40°C. Sulfuric acid (7.4 g) was added dropwise, and the mixture was stirred for 4 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-6) (32.0 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 61,000 and a number-average molecular weight of 31,000. 1 From 1H-NMR analysis, in the following equations (1-6), the mean value of n was 3.2, with 15% of the structures having n=1 and 29% having n=2.

[0294] [ka]

[0295] (Synthesis of organosilicon comparative compound P-3) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (300.0 g), octamethylcyclotetrasiloxane (compound A-2) (67.6 g), toluene (195.6 g), and 4-methyltetrahydropyran (195.6 g) were placed in a reactor and heated at 85°C. Sulfuric acid (23.6 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (P-3) (316.1 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 33,000 and a number-average molecular weight of 18,000. 1 From 1H-NMR analysis, in the following equation (P-3), the mean value of n was 3.0, with 27% of the structures having n=1 and 24% having n=2.

[0296] [ka]

[0297] [Preparation of resin composition] Each component shown in Tables 1-3 was uniformly mixed and dissolved in the masses shown in Tables 1-3 to prepare resin compositions (Examples 1-19 and Comparative Examples 1-7).

[0298] The components used other than the organosilicon compound (component A) mentioned above are listed below.

[0299] (A compound having a functional group that can chemically bond with organosilicon compounds (component B)) • MS51: MKC Silicate MS51 (trademark), manufactured by Mitsubishi Chemical Corporation, tetramethoxysilane average pentamer. • ES40: Tetraethoxysilane oligomer, manufactured by Colcoat Co., Ltd., average degree of polymerization: 4-5 Trimethoxyphenylsilane: Manufactured by Tokyo Chemical Industry Co., Ltd. • 1,6-Bis(trimethoxysilyl)hexane: Manufactured by Tokyo Chemical Industry Co., Ltd. Triacetoxyphenylsilane: Manufactured by Tokyo Chemical Industry Co., Ltd.

[0300] (solvent) Anisole: Manufactured by Fujifilm Wako Pure Chemical Corporation • EDM: Diethylene glycol ethyl methyl ether, manufactured by Toho Chemical Industry Co., Ltd. • PGMEA: Propylene glycol monomethyl ether acetate, manufactured by Fujifilm Wako Pure Chemical Corporation • 1,3-Dimethoxybenzene: Manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.

[0301] (curing catalyst) • ZC-150: Zirconium tetraacetylacetonate, manufactured by Matsumoto Fine Chemical Co., Ltd. • TC-750: Titanium ethyl acetoacetate, manufactured by Matsumoto Fine Chemical Co., Ltd.

[0302] [Evaluation of solubility] The appearance of the prepared resin composition was visually evaluated. A was assigned if it was transparent, B if it was cloudy (no insoluble matter), and C if it was cloudy (with insoluble matter).

[0303] [Evaluation of viscosity change rate over time] Resin compositions were prepared and stored at room temperature (21°C) for two weeks. For each resin composition, the viscosity was measured at 25°C and a rotation speed of 20 rpm using an E-type rotational viscometer manufactured by Toki Sangyo Co., Ltd. The viscosity at the time of preparation and after two weeks were compared, and the viscosity change rate (((viscosity after two weeks - viscosity at preparation) / viscosity at preparation) × 100) was calculated using the following formula.

[0304] [Table 1]

[0305] [Table 2]

[0306] [Table 3]

[0307] Tables 1-3 show that the resin compositions of Examples 1-19 exhibited a smaller rate of viscosity change (viscosity increase) over time compared to the resin compositions of Comparative Examples 1-7. Furthermore, it was found that the resin compositions according to Examples 1 to 19 have a transparent appearance and excellent solubility.

[0308] From the above, it has been found that in a resin composition containing an organosilicon compound having the structures represented by formulas (A) and (B), by providing a configuration in which the proportion of the organosilicon compound (component A) with the structure represented by formula (B) having m=2 is greater than the proportion of the structure represented by formula (B) having m=1, it is possible to provide a resin composition with a small rate of change in viscosity over time and excellent handling properties.

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