Wafer rotating apparatus, material coating apparatus, and wafer rotating method
The wafer rotating device addresses inconsistent wafer height issues by using a temporary stand and vertical actuator to stabilize wafer edges, facilitating accurate edge processing through consistent positioning.
JP2026115168APending Publication Date: 2026-07-09EBARA CORP
Patent Information
- Application Number
- JP2024231698
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
Smart Images
Figure 2026115168000001_ABST
Abstract
The present invention provides a wafer rotating device in which the wafer chuck can always hold the wafer at the same height. [Solution] The wafer rotating device includes a temporary storage table 28 having a wafer mounting surface 25 on which wafers W are temporarily placed before being held by a plurality of wafer chucks 5, and a vertical actuator 29 that moves the temporary storage table 28 between a first height and a second height. When the temporary storage table 28 is at the first height, the wafer mounting surface 25 is lower or higher than the plurality of edge holding parts 3 of the plurality of wafer chucks 5, and when the temporary storage table 28 is at the second height, the wafer mounting surface 25 is at the same height as the plurality of edge holding parts 3.
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Citation Information
Patent Citations
Substrate holding rotation mechanism and substrate processing device
JP2022036416A
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JP2023032581A