Wafer holder
The wafer holder achieves rapid and uniform cooling of heaters by using a movable cooling plate with a low thermal conductivity restricting member to manage contact points, addressing uneven cooling issues in existing designs.
JP2026115345AActive Publication Date: 2026-07-09SUMITOMO ELECTRIC INDUSTRIES LTD
Patent Information
- Application Number
- JP2024231988
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
- Estimated Expiration
- 2044-12-27
Smart Images
Figure 2026115345000001_ABST
Abstract
To provide a wafer holder that can cool the heater quickly and uniformly. [Solution] The wafer holder comprises a heater having an upper surface on which a wafer is placed and a lower surface opposite to the upper surface; a cooling plate having an upper surface that is positioned below the heater so as to be vertically movable and moves closer to and further away from the lower surface; and a restricting member that restricts contact between the lower surface of the heater and the upper surface of the cooling plate by partially contacting at least one of the lower surface of the heater and the upper surface of the cooling plate. The thermal conductivity of the restricting member is less than that of the cooling plate.
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Citation Information
Patent Citations
Heater module for semiconductor manufacturing apparatus
JP2007184550A