Sensor device and method for manufacturing a sensor device
The sensor device is miniaturized by exposing and utilizing non-covered surfaces of the magnet for positioning during resin molding, eliminating the need for a resin cap and reducing its overall size.
JP2026115425APending Publication Date: 2026-07-09SUMITOMO WIRING SYSTEMS LTD
Patent Information
- Application Number
- JP2024232125
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
Smart Images
Figure 2026115425000001_ABST
Abstract
The objective is to provide technology that enables the miniaturization of sensor devices. [Solution] The sensor device 10 comprises a magnet 20 including a first surface 21, a sensor 30 including a sensor body 31 disposed on the first surface 21, and a resin molded part 40 covering the magnet 20 and the sensor 30. The first surface 21 has a placement portion 21A on which the sensor body 31 is disposed, and a non-placement portion 21B adjacent to the placement portion 21A. The non-placement portion 21B is exposed from the resin molded part 40.
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Citation Information
Patent Citations
Sensor device and method of manufacturing same
JP2006308330A