Wiring circuit board
The wiring circuit board design addresses dust and short-circuit issues by using a resin-covered metal support layer, ensuring flexibility and design freedom through controlled resin thickness and spacing, preventing contact with surrounding components.
JP2026115634APending Publication Date: 2026-07-09NITTO DENKO CORP
Patent Information
- Application Number
- JP2024232468
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
Smart Images
Figure 2026115634000001_ABST
Abstract
To provide a wiring circuit board that can suppress dust generation from the metal support layer of the flexible part. [Solution] The wiring circuit board 1 has a flexible portion 3A and a support portion 2A that supports the flexible portion 3A. The wiring circuit board 1 comprises a first insulating layer 11, a conductor pattern 12, and a metal support layer 14. The flexible portion 3A comprises a part of the first insulating layer 11, a part of the conductor pattern 12, a part of the metal support layer 14, and a resin layer 15 that covers the metal support layer 14.
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Citation Information
Patent Citations
Wiring circuit board
JP2019212656A