Antenna wiring board

Abstract

To provide an antenna wiring board with improved visibility. [Solution] The antenna wiring board 100 includes a base layer 10, an antenna layer 20, and a ground layer 30. The base layer 10 is translucent. The antenna layer 20 is formed on one surface of the base layer 10. The ground layer 30 is formed on the other surface of the base layer 10. One of the antenna layer 20 and the ground layer 30 is formed by a mesh member having an opening 23 and composed of conductive wires 21 and 22 with a line width of 10.0 μm or less. The other of the antenna layer 20 and the ground layer 30 is formed by a translucent conductive film.

Description

Technical Field

[0001] The present invention relates to a wiring board for an antenna.

Background Art

[0002] Communication devices such as mobile phones, smart devices, or tablets are provided with antennas for transmitting and receiving radio waves. In recent years, since communication devices are miniaturized, it may not be easy to secure a space for providing an antenna inside the housing. In addition, the antenna needs to be provided so as to be able to transmit and receive radio waves with high directivity such as millimeter waves. Therefore, the antenna may be provided on the display of the communication device. Such an antenna is required to have low visibility (non-visibility).

[0003] For example, in the antenna described in Patent Document 1, an antenna element is provided on one surface of a transparent film substrate, and a ground portion is provided on the other surface of the transparent film substrate. Each of the antenna element and the ground portion is constituted by a mesh pattern formed of fine silver wires. The line width of the fine wire is 1.0 μm or more and less than 5.0 μm. The thickness of the transparent film substrate is 30 μm or more and 300 μm or less. The fine silver wire contains a plurality of silver particles dispersed in a polymer. The ratio of the plurality of silver particles contained in the fine silver wire is 70% by volume or more.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 describes that the above antenna configuration makes it possible to ensure the conductivity of thin wires while making the antenna less visible. However, in the above antenna configuration, moiré patterns are generated by the antenna elements and ground section, making the antenna conspicuously visible. Therefore, it is difficult to improve the invisibility of the antenna.

[0006] The object of the present invention is to provide an antenna wiring board with improved visibility. [Means for solving the problem]

[0007] An antenna wiring board according to one aspect of the present invention comprises a light-transmitting base layer, an antenna layer formed on one surface of the base layer, and a ground layer formed on the other surface of the base layer, wherein one of the antenna layer and the ground layer is formed of a mesh member having an opening and composed of conductive wires with a line width of 10.0 μm or less, and the other of the antenna layer and the ground layer is formed of a light-transmitting conductive film. [Effects of the Invention]

[0008] According to the present invention, the visibility of the wiring board for the antenna can be improved. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view of a communication device on which a wiring board according to the first embodiment of the present invention is mounted. [Figure 2] Figure 1 is a perspective view of the wiring board. [Figure 3] Figure 2 is a cross-sectional view of the wiring board along line AA. [Figure 4] Figure 1 is a partially enlarged cross-sectional view of the communication equipment. [Figure 5] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 6] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 7] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 8] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 9] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 10] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 11] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 12] Figure 3 is a schematic cross-sectional view illustrating the manufacturing method of the wiring board. [Figure 13] This is a perspective view of the external appearance of a wiring board according to a second embodiment of the present invention. [Figure 14] Figure 13 is a cross-sectional view of the BB line of the wiring board. [Figure 15] This is a partially enlarged cross-sectional view of the communication equipment in the second embodiment. [Figure 16] This is a cross-sectional view of a wiring board for illustrating a cover layer in another embodiment. [Figure 17] Figure 16 is a partially enlarged cross-sectional view of a communication device to which the wiring board is attached. [Modes for carrying out the invention]

[0010] 1. First Embodiment (1) Configuration of the wiring board for the antenna Hereinafter, an antenna wiring board (hereinafter simply referred to as a wiring board) according to one embodiment of the present invention will be described with reference to the drawings. Figure 1 is a plan view of a communication device on which a wiring board according to the first embodiment of the present invention is mounted. In the example of Figure 1, the communication device 200 is a mobile phone. The communication device 200 may be other devices such as a smart device or a tablet. The communication device 200 includes a housing 110 and a display 120. The display 120 is arranged over substantially the entire surface of one side of the housing 110.

[0011] The wiring board 100 is provided so as to overlap a part of the display 120 of the communication device 200. FIG. 2 is an external perspective view of the wiring board 100 in FIG. 1. FIG. 3 is a cross-sectional view taken along line A-A of the wiring board 100 in FIG. 2. As shown in FIGS. 2 and 3, the wiring board 100 includes a base layer 10, an antenna layer 20, a ground layer 30, and a cover layer 40. In FIG. 2, the illustration of the cover layer 40 is omitted.

[0012] The base layer 10 is formed of an insulating material having light transmissivity. The insulating material having light transmissivity includes, for example, cycloolefin polymer resin. The insulating material having light transmissivity may include an organic insulating material such as polyester resin, acrylic resin, polycarbonate resin, or polyimide resin. Alternatively, the insulating material having light transmissivity may include glass or transparent ceramics. The light transmittance of the base layer 10 is, for example, 70% or more in the visible light region where the wavelength is 380 nm or more and 780 nm or less. Also, the thickness of the base layer 10 is, for example, 20 μm or more and 200 μm or less.

[0013] The antenna layer 20 is formed on one surface of the base layer 10. The antenna layer 20 has a substantially square shape in plan view. The length L of each side of the antenna layer 20 in plan view is substantially equal to λ / 2. Here, λ is the wavelength of the radio wave transmitted and received by the antenna layer 20. Also, in the present embodiment, as shown by the dashed line box in FIG. 2, the antenna layer 20 is formed of a mesh member. The sheet resistance value of the mesh member is, for example, 1 Ω / □ or less. The mesh member is composed of a plurality of wires 21 and a plurality of wires 22 and has a plurality of openings 23.

[0014] Specifically, the multiple wires 21 extend in a first direction. The multiple wires 22 extend in a second direction that intersects (orthogonal in this example) the first direction. The region enclosed by the multiple wires 21 and 22 becomes the multiple openings 23 in the mesh member. Each wire 21, 22 is made of a conductive material. The conductive material includes, for example, copper or a copper alloy. The wire width of each wire 21, 22 is, for example, 1.0 μm or more. Also, the wire width of each wire 21, 22 is 10.0 μm or less. The thickness of each wire 21, 22 is, for example, 0.5 μm or more and 20 μm or less.

[0015] The ground layer 30 is formed on the other surface of the base layer 10. In this embodiment, the ground layer 30 is formed of a light-transmitting conductive film. The conductive film is formed of, for example, indium tin oxide (ITO) containing tin oxide. The sheet resistance of the conductive film is, for example, 100 Ω / □ or less. The light transmittance of the ground layer 30 is, for example, 70% or more in the visible light region. The thickness of the ground layer 30 is, for example, 20 μm or more and 200 μm or less.

[0016] The cover layer 40 is formed on one surface of the base layer 10 using a translucent insulating material so as to cover the antenna layer 20. The cover layer 40 may be formed from the same material as the base layer 10. In this example, the cover layer 40 has an uneven shape that follows the pattern of the mesh member forming the antenna layer 20. Therefore, the thickness of the cover layer 40 in the portion that overlaps the wires 21 and 22 of the antenna layer 20 is different from the thickness of the portion that is inside the opening 23 of the antenna layer 20. The cover layer 40 does not need to be present inside the opening 23 of the antenna layer 20, except for the side portions of the wires 21 and 22. On the other hand, the thickness of the portion of the cover layer 40 that overlaps the wires 21 and 22 is, for example, 1 μm or more and 30 μm or less.

[0017] Figure 4 is a partially enlarged cross-sectional view of the communication device 200 shown in Figure 1. As shown in Figure 4, the ground layer 30 of the wiring board 100 is bonded to the display 120 of the communication device 200 via a light-transmitting adhesive layer 130. A protective layer 150, such as a cover glass, is bonded to the cover layer 40 of the wiring board 100 via a light-transmitting adhesive layer 140. The adhesive layers 130 and 140 may be transparent double-sided tape. In this way, the wiring board 100 is attached to the display 120 of the communication device 200.

[0018] (2) Method for manufacturing a wiring board Figures 5 to 12 are schematic cross-sectional views illustrating the manufacturing method of the wiring board 100 shown in Figure 3. Note that the cross-sectional views in Figures 5 to 12 correspond to the cross-sectional view along line AA in Figure 2. First, as shown in Figure 5, a base layer 10 having one flat surface and the other is prepared. The base layer 10 may be formed by coating a photosensitive resin precursor onto a support layer (not shown) and exposing the photosensitive resin precursor with ultraviolet light. In this case, the support layer is removed from the base layer 10 before the step of forming the ground layer 30 on the other surface of the base layer 10, which will be described later.

[0019] Next, as shown in Figure 6, a base layer 20A is formed on one surface of the base layer 10. The base layer 20A contains, for example, ITO. Subsequently, as shown in Figure 7, a thin film layer 20B is formed on the base layer 20A. The thin film layer 20B contains, for example, copper. Both the base layer 20A and the thin film layer 20B may be formed by sputtering. Furthermore, if the thin film layer 20B has sufficient adhesion to the base layer 10, the base layer 20A may not be formed.

[0020] Subsequently, as shown in Figure 8, a plating resist layer 50 having a predetermined pattern opening 51 is formed on the thin film layer 20B. The pattern opening 51 has a mesh-like pattern. The plating resist layer 50 may also be formed by coating a photoresist onto the thin film layer 20B and then exposing and developing the photoresist in a predetermined pattern. Next, as shown in Figure 9, a plating layer 20C is formed on the thin film layer 20B in areas where the plating resist layer 50 is not formed, i.e., on each portion of the thin film layer 20B exposed through the pattern opening 51. The plating layer 20C may contain, for example, copper or a copper alloy and may be formed by electroplating.

[0021] Next, as shown in Figure 10, the plating resist layer 50 is removed. Then, as shown in Figure 11, the unnecessary portions of the thin film layer 20B and the underlayer 20A, i.e., the portions of the thin film layer 20B and the underlayer 20A that are exposed from the plating layer 20C, are removed. The thin film layer 20B and the underlayer 20A may be removed by wet etching or dry etching. This forms the mesh member as the antenna layer 20.

[0022] Specifically, the base layer 20A extending in the first direction, the thin film layer 20B formed on it, and the plating layer 20C formed on it constitute the wires 21 of the antenna layer 20. The base layer 20A extending in the second direction, the thin film layer 20B formed on it, and the plating layer 20C formed on it constitute the wires 22 of the antenna layer 20. The area surrounded by the multiple wires 21 and the multiple wires 22 becomes the multiple openings 23 in the mesh member. Note that the base layer 20A and the thin film layer 20B are not shown in Figure 12.

[0023] Next, as shown in Figure 12, a cover layer 40 is formed on one surface of the base layer 10 so as to cover the antenna layer 20. The cover layer 40 may be formed by coating a photosensitive resin precursor on one surface of the base layer 10 so as to cover the antenna layer 20 and exposing the photosensitive resin precursor with ultraviolet light. Subsequently, a ground layer 30 is formed on the other surface of the base layer 10. The ground layer 30 may be formed by sputtering a light-transmitting conductive film. This completes the wiring board 100 shown in Figure 3.

[0024] (3) Effects In the wiring board 100 according to this embodiment, an antenna layer 20 is formed on one surface of a light-transmitting base layer 10, and a ground layer 30 is formed on the other surface of the base layer 10. The antenna layer 20 is made of a mesh member composed of conductive wires 21 and 22 and having an opening 23. The ground layer 30 is made of a light-transmitting conductive film.

[0025] With this configuration, moiré patterns do not occur even when the antenna layer 20 and the ground layer 30 are stacked. Furthermore, since the line width of the wires 21 and 22 constituting the mesh member is 10.0 μm or less, they are hardly visible. This improves the visibility of the wiring board 100. In addition, the sheet resistance value of the antenna layer 20 can be easily reduced. Therefore, the gain of the antenna layer 20 can be improved.

[0026] The mesh member is formed from copper or a copper alloy. In this case, the sheet resistance can be easily reduced while maintaining the durability of the mesh member. Specifically, the sheet resistance of the mesh member is 1Ω / □ or less. Therefore, the sheet resistance of the mesh member can be sufficiently reduced. In addition, the wire width of wires 21 and 22 is 1.0 μm or more. This improves the durability of the mesh member.

[0027] The antenna layer 20, formed from a mesh member, is covered by a translucent cover layer 40. This configuration makes it easy to prevent corrosion of the antenna layer 20 even if the wires 21 and 22 constituting the mesh member do not have very high corrosion resistance. Furthermore, the conductive film is formed from ITO. This allows for a relatively low sheet resistance value while maintaining the translucency of the conductive film.

[0028] 2. Second Embodiment (1) Configuration of the wiring board The differences between the wiring board 100 according to the second embodiment of the present invention and the wiring board 100 according to the first embodiment will be described. Figure 13 is an external perspective view of the wiring board 100 according to the second embodiment of the present invention. Figure 14 is a cross-sectional view of the wiring board 100 of Figure 13 along line BB. As shown in Figures 13 and 14, in this embodiment, the wiring board 100 comprises a base layer 10, an antenna layer 20, a ground layer 30, and a cover layer 40. In Figure 13, the cover layer 40 is not shown.

[0029] The base layer 10 in this embodiment has the same configuration as the base layer 10 in the first embodiment. The antenna layer 20 has the same configuration as the antenna layer 20 in the first embodiment, except that it is formed of a light-transmitting conductive film instead of a mesh member. The conductive film is formed of, for example, ITO. The sheet resistance of the conductive film is, for example, 100 Ω / □ or less. The light transmittance of the antenna layer 20 is, for example, 70% or more in the visible light region. The thickness of the antenna layer 20 is, for example, 20 μm or more and 200 μm or less.

[0030] The ground layer 30 is not formed of a light-transmitting conductive film, and has the same configuration as the ground layer 30 in the first embodiment, except that it is formed of a mesh member, as shown by the dashed-dotted line in Figure 13. The sheet resistance of the mesh member is, for example, 1Ω / □ or less. The mesh member is composed of a plurality of wires 31 and a plurality of wires 32, and has a plurality of openings 33.

[0031] Specifically, the multiple wires 31 extend in a first direction. The multiple wires 32 extend in a second direction. The region enclosed by the multiple wires 31 and the multiple wires 32 becomes the multiple openings 33 in the mesh member. Each wire 31, 32 is made of a conductive material. The conductive material includes, for example, copper or a copper alloy. The wire width of each wire 31, 32 is, for example, 1.0 μm or more. Also, the wire width of each wire 31, 32 is 10.0 μm or less. The thickness of each wire 31, 32 is, for example, 0.5 μm or more and 20 μm or less.

[0032] The cover layer 40 is the same as the cover layer 40 in the first embodiment, except that it is formed on the other surface of the base layer 10 so as to cover the ground layer 30 rather than the antenna layer 20. Therefore, in this example, the cover layer 40 has an uneven shape that follows the pattern of the mesh member forming the ground layer 30. Consequently, the thickness of the cover layer 40 in the portion that overlaps the wires 31 and 32 of the ground layer 30 is different from the thickness of the portion that is inside the opening 33 of the ground layer 30. The cover layer 40 does not need to be present inside the opening 33 of the ground layer 30, except for the side portions of the wires 31 and 32. On the other hand, the thickness of the portion of the cover layer 40 that overlaps the wires 31 and 32 is, for example, 1 μm or more and 30 μm or less.

[0033] Figure 15 is a partially enlarged cross-sectional view of the communication device 200 in the second embodiment. As shown in Figure 15, in this embodiment, the cover layer 40 of the wiring board 100 is bonded to the display 120 of the communication device 200 via an adhesive layer 130. A protective layer 150 is bonded to the antenna layer 20 of the wiring board 100 via an adhesive layer 140. This attaches the wiring board 100 to the display 120 of the communication device 200.

[0034] (2) Method for manufacturing a wiring board Except for the following points, the method for manufacturing the wiring board 100 in this embodiment is the same as the method for manufacturing the wiring board 100 in the first embodiment. In this embodiment, a mesh member is formed as a ground layer 30 on the other surface of the base layer 10 by performing the same steps as in Figures 6 to 11. In addition, an antenna layer 20 is formed by forming a mask having a predetermined pattern on one surface of the base layer 10 and sputtering a light-transmitting conductive film onto the area exposed from the mask.

[0035] (3) Effects In the wiring board 100 according to this embodiment, the antenna layer 20 is formed of a light-transmitting conductive film. The ground layer 30 is formed of a mesh member composed of conductive wires 31 and 32 and having an opening 33. In this configuration as well, moiré patterns do not occur, similar to the first embodiment. Furthermore, since the wire width of the wires 31 and 32 constituting the mesh member is 10.0 μm or less, they are hardly visible. This improves the visibility of the wiring board 100.

[0036] Since the ground layer 30 is formed from a mesh member, even if the area of ​​the ground layer 30 is increased, it is possible to suppress an increase in the sheet resistance value of the ground layer 30. Therefore, by increasing the area of ​​the ground layer 30, the directivity of the antenna layer 20 can be improved. In addition, the ground layer 30 is covered with a light-transmitting cover layer 40. With this configuration, even if the corrosion resistance of the wires 31 and 32 constituting the mesh member is not very high, corrosion of the ground layer 30 can be easily prevented.

[0037] (4) Variations In this embodiment, the multiple openings 33 are formed uniformly throughout the entire ground layer 30. That is, the opening ratio of the ground layer 30 is uniform overall. Here, the opening ratio is the sum of the areas of the openings relative to the unit area of ​​the mesh member. However, the embodiment is not limited to this. In the ground layer 30, the opening ratio of the region overlapping with the antenna layer 20 may be smaller than the opening ratio of the region not overlapping with the antenna layer 20.

[0038] In this case, the sheet resistance value of the region of the ground layer 30 that overlaps with the antenna layer 20 is reduced. Therefore, it is possible to easily enlarge the area of ​​the ground layer 30 while suppressing an increase in the sheet resistance value. As a result, the directivity of the antenna layer 20 can be improved by enlarging the area of ​​the ground layer 30. In addition, since the aperture ratio of the region that does not overlap with the antenna layer 20 is relatively large, the invisibility of the ground layer 30 can be improved.

[0039] 3. Other Embodiments In the first embodiment, the cover layer 40 has an uneven shape that follows the pattern of the mesh member forming the antenna layer 20, but the embodiment is not limited thereto. The cover layer 40 does not have to have an uneven shape that follows the pattern of the mesh member. Figure 16 is a cross-sectional view of the wiring board 100 to illustrate the cover layer 40 in another embodiment. Figure 17 is a partially enlarged cross-sectional view of the communication device 200 to which the wiring board 100 of Figure 16 is attached.

[0040] As shown in Figure 16, in this embodiment, the cover layer 40 includes a plurality of regions 41 and a plurality of regions 42. The plurality of regions 41 each cover a plurality of wires 21, 22 of the mesh member forming the antenna layer 20. The plurality of regions 42 each fill a plurality of openings 23 of the mesh member. Here, the cover layer 40 is formed flat across the plurality of regions 41 and the plurality of regions 42.

[0041] With this configuration, as shown in Figure 17, when bonding the protective layer 150 of the communication device 200 to the cover layer 40 of the wiring board 100, it is not necessary to fill the recesses of the cover layer 40 with the adhesive layer 140. This allows the protective layer 150 to be stably bonded to the cover layer 40 using a thin adhesive layer 140. Furthermore, the flatness between the protective layer 150 and the cover layer 40 can be easily maintained.

[0042] Similarly, in the second embodiment, the cover layer 40 does not have to have an uneven shape that follows the pattern of the mesh member forming the ground layer 30. Similar to the example in Figure 16, in the cover layer 40, a plurality of regions 41 cover a plurality of wires 31, 32 of the mesh member forming the ground layer 30, respectively. A plurality of regions 42 may fill a plurality of openings 33 of the mesh member, respectively. Here, the cover layer 40 may be formed flat across the plurality of regions 41 and the plurality of regions 42.

[0043] With this configuration, when bonding the cover layer 40 of the wiring board 100 to the display 120 of the communication device 200, it is not necessary to fill the recesses of the cover layer 40 with the adhesive layer 130. This allows the cover layer 40 to be stably bonded to the display 120 using a thin adhesive layer 130. Furthermore, the flatness between the cover layer 40 and the display 120 can be easily maintained.

[0044] Furthermore, although the above embodiment includes a cover layer 40 in the wiring board 100, the embodiment is not limited thereto. If the mesh member forming the antenna layer 20 or the ground layer 30 is highly corrosive, the wiring board 100 does not need to include a cover layer 40. For example, if the mesh member is made of gold (Au) wire, the mesh member hardly corrodes. Therefore, the wiring board 100 does not need to include a cover layer 40.

[0045] 4. Examples and Comparative Examples In the following Examples 1 and 2 and Comparative Examples 1 to 3, various wiring boards were designed by simulation. In Example 1, a wiring board according to the first embodiment was designed. That is, the antenna layer of the wiring board was formed with a mesh member, and the ground layer was formed with a conductive film. The mesh member was made of copper wire with a line width of 2 μm. The sheet resistance of the mesh member was set to 0.1 Ω / □. The aperture ratio of the mesh member was set to 95%. The conductive film was formed with ITO. The sheet resistance of the conductive film was set to 50 Ω / □. The thickness of the antenna layer was set to 5 μm, and the thickness of the ground layer was set to 150 μm.

[0046] In Example 2, a wiring board according to the second embodiment was designed. Specifically, the antenna layer of the wiring board was formed from a conductive film, and the ground layer was formed from a mesh member. The structure of the conductive film was the same as that of the conductive film in Example 1. The structure of the mesh member was the same as that of the mesh member in Example 1. Furthermore, in order to match the area of ​​the antenna layer with that of the antenna layer in Example 1, and to match the sheet resistance value of the conductive film with that of the conductive film in Example 1, the thickness of the antenna layer was set to 125 μm. In order to match the area of ​​the ground layer with that of the ground layer in Example 1, and to match the sheet resistance value of the mesh member with that of the mesh member in Example 1, the thickness of the ground layer was set to 6 μm.

[0047] In Comparative Example 1, both the antenna layer and the ground layer of the wiring board were formed from a conductive film. The structure of the conductive film in the antenna layer and the thickness of the antenna layer were the same as those in Example 2. The structure of the conductive film in the ground layer and the thickness of the ground layer were the same as those in Example 1.

[0048] In Comparative Example 2, both the antenna layer and the ground layer of the wiring board were formed using mesh members. The configuration of the mesh members and the thickness of the antenna layer were the same as those of Example 1. The configuration of the mesh members and the thickness of the ground layer were the same as those of Example 2.

[0049] In Comparative Example 3, a wiring board similar to that in Example 2 was designed, except that the wire width of the wire constituting the mesh member was 15 μm instead of 2 μm. The visibility of the wiring boards in Examples 1 and 2 and Comparative Examples 1 to 3 was evaluated. In the evaluation, examples with good visibility were evaluated as "○" and examples with poor visibility were evaluated as "×". The evaluation results are shown in Table 1.

[0050] [Table 1]

[0051] As shown in Table 1, in Example 1, the visibility of the wiring board was good, so it was evaluated as "○". Similarly, in Example 2, the visibility of the wiring board was good, so it was evaluated as "○". On the other hand, in Comparative Example 1, the visibility was reduced because both the thickness of the antenna layer and the ground layer were large. Therefore, it was evaluated as "×". In Comparative Example 2, moiré patterns were generated by the mesh members of the antenna layer and the ground layer, so the visibility was reduced. Therefore, it was evaluated as "×". In Comparative Example 3, the visibility was reduced because the wire width was large. Therefore, it was evaluated as "×".

[0052] From the above comparison results, it was confirmed that the visibility of the wiring board can be improved by forming one of the antenna layer and ground layer with a mesh material and the other with a conductive film, and by making the wire width of the wire material constituting the mesh material less than 15 μm.

[0053] 5. Correspondence between each part of the embodiment and each component of the claim The following describes examples of the correspondence between each component of the claim and each component of the embodiment. Various other elements having the configuration or function described in the claim can also be used as each component of the claim.

[0054] In the above embodiment, the base layer 10 is an example of a base layer, the antenna layer 20 is an example of an antenna layer, the ground layer 30 is an example of a ground layer, and the wires 21, 22, 31, and 32 are examples of wires. The openings 23 and 33 are examples of openings, the wiring board 100 is an example of an antenna wiring board, and the cover layer 40 is an example of a cover layer.

[0055] 6. Summary of Embodiments (Paragraph 1) The antenna wiring board pertaining to Paragraph 1 is, A translucent base layer, An antenna layer formed on one surface of the base layer, The base layer comprises a ground layer formed on the other surface of the base layer, One of the antenna layer and the ground layer is formed by a mesh member having an opening and composed of conductive wires with a line width of 10.0 μm or less. The other of the antenna layer and the ground layer is formed of a light-transmitting conductive film.

[0056] In this antenna wiring board, an antenna layer is formed on one surface of a translucent base layer, and a ground layer is formed on the other surface of the base layer. One of the antenna layer and the ground layer is formed from a mesh member. The other of the antenna layer and the ground layer is formed from a translucent conductive film. With this configuration, moiré patterns do not occur even when the antenna layer and the ground layer are laminated. The wire width of the wires constituting the mesh member is 10.0 μm or less, so it is hardly visible. This improves the visibility of the antenna wiring board.

[0057] (Article 2) In the antenna wiring board described in Article 1, The antenna layer is formed by the conductive film, The ground layer may be formed by the mesh member.

[0058] This configuration makes it possible to suppress the increase in the sheet resistance of the ground layer even when the area of ​​the ground layer is increased. Therefore, by increasing the area of ​​the ground layer, the directivity of the antenna layer can be improved.

[0059] (Article 3) In the antenna wiring board described in Article 1, The antenna layer is formed by the mesh member, The ground layer may be formed by the conductive film.

[0060] In this case, the sheet resistance of the antenna layer can be easily reduced. This allows for an improvement in the gain of the antenna layer.

[0061] (Article 4) The antenna wiring board described in Article 1 or Article 2 is: The system may further include a cover layer that is translucent and covers the layer formed by the mesh member among the antenna layer and the ground layer.

[0062] In this case, corrosion of the layer formed by the mesh member can be easily prevented. [Explanation of Symbols]

[0063] 10…Base layer, 20…Antenna layer, 20A, 30A…Underlayment layer, 20B, 30B…Thin film layer, 20C, 30C…Plating layer, 21, 22, 31, 32…Wire, 23, 33…Aperture, 30…Ground layer, 40…Cover layer, 41, 42…Region, 50…Plating resist layer, 51…Pattern aperture, 100…Wiring board, 110…Housing, 120…Display, 130, 140…Adhesive layer, 150…Protective layer, 200…Communication equipment

Claims

1. A translucent base layer, An antenna layer formed on one surface of the base layer, The base layer comprises a ground layer formed on the other surface of the base layer, One of the antenna layer and the ground layer is formed by a mesh member having an opening and composed of conductive wires with a line width of 10.0 μm or less. An antenna wiring substrate in which the other of the antenna layer and the ground layer is formed of a light-transmitting conductive film.

2. The antenna layer is formed by the conductive film, The antenna wiring board according to claim 1, wherein the ground layer is formed by the mesh member.

3. The antenna layer is formed by the mesh member, The antenna wiring substrate according to claim 1, wherein the ground layer is formed by the conductive film.

4. The antenna wiring board according to claim 1 or 2, further comprising a cover layer that is translucent and covers the layer formed by the mesh member among the antenna layer and the ground layer.

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