Tray device for transporting substrates

Abstract

The present invention provides a substrate transfer tray device that safely transports substrates without the risk of contamination or damage during the transfer process. [Solution] The substrate transfer tray device 10 includes a fixed tray 100 which includes a plate-shaped fixed frame 110 with a shape corresponding to the substrate, and supports the bottom surface of the substrate with a mounting projection 120 so that it is separated from the fixed frame at a certain height, and an inner tray 200 which includes a plate-shaped inner frame 210 corresponding to the substrate, which is coupled to the fixed frame in a state where it is overlapping with the substrate and separated from the substrate, and is lifted by a substrate carrier so that the inner frame is in close contact with the bottom surface of the substrate, separating the substrate from the fixed tray, and is transferred together with the substrate by the substrate carrier.

Description

Technical Field

[0001] The embodiments disclosed in this specification relate to a tray device for substrate transfer. More specifically, the embodiments relate to a tray device that provides a placement site for a substrate and a traction site that enables the placed substrate to be indirectly transferred without direct contact with a substrate carrier.

Background Art

[0002] The four core technologies of the semiconductor industry that have enabled the rapid development of electronic products are semiconductor technology, semiconductor packaging technology, manufacturing process technology, and software technology.

[0003] Semiconductor technology has evolved into various forms such as sub-micron nanometer line widths, over ten million cells, high-speed operation, and a large amount of heat dissipation. However, relatively speaking, there is no technology that can perfectly package this.

[0004] Therefore, the electrical performance of a semiconductor may sometimes be determined by packaging technology and the electrical connections thereby, rather than by the performance of the semiconductor technology itself.

[0005] Recently, attempts have been made to apply a glass substrate (glass core) on an industrial scale as a high-end packaging substrate. Such a glass substrate becomes the subject of a precision inspection regarding quality in the middle of each process in an automated process. Therefore, a procedure for transferring the glass substrate to an optical stage for inspection is frequently required.

[0006] When performing a precision inspection on a sample substrate, conventionally, an operator directly takes out the sample substrate by hand, loads it onto a simple tray, transfers it to an optical stage, and then the operator lifts the sample substrate again and places it on the optical stage, and a precision inspection is performed through an optical device.

[0007] Previously, workers had to transport sample substrates by hand, which resulted in contamination from fingerprints and damage to the glass substrates during the handling process.

[0008] Therefore, in recent years, technologies for automatically transporting substrates have been proposed, such as the substrate transport tray disclosed in Korean Patent Publication No. 10-1318172. The aforementioned related technologies include a frame on which the substrate is mounted, and an adhesive and separation unit provided on the surface of the frame facing the substrate, which adheres to the substrate or separates the adhered substrate, and the substrate is fixed to or separated from the frame by the air pressure of an adhesive pad and an intake / exhaust channel.

[0009] According to such prior art, substrates are fixed to trays in an upright position and transported via adhesive and separation units. However, because the trays must be transported while maintaining the air pressure in the intake and exhaust passages during this process, the implementation of the transport line is complex, resulting in high construction costs.

[0010] Furthermore, the prior art has a problem in that when performing precision inspections of multiple substrates, the substrates must be separated from the tray, placed on an optical stage for inspection, then fixed back onto the tray and moved to their original position before inspecting the next substrate, which increases the inspection process and time.

[0011] Therefore, technologies are needed to solve the aforementioned problems.

[0012] On the other hand, the aforementioned background technology is technical information that the inventor possessed for the purpose of deriving the present invention, or acquired during the process of deriving the present invention, and is not necessarily publicly known technology that was disclosed to the general public before the filing of the present invention. [Overview of the project] [Problems that the invention aims to solve]

[0013] The embodiments disclosed herein aim to provide a substrate transfer tray device that enables the safe transfer of substrates without the risk of contamination or damage to the substrates during the transfer process.

[0014] Furthermore, the embodiments disclosed herein aim to provide a substrate transfer tray device that enables the transfer of substrates without direct contact with a substrate carrier while the substrates are placed on a tray.

[0015] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device that enables safe optical inspection while the substrate is placed on an inner tray.

[0016] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device that can transfer substrates without contact with a substrate carrier, via a fixed tray on which the substrates are placed and an inner tray that separates the substrates from the fixed tray while being raised by a substrate carrier.

[0017] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device that can support a substrate in a state separated from its bottom surface via mounting protrusions provided on a fixed tray, and can separate the substrate from the mounting protrusions and transfer it together with the inner tray by raising an inner tray that overlaps the fixed tray.

[0018] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device that can support the substrate in a fixed position as the inner tray is raised by the substrate carrier, and can prevent the substrate from moving horizontally during the transfer process.

[0019] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device in which the inner tray supports the substrate and prevents damage to the corners of the substrate.

[0020] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device in which the inner tray supports the substrate and prevents warping or bending of the central portion of the substrate.

[0021] Furthermore, the embodiments disclosed herein aim to present a substrate transfer tray device that allows inspection by optical instruments while the substrate is placed on the inner tray, by having the inner tray support the substrate and dummy areas in the outer and central portions rather than the product area. [Means for solving the problem]

[0022] A substrate transfer tray device according to one embodiment may include a fixed tray that includes a plate-shaped fixed frame corresponding to the substrate, and supports the substrate while supporting its bottom surface at a certain height distance from the fixed frame; and an inner tray that includes a plate-shaped inner frame corresponding to the substrate, which is coupled to the fixed frame in a state where it overlaps with the substrate and is separated from the substrate, and is lifted by a substrate carrier so that the inner frame is in close contact with the bottom surface of the substrate, separating the substrate from the fixed tray, and is transferred together with the substrate by the substrate carrier.

[0023] The fixed tray may further include a plurality of mounting protrusions that protrude perpendicularly from the fixed frame and support the substrate in a manner separated from the fixed frame.

[0024] The inner tray may further include a projection holder formed in the inner frame as a groove or hole corresponding to the horizontal cross-section of the aforementioned projection, and which surrounds the outer casing of the aforementioned projection and connects with the aforementioned projection so that the aforementioned projection is exposed upward when the inner tray is coupled to the fixed frame in an overlapping state.

[0025] The placement protrusion can be formed to protrude vertically from the outer contour of the fixed frame and include an outer contour protrusion that supports the outer contour portion of the substrate from below and from the side.

[0026] The outer contour protrusion can include a protrusion body that protrudes vertically from the upper surface of the fixed frame by a predetermined height, and an angle protrusion that protrudes horizontally from a certain height of the protrusion body, forms an angle with the protrusion body, and supports the outer contour portion of the substrate.

[0027] The placement protrusion can further include a central protrusion that is formed to protrude vertically at the center of the fixed frame and supports the central portion of the substrate from below, and the height of the central protrusion can correspond to the height at which the angle protrusion is formed.

[0028] The inner frame is formed in a shape that crosses the center of the inner frame and includes a central support where the protrusion holder is formed. The central support can include a deflection prevention protrusion that protrudes from the upper surface and adheres to the central portion of the bottom surface of the substrate when the inner frame rises to prevent deflection of the substrate.

[0029] The inner tray is formed along the periphery of the substrate in a stepped shape that forms a step on the upper surface of the inner frame. When the inner tray is lifted by the substrate carrier, it can further include a substrate step portion that supports the side surface of the substrate to suppress lateral movement of the substrate.

[0030] The substrate step portion can include a vertical portion that extends vertically from the upper surface of the inner frame and supports the side surface of the substrate, and an inclined portion that extends obliquely from the vertical portion and guides the substrate to the vertical portion when the inner frame rises.

[0031] The inner tray can be formed in a circular shape at the corner portion of the substrate step portion and further include a round portion that separates the corner portion of the substrate from the substrate step portion.

[0032] The inner tray may further include transfer vanes that protrude outward horizontally from the inner frame and are pulled by the substrate carrier when transported by the substrate carrier.

[0033] The transfer vanes can be formed to surround the projection holder, which is coupled to the outer projection, from the outside.

[0034] The substrate may be a semiconductor substrate including a glass layer or a glass core.

[0035] The substrate may be a semiconductor packaging substrate including a glass core. The glass core may include, but is not limited to, plate-shaped glass, and may, for example, be borosilicate glass, aluminosilicate glass, or alkali-free glass.

[0036] The inner tray supports a dummy area of ​​the substrate rather than the product area, allowing inspection of the substrate by optical equipment. [Effects of the Invention]

[0037] By using any one of the means to solve the aforementioned problems, it is possible to present a substrate transfer tray device that enables the safe transfer of substrates without the risk of contamination or damage to the substrates during the transfer process.

[0038] According to any one of the means to solve the aforementioned problems, a substrate transfer tray device can be presented that provides a substrate mounting area through a fixed tray and separates the substrate from the fixed tray through an inner tray that is raised by a substrate carrier, thereby enabling the transfer of substrates without direct contact with the substrate carrier.

[0039] Furthermore, by using any one of the means to solve the aforementioned problems, it is possible to present a substrate transfer tray device that enables safe optical inspection while the substrate is placed on the inner tray.

[0040] Furthermore, according to any one of the means for solving the aforementioned problems, the substrate can be placed on the fixed tray with the mounting protrusions separated from the bottom surface, and the projection holders constituting the inner tray are formed in the shape of grooves or holes, and the mounting protrusions are housed inside the grooves or holes, so a substrate transfer tray device can be presented in which the inner tray can be placed below the substrate with the inner tray overlapping the fixed tray.

[0041] Furthermore, by using any one of the means to solve the aforementioned problems, the side surface of the substrate can be supported via the substrate step provided in the inner tray, thereby preventing the substrate from moving horizontally and thus preventing damage to the substrate due to movement during the substrate transport process.

[0042] Furthermore, according to any one of the means for solving the aforementioned problems, as the inner tray rises, the substrate is guided to the vertical section through the inclined section that constitutes the substrate step, so that the side of the substrate is fixed in place on the vertical section and supported in a state where movement is prevented.

[0043] Furthermore, according to any one of the means for solving the aforementioned problems, the rounded portion formed at the corner of the stepped portion of the substrate separates the corner of the substrate from the stepped portion, thereby preventing damage to the corner of the substrate during the process in which the inner tray supports the substrate.

[0044] Furthermore, according to any one of the means for solving the aforementioned problems, the inner tray supports the outer portion of the substrate via the inner frame and also supports the central portion of the substrate via a deflection-preventing projection formed on the upper surface of the central support, thereby preventing warping and bending of the substrate.

[0045] Furthermore, by using any one of the aforementioned methods to solve the problems, the inner tray supports the substrate and also supports dummy areas in the outer or central part rather than the product area. This allows the substrate to be inspected with optical equipment while it is placed on the inner tray, enabling rapid and precise inspection of the substrate.

[0046] Furthermore, by using any one of the means to solve the aforementioned problems, the configuration of the substrate carrier can be changed as needed to separate only the substrate from the tray device, or to separate the substrate together with the inner tray while it is still placed on it.

[0047] The effects obtained from the disclosed embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by a person skilled in the art to which the disclosed embodiments belong from the following description. [Brief explanation of the drawing]

[0048] [Figure 1] This is an exploded perspective view showing the overall configuration of a substrate transfer tray device according to one embodiment. [Figure 2] This is a perspective view showing the state in which the fixed tray and inner tray, which constitute a substrate transfer tray device according to one embodiment, are coupled together. [Figure 3] This is a perspective view showing a substrate being transferred to and placed on a substrate transfer tray device according to one embodiment. [Figure 4] This is an enlarged view showing the stepped portion of the circuit board formed on the inner tray. [Figure 5] This is a perspective view showing a state in which a substrate placed on a substrate transfer tray device according to one embodiment is being transferred together with an inner tray. [Best Mode for Carrying Out the Invention]

[0049] Hereinafter, various embodiments will be described in detail with reference to the attached drawings. The embodiments described below can also be implemented in various different forms. In order to more clearly describe the characteristics of the embodiments, detailed explanations of matters that are commonly known to those who have ordinary skill in the art to which the embodiments belong will be omitted. Furthermore, in the drawings, parts that are not related to the description of the embodiments will be omitted, and similar parts throughout the specification will be denoted by similar reference numerals.

[0050] Throughout the specification, the expression “these combinations” as used in the Markush Group refers to a mixture or combination that includes at least one of the elements listed in the Group.

[0051] Throughout this specification, the terms "First," "Second," "A," "B," or similar expressions are used to distinguish elements having the same name from one another. Furthermore, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0052] Throughout the specification, the expression "~system" shall be interpreted as referring to an element that includes the referenced element or its derivatives.

[0053] The expression used herein, "B is placed on A," includes both the case where B is placed on A with space between them and the case where B is placed directly on A, and is not interpreted as being limited to B being placed directly on the surface of A.

[0054] When one configuration is said to be "linked" to another, this includes not only cases where they are "directly linked," but also cases where they are "linked through other configurations." Furthermore, when one configuration is said to "contain" another configuration, this does not exclude any other configurations unless otherwise stated, and means that it may contain even more configurations.

[0055] The embodiments will be described in detail below with reference to the attached drawings.

[0056] Figure 1 is an exploded perspective view showing the overall configuration of a substrate transfer tray device according to one embodiment; Figure 2 is a perspective view showing the fixed tray and inner tray of the substrate transfer tray device according to one embodiment in a combined state; Figure 3 is a perspective view showing a substrate being transferred to and placed on the substrate transfer tray device according to one embodiment; Figure 4 is an enlarged view showing the substrate step formed on the inner tray; and Figure 5 is a perspective view showing a substrate placed on the substrate transfer tray device according to one embodiment being transferred together with the inner tray.

[0057] A substrate transfer tray device 10 according to one embodiment is a device that allows a substrate 1 to be placed on it and enables the substrate 1 to be transported by a substrate carrier without direct contact with the substrate carrier.

[0058] Here, the substrate carrier may be, for example, a first substrate carrier 5a that takes the substrate 1 from the manufacturing line and places it on the fixed tray 100, as shown in Figure 3, or a second substrate carrier 5b that lifts the inner tray 200 together with the substrate 1 and transfers it to the inspection stage, as shown in Figure 5.

[0059] Furthermore, the first substrate carrier 5a is set so that the pair of forks are narrower than the substrate 1, allowing the substrate 1 to be directly lifted and transported, while the second substrate carrier 5b is set so that the pair of forks are wider than the substrate 1, allowing the inner tray 200 (described later) to be lifted and the substrate 1 to be transported together with the inner tray 200.

[0060] A substrate transfer tray device 10 according to one embodiment may be broadly configured to include a fixed tray 100 and an inner tray 200, as shown in Figure 1.

[0061] The fixed tray 100 is a component that supports and places the substrate 1, which is transported by the first substrate carrier 5a, at a certain height distance from the fixed frame 110 that forms the body of the fixed tray 100. The fixed tray 100 may be composed of a fixed frame 110 that is plate-shaped and corresponds to the shape of the substrate 1, and as shown in Figure 3, the bottom surface of the substrate 1 can be supported and placed on the fixed frame 110 at a certain height distance.

[0062] For example, one substrate 1, which is removed by the first substrate carrier 5a for quality inspection during the glass substrate manufacturing process, can be transported and placed on such a fixed tray 100.

[0063] Specifically, the fixed tray 100 may be configured to include a fixed frame 110 and a mounting projection 120, as shown in Figure 1.

[0064] The fixed frame 110 is manufactured in a plate shape corresponding to the substrate 1 and forms the bottom surface of the tray device 10, and can have a shape and size corresponding to the substrate 1. For example, the fixed frame 110 may be manufactured as a grid-like frame that is plate-shaped with a size corresponding to the substrate 1 and a certain area larger than the substrate 1.

[0065] Such a fixed frame 110 is preferably made of a rigid metal material, but is not limited to this, and may be made of a synthetic resin material such as reinforced plastic or a wood material.

[0066] The mounting projection 120 is formed to protrude vertically from the fixed frame 110 and is a component for supporting the substrate 1 in a state separated from the fixed frame 110.

[0067] Multiple such mounting protrusions 120 are provided and protrude from the fixed frame 110 at a certain height, allowing the substrate 1 to be mounted at a certain height away from the fixed frame 110. Furthermore, the mounting protrusions 120 can be inserted through the inner frame 210 which forms the inner tray 200 (described later), so that the inner tray 200 can be connected to the fixed tray 100 at a fixed position.

[0068] Here, the mounting projection 120 may be manufactured to form the same body as the fixing frame 110, and depending on the embodiment, it may be fixed to the fixing frame 110 via a separate fixing member such as a fixing bolt.

[0069] The inner tray 200 may include a plate-shaped inner frame 210 corresponding to the substrate 1, and can be coupled to the fixed frame 110 in a state where it overlaps with the substrate 1, thus being separated from the substrate 1.

[0070] In other words, the inner frame 210 is connected to the fixed frame 110 in a state where it overlaps with the substrate 1 before the substrate 1 is placed on the mounting protrusion 120, so that when the substrate 1 is placed on the mounting protrusion 120, the inner frame 210 can be separated from the substrate 1.

[0071] Furthermore, after the substrate 1 is placed on the mounting projection 120, the inner frame 210 can be lifted by the second substrate carrier 5b described above, making close contact with the bottom surface of the substrate 1 and separating the substrate 1 from the fixed tray 100, and then transported together with the substrate 1 by the second substrate carrier 5b.

[0072] Such an inner frame 210 is preferably made of a rigid metal material, but is not limited to this, and may be made of a synthetic resin material such as reinforced plastic or a wood material.

[0073] On the other hand, the inner tray 200 may further include a projection holder 220.

[0074] The projection holder 220 is configured to connect with the mounting projection 120 while surrounding its outer casing, so that when the inner tray 200 is joined to the fixed frame 110 in a state where it is overlapping the fixed frame 110, the mounting projection 120 of the fixed tray 100 is exposed upwards.

[0075] In other words, the projection holder 220 is formed in the shape of a groove or hole corresponding to the horizontal cross-section (transverse plane) of the mounting projection 120, and as the inner tray 200 is joined onto the fixed frame 110, it is fitted onto the mounting projection 120 as shown in Figure 2, thereby exposing the mounting projection 120 in an upward-projecting state.

[0076] Therefore, the inner frame 210 can be fitted onto the mounting projection 120 via the projection holder 220 and overlap the fixed frame 110, and as shown in Figure 5, it can be raised by the second substrate carrier 5b, making close contact with the substrate 1 and transported together with the substrate 1.

[0077] On the other hand, the mounting projection 120 may be composed of an outer projection 121 and a central projection 122.

[0078] The outer projection 121 is formed to protrude vertically from the outer portion of the fixed frame 110 and is configured to support the outer portion of the substrate 1 from below and from the side.

[0079] Such an outer projection 121 may be composed of a projection body 121a and an angle projection 121b.

[0080] The projection body 121a protrudes vertically from the upper surface of the fixed frame 110 at a certain height, and together with the angle projection 121b described later, forms an angle shape, supporting the substrate 1 at a certain height.

[0081] The projection body 121a may be manufactured integrally with the fixing frame 110, or alternatively, it may be fixed to the fixing frame 110 via a separate fixing member.

[0082] The angle projection 121b protrudes horizontally from a certain height above the projection body 121a, forming an angle shape together with the projection body 121a, and can support the outer casing of the substrate 1.

[0083] As a result, the substrate 1 can be supported upward while separated from the fixed frame 110 by having its outer casing rest on the angle projection 121b, and can be mounted in a state where horizontal movement is suppressed by having the side surface of the outer casing supported by the projection body 121a.

[0084] On the other hand, the central projection 122 is formed to protrude vertically from the central portion of the fixed frame 110, and can support the central portion of the substrate 1 from below. Here, the height of the central projection 122 can be the same as the height at which the angle projection 121b is formed.

[0085] As a result, the substrate 1 can be transported by the first substrate carrier 5a and placed on the outer projection 121, as shown in Figure 3, thereby being placed in a state separated from the fixed frame 110, and with its central portion supported by the central projection 122, it can be placed without downward bending or warping.

[0086] On the other hand, although not shown in the figures, in some embodiments, patches made of elastic material may be attached to the tip of the central projection 122 and the upper surface of the angle projection 121b, in order to prevent impact on the substrate 1, as these surfaces come into direct contact with the substrate 1.

[0087] On the other hand, the inner frame 210 may include a central support 250. The central support 250 can be formed in a shape that crosses the center of the inner frame 210 to provide support, and the aforementioned projection holder 220 may be formed on it and coupled to the central projection 122 of the mounting projection 120.

[0088] Here, the projection holder 220 formed on the inner frame 210 may be formed in a groove shape and connected to the outer projection 121 according to the embodiment, and the projection holder 220 formed on the central support 250 may be formed in a hole shape and connected to the central projection 122 according to the embodiment.

[0089] On the other hand, a deflection prevention projection 260 is formed protruding from the upper surface of the central support 250, and by making close contact with the central part of the bottom surface of the substrate 1 when the inner frame 210 rises, it is possible to prevent the central part of the substrate 1 from bending or warping.

[0090] Furthermore, the inner tray 200 may include a plurality of transfer vanes 270 that project outward horizontally from the inner frame 210. The transfer vanes 270 are formed to project horizontally from the outer casing of the inner frame 210 so that the inner frame 210 can be lifted by the second substrate carrier 5b, and can be pulled by the second substrate carrier 5b as shown in Figure 5. In this case, the transfer vanes 270 may be formed to surround from the outside a projection holder 220 that is coupled with the aforementioned outer casing projection 121.

[0091] On the other hand, a locking step 271 is formed on the bottom surface of the transfer blade 270, so that it can be locked onto the fork of the second substrate carrier 5b and lifted up and transported without moving horizontally.

[0092] As a result, the inner frame 210 rises on the second substrate carrier 5b coupled to the transfer vane 270 and makes close contact with the bottom surface of the substrate 1, and the central support 250 rises together with the inner frame 210 and makes close contact with the central part of the substrate 1, thereby raising and transporting the substrate 1.

[0093] On the other hand, the inner tray 200 may be configured to further include a substrate step portion 230, as shown in Figure 4.

[0094] The stepped substrate portion 230 is a component that supports both the bottom and side surfaces of the substrate 1 when the inner frame 210 rises on the second substrate carrier 5b and comes into close contact with the substrate 1, thereby suppressing the horizontal movement of the substrate 1.

[0095] Such a stepped substrate portion 230 can be formed on the upper surface of the inner frame 210 in a stepped shape along the perimeter of the substrate 1, and by supporting the outer bottom surface and sides of the substrate 1 when the inner tray 200 is raised by the second substrate carrier 5b, it is possible to suppress the substrate 1 from moving horizontally.

[0096] Specifically, the stepped portion 230 of the substrate may be configured to include a vertical portion 231 and an inclined portion 232, as shown in an enlarged view in Figure 4.

[0097] The vertical portion 231 is a part that directly supports the side surface of the substrate 1 when the inner frame 210 is in close contact with the bottom surface of the substrate 1. It extends vertically from the upper surface of the inner frame 210 and supports the side surface of the substrate 1 by forming a stepped portion on the outer edge of the contact area of ​​the substrate 1.

[0098] The inclined portion 232 is designed to guide the substrate 1 to the vertical portion 231 and position it in place when the inner frame 210 rises. It extends in a flared shape from the upper end of the vertical portion 231, and by guiding the substrate 1 along the inclined surface, it prevents damage to the substrate 1 and allows it to be positioned in place while being supported by the vertical portion 231.

[0099] On the other hand, rounded portions 240 can be formed at the corners of the stepped portions 230 of the substrate.

[0100] The rounded portion 240 is intended to prevent damage to the corner portion of the substrate 1 that is in close contact with the stepped portion 230 on its side. As shown in Figure 4, by being formed in a circular shape on the corner portion of the stepped portion 230, the horizontal and vertical portions of the stepped portion 230 can be separated from each other.

[0101] As a result, when the substrate 1 comes into close contact with the stepped portion 230, the corner portion is positioned on the rounded portion 240, preventing the corner portion from coming into close contact with the stepped portion 230, thus preventing damage to the corner portion.

[0102] In other words, when the second substrate carrier 5b lifts the inner tray 200, it supports the outer portion of the substrate 1 via the inner frame 210, supports the central portion of the substrate 1 via the deflection prevention projection 260 protruding from the central support 250, and supports the sides of the substrate 1 via the substrate step portion 230, thereby enabling the transport of the substrate 1.

[0103] Here, the inner tray 200, by being a frame-shaped structure, supports a dummy area such as an outer casing rather than the product area of ​​the substrate 1, thereby allowing light transmission. Through this, if the substrate 1 is made of a semiconductor substrate made of glass material, inspection of the substrate 1 by optical equipment can be permitted even while the substrate 1 is being supported.

[0104] The operation and function of a substrate transfer tray device 10 according to one embodiment, which includes the components described above, will be explained using the glass substrate inspection process as an example.

[0105] During the process of the inner tray 200 connecting to the fixed tray 100, the mounting protrusions 120 of the fixed tray 100 pass through the protrusion holders 220 of the inner tray 200, and the inner tray 200 aligns with the fixed position on the fixed frame 110.

[0106] When inspecting a substrate 1, the first substrate carrier 5a takes one substrate 1 from the substrate 1 manufacturing line, transports it, and places it on the mounting protrusion 120 of the fixed tray 100. At this time, the first substrate carrier 5a transports the substrates 1 horizontally arranged on the forks, and then slowly descends, positioning the substrates 1 on the mounting protrusion 120 exposed on the fixed tray 100, which has the inner trays 200 stacked on top of it.

[0107] Then, once the substrate 1 is placed in its designated position, the first substrate carrier 5a descends further and separates from the substrate 1, retracting through the separation space between the inner tray 200 and the mounting projection 120.

[0108] As a result, the substrate 1 can be placed on the outer projection 121, thereby being separated from the inner tray 200, and its central portion is supported by the central projection 122, so that it can be placed without bending or warping downwards. Furthermore, the substrate 1 can be placed with its outer portion resting on the angle projection 121b, and the sides of the outer portion being supported by the projection body 121a, so that horizontal movement is suppressed.

[0109] On the other hand, when attempting to transport the substrate 1 together with the inner tray 200, the second substrate carrier 5b slowly rises from below the inner tray 200, lifting the inner tray 200 and separating the substrate 1 from the fixed tray 100, and then transports the inner tray 200 together with the substrate 1 to the inspection stage.

[0110] At this time, the second substrate carrier 5b pulls the transfer vanes 270 to raise the inner frame 210, bringing the inner frame 210 into close contact with the bottom surface of the substrate 1. In this process, the stepped substrate portion 230 guides the substrate 1 to the vertical portion 231 via the inclined portion 232, positioning it in a fixed position and bringing it into close contact with the substrate, while the deflection prevention projection 260 of the central support 250 pushes up and supports the central portion of the substrate 1.

[0111] As a result, the substrate 1, supported by the inner tray 200, can be separated from the fixed tray 100 while rising together with the inner tray 200, and then transported to the inspection stage by the second substrate carrier 5b to perform the inspection process.

[0112] In this case, the substrate 1 is supported by the inner tray 200, with a dummy area rather than the product area being supported, allowing the inspection process to be performed via optical equipment while the substrate 1 is supported by the inner tray 200.

[0113] In this case, the shapes of the first substrate carrier 5a and the second substrate carrier 5b are merely illustrative, and they may be formed in other shapes. For example, the second substrate carrier 5b can be lifted by gripping it from above and below without pulling the transfer vane 270 from below.

[0114] As described above, the substrate transfer tray device 10 according to one embodiment places the substrate 1 on a fixed tray 100, but separates the substrate 1 from the fixed tray 100 via an inner tray 200 that is raised by the second substrate carrier 5b. Therefore, by transferring the substrate 1 without direct contact with the second substrate carrier 5b, damage can be prevented and inspection can be performed quickly.

[0115] The embodiments described above are illustrative, and those with ordinary skill in the art to which the embodiments belong will understand that they can be easily modified into other specific forms without altering the technical ideas or essential features of the embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

[0116] The scope of protection sought by this specification shall be determined by the claims set forth below rather than by the detailed description herein, and shall be interpreted to include the meaning and scope of the claims and all modified or altered forms derived therefrom from the concept of equivalents. [Explanation of symbols]

[0117] 10. Tray device for substrate transfer 100 Fixed Trays 110 Fixed Frame 120 Mounting protrusion 121 Outer projection 121a Protruding body 121b Angular protrusion 122 Central projection 200 Inner Tray 210 Inner Frame 220 Protrusion Holder 230 PCB Step Section 231 Vertical section 232 Slope 240 Round Section 250 Central Support 260 Anti-flexing protrusions 270 Transfer blades

Claims

1. A tray device for transporting substrates, A fixing tray includes a plate-shaped fixing frame corresponding to the shape of the substrate, and supports the substrate while its bottom surface is separated from the fixing frame by a certain height. A tray device for transporting substrates, comprising an inner tray which includes a plate-shaped inner frame corresponding to the substrate, is coupled to the fixed frame in a state overlapping with the substrate and separated from the substrate, and is lifted by a substrate carrier, the inner frame making close contact with the bottom surface of the substrate to separate the substrate from the fixed tray, and the inner tray which is transported together with the substrate by the substrate carrier.

2. The aforementioned fixed tray is The substrate transfer tray device according to claim 1, further comprising a plurality of mounting protrusions formed to protrude perpendicularly from the fixed frame and supporting the substrate in a state separated from the fixed frame.

3. The substrate transfer tray device according to claim 2, wherein the inner tray further includes a projection holder formed in the inner frame as a groove or hole corresponding to the horizontal cross-section of the projection described above, and which surrounds the outer casing of the projection described above and connects with the projection described above so that the projection is exposed upward when the inner tray is coupled to the fixed frame in an overlapping state.

4. The aforementioned mounting projection is The substrate transfer tray device according to claim 3, further comprising an outer projection formed to protrude vertically from the outer casing of the fixed frame, which supports the outer casing portion of the substrate from below and the side.

5. The aforementioned outer projection is, A projection body that protrudes vertically from the upper surface of the fixed frame to a predetermined height, The substrate transfer tray device according to claim 4, further comprising an angle projection that protrudes horizontally from a certain height from the projection body and, together with the projection body, forms an angle shape and supports the outer casing of the substrate.

6. The aforementioned mounting projection is The fixed frame further includes a central projection that protrudes vertically from the center and supports the central portion of the substrate from below, The height of the aforementioned central projection is, A substrate transfer tray device according to claim 5, corresponding to the height at which the angle projection is formed.

7. The aforementioned inner frame is It includes a central support formed in a shape that crosses the center of the inner frame, and on which the projection holder is formed, The aforementioned central support is A tray device for transporting substrates according to claim 3, comprising a deflection prevention projection formed to protrude from the upper surface, which adheres closely to the central portion of the bottom surface of the substrate when the inner frame rises to prevent the substrate from bending.

8. The aforementioned inner tray is The substrate transfer tray device according to claim 1, further comprising a substrate step portion formed in a stepped manner along the periphery of the substrate on the upper surface of the inner frame, which supports the side surface of the substrate and suppresses horizontal movement of the substrate when the inner tray is raised by the substrate carrier.

9. The aforementioned substrate step portion is A vertical portion extending vertically from the upper surface of the inner frame and supporting the side surface of the substrate, A substrate transfer tray device according to claim 8, further comprising an inclined portion extending inclined from the vertical portion and guiding the substrate to the vertical portion when the inner frame rises.

10. The aforementioned inner tray is The substrate transfer tray device according to claim 8, further comprising a rounded portion formed in a circular shape at the corner of the stepped portion of the substrate, which separates the corner of the substrate from the stepped portion of the substrate.

11. The aforementioned inner tray is The substrate transfer tray device according to claim 4, further comprising a transfer vane formed to protrude outward horizontally from the inner frame and to be pulled by the substrate carrier when the substrate is transferred by the substrate carrier.

12. The aforementioned transfer blades are A substrate transfer tray device according to claim 11, wherein the projection holder, which is coupled to the outer projection, is formed to surround the projection holder from the outside.

13. The substrate is a glass core, or a semiconductor packaging substrate including a glass core. The aforementioned inner tray is A substrate transfer tray device according to claim 1, which supports a dummy area rather than a product area within the region of the substrate, and allows inspection of the substrate by an optical instrument.

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