Imaging device

Abstract

To provide an imaging device that easily achieves both heat dissipation and design aesthetics. [Solution] The imaging device (2) comprises a heat source (H), a heat dissipation mechanism (10) for dissipating heat from the heat source (H), and a main body (4) to which the heat source (H) and the heat dissipation mechanism (10) are attached, with the heat dissipation mechanism (10) being located on the outer periphery of the main body (4).

Description

Technical Field

[0001] The present disclosure relates to an imaging device that images a subject.

Background Art

[0002] Patent Document 1 discloses an imaging device that images a subject. The imaging device of Patent Document 1 has heat sources such as an image sensor and an image engine, and various heat dissipation mechanisms for dissipating the heat generated from these heat sources have been proposed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] With the recent trend of higher image quality and higher performance, and the increasing popularity of video applications, the heat generated by heat sources such as image sensors and image engines has also been showing a significant increasing trend. Since the operation stop of the imaging device due to overheating is likely to become a problem, various components such as heat sinks and fans are required for a heat dissipation mechanism that can dissipate a large amount of heat, and the imaging device is likely to become larger in size, which may damage the design. It can be said that there is room for improvement in achieving both heat dissipation performance and design in an imaging device having various heat sources.

[0005] The present disclosure provides an imaging device that can easily achieve both heat dissipation performance and design.

Means for Solving the Problems

[0006] The imaging device according to the present disclosure includes a heat source, a heat dissipation mechanism for dissipating the heat of the heat source, and a main body portion to which the heat source and the heat dissipation mechanism are attached, and the heat dissipation mechanism is disposed on an outer peripheral portion of the main body portion.

Effects of the Invention

[0007] The imaging device described herein makes it easier to achieve both heat dissipation and aesthetic design. [Brief explanation of the drawing]

[0008] [Figure 1] Perspective view of the imaging device according to Embodiment 1 of this disclosure [Figure 2] Perspective view of the imaging device according to Embodiment 1 [Figure 3] Perspective view showing the internal configuration of the imaging unit and grip unit according to Embodiment 1 [Figure 4] Exploded perspective view showing the internal configuration of the imaging unit and grip unit according to Embodiment 1. [Figure 5] Side view showing the heat source and heat dissipation mechanism according to Embodiment 1 [Figure 6] Perspective view showing the heat source and heat dissipation mechanism according to Embodiment 1 [Figure 7] Perspective view of the duct section according to Embodiment 1 [Figure 8] Perspective view of the duct section according to Embodiment 1 [Figure 9] Exploded perspective view of the duct section according to Embodiment 1 [Figure 10] Exploded perspective view of the duct section according to Embodiment 1 [Figure 11] Perspective view of the heatsink and fan according to Embodiment 1, viewed from below. [Figure 12] Perspective view showing the peripheral configuration of the first heat transfer member according to Embodiment 1. [Figure 13] Perspective view showing the peripheral configuration of the first heat transfer member according to Embodiment 1. [Figure 14] Perspective view showing the first heat transfer member according to Embodiment 1 [Figure 15] Perspective view showing the first heat transfer member according to Embodiment 1 [Figure 16] Perspective view of the tracking portion of the first heat transfer member according to Embodiment 1, viewed from the front. [Figure 17] Perspective view showing the peripheral configuration of the second heat transfer member according to Embodiment 1. [Figure 18] Perspective view showing the peripheral configuration of the second heat transfer member according to Embodiment 1 [Figure 19] Perspective view showing the peripheral configuration of the EVF unit according to Embodiment 1 [Figure 20] Perspective view showing the peripheral configuration of the EVF unit according to Embodiment 1 [Figure 21] Perspective view showing the peripheral configuration of the EVF unit according to Embodiment 1 [Figure 22] Side view schematically showing the layout of the imaging device according to Embodiment 1 [Figure 23] Perspective view schematically showing the layout of the imaging device according to Embodiment 1 [Figure 24] Perspective view showing the imaging device according to Modification 1 of Embodiment 1 [Figure 25] Perspective view showing the imaging device according to Modification 1 of Embodiment 1 [Figure 26] Perspective view showing the imaging device according to Modification 1 of Embodiment 1 [Figure 27] Perspective view showing the imaging device according to Modification 2 of Embodiment 1 [Figure 28] Perspective view showing the imaging device according to Modification 2 of Embodiment 1 [Figure 29] Perspective view showing the imaging device according to Modification 3 of Embodiment 1 [Figure 30] Perspective view showing the imaging device according to Modification 3 of Embodiment 1 [Figure 31] Perspective view showing the imaging device according to Modification 4 of Embodiment 1 [Figure 32] Perspective view showing the imaging device according to Modification 4 of Embodiment 1 [Figure 33] Perspective view showing the imaging device according to Embodiment 2 [Figure 34] Perspective view showing the imaging device according to Embodiment 2 [Figure 35] Perspective view schematically showing the layout of the imaging device according to Embodiment 2 [Figure 36] Perspective view showing the imaging device according to the modification of Embodiment 2

Mode for Carrying Out the Invention

[0009] The embodiments will be described in detail below, with reference to the drawings as appropriate. However, unnecessary details may be omitted. For example, detailed explanations of already well-known matters or redundant explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily verbose and to facilitate understanding by those skilled in the art. The inventors provide the accompanying drawings and the following explanation so that those skilled in the art can fully understand this disclosure, and do not intend to limit the subject matter described in the claims by means of these.

[0010] (Embodiment 1) Embodiment 1 describes a digital camera as an example of an imaging device according to this disclosure.

[0011] The configuration of the imaging device 2 according to Embodiment 1 will be described with reference to Figures 1 and 2. Hereafter, the left-right direction as seen from the user using the imaging device 2 will be defined as the X-axis direction, the front-back direction as the Y-axis direction, and the up-down direction as the Z-axis direction. Terms indicating directions such as "up," "down," "front," "back," "left," and "right" will be used, but this does not mean that the usage state of the imaging device of this disclosure is limited.

[0012] Figures 1 and 2 are schematic perspective views of the imaging device 2 according to Embodiment 1. The imaging device 2 shown in Figures 1 and 2 comprises an imaging main unit 4 and a grip unit 6.

[0013] The imaging unit 4 is the part used to image a subject using a lens (not shown). The imaging unit 4 incorporates various components such as an image sensor and an image engine, which will be described later, and images a subject (not shown) located in front of it, along the optical axis L, in the imaging direction A (Y-axis direction).

[0014] The grip portion 6 is the part for the user to grasp the imaging device 2. The grip portion 6 is located laterally (on the right side in Embodiment 1) relative to the main body 4. A release button 16 is provided on the upper surface of the grip portion 6. A gyro sensor 84 (Figure 23), which will be described later, is built into the grip portion 6. In Embodiment 1, the grip portion 6 is integrally formed with the imaging main body 4, but it may be detachable.

[0015] As shown in Figures 1 and 2, the imaging unit 4 comprises a lens cap 8 (Figure 1), a heat dissipation mechanism 10, an EVF unit 12, and a monitor unit 14 (Figure 2).

[0016] The lens cap 8 is a component that covers the lens mounting section (not shown) for attaching interchangeable lenses. Various lenses can be attached to the lens mounting section covered by the lens cap 8. The heat dissipation mechanism 10 is a mechanism for dissipating heat from heat sources such as the image sensor and image engine built into the imaging body 4. In Embodiment 1, the heat dissipation mechanism 10 is located in the upper center of the imaging body 4 (directly above the optical axis L), and is positioned on the front side, corresponding to the so-called "penta" section. The detailed configuration of the heat dissipation mechanism 10 will be described later.

[0017] The EVF (Electronic View Finder) unit 12 is a unit that displays the image (through image) being captured by the imaging device 2 within the viewfinder. The monitor unit 14 shown in Figure 2 is a monitor that displays the image (through image) being captured by the imaging device 2. The monitor unit 14 can be rotated using a vari-angle mechanism.

[0018] Figure 3 is a perspective view showing the internal structure of the imaging unit 4 and the grip unit 6, and Figure 4 is an exploded perspective view thereof. In Figures 3 and 4, only the necessary components are shown, and other components are omitted from the illustration.

[0019] As shown in Figures 3 and 4, the imaging unit 4 and the grip unit 6 comprise a front case 18, a rear case 20, and a top case 22. The front case 18 is positioned at the front, the rear case 20 at the rear, and the top case 22 at the top. The front case 18, rear case 20, and top case 22 are fixed to each other by screws.

[0020] As shown in Figure 4, the heat source H is attached to the front case 18. The heat dissipation mechanism 10 for dissipating heat from the heat source H is connected to the heat source H, and some components of the heat dissipation mechanism 10 are located inside the top case 22. The heat source H and the heat dissipation mechanism 10 will be explained with reference to Figures 5 and 6.

[0021] Figures 5 and 6 are side views and perspective views, respectively, showing the heat source H and the heat dissipation mechanism 10.

[0022] As shown in Figure 5, the heat source H includes an image sensor 24 and an image engine 26.

[0023] The image sensor 24 is an element that captures an image of a subject incident through a lens and generates image data (RAW data). The image sensor 24 is, for example, a CMOS image sensor. The image sensor 24 has a plate-like shape and a main surface 24A. The optical axis L extends perpendicularly to the main surface 24A, and the optical axis L extends in the front-to-back direction (Y-axis direction), which is the thickness direction of the imaging device 2. The image sensor 24 is located in front of the image engine 26.

[0024] The image engine 26 is a component for generating and outputting processed data by performing various processes on the image data generated by the image sensor 24. The image engine 26 includes a processor and electronic circuits for processing the image data. The image engine 26 has a plate-like shape, similar to the image sensor 24, and has a main surface 26A. The main surface 26A extends in a direction perpendicular to the optical axis L (XZ plane), similar to the main surface 24A of the image sensor 24.

[0025] As shown in Figure 5, the image sensor 24 and the image engine 26 are positioned with their main surfaces 24A and 26A facing each other along the optical axis L, and spaced apart front to back.

[0026] The image sensor 24 is mounted on a sensor substrate 28. The sensor substrate 28 is a substrate for mounting and supporting the image sensor 24 and has a plate-like shape. The sensor substrate 28 is supported by a sensor holder 29 attached to the front case 18. The sensor substrate 28 and sensor holder 29 are supported in a movable state inside the imaging main unit 4 and are driven in the XZ plane during BIS (Body Image Stabilization) control for correcting camera shake. The sensor substrate 28 and sensor holder 29 are supported so as to be movable in the XZ direction by steel balls, which are highly rigid members, while being attracted by magnetic force.

[0027] The image engine 26 is mounted on the main board 30. The main board 30 is a board that stores programs and other information for controlling the operation of the imaging device 2, and mounts and supports the image engine 26. The main board 30 has a plate-like shape and is fixed to a main frame (not shown) fastened to the front case 18.

[0028] The heat dissipation mechanism 10 includes a heat sink 32, a fan 33, a first heat transfer member 34, and a second heat transfer member 36 as components for dissipating the heat generated by the image sensor 24 and image engine 26, which act as heat sources H.

[0029] The heat sink 32 is a component for storing and dissipating heat from a heat source H that is transferred via heat transfer members 34 and 36. The heat sink 32 has a plurality of heat dissipation fins 38. The heat dissipation fins 38 are a plurality of plate-shaped members that are spaced apart from each other and are positioned opposite the fan 33. A recess 40 for positioning the fan 33 is formed in the center of the heat sink 32.

[0030] The fan 33 is a component that dissipates heat from the heat sink 32 to the outside by blowing air onto the inner surface of the heat sink 32, including the heat dissipation fins 38. The fan 33 and the heat sink 32 constitute a duct section 11 that performs intake and exhaust. In Figures 5 and 6, a part of the duct section 11 is omitted from the illustration, and the configuration of the duct section 11 will be explained using Figures 7 to 11.

[0031] Figures 7 and 8 are perspective views of the duct section 11, respectively, Figures 9 and 10 are exploded perspective views of the duct section 11, respectively, and Figure 11 is a perspective view of the heat sink 32 and fan 33 that constitute the duct section 11, viewed from below.

[0032] As shown in Figures 7 and 8, the duct section 11 comprises an intake cover 41 and two exhaust covers 45 and 47. The intake cover 41 is a component that forms an intake port 42, and the exhaust covers 45 and 47 are components that form exhaust ports 46 and 48, respectively. The intake port 42 is an opening for drawing in air by driving the fan 33, and the exhaust ports 46 and 48 are openings for expelling air. The intake port 42 and the exhaust covers 45 and 47 are each composed of multiple openings. In Embodiment 1, the intake port 42 opens upward, and the exhaust ports 46 and 48 open to the left and right (see Figures 1 and 2).

[0033] The intake cover 41 and the exhaust covers 45 and 47 are all attached to the heatsink 32. With the fan 33 shown in Figures 9 and 10 positioned in the recess 40 of the heatsink 32, the intake cover 41 is attached to the top of the heatsink 32, and the exhaust covers 45 and 47 are attached to the sides of the heatsink 32 so as to cover the opening 43 of the heatsink 32.

[0034] When the fan 33 is driven, air is drawn in through the intake port 42 which opens upward (arrow C in Figures 7 and 8), and exhausted through the exhaust ports 46 and 48 which open to the left and right (arrows D1 and D2). As air flows from the intake port 42 to the exhaust ports 46 and 48, the air comes into contact with the inner surface of the heat sink 32, including the heat dissipation fins 38, thereby dissipating the heat from the heat source H that has been transferred to the heat dissipation fins 38 to the outside of the imaging device 2.

[0035] In Embodiment 1, an axial flow fan is used as the fan 33. As shown in Figures 9 to 11, the fan 33 as an axial flow fan has an intake port 50 on its front side and an outlet port 52 (Figure 11) on its back side. As shown in Figure 11, the fan 33 has a plurality of blades 53, and as the blades 53 rotate around a rotation axis E that extends in the Z-axis direction, air is drawn in from the intake port 50 of the fan 33 (arrow C1) and blown out from the outlet port 52 (arrow C2). The fan 33 as an axial flow fan draws in and exhausts air in the direction along the rotation axis E (arrows C1, C2). Figures 9 to 11 schematically show the shapes of the intake port 50, the outlet port 52 and the blades 53.

[0036] When the fan 33 is placed in the recess 40, the outlet 52 of the fan 33 is positioned to face the heat sink 32's heat dissipation fins 38. The air blown out from the fan 33's outlet 52 directly hits the heat dissipation fins 38. This creates airflow inside the heat sink 32, allowing the air to circulate throughout and efficiently dissipate the heat collected on the heat dissipation fins 38.

[0037] Returning to Figures 5 and 6, the first heat transfer member 34 is a member that transfers heat from the image sensor 24 to the heat sink 32. The second heat transfer member 36 is a member that transfers heat from the image engine 26 to the heat sink 32.

[0038] Both heat transfer members 34 and 36 extend upward from the heat source H (arrow B) and are connected to the heat sink 32. In other words, heat transfer members 34 and 36 extend in directions along the main surface 24A of the image sensor 24 and the main surface 26A of the image engine 26, respectively.

[0039] The first heat transfer member 34 is attached to the upper end portion 29A of the sensor holder 29 that supports the image sensor 24. As shown in Figure 5, the first heat transfer member 34 comprises a follow-up portion 54 and a sheet portion 56. The configurations of the follow-up portion 54 and the sheet portion 56 will be explained with reference to Figures 12 to 16.

[0040] Figures 12 and 13 are perspective views showing the peripheral configuration of the first heat transfer member 34, Figures 14 and 15 are perspective views showing the first heat transfer member 34, and Figure 16 is a perspective view of the follow-up section 54 from the front.

[0041] The tracking portion 54 is a component having a shape that follows the movement of the sensor substrate 28 and the sensor holder 29 that support the image sensor 24. The tracking portion 54 is attached to the upper end portion 29A of the sensor holder 29. The sheet portion 56 is connected to the tracking portion 54 and is also attached to the bottom surface 58 (Figure 11) of the heat sink 32.

[0042] As shown in Figures 14 to 16, the follow-up section 54 has a concentric sheet section 60, binding sections 62 and 64, and a sheet section 66. The concentric sheet section 60 is a portion in which sheets are arranged concentrically, and the binding sections 62 and 64 are portions that bind a part of the concentric sheet section 60, respectively. The first binding section 62 binds the lower central portion of the concentric sheet section 60, and the second binding section 64 binds the upper central portion of the concentric sheet section 60. The sheet section 66 is connected to the second binding section 64 and is attached to the back surface 70 (Figure 13) of the heat sink 32.

[0043] By providing the concentric sheet portion 60, even when the sensor substrate 28 and sensor holder 29 are driven in the XZ plane by BIS control, the concentric sheet portion 60 deforms in accordance with the movement of the sensor holder 29, thereby following the movement of the sensor holder 29. This makes it possible to achieve both BIS control, which is performed by driving the sensor substrate 28 and sensor holder 29, and heat conduction by the first heat transfer member 34.

[0044] Each component constituting the first heat transfer member 34 described above may be made of a material with high thermal conductivity (for example, a graphite sheet).

[0045] Next, the second heat transfer member 36 will be described using Figures 17 and 18. Figures 17 and 18 are perspective views showing the surrounding configuration of the second heat transfer member 36.

[0046] The second heat transfer member 36 shown in Figures 17 and 18 is attached to a main frame (not shown) and contacts the image engine 26 mounted on the main substrate 30 via an elastic heat transfer member (Thermal Interface Material). The second heat transfer member 36 comprises a first sheet portion 72 and a second sheet portion 74.

[0047] The first sheet portion 72 is the part that is attached to the image engine 26 via an elastic heat transfer member. The second sheet portion 74 extends upward from the first sheet portion 72 and is attached to the back surface 70 (Figure 13) of the heat sink 32. The first sheet portion 72 and the second sheet portion 74 are integrally formed by folding a single sheet.

[0048] As shown in Figure 17, the second sheet portion 74 is attached to the back surface 70 of the heat sink 32 while in contact with the sheet portion 66 of the aforementioned follow-up portion 54 (dotted arrow), and contacts the heat sink 32 at a different location than the sheet portion 66.

[0049] Next, the EVF unit 12 shown in Figures 1 to 4 will be explained using Figures 19 to 21. Figures 19 to 21 are perspective views showing the peripheral configuration of the EVF unit 12.

[0050] The EVF unit 12 shown in Figure 19 is fixed to the top case 22 (Figure 4) with screws and is positioned to sandwich the eye cup mounting portion 78 provided on the rear case 20.

[0051] As shown in Figure 20, the EVF unit 12 comprises a main body 80 and an eyecup 82. The main body 80 and the eyecup 82 are positioned so as to sandwich the eyecup mounting portion 78 of the rear case 20.

[0052] The main body 80 is the main body of the EVF unit 12 and includes a heat source such as an LCD panel and ICs, and a board connection section 83. The board connection section 83 is for connecting the EVF unit 12 to the main board 30, and the operation of the EVF unit 12 is controlled by the main board 30. The eyecup 82 is the part that the user places their eyes on when viewing the screen of the EVF unit 12.

[0053] As shown in Figure 21, the main body 80 of the EVF unit 12 is positioned close to the back surface of the sheet portion 74 of the second heat transfer member 36. This allows the EVF unit 12 to generate a large amount of heat, and if it does, heat can be transferred from the EVF unit 12 to the sheet portion 74 via the elastic heat transfer member, and then dissipated to the heat sink 32 via the second heat transfer member 36.

[0054] The layout of the imaging device 2 having the above-described configuration, including the heat source H and the heat dissipation mechanism 10, will be explained using Figures 22 and 23. Figures 22 and 23 are schematic side views and perspective views showing the layout including the heat source H and the heat dissipation mechanism 10.

[0055] As shown in Figure 22, the heat transfer members 34 and 36 extend upward from the heat source H and are connected to the heat sink 32, and the heat sink 32 is located on the outer periphery side of the imaging body 4 relative to the heat source H (arrow B). With this arrangement, when providing the heat sink 32 and fan 33 as the heat dissipation mechanism 10, the space of the imaging device 2 can be effectively utilized, and the thickness of the imaging device 2, especially in the front-to-back direction, can be kept small. This makes it possible to achieve both heat dissipation and a compact imaging device 2, making it easier to balance heat dissipation and design.

[0056] As shown in Figure 23, the heatsink 32 and fan 33 are positioned on the outer periphery of the imaging unit 4, and in the upper center (especially directly above the optical axis L). By positioning the heatsink 32 and fan 33 in a location similar to the "pentaprism section" (where the pentaprism is housed) in conventional film cameras, it becomes possible to newly position the heatsink 32 and fan 33 without significantly altering the form of conventional digital cameras. This makes it possible to realize a digital camera 2 that easily balances heat dissipation and design. Note that the "upper center" can be any position facing upwards (+Z direction) in the area of ​​the imaging unit 4 excluding both ends in the width (X direction).

[0057] Furthermore, the heatsink 32 and fan 33 are provided in the area in front of the EVF unit 12. This makes it possible to newly position the heatsink 32 and fan 33 without significantly changing the form of the conventional imaging device that has the EVF unit 12.

[0058] As shown in Figure 22, the duct section 11 (heat sink 32 and fan 33) is positioned directly above the image sensor 24, and the EVF unit 12 is positioned directly above the image engine 26. This allows the duct section 11 and the EVF unit 12 to be positioned while making effective use of the space of the imaging device 2.

[0059] As shown in Figures 1 and 20, when viewed from the front of the camera along the Y-axis, the heat dissipation mechanism 10 overlaps in size with the EVF unit 12. Furthermore, as shown in Figure 23, both the duct section 11 and the EVF unit 12 are positioned directly above the optical axis L (arrows D1 and D2). This allows for a well-balanced overall form of the imaging device 2, improving its design aesthetics.

[0060] Furthermore, a gyro sensor 84 for detecting camera shake is housed inside the grip section 6. Compared to a conventional imaging device in which the gyro sensor is housed in the upper center of the imaging main unit 4 (the pentaprism section in a conventional film camera), the available space in the imaging main unit 4 is increased, and it is possible to suppress the increase in size of the imaging device 2, such as by newly providing a duct section 11 on the upper part of the imaging main unit 4.

[0061] With the above configuration, even when heat sources H such as the image sensor 24 and image engine 26 generate a large amount of heat, the heat dissipation mechanism 10, which has a heat sink 32 and a fan 33, efficiently dissipates the heat, thereby preventing the imaging device 2 from shutting down due to overheating. In recent years, with the trend towards higher image quality and performance, and with video applications becoming mainstream, the problem of camera function shutdown due to overheating is becoming serious. This configuration can be an effective solution to such heat problems and can give users peace of mind. On the other hand, by positioning the duct section 11, which has a heat sink 32 and a fan 33, in the upper center of the imaging main unit 4, which corresponds to the empty space in the front area of ​​the EVF unit 12, it is possible to suppress the size increase of the imaging device 2 and make it easier to balance heat dissipation and design.

[0062] As described above, the imaging device 2 of Embodiment 1 comprises a heat source H, a heat dissipation mechanism 10 for dissipating heat from the heat source H, an imaging main body 4 to which the heat source H and the heat dissipation mechanism 10 are attached, and a grip portion 6 provided on the side of the imaging main body 4. The heat dissipation mechanism 10 (particularly the heat sink 32 and the fan 33) is arranged on the outer periphery of the imaging main body 4.

[0063] With this configuration, the heat dissipation mechanism 10 can be positioned while making effective use of the space of the imaging device 2, making it easier to achieve both heat dissipation and a good design. When the heat dissipation mechanism 10 is positioned on the outer periphery of the imaging main unit 4, at least the intake port 42 and exhaust port 46 should be positioned so that they are exposed on the outer periphery of the imaging main unit 4, and the heat sink 32 and fan 33 should be positioned nearby.

[0064] Furthermore, in the imaging device 2 of Embodiment 1, the heat dissipation mechanism 10 is positioned at the upper center of the imaging main unit 4. This allows the heat dissipation mechanism 10 to be positioned without significantly changing the form of conventional imaging devices, making it easier to achieve both heat dissipation and a good design.

[0065] Furthermore, the imaging device 2 of Embodiment 1 further includes an EVF unit 12, and the heat dissipation mechanism 10 is positioned in front of the EVF unit 12. This allows the heat dissipation mechanism 10 to be positioned without significantly changing the form of conventional imaging devices that have an EVF unit, making it easier to achieve both heat dissipation and design aesthetics.

[0066] Furthermore, in the imaging device 2 of Embodiment 1, the heat dissipation mechanism 10 is positioned directly above the optical axis L. This allows for a well-balanced overall form of the imaging device 2.

[0067] Furthermore, in the imaging device 2 of Embodiment 1, the heat dissipation mechanism 10 includes a heat sink 32, a fan 33, and heat transfer members 34 and 36 that transfer heat from the heat source H to the heat sink 32. The heat source H has main surfaces 24A and 26A extending in a direction intersecting the optical axis L, and the heat transfer members 34 and 36 extend from the heat source H in a direction along the main surfaces 24A and 26A and are connected to the heat sink 32. The heat sink 32 and fan 33 are arranged on the outer periphery of the imaging body 4. This makes it easier to ensure heat dissipation without compromising the design of the imaging device 2 by arranging the heat sink 32 and fan 33, which have relatively large volumes, in the available space of the imaging body 4.

[0068] Furthermore, in the imaging device 2 of Embodiment 1, the heat source H comprises an image sensor 24 (first heat source) and an image engine 26 (second heat source), and the heat transfer members 34 and 36 comprise a first heat transfer member 34 that transfers heat from the image sensor 24 to the heat sink 32, and a second heat transfer member 36 that transfers heat from the image engine 26 to the heat sink 32.

[0069] With this configuration, multiple heat sources H can be connected to the heat sink 32 for heat dissipation.

[0070] Furthermore, the imaging device 2 of Embodiment 1 further comprises a sensor substrate 28 that supports the image sensor 24, and the first heat transfer member 34 comprises a tracking portion 54 that follows the movement of the sensor substrate 28 when it is driven by BIS control, and a sheet portion 56 that is attached to the heat sink 32.

[0071] With this configuration, even when the sensor substrate 28 supporting the image sensor 24 is driven by BIS control, the tracking portion 54 of the first heat transfer member 34 follows the movement of the sensor substrate 28, thereby enabling both BIS control driving the sensor substrate 28 and heat transfer by the first heat transfer member 34 to function simultaneously.

[0072] Furthermore, the imaging device 2 of Embodiment 1 further includes a duct section 11 that passes through the heat sink 32, connecting an intake port 42 and exhaust ports 46, 48 for the fan 33 to draw in and exhaust air, and the imaging main unit 4 houses the duct section 11.

[0073] With this configuration, the imaging device 2 can be made more compact by housing the duct section 11 in the imaging main unit 4.

[0074] Furthermore, in the imaging device 2 of Embodiment 1, the heat sink 32 is equipped with heat dissipation fins 38, and the heat dissipation fins 38 are positioned to face the air outlet 52 of the fan 33.

[0075] With this configuration, the air blown out from the fan 33 can be directed directly onto the heat dissipation fins 38, thereby improving heat dissipation efficiency.

[0076] Furthermore, in the imaging device 2 of Embodiment 1, the fan 33 is an axial flow fan.

[0077] With this configuration, if the fan 33 is mounted within the external appearance of Embodiment 1, the axial fan can have heat dissipation fins 38 over a larger area than the centrifugal fan, thus enabling a more compact imaging device 2 and improved heat dissipation efficiency.

[0078] Furthermore, in the imaging device 2 of Embodiment 1, the rotation axis E of the fan 33 extends in a direction intersecting the optical axis L (in Embodiment 1, the Z-axis direction).

[0079] Furthermore, the imaging device 2 of Embodiment 1 further comprises a gyro sensor 84 for detecting hand shake and a grip portion 6 housing the gyro sensor 84.

[0080] With this configuration, by placing the gyro sensor 84 on the grip portion 6, extra space is created above the imaging main unit 4 where the gyro sensor was conventionally located. This allows for a more compact imaging device 2, such as by placing the duct portion 11, which includes the heat sink 32 and fan 33, on top of the imaging main unit 4.

[0081] Furthermore, the imaging device 2 of Embodiment 1 includes a heat source H with main surfaces 24A and 26A extending in a direction intersecting the optical axis L (optical axis direction), a heat dissipation mechanism 10 for dissipating heat from the heat source H, and an imaging body 4 (body part) to which the heat source H and the heat dissipation mechanism 10 are attached. The heat dissipation mechanism 10 includes a heat sink 32, a fan 33, and heat transfer members 34 and 36 that transfer heat from the heat source H to the heat sink 32. The heat transfer members 34 and 36 extend from the heat source H in a direction along the main surfaces 24A and 26A and are connected to the heat sink 32, and the heat sink 32 is positioned on the outer circumference side of the imaging body 4 relative to the heat source H.

[0082] With this configuration, heat dissipation can be ensured by the heat dissipation mechanism 10 having a heat sink 32 and a fan 33, while keeping the thickness of the imaging main unit 4 in the front-to-back direction small, thereby making the imaging device 2 more compact. This makes it possible to realize an imaging device 2 that easily balances heat dissipation and design.

[0083] (Modified version of Embodiment 1) In Embodiment 1, as shown in Figures 1 and 2, the case in which the intake port 42 is opened upward and the exhaust ports 46 and 48 are opened to the left and right was described, but the invention is not limited to this case. The positions of the intake port and exhaust port, and the direction of intake and exhaust may be changed as appropriate, and such modified examples will be described using Figures 24 to 30.

[0084] Figures 24 and 25 show an imaging device 100 according to modified example 1. The imaging device 100 shown in Figures 24 and 25 comprises an imaging main body 104, a grip portion 106, a heat dissipation mechanism 110, and an EVF unit 112. The duct portion 111 of the heat dissipation mechanism 110 forms an intake port 113 and an exhaust port 114.

[0085] In the example shown in Figures 24 and 25, the intake port 113 is positioned below the exhaust port 114, with the intake port 113 opening downwards and the exhaust port 114 opening forwards. The intake port 113 draws in air from below upwards (arrow F1), and the exhaust port 114 exhausts air forwards (arrow F2). Even with this configuration, the same effect can be achieved by arranging the heat sink 32, fan 33, heat transfer members 34, 36, etc., with respect to the heat source H in the same arrangement as in Embodiment 1.

[0086] Furthermore, the intake port 113 and exhaust port 114 are not necessarily always open; covers that can be opened and closed by the user may be provided. For example, in the example shown in Figure 26, a cover 116 is provided for opening and closing the exhaust port 114. In Figure 26, the cover 116 is shown in the closed position of the exhaust port 114, and when the user opens the cover 116, the exhaust port 114 is exposed as shown in Figures 23 and 24. By providing such a cover 116, when shooting videos, etc., the cover 116 can be opened to ensure heat dissipation, and when shooting still images, etc., or when not in use, the cover 116 can be closed to prevent the exhaust port 114 from being exposed to the outside, thereby enhancing the design. In the example shown in Figure 26, the intake port 113 opens downwards and is in a location that is not easily visible from the outside, so a cover may not be necessary.

[0087] Figures 27 and 28 show the imaging device 200 according to Modification 2. The imaging device 200 shown in Figures 27 and 28 has the same configuration as the imaging device 100 according to Modification 1, but also has an additional exhaust port 202 (Figure 27) separate from the exhaust port 114.

[0088] In the example shown in Figures 27 and 28, the exhaust port 202 opens upward and exhausts air upward (arrow F3). With this configuration, by providing two types of exhaust ports 114 and 202, the exhaust path can be distributed (arrows F2 and F3), and the heat dissipation efficiency can be improved.

[0089] Figures 29 and 30 show an imaging device 300 according to Modification 3. Unlike the imaging devices 100 and 200 according to Modifications 1 and 2, the imaging device 300 shown in Figures 29 and 30 has exhaust ports 302 and 304 that exhaust to the left and right, instead of an exhaust port 114 that exhausts to the front.

[0090] In the example shown in Figures 29 and 30, exhaust port 302 opens to the left and exhausts to the left (arrow F4), and exhaust port 304 opens to the right and exhausts to the left (arrow F5). With this configuration, by providing three types of exhaust ports 202, 304, and 306, the exhaust path can be distributed (arrows F3, F4, F5), and the heat dissipation efficiency can be improved.

[0091] Note that the exhaust port 202 shown in Figure 29 may be omitted. Specifically, as in the imaging device 400 according to Modification 4 shown in Figures 31 and 32, only exhaust ports 302 and 304 may be provided, and the exhaust path may be distributed in two directions, left and right (arrows F4 and F5).

[0092] In the modified examples 1 to 4 described above, the air intake may be changed to an exhaust port, or the exhaust port may be changed to an air intake port.

[0093] (Embodiment 2) The imaging device 100 of Embodiment 2 according to the present invention will be described with reference to Figures 33 to 35. In Embodiment 2, the differences from Embodiment 1 will be mainly described. Furthermore, identical or equivalent components are denoted by the same reference numerals and their descriptions are omitted.

[0094] In Embodiment 1, the duct section 11 was provided at the upper center of the imaging main unit 4, whereas in Embodiment 2, the duct section is provided on the side of the imaging main unit, which is different from Embodiment 1.

[0095] Figures 33 and 34 are perspective views showing an imaging device 500 according to Embodiment 2. The imaging device 500 shown in Figures 33 and 34 comprises an imaging main unit 504, a grip unit 506, a heat dissipation mechanism 510, and an EVF unit 512. The heat dissipation mechanism 510 particularly includes a duct unit 520 provided on the side of the imaging main unit 504.

[0096] As shown in Figures 33 and 34, the grip portion 506 is located on the right side (-X direction) of the imaging body 504, while the duct portion 520 is located on the opposite side from the grip portion 506, i.e., on the left side (+X direction) of the imaging body 504. With this arrangement, the grip portion 506 and the heat dissipation mechanism 510 (especially the duct portion 520) are positioned symmetrically with respect to the imaging body 504, allowing for a well-balanced form when the imaging device 2 is viewed from the front. This makes it possible to realize an imaging device 500 that easily balances heat dissipation and design.

[0097] Furthermore, a pentaprism 505 may be provided at the upper center of the imaging main unit 504, or a different component from the pentaprism 505 may be placed there.

[0098] The duct section 520 forms an intake port 542 and an exhaust port 544. In the example shown in Figures 33 and 34, the intake port 542 opens upward to draw air downward (arrow F6), and the exhaust port 544 opens downward to exhaust air downward (arrow F7).

[0099] The configuration of the heat dissipation mechanism 510 and the layout of the imaging device 500 in Embodiment 2 will be explained with reference to Figure 35. Figure 35 is a schematic perspective view showing the layout of the imaging device 500.

[0100] As shown in Figure 35, the imaging main unit 504 is equipped with an image sensor 24 and an image engine 26 as heat sources H, and a heat sink 532 and a fan 533 are provided inside the duct section 520 located on the side of the imaging main unit 504.

[0101] Inside the imaging unit 504, two heat transfer members 534 and 536 are provided to connect the heat source H and the heat sink 132. The first heat transfer member 534 transfers heat from the image sensor 24 to the heat sink 532, and the second heat transfer member 536 transfers heat from the image engine 26 to the heat sink 532. The heat transfer members 534 and 536 may be formed from a material with high thermal conductivity (e.g., graphite), similar to the heat transfer members 34 and 36 in Embodiment 1.

[0102] As shown in Figure 35, both heat transfer members 534 and 536 extend from the heat source H in a direction along the main surfaces 24A and 26A (arrow B1) and are connected to the heat sink 532. The heat sink 532 is positioned on the outer periphery side of the imaging body 504 relative to the heat source H. That is, the heat dissipation mechanism 510 having the heat sink 532 is positioned on the outer periphery of the imaging body 504.

[0103] With this configuration, similar to Embodiment 1, heat dissipation can be ensured by the heat dissipation mechanism 510 having a heat sink 532 and a fan 533, while keeping the thickness of the imaging device 500 in the front-to-back direction small, thereby making the imaging device 500 more compact. This makes it possible to realize an imaging device 500 that easily balances heat dissipation and design.

[0104] As shown in Embodiments 1 and 2, by arranging the heat dissipation mechanism for dissipating heat from heat sources H such as the image sensor 24 and image engine 26 at the upper center of the imaging body (Embodiment 1), or on the side opposite to the side where the grip portion is provided relative to the imaging body (Embodiment 2), an imaging device that easily balances heat dissipation and design can be realized.

[0105] (Modified version of Embodiment 2) In Embodiment 2, an example was described in which the duct section 520 draws in air from above and exhausts it downwards (arrows F6, F7), but the direction of intake and exhaust is not limited to this. For example, as in the modified imaging device 600 shown in Figure 36, in a duct section 620 provided on the side of the imaging main unit 604, the intake port 622 may draw in air from the side (arrow F8), and the exhaust port 624 may exhaust air upwards or diagonally upwards (arrow F9). In the configuration shown in Figure 36, the fan (not shown) provided inside the duct section 620 may be a centrifugal fan. Thus, even when the duct section 620 is provided on the side of the imaging main unit 604, the direction of intake and exhaust can be arranged in any direction, and the arrangement and specifications of the heat sink and fan can be changed accordingly.

[0106] Although the present invention has been described above with reference to Embodiments 1 and 2 and their modifications, the present invention is not limited to Embodiments 1 and 2 and their modifications. For example, the imaging device may not have an EVF unit 12. Also, when the imaging device 2 has an EVF unit 12, a third heat transfer member may be provided that connects the EVF unit 12 to the heat sink 32 via an independent heat dissipation path, separate from the heat transfer members 34 and 36.

[0107] Furthermore, while embodiments 1 and 2 described the case in which the imaging device 2 is equipped with a grip portion 6, the invention is not limited to this case, and the device may not be equipped with a grip portion 6.

[0108] Furthermore, while embodiments 1 and 2 described a case where the image sensor 24 and the image engine 26 dissipate heat using the same heat dissipation mechanism 10, the invention is not limited to this case. For example, one of the components of the image sensor 24 or the image engine 26 may be dissipated by the heat dissipation mechanism 10 (for example, the upper center of the imaging main unit 4), and the other component may be dissipated by a different heat dissipation mechanism (for example, the rear side of the imaging main unit 4).

[0109] Furthermore, while embodiments 1 and 2 described the case where the heat source H consists of the image sensor 24 and the image engine 26, the heat source H is not limited to this case and may include other heat sources (for example, the storage compartment for the recording medium). The heat source H may include at least three heat sources: the image sensor 24 (first heat source), the image engine 26 (second heat source), and the storage compartment for the recording medium (third heat source), and the main surfaces of these heat sources may all extend in a direction intersecting the optical axis L. Note that the image engine 26 (processor) and the storage compartment may be mounted on a separate board from the main board 30.

[0110] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood as being included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0111] Furthermore, by appropriately combining any of the above embodiments and various modifications, the effects of each can be achieved. [Industrial applicability]

[0112] This disclosure is applicable to imaging devices that capture images of subjects, such as digital cameras. [Explanation of Symbols]

[0113] 2. Imaging device 4. Imaging Unit (Main Unit) 10 Heat dissipation mechanism 11 Duct section 12 EVF units 24 Image sensor (first heat source) 26 Image engine (second heat source) 28 Sensor board 32 Heatsinks 33 Fans 34. First heat transfer element 36. Second heat transfer element 38 heat dissipation fins E Rotation axis H heat source L optical axis

Claims

1. A lens mounting section that allows for the attachment and detachment of lenses, A heat source, and a main body including the heat source and the lens mounting portion, A heat transfer member that transmits heat from the heat source, The main body is provided with a fan housing located at the top of the main body, The fan housing includes a fan and a heat sink that dissipates the heat transmitted through the heat transfer member. The aforementioned fan includes an intake port and an exhaust port for intake and exhaust, The fan housing portion is a protruding portion having multiple surfaces that protrude from the main body portion, An imaging device in which the intake port and the exhaust port are provided on different surfaces among the plurality of surfaces.

2. The imaging apparatus according to claim 1, wherein the protrusion has a forward protrusion that extends in the direction in which the lens mounted on the lens mounting portion extends, located on the upper part of the lens mounting portion.

3. The imaging device according to claim 2, wherein the protruding portion has the shape of a pentaprism.

4. The imaging apparatus according to claim 1, wherein the plurality of surfaces include a top surface, a side surface, and a bottom surface.

5. The aforementioned plurality of surfaces include the top surface, the side surface, and the bottom surface. The imaging apparatus according to claim 2, wherein the lower surface is the lower surface of the forward projection.

6. The imaging device according to claim 2, wherein the air intake is provided on the lower surface of the forward projection which is one of the plurality of surfaces.

7. The imaging apparatus according to claim 1, wherein the intake port draws in air in the direction of a first axis, and the exhaust port exhausts air in the direction of a second axis that is 90 degrees different from the first axis.

8. The imaging device according to claim 4, wherein the intake port is provided on the lower surface among the plurality of surfaces, and the exhaust port is provided on the side surface among the plurality of surfaces.

9. The imaging apparatus according to claim 7 or claim 8, wherein the number of intake ports is one and the number of exhaust ports is two.

10. A lens mounting section that allows for the attachment and detachment of lenses, A heat source, and a main body including the heat source and the lens mounting portion, A grip portion provided on the side of the main body, A heat transfer member that transmits heat from the heat source, The main body comprises a fan housing located at the upper center, The fan housing includes a fan and a heat sink that dissipates the heat transmitted through the heat transfer member. The aforementioned fan includes an intake port and an exhaust port for intake and exhaust, The fan housing portion is a protruding portion that extends from the main body portion and has multiple surfaces, An imaging device wherein the intake port or exhaust port is provided on any of the multiple surfaces.

Images