Multilayer electronic components
The innovative design of multilayer ceramic capacitors with alternating internal electrodes and optimized electrode arrangements addresses the challenge of high ESL, resulting in enhanced capacitance and reduced loop lengths for improved performance in miniaturized electronic devices.
JP2026116788APending Publication Date: 2026-07-13SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- JP2025184753
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-31
- Filing Date
- 2025-10-31
- Publication Date
- 2026-07-13
AI Technical Summary
Technical Problem
Existing multilayer ceramic capacitors face challenges in achieving low equivalent series inductance (ESL) due to limitations in current path design, which affects their performance in miniaturized and high-capacity electronic devices.
Method used
The design incorporates a stacked structure with alternating internal electrodes, external electrodes arranged in specific patterns, and via electrodes to increase current paths and reduce loop lengths, enhancing capacitance and reducing ESL.
Benefits of technology
The solution provides a multilayer ceramic capacitor with low ESL, improving current path efficiency and enabling higher capacitance in a compact form factor, suitable for high-frequency applications.
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Figure 2026116788000001_ABST
Abstract
We provide multilayer electronic components with low equivalent series inductance. [Solution] The stacked electronic component 100A includes a first group of external electrodes EG1 arranged on at least one of the first and second main surfaces, adjacent to corners E1 to E4 where the sides S1 to S4 abut each other and electrically connected to the first internal electrode 121, a second group of external electrodes EG2 electrically connected to the second internal electrode 122, and a via electrode 123 that penetrates the stacked body 110 in the stacking direction D1 and connects the second internal electrode and the second group of external electrodes. The via electrode passes through the indentation around the first internal electrode and the second internal electrode, and the first separation distance between the side surface of the stacked body and the main body of the first internal electrode is greater than the second separation distance between the side surface of the stacked body and the second internal electrode.
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