Element package, packaging substrate containing the same, and method for manufacturing the same

Abstract

The present invention provides an element package, a packaging substrate, and a method for manufacturing the same, which offer excellent reliability and long-term durability, and facilitate the formation of electrical connections when mounted within the packaging substrate. [Solution] The element package 100 includes one or more elements 10 and a sealing layer 20 surrounding the elements 10. The sealing layer 20 includes a first sealing layer 21 surrounding the upper surface of the elements and a second sealing layer 22 disposed below the first sealing layer 21. The element package 100 further includes an adhesive layer 30 disposed between the first sealing layer 21 and the second sealing layer 22. In this case, an element package 100 can be provided that is highly reliable and durable over long term, and facilitates the formation of electrical connections when mounted on a packaging substrate.

Description

Technical Field

[0001] Embodiment examples relate to an element package, a packaging substrate including the same, and a method of manufacturing the same.

Background Art

[0002] In manufacturing an electronic component, forming a circuit on a semiconductor wafer is referred to as a front-end (FE) process, and assembling the wafer into a state where it can be used as an actual product is referred to as a back-end (BE) process, and a packaging process is included in this back-end process.

[0003] As four core technologies of the semiconductor industry that have enabled the recent rapid development of electronic products, there are semiconductor technology, semiconductor packaging technology, manufacturing process technology, and software technology. Semiconductor technology has evolved into various forms such as line widths in nano units below micro, over ten million cells, high-speed operation, and a large amount of heat dissipation, but relatively, there is no technology that perfectly packages this. Therefore, the electrical performance of a semiconductor may sometimes be determined by the packaging technology and the electrical connection thereby, rather than the performance of the semiconductor technology itself.

[0004] As the electronics industry develops, electronic products are also required to be high-density, multi-functional, and miniaturized. An element-embedded substrate and a package incorporate passive or active elements inside the package substrate. Such a method can shorten the length of the circuit, improve electrical characteristics, enhance the reliability of the package substrate, and also reduce manufacturing costs.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The objective of this embodiment is to provide an element package that offers excellent reliability and long-term durability, and facilitates the formation of electrical connections when mounted on a packaging substrate. [Means for solving the problem]

[0007] An element package according to one embodiment of this specification includes one or more elements and a sealing layer surrounding the elements.

[0008] The sealing layer includes a first sealing layer surrounding the upper surface of the element, and a second sealing layer disposed below the first sealing layer.

[0009] The element package further includes an adhesive layer disposed between the first sealing layer and the second sealing layer.

[0010] At least a portion of the adhesive layer may be placed in contact with the lower surface of the first sealing layer.

[0011] The ratio of the area of ​​the adhesive layer to the area of ​​the lower surface of the element package may be 15% or more.

[0012] The adhesive layer may include any one selected from the group consisting of silicone-based adhesives, epoxy-based adhesives, acrylic-based adhesives, and combinations thereof.

[0013] The element package may include a first point located on the lower surface of the element and a second point located on the lower surface of the second sealing layer.

[0014] The minimum distance between the first point and the second point can be between 5 μm and 100 μm.

[0015] The thickness of the second sealing layer located beneath the element may be 5 μm to 100 μm.

[0016] A packaging substrate according to other embodiments of this specification includes a core layer and a cavity portion which is a space formed by recessing a portion of the upper surface of the core layer.

[0017] The packaging substrate includes the element package disposed in the cavity portion.

[0018] A method for manufacturing an element package according to yet another embodiment of this specification includes a pre-element package preparation step of providing a pre-element package including one or more elements and a first sealing layer surrounding the upper surface of the elements; an adhesive layer formation step of forming an adhesive layer to be disposed on the lower surface of the pre-element package; and a second sealing layer formation step of manufacturing an element package by forming a second sealing layer to be disposed below the lower surface of the pre-element package on which the adhesive layer has been formed.

[0019] The adhesive layer formation step may include an adhesive layer placement step of placing the adhesive layer on the lower surface of the spare element package, and a plasma treatment step of plasma treatment of the lower surface of the spare element package on which the adhesive layer is placed.

[0020] In the adhesive layer formation step, at least a portion of the adhesive layer can be formed in contact with the lower surface of the element.

[0021] In the adhesive layer formation step, the adhesive layer can be formed such that the ratio of the area of ​​the adhesive layer to the area of ​​the lower surface of the spare element package is 15% or more.

[0022] The adhesive layer may include any one selected from the group consisting of silicone-based adhesives, epoxy-based adhesives, acrylic-based adhesives, and combinations thereof. [Effects of the Invention]

[0023] The example device package has excellent reliability and long-term durability, and may facilitate the formation of electrical connections when mounted on a packaging substrate. [Brief explanation of the drawing]

[0024] [Figure 1] It is a cross-sectional view for explaining an element package according to an embodiment of an embodiment example. [Figure 2] It is a cross-sectional view for explaining a packaging substrate according to another embodiment of an embodiment example.

BEST MODE FOR CARRYING OUT THE INVENTION

[0025] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement them. However, the present invention can be realized in various different forms and is not limited to the embodiments described herein. The same reference numerals are given to similar parts throughout the specification.

[0026] Throughout this specification, the term "these combinations" included in the Markush-type expression means one or more mixtures or combinations selected from the group consisting of the components described in the Markush-type expression, and means including one or more selected from the group consisting of the said components.

[0027] Throughout this specification, terms such as "first", "second" or "A", "B" are used to distinguish the same terms from each other. Also, the singular expression includes the plural expression unless the context clearly indicates a different meaning.

[0028] In this specification, "~-based" may mean including a compound corresponding to "~" or a derivative of "~" in the compound.

[0029] In this specification, the meaning that B is located on A means that B is located directly abutting on A or B is located on A while another layer is located between them, and is not construed as being limited to B being located abutting on the surface of A.

[0030] In this specification, the meaning of B being connected to A means either that A and B are directly connected, or that A and B are connected through other components between them, and is not limited to the direct connection of A and B unless otherwise specified.

[0031] In this specification, unless otherwise specified, singular expressions are interpreted to include singular or plural, as interpreted in the context.

[0032] In this specification, the form, relative size, angles, etc., of each component in the drawings are illustrative and may be exaggerated for illustrative purposes, and the rights shall not be construed as being limited to the drawings.

[0033] In this specification, "adjacent to A and B" means that A and B are located touching each other, or that A and B are not touching but are located close to each other. In this specification, the expression "adjacent to A and B" is not construed to mean that A and B are located touching each other unless otherwise specified.

[0034] In this specification, unless otherwise specified, the physical properties of each component within the packaging substrate are assumed to have been measured at room temperature. Room temperature is defined as 20°C to 25°C.

[0035] In the case of an element package mounted on a packaging substrate, a sealing layer can surround the element with a certain thickness on the upper / lower surface of the element. Through this, a wiring layer perpendicular to the sealing layer surrounding the element can be easily formed.

[0036] An element package having the above-described characteristics can be provided by first forming a sealing layer surrounding the upper surface of the element, and then forming a sealing layer surrounding the lower surface of the element. Specifically, when a sealing layer manufacturing composition is injected into the lower side of the element, the composition may harden in contact with the sealing layer on the upper side of the element, which has already hardened. In this case, sufficient adhesion may not be formed between the sealing layer formed on the upper side of the element and the sealing layer formed on the lower side of the element. This may cause problems with the reliability of the element package and may result in delamination between the sealing layers.

[0037] The inventors of the embodiment completed the embodiment by experimentally confirming that the element package exhibits excellent electrical reliability and long-term durability, and facilitates the formation of electrical connections when mounted on a packaging substrate, by introducing the technical features detailed below into the element package.

[0038] The following provides a detailed explanation of specific examples.

[0039] Figure 1 is a cross-sectional view illustrating an element package according to one embodiment of the actual example. The actual example will be described below with reference to Figure 1.

[0040] element package An element package 100 according to one embodiment of the embodiment includes one or more elements 10 and a sealing layer 20 surrounding the elements 10. The sealing layer 20 includes a first sealing layer 21 surrounding the upper surface of the elements 10 and a second sealing layer 22 disposed below the first sealing layer 21. The element package 100 further includes an adhesive layer 30 disposed between the first sealing layer 21 and the second sealing layer 22.

[0041] The element 10 may be a semiconductor element such as a CPU, GPU, or memory chip, or it may be a capacitor element, a transistor element, an impedance element, or other modules. In other words, any semiconductor element that is mounted on a semiconductor device can be used as the element 10 without limitation.

[0042] The element package 100 may contain one element 10, or it may contain two or more elements 10. If the element package 100 contains two or more elements 10, each element 10 may be arranged separately from each other, or each element 10 may be arranged in contact with each other.

[0043] The sealing layer 20 supports and protects the element 10 and electrical connections contained within the element package 100, and can provide insulation to the target area within the element package 100.

[0044] The sealing layer 20 can contain a material that can properly fix the element 10 and other components, as well as prevent electrical short circuits.

[0045] The sealing layer 20 may contain an epoxy resin. The epoxy resin may be any one selected from the group consisting of bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, naphthalene type epoxy resin, silicone epoxy copolymer resin, and combinations thereof.

[0046] The sealing layer 20 may further contain other additives besides the resin described above. These additives are not limited to those commonly used in the field of molding compounds. Exemplary examples of additives include curing agents, curing catalysts, coupling agents, defoaming agents, flame retardants, surfactants, inorganic fillers, and the like.

[0047] The sealing layer 20 may include a first sealing layer 21 surrounding the upper surface of the element 10, and a second sealing layer 22 positioned below the first sealing layer 21.

[0048] The first sealing layer 21 can be in contact with the upper surface of the element 10 and surround the upper surface of the element 10. Other components may be placed between the first sealing layer 21 and the upper surface of the element 10. The first sealing layer 21 can surround at least a portion of the side surface of the element 10. The first sealing layer 21 can be in contact with the side surface of the element 10 and surround the side surface of the element 10. Other components may be placed between the first sealing layer 21 and the side surface of the element 10. The first sealing layer 21 can surround the lower surface of the element 10. The first sealing layer 21 can be in contact with the lower surface of the element 10 and surround the lower surface of the element 10. Other components may be placed between the first sealing layer 21 and the lower surface of the element 10.

[0049] The second sealing layer 22 is positioned below the first sealing layer 21. The second sealing layer 22 can be in contact with the lower surface of the element 10 and surround the lower surface of the element 10. Other components may be positioned between the second sealing layer 22 and the lower surface of the element 10. The second sealing layer 22 can surround at least a portion of the side surface of the element 10. The second sealing layer 22 can be in contact with the side surface of the element 10 and surround the side surface of the element 10. Other components may be positioned between the second sealing layer 22 and the side surface of the element 10.

[0050] The first sealing layer 21 and the second sealing layer 22 may be arranged in contact with each other in a portion of the device package 100. In such a case, the interface between the first sealing layer 21 and the second sealing layer 22 may not be observed.

[0051] The first sealing layer 21 and the second sealing layer 22 may have the same composition or may have different compositions from each other.

[0052] The element package 100 allows the thickness of the sealing layer 20 surrounding the element 10 to be controlled within a range predetermined in the embodiment. In this case, the element 10 is stably protected, and wiring for the electrical conductive layer for embedding can be easily formed on the upper / lower sides of the element 10 within the element package 100.

[0053] The element package 100 may include a first point located on the lower surface of the element 10 and a second point located on the lower surface of the second sealing layer 22. The minimum distance between the first and second points may be 5 μm to 100 μm. The minimum value may be 10 μm or more. The minimum value may be 15 μm or more. The minimum value may be 90 μm or less. The minimum value may be 80 μm or less. The minimum value may be 70 μm or less.

[0054] The element package 100 may include a third point located on the upper surface of the element 10 and a fourth point located on the upper surface of the first sealing layer 21. The minimum distance between the third point and the fourth point may be 5 μm to 100 μm. The minimum value may be 10 μm or more. The minimum value may be 15 μm or more. The minimum value may be 90 μm or less. The minimum value may be 80 μm or less. The minimum value may be 70 μm or less.

[0055] In such cases, it can be helpful to accurately and precisely form fine patterns on the upper / lower sides of the element 10 within the element package 100.

[0056] The element package 100 may further include an adhesive layer 30 disposed between the first sealing layer 21 and the second sealing layer 22. The adhesive layer 30 may have excellent adhesive properties to the first sealing layer 21 and the second sealing layer 22. The adhesive layer 30 improves the durability of the element package 100 and maintains stable electrical connections within the element package 100 by ensuring that the first sealing layer 21 and the second sealing layer 22 are stably bonded to each other.

[0057] The adhesive layer 30 may be placed beneath the first sealing layer 21. At least a portion of the adhesive layer 30 may be placed in contact with the lower surface of the first sealing layer 21. At least a portion of the adhesive layer 30 may be placed beneath the element 10. At least a portion of the adhesive layer 30 may be placed in contact with the lower surface of the element 10. At least a portion of the adhesive layer 30 may be placed on the second sealing layer 22. At least a portion of the adhesive layer 30 may be placed in contact with the upper surface of the second sealing layer 22. When the adhesive layer 30 is placed as described above, it is possible to effectively suppress the occurrence of cracks, peeling, etc., of the sealing layer 20 within the element package 100.

[0058] The ratio of the area of ​​the adhesive layer 30 to the area of ​​the lower surface of the element package 100 may be 15% or more. The ratio may be 20% or more. The ratio may be 25% or more. The ratio may be 30% or more. The ratio may be 35% or more. The ratio may be 40% or more. The ratio may be 45% or more. The ratio may be 50% or more. The ratio may be 80% or less. The ratio may be 70% or less.

[0059] The ratio of the area of ​​the adhesive layer 30 to the area of ​​the upper surface of the element package 100 may be 15% or more. The ratio may be 20% or more. The ratio may be 25% or more. The ratio may be 30% or more. The ratio may be 35% or more. The ratio may be 40% or more. The ratio may be 45% or more. The ratio may be 50% or more. The ratio may be 80% or less. The ratio may be 70% or less.

[0060] In such cases, the adhesive layer 30 can provide sufficient bonding force between the first sealing layer 21 and the second sealing layer 22, and the convenience of the process of forming the adhesive layer 30 can be improved.

[0061] The adhesive layer 30 may include any one selected from the group consisting of silicone-based adhesives, epoxy-based adhesives, acrylic-based adhesives, and combinations thereof. Such adhesives can be further enhanced by plasma treatment, as detailed below, and the modification and degradation of the adhesive layer 30 due to the plasma treatment can be stably suppressed.

[0062] Silicone-based adhesives, epoxy-based adhesives, and acrylic-based adhesives can be applied without limitation, as long as they are commonly used in the field of adhesion.

[0063] Packaging substrate Figure 2 is a cross-sectional view illustrating a packaging substrate according to another embodiment of the concrete example. The concrete example will be described below with reference to Figure 2.

[0064] The element package 100 is the same as described in Figure 1 above. The differences will be explained below.

[0065] Another embodiment of the packaging substrate 200 includes a core layer 50 and a cavity portion 51 which is a space formed by recessing the upper surface of the core layer 50. The packaging substrate 200 includes an element package 100 disposed in the cavity portion 51.

[0066] The core layer 50 can function as a support layer in the packaging substrate 200. The core layer 50 can be applied without limitation as long as it can be used as a support layer in the field of packaging substrate 200. For example, the core layer 50 may be a glass substrate, a ceramic substrate, an organic substrate, etc.

[0067] In particular, the core layer 50 can be a glass substrate. When a glass substrate is used as the core layer 50, it is advantageous for realizing fine patterns and can stably suppress the generation of parasitic elements.

[0068] The glass substrate may, for example, be alkali borosilicate glass, alkali-free borosilicate glass, alkali-free alkaline earth borosilicate glass, or any glass plate used for electronic components. Electronic device glass substrates are applicable, and for example, those manufactured by Schott, AGC, Corning, etc., may be used, but are not limited to these.

[0069] The core layer 50 may include through vias that penetrate in the thickness direction of the core layer 50.

[0070] A through via consists of an internal space and an inner diameter surface of the via surrounding the internal space. The internal space refers to an empty space, and the inner diameter surface of the via refers to the surface of the core layer 50 formed inside the through via.

[0071] The through vias may have a diameter that varies in the thickness direction of the core layer 50. The through vias may have a substantially uniform diameter in the thickness direction of the core layer 50.

[0072] The surface of the core layer 50 may include an upper surface and a side surface connected to the upper surface and formed in the thickness direction of the core layer 50. The surface of the core layer 50 may also include a lower surface facing the upper surface.

[0073] The statement that the side surface is formed in the thickness direction of the core layer 50 is interpreted to mean not only that the side surface is perpendicular to the upper surface of the core layer 50, but also that at least a portion of the side surface forms an angle (angle of inclination) other than 90° with the upper surface.

[0074] The aforementioned side surface may be flat or curved.

[0075] The thickness of the core layer 50 may be 100 μm or more. The thickness may be 200 μm or more. The thickness may be 300 μm or more. The thickness may be 3000 μm or less. The thickness may be 2000 μm or less. The thickness may be 1000 μm or less. In such cases, the core layer 50 can have mechanical properties suitable for application to the packaging substrate 200.

[0076] The cavity 51 may be formed by recessing the upper surface of the core layer 50. The cavity 51 may be formed by recessing a portion of the upper surface of the core layer 50 in the thickness direction of the core layer 50. The cavity 51 may also be formed by penetrating through the core layer 50 in the thickness direction.

[0077] The cavity portion 51 may include an element package mounting space 511 and an inner cavity surface 512 surrounding the element package mounting space 511. The cavity portion 51 includes a cavity opening (not shown) located on the upper side of the core layer 50, an inner cavity surface 512 connected to the cavity opening and extending in the thickness direction of the core layer 50, and an internal space surrounded by the inner cavity surface 512.

[0078] The cavity opening may be positioned in contact with the upper surface of the core layer 50. The cavity opening may constitute the inner edge of the upper surface of the core layer 50.

[0079] The statement that the cavity inner surface 512 is formed extending in the thickness direction of the core layer 50 is interpreted to mean not only that the cavity inner surface 512 is perpendicular to the upper surface of the core layer 50, but also that at least a portion of the cavity inner surface 512 forms an angle (inclination angle) other than 90° with the upper surface.

[0080] The inner surface 512 of the cavity may be flat or curved.

[0081] The element package mounting space 511 is the space on which the element package 100 is mounted. The element package mounting space 511 may be an internal space formed by a recess on the upper side of the core layer 50.

[0082] The element package 100 may be the element package 100 described above. The explanation of the element package 100 will be omitted as it will be redundant with the previous explanation.

[0083] After placing the element package 100 in the cavity, the remaining element package mounting space 511 within the cavity can be filled with a sealing layer. The sealing layer can be any type commonly used in the field of packaging substrates, without any limitations.

[0084] A redistribution layer may be formed above and / or below the core layer. The redistribution layer may include an electrically conductive layer which is a conductive layer that transmits electrical signals, and an insulating layer which surrounds at least a portion of the electrically conductive layer.

[0085] The redistribution layer can be applied without limitation as long as it is one that is commonly used in the field of packaging substrates.

[0086] Method for manufacturing element packages A method for manufacturing an element package according to another embodiment of the embodiment includes a preliminary element package preparation step of providing a preliminary element package including one or more elements and a first sealing layer surrounding the upper surface of the elements; an adhesive layer formation step of forming an adhesive layer to be disposed on the lower surface of the preliminary element package; and a second sealing layer formation step of manufacturing an element package by forming a second sealing layer to be disposed below the lower surface of the preliminary element package on which the adhesive layer has been formed.

[0087] Preparation step for spare element packages In the spare element package preparation step, a spare element package can be provided, which includes one or more elements and a first sealing layer surrounding the upper surface of the elements. The elements and first sealing layer may be those described above. A description of the elements and first sealing layer will be omitted as it will be redundant with the above.

[0088] The lower surface of the element can be exposed to the lower side of the spare element package. The lower surface of the element may be surrounded by a first sealing layer.

[0089] In the spare element package preparation step, a spare element package in which the element is already surrounded by a first sealing layer may be introduced, or the spare element package may be provided by forming the first sealing layer so as to surround the upper surface of the element.

[0090] The first encapsulation layer can be formed from a composition for manufacturing the first encapsulation layer. Specifically, the elements can be placed in the internal space formed in the mold. If there are two or more elements, each element can be placed in the mold at a predetermined interval. The mold can be any type commonly used in the field of element packaging, without limitation.

[0091] Subsequently, the first encapsulation layer manufacturing composition can be injected into the internal space of the mold, filling the remaining portion of the internal space of the mold, excluding the portion occupied by the element, with the first encapsulation layer manufacturing composition. The first encapsulation layer manufacturing composition can then harden to form the first encapsulation layer.

[0092] The composition for manufacturing the first sealing layer may contain an epoxy resin and a curing agent. The epoxy resin may contain two or more epoxy groups. The epoxy resin may be any one selected from the group consisting of bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, naphthalene type epoxy resin, silicone epoxy copolymer resin, and combinations thereof.

[0093] The weight-average molecular weight of the epoxy resin may be 1,000 g / mol or less. The weight-average molecular weight may be 800 g / mol or less. The weight-average molecular weight may be 600 g / mol or less. The weight-average molecular weight may be 100 g / mol or more.

[0094] The curing agent in the example is not limited as long as it is a compound that can function as a curing agent for epoxy resins. For example, the curing agent may be an acid anhydride-based curing agent, an aromatic amine, a phenolic resin, an imidazole-based compound, etc.

[0095] The composition for manufacturing the first sealing layer may contain 0.3 equivalents or more of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the first sealing layer may contain 0.5 equivalents or more of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the first sealing layer may contain 0.7 equivalents or more of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the first sealing layer may contain 2 equivalents or less of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the first sealing layer may contain 1.5 equivalents or less of curing agent per equivalent of epoxy groups in the epoxy resin.

[0096] The first encapsulation layer manufacturing composition may further contain a filler. The filler can contribute to the encapsulation layer manufacturing composition having a viscosity within a predetermined range in the embodiment, and can help the encapsulation layer have physical properties suitable for the device package.

[0097] The filler may include inorganic particles. For example, silica, titania, alumina, etc., may be used as the filler.

[0098] The average particle size of the filler may be 150 nm or less. The average particle size may be 120 nm or less. The average particle size may be 100 nm or less. The average particle size may be 80 nm or less. The average particle size may be 10 nm or more. The average particle size may be 30 nm or more. In such cases, the composition for manufacturing the first sealing layer can have viscosity characteristics suitable for filling the internal space in the mold, which can help ensure that the first sealing layer has the desired mechanical properties. Furthermore, it may be easy to implement an electrically conductive layer having a fine pitch within the first sealing layer.

[0099] In this embodiment, the filler content in the composition for manufacturing the first sealing layer can be adjusted to a range predetermined in the embodiment. This allows the composition for manufacturing the first sealing layer to have flow characteristics suitable for smooth filling of the internal space of the mold, and the formed first sealing layer can stably protect the element from external shocks and thermal shocks.

[0100] The composition for manufacturing the first encapsulation layer may contain 45% by weight or more of filler. The composition for manufacturing the first encapsulation layer may contain 50% by weight or more of filler. The composition for manufacturing the first encapsulation layer may contain 75% by weight or more of filler. The composition for manufacturing the first encapsulation layer may contain 95% by weight or less of filler. In such cases, the composition can have flow characteristics suitable for the molding process. Furthermore, it is possible to form an encapsulation layer that stably fixes the element and does not apply excessive stress to the core layer in a high-temperature atmosphere when mounting the element package onto a packaging substrate.

[0101] The composition for manufacturing the first sealing layer may contain a solvent. The solvent is not limited as long as it is generally applicable in the art. For example, the solvent may include aliphatic hydrocarbon solvents, aromatic hydrocarbon solvents, ethers, esters, and the like.

[0102] The composition for manufacturing the first sealing layer may further contain additives. The additives are not limited as long as they are generally applicable in the art. Exemplary examples of additives may include defoamers, coupling agents, flame retardants, surfactants, and the like.

[0103] When injecting the composition for manufacturing the first sealing layer into the mold, the temperature of the composition may be between 120°C and 250°C. The temperature may be 130°C or higher. The temperature may be 200°C or lower. The temperature may be 180°C or lower. In such cases, the empty space inside the mold can be sufficiently filled.

[0104] When injecting the composition for manufacturing the first sealing layer into the mold, the molding pressure may be 3 MPa or higher. The molding pressure may be 4 MPa or higher. The molding pressure may be 5 MPa or higher. The molding pressure may be 20 MPa or lower. Through this, the formation of voids in the first sealing layer can be stably suppressed.

[0105] After the injection of the composition for manufacturing the first sealing layer into the mold is complete, the composition can be pressurized for a certain period of time. Through this, the formation of voids within the first sealing layer can be reliably suppressed.

[0106] After the injection of the first sealing layer manufacturing composition into the mold is complete, the pressurization time may be 30 seconds or more. The pressurization time may be 40 seconds or more. The pressurization time may be 5 minutes or less.

[0107] By lowering the temperature of the first sealing layer manufacturing composition placed in the internal space within the mold, the composition can harden and form the first sealing layer. The temperature reduction time for the first sealing layer manufacturing composition can be 50 seconds to 500 seconds.

[0108] A first sealing layer can be formed to provide a spare element package.

[0109] Adhesive layer formation step The adhesive layer formation step in the embodiment can form an adhesive layer that is placed on the lower surface of the spare element package.

[0110] The adhesive layer formation step may include an adhesive layer placement step of placing an adhesive layer on the lower surface of the spare element package, and a plasma treatment step of plasma treatment of the lower surface of the spare element package on which the adhesive layer is placed.

[0111] The adhesive layer applied in the adhesive layer formation step may be the adhesive layer described above. A detailed explanation of the adhesive layer will be omitted as it will be redundant with the previous explanation.

[0112] Adhesive layer placement process During the adhesive layer placement process, the adhesive layer can be placed on the lower surface of the spare element package. The adhesive layer may be placed beneath the first sealing layer. At least a portion of the adhesive layer may be placed in contact with the lower surface of the first sealing layer. At least a portion of the adhesive layer may be placed beneath the element. In the spare element package, if at least a portion of the lower surface of the element is exposed to the outside, at least a portion of the adhesive layer may be placed in contact with the lower surface of the element.

[0113] The adhesive layer can be formed such that the ratio of the area of ​​the adhesive layer to the area of ​​the lower surface of the spare element package is 15% or more. The ratio may be 20% or more. The ratio may be 25% or more. The ratio may be 30% or more. The ratio may be 35% or more. The ratio may be 40% or more. The ratio may be 45% or more. The ratio may be 50% or more. The ratio may be 80% or less. The ratio may be 70% or less.

[0114] In such cases, the adhesive layer can contribute to the stable fixing and adhesion of the first sealing layer and the second sealing layer.

[0115] The adhesive layer may include any one selected from the group consisting of silicone-based adhesives, epoxy-based adhesives, acrylic-based adhesives, and combinations thereof. Such adhesives can have improved adhesive strength due to the plasma treatment process, and the modification of the adhesive material due to the plasma treatment process can be stably suppressed.

[0116] Silicone-based adhesives, epoxy-based adhesives, and acrylic-based adhesives can be applied without limitation, as long as they are commonly used in the field of adhesion.

[0117] The adhesive layer can be formed by attaching adhesive tape to the underside of a pre-packaged element, and then removing the substrate layer of the adhesive tape. For example, Tapex adhesive tape can be used.

[0118] Plasma treatment process During the plasma treatment process, the lower surface of the pre-installed element package on which the adhesive layer is placed can be plasma-treated. Through plasma treatment, the surface energy of the adhesive layer can be increased, thereby improving the bonding strength between the adhesive layer and the second sealing layer during the second sealing layer formation process. Furthermore, by also increasing the surface energy of the first sealing layer within the lower surface of the pre-installed element package, a chemical reaction between the composition for manufacturing the second sealing layer and the surface of the first sealing layer can be induced, contributing to the provision of a sealing layer with improved durability.

[0119] In the plasma treatment process, one of the following gases can be introduced as the atmospheric gas: oxygen gas, argon, nitrogen gas, or a combination thereof.

[0120] During the plasma processing process, the atmospheric gas may be introduced at a flow rate of 3 sccm or more. The atmospheric gas may be introduced at a flow rate of 5 sccm or more. The atmospheric gas may be introduced at a flow rate of 30 sccm or less. The atmospheric gas may be introduced at a flow rate of 20 sccm or less.

[0121] In the plasma processing process, the plasma power may be 1W or more. The plasma power may be 3W or more. The plasma power may be 5W or more. The plasma power may be 30W or less. The plasma power may be 25W or less. The plasma power may be 20W or less.

[0122] The plasma treatment process may be performed for 5 seconds or more. The plasma treatment process may be performed for 7 seconds or more. The plasma treatment process may be performed for 10 seconds or more. The plasma treatment process may be performed for 60 seconds or less. The plasma treatment process may be performed for 40 seconds or less.

[0123] In such cases, excessive damage to the surfaces of the adhesive layer and the first sealing layer caused by plasma treatment can be suppressed, and the durability of the sealing layer can be effectively improved.

[0124] Second sealing layer formation step In the second sealing layer formation step, a second sealing layer can be formed which is located below the lower surface of the preliminary element package on which the adhesive layer has been formed.

[0125] The second encapsulation layer can be formed from a composition for manufacturing the second encapsulation layer. Specifically, a preliminary element package with an adhesive layer formed on it can be placed in the internal space of the mold. The same mold used when forming the first encapsulation layer can be used.

[0126] Subsequently, the second sealing layer manufacturing composition can be injected into the internal space of the mold, filling the remaining portion of the internal space of the mold, excluding the portion occupied by the spare element package, with the second sealing layer manufacturing composition. The second sealing layer manufacturing composition can then harden to form the second sealing layer.

[0127] The composition for manufacturing the second sealing layer may include an epoxy resin and a curing agent. The epoxy resin and curing agent may be those described above. The description of the epoxy resin and curing agent is omitted as it will be redundant with the above.

[0128] The composition for manufacturing the second sealing layer may contain 0.3 equivalents or more of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the second sealing layer may contain 0.5 equivalents or more of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the second sealing layer may contain 0.7 equivalents or more of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the second sealing layer may contain 2 equivalents or less of curing agent per equivalent of epoxy groups in the epoxy resin. The composition for manufacturing the second sealing layer may contain 1.5 equivalents or less of curing agent per equivalent of epoxy groups in the epoxy resin.

[0129] The composition for manufacturing the second sealing layer may further contain a filler. The filler may be one of the fillers described above. The description of the composition and content of the filler is omitted as it is redundant with the above.

[0130] The composition for manufacturing the second sealing layer may contain a solvent. The solvent is not limited as long as it is generally applicable in the art. For example, the solvent may include aliphatic hydrocarbon solvents, aromatic hydrocarbon solvents, ethers, esters, and the like.

[0131] The composition for manufacturing the second sealing layer may further contain additives. The additives are not limited as long as they are generally applicable in the art. Exemplary examples of additives may include defoamers, coupling agents, flame retardants, surfactants, and the like.

[0132] When injecting the composition for manufacturing the second sealing layer into the mold, the temperature of the composition may be between 120°C and 250°C. The temperature may be 130°C or higher. The temperature may be 140°C or higher. The temperature may be 230°C or lower. The temperature may be 200°C or lower.

[0133] The composition for manufacturing the second sealing layer may be injected into the mold at a pressure of 3 MPa or higher. The composition for manufacturing the second sealing layer may be injected into the mold at a pressure of 4 MPa or higher. The composition for manufacturing the second sealing layer may be injected into the mold at a pressure of 5 MPa or higher. The composition for manufacturing the second sealing layer can be injected into the mold at a pressure of 20 MPa or lower.

[0134] Through this process, the formation of empty spaces within the second sealing layer can be effectively suppressed.

[0135] By lowering the temperature of the second sealing layer manufacturing composition placed in the internal space of the mold, the composition can harden and form the second sealing layer. The temperature of the second sealing layer manufacturing composition can be lowered over a period of 50 to 500 seconds.

[0136] A second sealing layer can be formed to provide an element package.

[0137] Electrical conductive layer formation step The manufacturing method of the element package in the embodiment may further include a conductive layer formation step, after the sealing layer formation step, in which conductive layers are formed on the first sealing layer and / or the second sealing layer.

[0138] The electrical conductive layer formation step may include a through-hole formation step of forming through-holes in the first sealing layer and / or second sealing layer in the thickness direction of the device package, and a step of forming an electrical conductive layer within the through-holes.

[0139] In the through-hole formation process, a resist film can be laminated on the surface of the sealing layer to which the hole pattern is to be transferred. After irradiating the resist film with exposure light in the pattern shape to be transferred, it can be developed to form a patterned resist film. The patterned resist film can be used as an etching mask to etch the sealing layer, and by removing the patterned resist film, the hole pattern can be transferred to the sealing layer.

[0140] The lamination, exposure, development, and stripping of resist films, as well as the etching of the sealing layer, can be applied without limitation, as long as they are commonly used in the field of packaging.

[0141] The electrical conductive layer within the through-hole may be formed using a dry or wet method.

[0142] The dry method involves sputtering in the region where the electrical conductive layer will be placed to form a seed layer, and then plating the region where the seed layer has been formed to form the electrical conductive layer. When forming the seed layer, metals such as titanium, chromium, and nickel may be sputtered, or the aforementioned metals and copper may be applied together during sputtering. Through sputtering, an anchoring effect occurs in which the surface on which the electrical conductive layer will be placed and the deposited metal particles interact, which can improve the adhesion of the electrical conductive layer.

[0143] The wet method involves applying a primer to the area where an electrical conductive layer needs to be formed, followed by the formation of a seed layer. The primer may contain compounds with functional groups such as amines. Depending on the desired degree of adhesion, the primer may contain both a compound with functional groups such as amines and a silane coupling agent. When using a silane coupling agent, the surface to be primed can be pre-treated with the silane coupling agent, and then a compound with amine groups can be applied to the pre-treated area to form the primer layer.

[0144] After forming a seed layer, a metal plating can be applied to form an electrically conductive layer. Copper plating may be applied during the formation of the electrically conductive layer, but is not limited to this. Before metal plating, parts of the seed layer or primer layer where the conductive layer formation is unnecessary can be deactivated, or parts where the conductive layer formation is necessary can be activated before plating. The activation or deactivation treatment method may include light irradiation treatment using a laser of a specific wavelength, chemical treatment, etc. However, after applying metal plating without applying activation or deactivation treatment, the electrically conductive layer can be etched and patterned according to a pre-designed shape.

[0145] The following examples will provide a more detailed explanation of the implementation through specific embodiments. These embodiments are merely illustrative to aid in understanding the implementation, and the scope of implementation is not limited to them.

[0146] Manufacturing example: Formation of element packages Example 1: After placing three elements in a mold, Resonaq's CEL-400ZHF epoxy molding compound composition was injected into the mold and cured to form a first sealing layer surrounding the top and sides of the elements, thereby providing a spare element package. When injecting the composition for manufacturing the first sealing layer, the temperature of the composition was set to 175°C, the molding pressure to 7.5 MPa, and the pressurization time to 60 seconds. The composition was then cooled and cured for 180 seconds. The thickness of the first sealing layer formed on the elements was set to 30 μm.

[0147] After removing the spare element package from the mold, TAPEX's silicone-based adhesive tape was applied to the bottom surface of the spare element package. Then, the base layer of the adhesive tape was removed to form an adhesive layer. The adhesive layer was formed to cover 50% of the total area of ​​the bottom surface of the spare element package.

[0148] After the bonding layer was formed, the underside of the spare element package was plasma-treated. For the plasma treatment, argon gas was introduced at a flow rate of 10 sccm, and the plasma power was set to 10 W for 20 seconds.

[0149] After plasma treatment, a spare element package was placed in the mold. The spare element package was positioned with its bottom surface facing upwards. A encapsulation layer manufacturing composition was injected onto the bottom surface of the spare element package and cured to form a second encapsulation layer, and the element package was then placed. The manufacturing conditions for forming the second encapsulation layer were the same as those for forming the first encapsulation layer. The thickness of the second encapsulation layer formed beneath the element was set to 30 μm.

[0150] Example 2: The element package was prepared under the same conditions as in Example 1, except that Tapex's epoxy adhesive tape was used as the adhesive layer.

[0151] Example 3: The element package was prepared under the same conditions as in Example 1, except that Tapex's acrylic adhesive tape was used as the adhesive layer.

[0152] Comparative Example 1: The element package was prepared under the same conditions as in Example 1, except that an adhesive layer and plasma treatment were not applied.

[0153] Comparative Example 2: The element package was prepared under the same conditions as in Example 1, except that a polyurethane adhesive tape from Tapex was used as the adhesive layer.

[0154] Comparative Example 3: The element package was prepared under the same conditions as in Example 1, except that plasma treatment was not applied.

[0155] Comparative Example 4: The element package was prepared under the same conditions as in Example 2, except that plasma treatment was not applied.

[0156] The process conditions for each example and comparative example are shown in Table 1 below.

[0157] Evaluation example: Reliability evaluation The element packages for each example and comparative example were subjected to JEDEC MSL-3 testing under uHAST conditions. Specifically, the element packages were left at 130°C in an 85RH atmosphere for 96 hours.

[0158] Subsequently, the cross-section of the packaging substrate was observed with an optical microscope to evaluate whether delamination occurred between the first and second sealing layers, whether cracks occurred in the sealing layers, and whether chemical modification occurred in the adhesive layer.

[0159] When evaluating whether or not delamination occurred, a rating of P was given if no delamination was detected, and an F rating was given if delamination occurred.

[0160] When evaluating whether or not cracks had occurred in the sealing layer, a rating of P was given if no cracks were found, and an F rating was given if cracks were found.

[0161] When evaluating whether chemical degradation of the adhesive layer had occurred, a rating of P was given if no discoloration of the adhesive layer was detected, and an F rating was given if discoloration of the adhesive layer was detected.

[0162] The evaluation results for each example and comparative example are shown in Table 2 below.

[0163] [Table 1]

[0164] [Table 2]

[0165] In the evaluation of the presence or absence of peeling in Table 2, Examples 1 to 3 were evaluated as P, while Comparative Example 1 was evaluated as F.

[0166] In the evaluation of whether or not cracks occurred, Examples 1-3 were rated as P, while Comparative Examples 3 and 4 were rated as F.

[0167] In the evaluation of whether or not the adhesive layer was modified, Examples 1-3 were evaluated as P, while Comparative Example 2 was evaluated as F.

[0168] Although preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto. Various modifications and improvements by those skilled in the art, utilizing the basic concepts of the present invention as defined in the appended claims, also fall within the scope of the present invention. [Explanation of Symbols]

[0169] 100-element package 10 elements 20 sealing layer 21. First sealing layer 22 Second sealing layer 30 Adhesive layer 200 Packaging substrates 50 core layers 51 Cavity section 511 Element Package Mounting Space 512 Cavity interior

Claims

1. It includes one or more elements and a sealing layer surrounding the elements, The sealing layer includes a first sealing layer surrounding the upper surface of the element, and a second sealing layer disposed below the first sealing layer. An element package further comprising an adhesive layer disposed between the first sealing layer and the second sealing layer.

2. The element package according to claim 1, wherein at least a portion of the adhesive layer is disposed in contact with the lower surface of the first sealing layer.

3. The element package according to claim 1, wherein the ratio of the area of ​​the adhesive layer to the area of ​​the lower surface of the element package is 15% or more.

4. The element package according to claim 1, wherein the adhesive layer comprises one selected from the group consisting of a silicone adhesive, an epoxy adhesive, an acrylic adhesive, and a combination thereof.

5. Including a first point located on the lower surface of the element and a second point located on the lower surface of the second sealing layer, The element package according to claim 1, wherein the minimum distance between the first point and the second point is 5 μm to 100 μm.

6. It includes a core layer and a cavity portion which is a space formed by recessing a part of the upper surface of the core layer. A packaging substrate including the element package according to claim 1, disposed in the cavity portion.

7. A preliminary element package preparation step includes providing a preliminary element package comprising one or more elements and a first sealing layer surrounding the upper surface of the elements, The adhesive layer forming step involves forming an adhesive layer that is placed on the lower surface of the aforementioned spare element package, A method for manufacturing an element package, comprising: a second sealing layer forming step of manufacturing an element package by forming a second sealing layer disposed below the lower surface of the preliminary element package on which the adhesive layer has been formed.

8. The method for manufacturing an element package according to claim 7, wherein the adhesive layer formation step includes an adhesive layer placement step of placing an adhesive layer on the lower surface of the spare element package, and a plasma treatment step of plasma treatment of the lower surface of the spare element package on which the adhesive layer is placed.

9. The method for manufacturing an element package according to claim 7, wherein in the adhesive layer forming step, at least a portion of the adhesive layer is formed so as to be in contact with the lower surface of the element.

10. The method for manufacturing an element package according to claim 7, wherein in the adhesive layer forming step, the adhesive layer is formed such that the ratio of the area of ​​the adhesive layer to the area of ​​the lower surface of the spare element package is 15% or more.

11. The method for manufacturing an element package according to claim 7, wherein the adhesive layer comprises one selected from the group consisting of a silicone adhesive, an epoxy adhesive, an acrylic adhesive, and a combination thereof.

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