substrate holding device

Abstract

To provide a substrate holding device that suppresses substrate contamination. [Solution] The substrate holding device 20 includes an outer casing member 221 having a hand portion 21 for holding a substrate W, an elastic ring-shaped first member 221a provided on the hand portion, and a ring-shaped second member 221b provided at the upper end of the first member and having higher rigidity than the first member; a contact member 222 provided in the region surrounded by the outer casing member and having a contact portion 222b that contacts a part of the substrate; and a suction mechanism 223 that creates a vacuum suction within the closed space CS defined by the substrate and the outer casing member when the substrate contacts the upper surface of the second member.

Description

[Technical Field]

[0001] The present invention relates to a substrate holding apparatus. [Background Art]

[0002] There has been known a work stage including a sealing elastic body that can perform vacuum suction even on a workpiece having large warpage (for example, Patent Document 1). When a sealing elastic body is used as in Patent Document 1, if a workpiece (wafer) comes into contact with the elastic body, the elastic body may generate dust and contaminate the wafer. [Prior Art Literature] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Laying-Open No. 2010-197415 [Summary of Invention]

[0004] According to a first aspect of the disclosure, a substrate holding apparatus includes a suction mechanism including: an outer member having a hand portion that holds a substrate, an elastic ring-shaped first member provided on the hand portion, and a ring-shaped second member provided at an upper end portion of the first member and having higher rigidity than the first member; a contact member provided in a region surrounded by the outer member and having a contact portion that comes into contact with a part of the substrate; and a suction mechanism that vacuum-sucks the inside of a closed space defined by the substrate and the outer member when the substrate comes into contact with an upper surface of the second member.

[0005] It should be noted that the configurations of the embodiments described below may be modified as appropriate, or at least a part thereof may be replaced with other configurations. Furthermore, constitutional elements with no particular limitation on their arrangement are not limited to the arrangement disclosed in the embodiments, and can be arranged at positions where their functions can be achieved. [Brief Description of Drawings]

[0006] [Figure 1] FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus according to an embodiment. [Figure 2] Figure 2(A) is a perspective view of the substrate holder, and Figure 2(B) is an enlarged view of the area enclosed by the dotted line in Figure 2(A). [Figure 3] Figure 3(A) is a plan view of the substrate holding device as seen from the +Z direction, Figure 3(B) shows the substrate holding device with the suction mechanism removed, and Figure 3(C) is a cross-sectional view of Figure 3(A) along line AA. [Figure 4] Figure 4(A) is a plan view of the first member, Figure 4(B) is a cross-sectional view of Figure 4(A) along line AA, Figure 4(C) is a plan view of the second member, and Figure 4(D) is a cross-sectional view of Figure 4(C) along line BB. [Figure 5] Figure 5 shows a closed space CS defined by the wafer and the outer casing member. [Figure 6] Figure 6 shows the wafer being held at three points. [Figure 7] Figures 7(A) to 7(C) are cross-sectional views showing the configuration of the adsorption mechanism according to modified examples 1 to 3, respectively. [Figure 8] Figure 8 is a cross-sectional view showing the configuration of the adsorption mechanism according to Modified Example 4. [Figure 9] Figures 9(A) and 9(B) show the configuration of the adsorption mechanism according to Modification 5, and Figure 9(C) shows another example of the configuration of the adsorption mechanism according to Modification 5. [Modes for carrying out the invention]

[0007] Figure 1 is a schematic diagram showing the configuration of the exposure apparatus EX according to this embodiment. The exposure apparatus EX according to this embodiment is a step-and-scan type projection exposure apparatus, that is, a so-called scanner. However, the exposure apparatus EX may also be a step-and-repeat type projection exposure apparatus, that is, a so-called repeater.

[0008] As shown in Figure 1, the exposure apparatus EX comprises an apparatus body 100 and a substrate transport apparatus 200.

[0009] (Configuration of the main unit of the device) The main body of the apparatus 100 includes an illumination unit ILU, a reticle stage RST that holds the reticle R, a projection unit PLU, and a wafer stage WST that holds the wafer W. In the following description, the direction parallel to the optical axis AX of the projection unit PLU will be referred to as the Z-axis direction, the direction in which the reticle R and wafer W are scanned relative to each other in a plane perpendicular to this will be referred to as the Y-axis direction, and the direction perpendicular to the Z-axis and Y-axis will be referred to as the X-axis direction. The rotation (tilting) directions around the X-axis, Y-axis, and Z-axis will be referred to as the θx, θy, and θz directions, respectively.

[0010] The illumination unit ILU includes a light source, an illumination homogenization optical system including an optical integrator, and an illumination optical system having a reticle blind, etc. (none of which are shown in the illustration), as disclosed in, for example, U.S. Patent Application Publication No. 2003 / 0025890. The illumination unit ILU illuminates a slit-shaped illumination area IAR on a reticle R, which is set (restricted) by a reticle blind (also called a masking system), with a nearly uniform illumination intensity by illumination light (exposure light) IL. Here, ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or KrF excimer laser light (wavelength 248 nm) is used as the illumination light IL.

[0011] The reticle stage RST holds the reticle R, which is illuminated by the exposure illumination light (hereinafter abbreviated as illumination light) IL from the illumination unit ILU, and moves in a predetermined scanning direction (here, the Y-axis direction in Figure 1).

[0012] The reticle stage RST holds a reticle R, on which a circuit pattern or the like is formed on the pattern surface (the -Z side surface in Figure 1), for example by vacuum suction. The reticle stage RST can be driven in the scanning direction (Y-axis direction) with a predetermined stroke, and can also be driven minutely in the X-axis and θz directions, by a reticle stage drive system (not shown) including, for example, a linear motor. The position information of the reticle stage RST in the XY plane (including rotation amount information in the θz direction) is constantly measured with a predetermined resolution, for example, a resolution of about 0.25 nm, by a reticle stage position measurement system (not shown) including, for example, a laser interferometer system (or encoder system), and the measured values ​​are transmitted to a control device (not shown). The control device controls the position (and speed) of the reticle stage RST in the X-axis direction, Y-axis direction and θz direction (rotation direction around the Z-axis) via the reticle stage drive system based on the measured values ​​of the reticle stage position measurement system.

[0013] The projection unit PLU is located below (-Z side) the reticle stage RST. The projection unit PLU includes a lens barrel BR and a projection optical system PL held within the lens barrel BR. As the projection optical system PL, for example, a refractive optical system consisting of multiple optical elements (lens elements) arranged along the optical axis AX is used. The projection optical system PL is, for example, bilaterally telecentric and has a predetermined projection magnification (e.g., 1 / 4x, 1 / 5x, or 1 / 8x).

[0014] Therefore, when the illumination region IAR on the reticle R is illuminated by the illumination light IL from the illumination unit ILU, the illumination light IL that has passed through the reticle R, where the first surface (object surface) and the pattern surface of the projection optical system PL are positioned in approximately coincidence, forms a reduced image of the circuit pattern of the reticle R within the illumination region IAR (a reduced image of a part of the circuit pattern) in a region IA (hereinafter also called the exposure region) on the wafer W, which is coated with a resist (sensitive agent) and positioned on the second surface (image surface) side of the projection optical system PL, that is conjugate to the illumination region IAR. Then, through the synchronous drive of the reticle stage RST and the wafer stage WST, the reticle R moves relative to the illumination region IAR (illumination light IL) in the scanning direction, and the wafer W moves relative to the exposure region IA (illumination light IL) in the scanning direction, thereby performing scanning exposure of one shot region (partition region) on the wafer W, and transferring the pattern of the reticle R to that shot region. Furthermore, the exposure apparatus EX may be a so-called immersion exposure apparatus, which performs the exposure operation with a liquid (e.g., pure water) filled between the projection unit PLU and the wafer W.

[0015] (Configuration of the substrate transport device) The substrate transport device 200 transports the wafer W (substrate) to the wafer stage WST. The substrate transport device 200 includes a substrate holding device 20 for holding the wafer W, an arm portion 201 that supports and moves the substrate holding device 20, and a drive unit (not shown) for driving the arm portion 201.

[0016] Figure 2(A) is a perspective view of the substrate holding device 20, and Figure 2(B) is an enlarged view of the area enclosed by the dotted line in Figure 2(A). Figure 3(A) is a plan view of the substrate holding device 20 as seen from the +Z direction.

[0017] As shown in Figure 2(A), the substrate holding device 20 comprises a hand portion 21 and a suction mechanism 22. Figure 3(B) shows the substrate holding device 20 with the suction mechanism 22 removed, and Figure 3(C) is a cross-sectional view taken along line AA in Figure 3(A). In Figure 3(C), the direction parallel to line AA is defined as the X1 direction, and the direction perpendicular to the X1 and Z directions is defined as the Y1 direction.

[0018] The hand portion 21 holds a wafer W. The hand portion 21 is, for example, a plate-shaped member made of ceramic, and in the present embodiment, as shown in FIG. 3(B), has a substantially Y-shape in a plan view. The planar shape of the hand portion 21 is not limited to a Y-shape, and any shape that can hold the wafer W with good weight balance is acceptable.

[0019] As shown in FIG. 3(B), a ring-shaped (annular in the present embodiment) recessed portion 211 is formed on the upper surface of the hand portion 21. As shown in FIG. 3(C), the recessed portion 211 is a so-called dovetail groove having a shape in which the width of the opening on the +Z side is smaller than the width of the bottom portion.

[0020] Further, as shown in FIG. 3(B) and FIG. 3(C), a suction port 212 is formed in a region surrounded by the ring-shaped recessed portion 211. The suction port 212 is connected to a suction pipe line 223b provided in a suction mechanism 223 described later.

[0021] The suction mechanism 22 contacts a part of the back surface (the surface on the -Z side) of the wafer W to position and support the wafer W. The suction mechanism 22 generates a suction force on the wafer W by negative pressure.

[0022] In the present embodiment, the substrate holding device 20 includes three suction mechanisms 22. The number of suction mechanisms 22 included in the substrate holding device 20 is not limited to three, and as long as there is a plurality of suction mechanisms, the number may be two, or four or more.

[0023] As shown in FIG. 3(C), the suction mechanism 22 includes: an outer shell member 221; a contact member 222 provided in a region surrounded by the outer shell member 221 and configured to contact a part of the wafer W; and a suction mechanism 223 configured to vacuum-suck the inside of a closed space defined by the wafer W and the outer shell member 221.

[0024] The outer casing member 221 includes an elastic, ring-shaped (annular in this embodiment) first member 221a provided on the hand portion 21, and a ring-shaped (annular in this embodiment) second member 221b provided at the upper end of the first member 221a and having higher rigidity than the first member 221a.

[0025] Figure 4(A) is a plan view of the first member 221a, and Figure 4(B) is a cross-sectional view of Figure 4(A) along line AA. Figure 4(C) is a plan view of the second member 221b, and Figure 4(D) is a cross-sectional view of Figure 4(C) along line BB.

[0026] In this embodiment, the first member 221a is a conductive rubber member. As shown in Figure 4(B), the width W1 of the lower end of the first member 221a is greater than the width W2 of the upper end. As shown in Figure 3(C), the lower end of the first member 221a is inserted into a recess 211 formed in the hand portion 21. This fixes the first member 221a to the hand portion 21. By fitting the lower end of the first member 221a into the recess 211, the first member 221a can be fixed to the hand portion 21 without using adhesive, and the outer member 221 can be easily replaced if it becomes necessary to replace it. In addition, unfavorable tensile stress is less likely to be applied to the rubber first member 221a.

[0027] The second member 221b is made of silicon carbide (SiC). As shown in Figure 4(D), a recess R1 is formed on the lower surface of the second member 221b. As shown in Figure 3(C), the first member 221a and the second member 221b are vulcanized and bonded together with the upper end of the first member 221a inserted into the recess R1 of the second member 221b. Vulcanization bonding is a method of bonding unvulcanized rubber to other members (such as metal or resin) in the mold at the same time as the vulcanization of the rubber, and it can bond more strongly than fixing the vulcanized rubber to other members (second member 221b) with adhesive.

[0028] As shown in Figure 3(C), the contact member 222 has a base portion 222a and a contact portion 222b. A through hole 222c is formed in the center of the contact member 222, which communicates with the suction port 212 formed in the hand portion 21. In this embodiment, the contact member 222 is made of SiC.

[0029] As shown in Figure 3(C), the base portion 222a is the part that is bonded to the hand portion 21.

[0030] The contact portion 222b is the part that contacts a portion of the wafer W. In this embodiment, as shown in Figure 2(B), the contact portion 222b has a plurality of protrusions 222d that project in the +Z direction from its upper surface. Since adjacent protrusions 222d are spaced apart in the circumferential direction, an air passage is formed between adjacent protrusions 222d.

[0031] As shown in Figure 3(C), when the wafer W is not held by the hand portion 21, the upper surface of the second member 221b is higher than the uppermost surface of the contact portion 222b (the upper surface of the protruding portion 222d). Therefore, when the hand portion 21 holds the wafer W, the wafer W first comes into contact with the upper surface of the second member 221b.

[0032] The suction mechanism 223 includes a suction device 223a and a suction conduit 223b. The suction device 223a is, for example, a suction pump, and when the hand portion 21 holds the wafer W, it creates a vacuum suction within the closed space defined by the wafer W and the outer member 221. Figure 5 shows the closed space CS defined by the wafer W and the outer member 221. When the hand portion 21 holds the wafer W, the suction device 223a sucks the air from the closed space CS as indicated by the arrow AR1. As a result, the closed space CS becomes negative pressure and the wafer W is attracted. Due to the attraction of the wafer W, the first member 221a of the outer member 221 deforms, and the wafer W and the protruding portion 222d of the contact member 222 come into contact at least at one point. As a result, a contact friction force is generated between the wafer W and the protruding portion 222d. The suction device 223a may also perform the suction operation when the hand portion 21 is not holding the wafer W.

[0033] In this embodiment, the hand portion 21 is provided with three suction mechanisms 22 (see, for example, Figure 3(A)). Therefore, at each of the three suction mechanisms 22, the wafer W and the protruding portion 222d of the contact member 222 make contact at at least one point. As a result, as shown in Figure 6, contact friction force is generated at three points P1, P2, and P3 within the wafer W, allowing the wafer W to be positioned and held stably. Furthermore, since the second member 221b and the contact member 222 of the outer member 221 that come into contact with the wafer W are made of SiC, dust generation from the second member 221b and the contact member 222 can be suppressed to contaminate the wafer W.

[0034] As described in detail above, according to this embodiment, the substrate holding device 20 includes a handle portion 21 for holding the wafer W, an outer casing member 221 having an elastic ring-shaped first member 221a provided on the handle portion 21 and a ring-shaped second member 221b provided at the upper end of the first member 221a and having higher rigidity than the first member 221a, a contact member 222 provided in the region surrounded by the outer casing member 221 and having a contact portion 222b that contacts a part of the wafer W, and a suction mechanism 222 including a suction mechanism 223 that creates vacuum suction within the closed space CS defined by the wafer W and the outer casing member 221 when the wafer W contacts the upper surface of the second member 221b. By creating vacuum suction within the closed space CS defined by the wafer W and the outer casing member 221, the contact member 222 and a part of the wafer W come into contact, generating a contact friction force, and the wafer W can be positioned. This allows the wafer W to be held stably. Furthermore, since the second member 221b has higher rigidity than the first member 221a, it is possible to suppress contamination of the wafer W by dust generation compared to the case where only the first member 221a is used as the outer shell member 221.

[0035] Furthermore, in this embodiment, the second member 221b and the contact member 222 are made of silicon carbide (SiC). This suppresses dust generation from the second member 221b and the contact member 222 that come into contact with the wafer W, thereby preventing contamination of the wafer W.

[0036] Furthermore, in this embodiment, the first member 221a and the second member 221b are vulcanized and bonded together. This allows for a stronger bond between the first member 221a and the second member 221b than when using an adhesive.

[0037] Furthermore, in this embodiment, the contact portion 222b has a protruding portion 222d, and the protruding portion 222d contacts a part of the wafer W. The contact portion 222b does not necessarily have to have a protruding portion 222d. However, providing the protruding portion 222d ensures that the contact portion 222b and a part of the wafer W make reliable contact.

[0038] Furthermore, in this embodiment, when the wafer W is not held by the hand portion 21, the upper surface of the second member 221b is higher than the uppermost surface of the protruding portion 222d. As a result, when the hand portion 21 holds the wafer W, the upper surface of the second member 221b first comes into contact with the wafer W, and a closed space CS is formed between the wafer W and the outer casing member 221. This allows the suction mechanism 223 to draw in the closed space CS and generate negative pressure.

[0039] Furthermore, in this embodiment, multiple protrusions 222d are provided. Since an air passage is formed between adjacent protrusions 222d in the radial direction, the suction mechanism 223 can draw in the closed space CS, and even if the wafer W comes into contact with the protrusions 222d, the negative pressure in the closed space CS can be suppressed.

[0040] Furthermore, in this embodiment, the hand portion 21 has a ring-shaped recess 211 on its upper surface, and the lower end of the first member 221a is inserted into the recess 211. This allows the first member 221a to be fixed to the hand portion 21 without using adhesive, and the outer casing member 221 can be easily replaced if necessary.

[0041] Furthermore, in this embodiment, the recess 211 is a dovetail groove. Since the width of the opening on the +Z side of the recess 211 is smaller than the width of the bottom, the first member 221a is less likely to come off. This makes it possible to achieve high joint strength between the first member 221a and the hand portion 21.

[0042] Furthermore, in this embodiment, the recess 211 of the hand portion 21 is formed in an annular shape. Also, the first member 221a and the second member 221b of the outer member 221 are annular. As a result, when the hand portion 21 holds a wafer W that has a curve, the area in contact between the wafer W and the second member 221b can be increased compared to other shapes.

[0043] (Variation 1) The configuration of the adsorption mechanism 22 is not limited to the above embodiment. Figure 7(A) is a cross-sectional view showing the configuration of the adsorption mechanism 22A according to Modification 1. Note that the cross-section in Figure 7(A) corresponds to the cross-section along line AA in Figure 3(A).

[0044] In the above embodiment, the outer diameter of the base portion 222a of the contact member 222 was the same as the outer diameter of the contact portion 222b. However, in modified example 1, the outer diameter of the base portion 222aA of the contact member 222A is larger than the outer diameter of the contact portion 222b. Therefore, the base portion 222aA has a flat portion on the outside of the contact portion 222b.

[0045] In the modified example 1, the hand portion 21A does not have a ring-shaped recess; instead, a ring-shaped recess 222e is formed on the flat portion of the base portion 222aA of the contact member 222A. The recess 222e is a dovetail groove.

[0046] In the modified example 1, the outer shell member 221 is fixed to the contact member 222A by fitting the lower end of the first member 221a of the outer shell member 221 into the recess 222e provided in the contact member 222A. The other configurations are the same as in the above embodiment, so a detailed explanation is omitted.

[0047] (Modification 2) Figure 7(B) is a cross-sectional view showing the configuration of the adsorption mechanism 22B according to modified example 2. Note that the cross-section in Figure 7(B) corresponds to the cross-section along line AA in Figure 3(A).

[0048] In Modification 2, as in Modification 1, the outer diameter of the base portion 222aB of the contact member 222B is larger than the outer diameter of the contact portion 222bB. Therefore, the base portion 222aB has a flat portion on the outside of the contact portion 222bB. However, the difference between the outer diameter of the base portion 222aB and the outer diameter of the contact portion 222bB is smaller than in Modification 1.

[0049] In Modification 2, similar to Modification 1, the hand portion 21A does not have a ring-shaped recess. Also, the base portion 222aB of the contact member 222B does not have a ring-shaped recess. In Modification 2, the first member 221aB of the outer casing member 221B is fixed to the base portion 222aB and the contact portion 222bB of the contact member 222B by adhesive. The upper part of the first member 221aB of the outer casing member 221B has a mortar-like shape. The ring-shaped second member 221bB is vulcanized and bonded to the upper end of the first member 221aB.

[0050] The other components are the same as those in the above embodiment, so a detailed explanation is omitted.

[0051] (Variation 3) Figure 7(C) is a cross-sectional view showing the configuration of the adsorption mechanism 22C according to the modified example 3. Note that the cross-section in Figure 7(C) corresponds to the cross-section along line AA in Figure 3(A).

[0052] In Modification 3, similar to Modifications 1 and 2, the hand portion 21A does not have a ring-shaped recess. In Modification 3, the first member 221aC of the outer casing member 221C is fixed to the upper surface of the hand portion 21A by adhesive. In Modification 3, the outer diameter of the first member 221aC of the outer casing member 221C increases the further it is from the hand portion 21A. That is, the first member 221aC of the outer casing member 221C has a mortar-like shape. The ring-shaped second member 221bC is vulcanized and bonded to the upper end of the first member 221aC.

[0053] Thus, the first member 221aC of the outer casing member 221C may be fixed to the upper surface of the hand portion 21A by adhesive.

[0054] The other components are the same as those in the above embodiment, so a detailed explanation is omitted.

[0055] Even if the adsorption mechanisms 22A to 22C according to Modified Examples 1 to 3 are used instead of the adsorption mechanism 22 according to the embodiment, the protruding portion 222d and the wafer W can be brought into contact at least at one point in each adsorption mechanism 22A to 22C. This allows the wafer W to be positioned by contact friction force. Furthermore, since the contact members 222A and 222B and the second members 221bB and 221bC are made of SiC, contamination of the wafer by dust generation can be suppressed.

[0056] (Modification 4) Figure 8 is a cross-sectional view showing the configuration of the adsorption mechanism 22D according to the modified example 4. In the above embodiment, the first member 221a was a conductive rubber member, but the rubber member of the first member 221a does not have to be conductive. In this case, the first member 221a may become charged, and the wafer W may become charged. If the wafer W becomes charged, dust may adhere to the wafer W, and devices already formed on the wafer W may be damaged by static electricity.

[0057] Therefore, in Modification 4, as shown in Figure 8(A), the second member 221b and the hand portion 21 are connected by a conductive wire 224 (conductive member). This electrically connects the second member 221b and the hand portion 21, thereby suppressing the charging of the wafer W. The same applies to Modifications 1 to 3.

[0058] The other components are the same as in the embodiment, so a detailed explanation is omitted.

[0059] (Variation 5) In the above embodiment, the contact member 222 had a donut shape in plan view with a through hole 222c in the center, but it is not limited to this. Figures 9(A) to 9(C) show the configuration of the adsorption mechanism 22E according to modified example 5. Figure 9(A) is a top view of the adsorption mechanism 22E, Figure 9(B) is a cross-sectional view of line AA of Figure 9(A), and Figure 9(C) is a top view showing another example of the adsorption mechanism 22E.

[0060] As shown in Figure 9(A), in the modified example 5, a plurality of pin-shaped contact members 222E are provided within the region surrounded by the outer member 221. As shown in Figure 9(B), the contact member 222E has a base portion 222aE that is adhered to the hand portion 21 and a contact portion 222bE that contacts a part of the wafer W. The contact portion 222bE of the contact member 222E may or may not have a protrusion. It is sufficient that the contact portion 222bE of at least one of the plurality of contact members 222E makes contact with a part of the wafer W.

[0061] Furthermore, the contact members 222E may be arranged in a matrix pattern as shown in Figure 9(C), rather than in a concentric circle pattern as shown in Figure 9(A). Also, as shown in Figure 9(C), the suction port 212 of the hand portion 21 may be located at any position other than the center, as long as it is within the area surrounded by the outer casing member 221. The same applies to the above embodiment and its modified forms. The other configurations are the same as in the embodiment, so a detailed explanation is omitted.

[0062] In the above embodiments and modifications, the case in which the substrate holding device 20 holds the wafer W was described, but the substrate holding device 20 may, for example, hold the reticle R.

[0063] Furthermore, in the above embodiment, the recess 211 formed in the hand portion 21 and the first member 221a and second member 221b of the outer member 221 were annular in shape, but the shape of the recess 211 of the hand portion 21 and the first member 221a and second member 221b of the outer member 221 is not limited to this. As long as a closed space CS can be defined by the outer member 221 and the wafer W in contact with the second member 221b, the recess 211 formed in the hand portion 21 and the first member 221a and second member 221b of the outer member 221 may have polygonal shapes including triangular and quadrilateral shapes, or they may have elliptical shapes.

[0064] The embodiments and modifications described above are preferred examples of the present invention. However, the invention is not limited thereto, and various modifications can be made without departing from the spirit of the invention. Furthermore, the embodiments and modifications can be combined with each other as appropriate. [Explanation of symbols]

[0065] 20 Substrate holding device 21,21A Hand section 22,22A,22B,22C,22D,22E Adsorption mechanism 211 Recess 221, 221B, 221C Outer enclosure members 222, 222A, 222B, 222E Contact Members 222a, 222aA, 222aB, 222aE Base section 222b,222bE Contact part 222d Protrusion 222e recess 223 Suction mechanism W wafer

Claims

1. A handle that holds the circuit board, An outer shell member having an elastic ring-shaped first member provided on the hand portion, and a ring-shaped second member provided at the upper end of the first member and having higher rigidity than the first member, A contact member provided in the region surrounded by the outer casing member and having a contact portion that contacts a part of the substrate, A suction mechanism that creates a vacuum in the closed space defined by the substrate and the outer casing member by the substrate contacting the upper surface of the second member, Adsorption mechanism including, A substrate holding device equipped with the following features.

2. The second member and the contact member are made of silicon carbide. The substrate holding device according to claim 1.

3. The first member and the second member are vulcanized and bonded together. A substrate holding device according to claim 1 or claim 2.

4. The contact portion has a protruding portion, The protruding portion contacts a part of the substrate. A substrate holding device according to any one of claims 1 to 3.

5. Multiple protrusions are provided. The substrate holding device according to claim 4.

6. When the substrate is not held in the hand portion, the upper surface of the second member is positioned higher than the uppermost surface of the contact portion. A substrate holding device according to any one of claims 1 to 5.

7. The aforementioned hand portion has a ring-shaped recess on its upper surface, The lower end of the first member is inserted into the recess. A substrate holding device according to any one of claims 1 to 6.

8. The aforementioned recess is a dovetail groove. The substrate holding device according to claim 7.

9. The contact member comprises a base portion fixed to the upper surface of the hand portion, The outer casing member is fixed to the base portion. A substrate holding device according to any one of claims 1 to 6.

10. The base portion has a ring-shaped recess on its upper surface, The lower end of the first member is inserted into the recess. The substrate holding device according to claim 9.

11. The aforementioned recess is a dovetail groove. The substrate holding device according to claim 10.

12. Multiple adsorption mechanisms are provided. A substrate holding device according to any one of claims 1 to 11.

13. The second member and the hand portion are electrically connected by a conductive member. A substrate holding device according to any one of claims 1 to 12.

14. The aforementioned ring shape is annular. A substrate holding device according to any one of claims 1 to 13.

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