Positioning device, exposure device, air sensor, and method for manufacturing articles.

Abstract

This technology offers advantages in preventing collisions between the air sensor and the substrate being measured. [Solution] The positioning device for positioning a substrate comprises a substrate stage mechanism for driving the substrate, a measuring instrument for measuring the height of the substrate, an air sensor for measuring the height of the substrate based on the pressure in the pipeline while discharging air through the pipeline, and a control unit for controlling the substrate stage mechanism. The measurement range, which is the range of height that can be measured by the air sensor, is narrower than the range of height that can be measured by the measuring instrument. The control unit controls the substrate stage mechanism based on the output of the measuring instrument to bring the height of the measurement point on the substrate within the measurement range.

Description

[Technical Field]

[0001] The present invention relates to a positioning apparatus, an exposure apparatus, an air sensor, and a method for manufacturing an article. [Background Art]

[0002] Patent Document 1 describes a lithography projection apparatus including a first sensor that is a process-independent sensor such as an air micrometer, and a second sensor that is a process-dependent sensor. A measurement value obtained by the second sensor has a process-dependent offset error (PDOE) that may depend on a process. The lithography projection apparatus can perform scanning for a plurality of positions on a substrate by scanning the substrate directly below the first and second sensors. Using the measurement values obtained by the first and second sensors, a map storing the PDOE of the second sensor for each measured position on the substrate is generated. [Prior Art Document] [Patent Document]

[0003] [Patent Document 1] Japanese Patent Laid-Open No. 2010-109378 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] An air sensor is a sensor that measures the height or position of a measurement object based on the pressure in a pipe while discharging air through the pipe. When the distance between the outlet of the pipe and the measurement object (i.e., working distance) is large, the measurement accuracy and sensitivity decrease, and when the working distance is small, the measurement accuracy and sensitivity increase. Therefore, in order to achieve high measurement accuracy, it is necessary to reduce the working distance. However, reducing the working distance may cause a collision between the air sensor and the measurement object.

[0005] The present invention aims to provide a technology that is advantageous for preventing collisions between an air sensor and a substrate that is the object to be measured. [Means for solving the problem]

[0006] One aspect of the present invention relates to a positioning device for positioning a substrate, the positioning device comprising a substrate stage mechanism for driving the substrate, a measuring instrument for measuring the height of the substrate, an air sensor for measuring the height of the substrate based on the pressure in the pipeline while discharging air through the pipeline, and a control unit for controlling the substrate stage mechanism, wherein the measurement range, which is the range of height that can be measured by the air sensor, is narrower than the range of height that can be measured by the measuring instrument, and the control unit controls the substrate stage mechanism based on the output of the measuring instrument to bring the height of the measurement point on the substrate into the measurement range. [Effects of the Invention]

[0007] According to the present invention, an advantageous technique is provided for preventing collisions between the air sensor and the substrate, which is the object to be measured. [Brief explanation of the drawing]

[0008] [Figure 1A] A schematic diagram showing the configuration of an exposure apparatus according to one embodiment, which incorporates a height measuring device according to one embodiment. [Figure 1B] A schematic diagram showing the configuration of an exposure apparatus according to one embodiment, which incorporates a height measuring device according to one embodiment. [Figure 1C] A schematic diagram showing the configuration of an exposure apparatus according to one embodiment, which incorporates a height measuring device according to one embodiment. [Figure 2] A schematic diagram showing the top view of the circuit board stage. [Figure 3A] A schematic diagram showing a first configuration example of an air sensor. [Figure 3B] A schematic diagram showing a second configuration example of the air sensor. [Figure 4A] A diagram illustrating the measurement or positioning method in the comparative example. [Figure 4B]A diagram illustrating the measurement method or positioning method in the embodiment. [Figure 5] This diagram illustrates the procedure for driving the circuit board so that the measurement point on the board coincides with the center position (best focus position) of the height air sensor's detection range. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] Figures 1A, 1B, and 1C schematically show the configuration of one embodiment of an exposure apparatus EXP incorporating a positioning device PS of one embodiment. The exposure apparatus EPX may include an illumination optical system 62 for illuminating a master plate 61, and a projection optical system 3 for projecting the pattern of the master plate 61 onto the substrate 1. The exposure apparatus EXP may be configured to expose the substrate 1 by projecting the pattern of the master plate 61 onto the substrate 1 using the projection optical system 3. The exposure apparatus EPX may include a positioning device PS for positioning the substrate 1, an illumination optical system 62 for illuminating the substrate 1, a projection optical system 3 for projecting the pattern of the master plate 61 onto the substrate 1, an optical measuring instrument OM for measuring the height of the substrate 1, and a control unit 63.

[0011] The optical measuring instrument OM is, for example, an oblique incidence measuring instrument that irradiates light onto the surface of the substrate 1 and receives the reflected light from the substrate 1. Specifically, the optical measuring instrument OM may include a light projector 12 that projects patterned light onto the substrate 1 and a light receiver 13 that receives the reflected light from the substrate 1. In the optical measuring instrument OM, light is reflected not only from the outermost surface of the substrate 1 but also from the internal structure of the substrate 1 (structures existing below the outermost surface), so measurement errors dependent on the internal structure of the substrate 1 may occur. The control unit 63 may be composed of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a program installed, or a combination of all or part of these.

[0012] The exposure apparatus EXP or positioning apparatus PS may include a substrate stage mechanism SD that holds and drives the substrate 1, a measuring instrument 51 that measures the height of the substrate 1, and an air sensor 21 that measures the height of the substrate 1. The control unit 63 may function as a control unit that controls the positioning apparatus PS. The exposure apparatus EXP or positioning apparatus PS may include a measuring system MS that measures the position and orientation of the substrate stage 41, and can control the position and orientation of the substrate stage 41 based on the output of the measuring system MS. The measuring system MS may include, for example, a plurality of measuring instruments, including measuring instruments 42, 43. The measuring system MS may measure the substrate stage 41 in six axes using the plurality of measuring instruments. The positioning apparatus PS can control the substrate stage 41 in six axes based on the output of the measuring system MS. The plurality of measuring instruments may include, for example, a plurality of interferometers, a plurality of encoders, or one or more interferometers and one or more encoders.

[0013] The measuring instrument 51 is, for example, a measuring instrument that measures the height of the substrate 1 optically, electrostatically, or magnetically. In one example, the measuring instrument 51 may be a spectroscopic interferometric laser displacement meter. In another example, the measuring instrument 51 may be an oblique incidence measuring instrument that irradiates the substrate 1 with light and receives the reflected light from the substrate 1. The air sensor 21 may also be called an air microsensor. The air sensor 21 may be configured to measure the height of the substrate 1 with a resolution of the nanometer order or higher than 1 nm. The air sensor 21 may be configured to measure the surface height of the substrate 1 based on the pressure in the conduit while discharging air through the conduit. The measurement result by the air sensor 21 is not affected by the internal structure of the substrate 1.

[0014] The exposure apparatus EXP may include a reference plate 2 having a reference surface RS. The reference plate 2 may have reference marks whose position is detected by an alignment sensor (not shown) and may be placed on the substrate stage 41. The reference surface RS may be a flat surface. The measurement range, which is the range of heights that can be measured by the air sensor 21, is narrower than the range of heights that can be measured by the measuring instrument 51. The control unit 63 may operate to control the substrate stage mechanism SD based on the output of the measuring instrument 51 so that the height of the measurement point on the substrate 1 (surface) falls within the measurement range of the air sensor 21.

[0015] Figure 1A schematically shows the measurement of the height of the first measurement point on the substrate 1 using the optical measuring instrument OM, and the measurement of the height of the reference plane RS using the measuring instrument 51 and / or the air sensor 21. Figure 1B schematically shows the measurement of the height of the measurement point on the substrate 1 using the measuring instrument 51 and / or the air sensor 21. Figure 1C schematically shows the measurement of the height of the reference plane RS using the optical measuring instrument OM.

[0016] FIG. 2 schematically shows a top view of a substrate stage 41. Additional reference plates 4 and 5 may be arranged on the substrate stage 41. The reference plates 4 and 5 can have reference marks. Thermal deformation of the top plate of the substrate stage 41 can be evaluated by measuring the position of each reference mark of the reference plates 2, 4, and 5 using an off-axis scope (not shown).

[0017] FIG. 3A schematically shows a first configuration example of an air sensor 21. The air sensor 21 can include a reference nozzle 22 that discharges air through a first pipe line 71, a measurement nozzle 23 that discharges air through a second pipe line 72, and a differential pressure sensor 25 that detects a difference between the pressure of the first pipe line 71 and the pressure of the second pipe line 72. The air sensor 21 may further include a mass flow controller 28, and air can be supplied to the reference nozzle 22 and the measurement nozzle 23 via the mass flow controller 28. Air can be supplied to the mass flow controller 28 from an air supply source 31. A filter 29 and a valve 30 can be arranged between the mass flow controller 28 and the air supply source 31. An exposure apparatus EXP or a positioning apparatus PS can include a drive mechanism (for example, a lifting mechanism) 24 that moves the air sensor 21. The mass flow controller 28 can supply air to the reference nozzle 22 and the measurement nozzle 23 via a sensor 27 such as a pressure gauge or a flow meter. The air sensor 21 may further include a processor 26, and the processor 26 can convert an output of the differential pressure sensor 25 into height information. An orifice 34 can be provided at each inlet and outlet of the reference nozzle 22 and the measurement nozzle 23.

[0018] The mass flow controller 28 supplies air whose pressure and flow rate have been adjusted to be constant to the reference nozzle 22 and the measurement nozzle 23. The mass flow controller 28 is operable, based on the output of the sensor 27, to maintain the pressure on the outlet side of the mass flow controller 28 at a predetermined pressure (for example, 70 kPa±0.01 kPa). The diameter of the orifice 34 may be, for example, in the range of 0.1 to 0.2 mm. Since the orifice 34 acts as a resistance to the air flow, the pressure in the first pipe line 71 of the reference nozzle 22 can be maintained constant. The pressure in the second pipe line 72 of the measurement nozzle 23 becomes a value corresponding to the distance between the measurement nozzle 23 and the surface to be measured, and the differential pressure sensor 25 is supplied with the pressure in the first pipe line 71 of the reference nozzle 22 and the pressure in the second pipe line 72 of the measurement nozzle 23. Accordingly, the differential pressure sensor 25 is supplied with a differential pressure corresponding to the distance between the measurement nozzle 23 and the surface to be measured. The air sensor 21 does not generate measurement errors caused by an internal structure that may exist below the measurement target surface.

[0019] The output voltage of the differential pressure sensor 25 can depend on the diameter of the orifice 34. When the diameter of the orifice 34 is increased, the measurement resolution increases, while the working distance expands and the time required for measurement shortens. Conversely, when the diameter of the orifice 34 is decreased, the measurement resolution decreases, while the working distance contracts and the time required for measurement lengthens. For example, the diameter of the orifice 34 can be determined such that when the height of the reference surface RS changes by 1 nm, the output voltage of the differential pressure sensor 25 changes by 2 mV. In this case, the working distance is, for example, 35 micrometers.

[0020] The control unit 63 may calibrate the air sensor 21 based on the output of the air sensor 21 when the positioning device PS changes the height of the substrate stage 41 by a predetermined height. Calibration of the air sensor 21 may include the processor 26 updating a conversion formula for converting the output voltage of the differential pressure sensor 25 to height. The control unit 63 may also calibrate the air sensor 21 based on the change in the output of the differential pressure sensor 25 when the positioning device PS changes the height of the substrate stage 41 by a fixed amount (e.g., by raising or lowering by 1 nm). The conversion formula is usually nonlinear. The conversion formula may include a time drift component and / or a temperature-dependent component. The base of the reference plate may be made of a metal or ceramic material with a low coefficient of thermal expansion, and the reference mark may be made of quartz glass.

[0021] The control unit 63 may calibrate the air sensor 21 so that the result of measuring the height of the reference surface RS of the reference plate 2 by the air sensor 21 is 0. Alternatively, the control unit 63 may hold the result of measuring the height of the reference surface RS of the reference plate 2 by the air sensor 21 as a reference value, and obtain a corrected measurement value by subtracting the reference value from the measurement value of the height measured at the measurement point by the air sensor 21. In this case, the operation of holding the reference value is calibration. Similarly, the control unit 63 may calibrate the optical measuring instrument OM so that the result of measuring the height of the reference surface RS of the reference plate 2 by the optical measuring instrument OM is 0. Alternatively, the control unit 63 may hold the result of measuring the height of the reference surface RS of the reference plate 2 by the optical measuring instrument OM as a reference value, and obtain a corrected measurement value by subtracting the reference value from the measurement value of the height measured at the measurement point by the optical measuring instrument OM. In this case, the operation of holding the reference value is calibration. Since the drift of the air sensor 21 is quite large, calibration of the air sensor 21 may be performed frequently, for example, every 9 seconds.

[0022] In one example, the air sensor 21 and the optical measuring instrument OM can each be calibrated using the reference surface RS of the reference plate 2. If the difference between the height measurements of the measurement points on the substrate 1 by the air sensor 21 and the optical measuring instrument OM is greater than or equal to a predetermined value (e.g., 10 nm), the control unit 63 may update or generate correction information. The control unit 63 may update or generate correction information so that the measurement result from the optical measuring instrument OM matches the measurement result from the air sensor 21.

[0023] The control unit 63 may acquire a first result obtained by measuring the height of a first measurement point on the substrate 1 and the height of the reference surface RS of the reference plate 2 using the optical measuring instrument OM. The control unit 63 may also acquire a second result obtained by measuring the height of a first measurement point on the substrate 1 and the height of the reference surface RS of the reference plate 2 using the air sensor 21. The control unit 63 may also correct the result of measuring a second measurement point on the substrate 1 using the optical measuring instrument OM based on the first and second results. The control unit 63 may, for example, generate correction information to correct the result of measuring a second measurement point on the substrate 1 using the optical measuring instrument OM based on the first and second results. The control unit 63 may, for example, generate correction information based on the difference between the first and second results. By correcting the result of measuring the height of the second measurement point on the substrate 1 using the optical measuring instrument OM based on the correction information, the control unit 63 can obtain height information of the second measurement point in a short time and with high accuracy.

[0024] Figure 3B schematically shows a second configuration example of the air sensor 21. In the second configuration example, a first differential pressure sensor 25A and a second differential pressure sensor 25B are provided instead of the differential pressure sensor 25 in the first configuration example. The first differential pressure sensor 25A detects the difference between the pressure in the first pipe 71 and the pressure in the second pipe 72. Similarly, the second differential pressure sensor 25B detects the difference between the pressure in the first pipe 71 and the pressure in the second pipe 72. The sensitivity (and measurement range) of the first differential pressure sensor 25A and the second differential pressure sensor 25B are different from each other. The processor 26 can convert the output of the first differential pressure sensor 25A into height information. The processor 26 can also convert the output of the second differential pressure sensor 25B into height information.

[0025] Next, the principle of a spectroscopic interference laser displacement meter (hereinafter referred to as the displacement meter), which can be used as the measuring instrument 51, will be explained. The displacement meter irradiates a reference surface and a surface to be measured with light emitted from a light source (e.g., a laser). The reference surface is located inside the displacement meter, and the light irradiated onto the reference surface is reflected by the reference surface to form reference light. The light irradiated onto the surface to be measured is reflected by the surface to be measured to form measurement light. The reference light and measurement light interfere with each other to form interference light. The intensity of the interference light at each wavelength changes according to the difference between the optical path length of the reference light and the optical path length of the surface to be measured. For example, the interference light can be spectrally separated using a diffraction grating, and the intensity of light at each wavelength can be measured. This makes it possible to measure the difference in optical path length, and as a result, the relative position of the surface to be measured with respect to the reference surface. The measurement time required for the displacement meter to perform a measurement is short, for example, 0.1 msec.

[0026] Figure 4A is a diagram illustrating the measurement method or positioning method in a comparative example. Figure 4B is a diagram illustrating the measurement method or positioning method in this embodiment. In Figures 4A and 4B, Ras indicates the range measurable by the air sensor 21 (measurement range), and Rhs indicates the range measurable by the measuring instrument 51 (measurement range). Also, 73 is the range below the center of the detection range Ras of the air sensor 21. 76 is the range above the center of the detection range Ras of the air sensor 21. 78 is the range below the lower end of the detection range Ras and close to the detection range Ras. 79 is the range below the lower end of range 78. 77 is the interval in which the output of the air sensor 21 saturates. 74 is the detection range Rhs of the measuring instrument 51, but not the detection range Ras of the air sensor 21. 75 is neither within the detection range Rhs of the measuring instrument 51 nor within the detection range Ras of the air sensor 21.

[0027] The operation of the comparative example will be explained below with reference to Figure 4A. In the comparative example, the height of the substrate 1 is controlled using only the air sensor 21. Here, the time required for one measurement by the air sensor 21 is 300 msec, the working distance of the air sensor 21 is 30 μm, and the measurement range Ras is ±1 μm. Note that μm means micrometer.

[0028] Assuming that the substrate 1 is initially located within range 79, in the first step, the substrate stage mechanism SD drives the surface of the substrate 1 until it reaches a height near the detection range Ras of the air sensor 21. Since the working distance of the air sensor 21 is 30um, care must be taken to bring the surface of the substrate 1 close to the height near the detection range Ras. If the surface of the substrate 1 approaches the height near the detection range Ras of the air sensor 21 (for example, range 78), the substrate 1 may collide with the air sensor 21 unless it is driven in steps of 30um or less. Since the measurement range Ras is only ±1um, there is a possibility of overshooting the measurement range Ras during step driving. In that case, the output of the air sensor 21 will saturate, and based on this, it is possible to detect that the substrate 1 has entered range 77. For example, if the output of the differential pressure sensor of the air sensor 21 is in the range of -5V to +5V, then +5V will be output from the air sensor 21 when saturation occurs.

[0029] Subsequently, in the second step, since the measurement range Ras of the air sensor 21 is ±1um, the substrate 1 is gradually lowered, and the surface of the substrate 1 is moved to the center of the measurement range Ras of the air sensor 21. In the first step, assuming that the range 79 is 20um × 10 steps = 200um, the measurement by the air sensor 21 takes a total of 3000 msec. Next, in the second step, assuming that it is driven by 2um × 10 steps = 20um, the measurement by the air sensor 21 takes a total of 3000 msec.

[0030] In the third step, based on the measurement results from the second step, the positioning device PS is controlled so that the surface of substrate 1 is within ±0.1um of the center position of the measurement range Ras (best focus position). The position in the Z-axis direction at this time is measured and recorded by the measuring instrument MS. In this way, a total of 6000 msec is required to position the surface of substrate 1 to the best focus position (height). This can be said to be extremely slow.

[0031] Here, it is difficult to omit the measurement by the air sensor 21 from the second time onward. There is a method to drive the substrate 1 based on the measurement by the measuring instrument MS, but the driving accuracy of the drive mechanism 24 that drives the air sensor 21 may be, for example, around ±1um. Also, considering the tilt of the substrate 1 of ±30um and the thickness error of the substrate 1 of ±20um (SEMI standard), it may be possible to start the first step from range 78. If we assume that range 78 is 50um away from the center position of the detection range Ras of the air sensor 21, then the first step will take 20um × 3 steps = 60um, requiring 900msec for measurement. Furthermore, since the second step and beyond cannot be omitted, 2um × 10 steps = 20um will be required, requiring 3000msec for measurement. Therefore, even from the second time onward, a total of approximately 3900msec is required.

[0032] The operation of the embodiment will be described below with reference to Figure 4B. Here, a spectroscopic interferometric laser displacement meter (hereinafter referred to as the displacement meter) will be used as the measuring instrument 51. The time required for one measurement by the measuring instrument 51 (displacement meter) will be 0.1 msec, the working distance of the measuring instrument 51 will be 11.8 mm, and the measurement range Rhs will be ±500 μm.

[0033] The positional relationship between the air sensor 21 and the measuring instrument 51 can be guaranteed in advance to be within, for example, ±200 μm. This accuracy can be sufficiently guaranteed by machining precision and assembly adjustment. The first measurement may take 6000 msec to perform the above steps 1 to 3. However, the measurement value by the measuring instrument 51 is stored with the surface of the substrate 1 positioned at the center of the measurement range Ras of the air sensor 21.

[0034] From the second time onward, the height of the substrate 1 can be measured using the measuring instrument 51, and the position of the substrate 1 can be adjusted based on the result. This significantly reduces the time required to perform measurement using the air sensor 21.

[0035] In the second step of this embodiment, operation can be started from range 74 based on the output of the measuring instrument 51. After starting operation from range 74 and performing one measurement (0.1 msec), the surface of the substrate 1 can be immediately moved to the center of the detection range Ras of the air sensor 21. Next, one measurement (300 msec) is performed by the air sensor 21 to confirm that the surface of the substrate 1 is within the detection range Ras. Finally, based on the measurement result from the air sensor 21, the positioning device PS is controlled so that the surface of the substrate 1 is within ±0.1 μm (best focus) of the center position of the measurement range Ras.

[0036] The time required for subsequent measurements was 3900 msec in the comparative example, but in this embodiment, it was reduced to approximately 300 msec.

[0037] Here, a spectroscopic interferometer laser displacement meter is given as an example of the measuring instrument 51, but for example, a capacitance sensor, laser displacement meter, laser interferometer, encoder, etc. may be used. In addition, the measuring instrument 51 may be placed on the substrate stage, or it may measure the positional relationship with the air sensor 21 and the position of the substrate 1 from a position independent of the air sensor 21 and the substrate stage 41.

[0038] After adjusting the height of the substrate 1 using the air sensor 21, that is, after positioning the substrate 1 in the Z-axis direction, the air sensor 21 is retracted to the retracted position by the drive mechanism 24. Subsequently, the exposure operation of the substrate 1 is performed. When measuring the next substrate 1 with the air sensor 21, the air sensor 21 is driven to the measurement position by the drive mechanism 24.

[0039] In the above embodiment, the measuring instrument 51 is fixed, but the measuring instrument 51 may be driven (raised and lowered) by the drive mechanism 24 together with the air sensor 21.

[0040] For example, if the substrate 1 suddenly tilts or the substrate chuck mounted on the substrate stage 41 loses its ability to hold the substrate 1, the air sensor 21 may be retracted if it is detected as such. Based on this detection, the air sensor 21 may be retracted. This will improve the relationship between the substrate 1 and the air sensor 21. It is possible to avoid a collision.

[0041] Figure 5 illustrates the procedure for driving the substrate 1 (substrate stage 41) so that the measurement point on the substrate 1 (surface) coincides with the center position (best focus position) of the detection range Ras of the height air sensor 21. This procedure is controlled by the control unit 63. In step S501, the control unit 63 starts measuring the height of the measurement point on the substrate 1 using the measuring instrument 51. In step S502, the control unit 63 controls the substrate stage mechanism SD based on the output of the measuring instrument 51. More specifically, the control unit 63 controls the substrate stage mechanism SD to raise the substrate 1 (substrate stage 41) so that the height of the measurement point on the substrate 1 approaches the center position of the detection range Ras.

[0042] In step S503, the control unit 63 reduces the driving speed of the substrate by the substrate stage mechanism SD based on the output of the measuring instrument 51, in accordance with the fact that the height of the measurement point on the substrate 1 approaches the measurement range Ras. In step S504, the control unit 63 stops driving the substrate 1 by the substrate stage mechanism SD in accordance with the fact that the height of the measurement point on the substrate 1 has entered the measurement range Ras.

[0043] In step S505, the control unit 63 stops the driving of the substrate 1 by the substrate stage mechanism SD and measures the height of the measurement point on the substrate 1 using the air sensor 21. If the output of the air sensor 21 is within a predetermined range, that is, if measurement of the measurement point on the substrate 1 is possible using the air sensor 21, the control unit 63 executes step S507. On the other hand, if the output of the air sensor 21 is not within a predetermined range, that is, if measurement of the measurement point on the substrate 1 is not possible using the air sensor 21, the control unit 63 executes step S506. In step S507, the control unit 63 controls the substrate stage mechanism SD based on the output of the air sensor 21 in step S505 to set the height of the measurement point on the substrate 1 to the target height, i.e., the center position of the measurement range Ras. Here, the control unit 63 controls the substrate stage mechanism SD based on the output obtained to confirm that the output of the air sensor 21 is within a predetermined range to set the height of the measurement point on the substrate 1 to the target height.

[0044] In step S506, if the output of the air sensor 21 is not within a predetermined range, the control unit 63 uses the air sensor 21 to control the substrate stage mechanism SD to bring the height of the measurement point on the substrate 1 within a predetermined range.

[0045] Next, a method for manufacturing articles (semiconductor IC elements, liquid crystal display elements, MEMS, etc.) using the aforementioned exposure apparatus will be described. The articles are manufactured by using the aforementioned exposure apparatus to expose a substrate (wafer, glass substrate, etc.) coated with a photosensitive material, developing the substrate (photosensitive material), and processing the developed substrate in other well-known processes. Other well-known processes include etching, resist stripping, dicing, bonding, packaging, etc. According to this method of manufacturing articles, it is possible to manufacture articles of higher quality than conventional methods.

[0046] This specification and accompanying drawings include the following disclosures: (Document Title) Claims (Item 1) A positioning device for positioning a substrate, A substrate stage mechanism for driving the aforementioned substrate, A measuring instrument for measuring the height of the aforementioned substrate, An air sensor that measures the height of the substrate based on the pressure in the conduit while discharging air through the conduit, The system includes a control unit for controlling the substrate stage mechanism, The measurement range, which is the range of height that can be measured by the air sensor, is narrower than the range of height that can be measured by the measuring instrument. The control unit controls the substrate stage mechanism based on the output of the measuring instrument to bring the height of the measurement point on the substrate into the measurement range. A positioning device characterized by the following features. (Item 2) The control unit, based on the output of the measuring instrument, reduces the driving speed of the substrate by the substrate stage mechanism as the height of the measurement point on the substrate approaches the measurement range. The positioning device described in item 1, characterized by the features described herein. (Item 3) The control unit stops the driving of the substrate by the substrate stage mechanism when the height of the measurement point on the substrate enters the measurement range. The positioning device according to item 2, characterized in that it is a positioning device. (Item 4) The control unit measures the height of the substrate using the air sensor while the substrate stage mechanism has stopped driving the substrate. The positioning device according to item 3, characterized by the features described herein. (Item 5) If the output of the air sensor is within a predetermined range, the control unit controls the substrate stage mechanism based on the output of the air sensor to set the height of the measurement point on the substrate to the target height. The positioning device described in item 4, characterized by the features described herein. (Item 6) The control unit, based on the output obtained to confirm that the output of the air sensor falls within the predetermined range, controls the substrate stage mechanism to set the height of the measurement point on the substrate to the target height. The positioning device described in item 5, characterized by the features described herein. (Item 7) If the output of the air sensor is not within the predetermined range, the control unit uses the air sensor to control the substrate stage mechanism to bring the height of the measurement point on the substrate within the predetermined range. The positioning device described in item 5, characterized by the features described herein. (Item 8) The measuring instrument measures the height of the substrate optically, electrostatically, or magnetically. A positioning device according to any one of items 1 to 7, characterized by the features described above. (Item 9) The measuring instrument is an oblique incidence measuring instrument that irradiates light onto the substrate and receives the reflected light from the substrate. A positioning device according to any one of items 1 to 7, characterized by the features described above. (Item 10) The substrate stage mechanism includes a substrate stage for holding the substrate, a drive mechanism for driving the substrate stage, and a measurement system for measuring the position and orientation of the substrate stage. The control unit controls the position and orientation of the substrate stage based on the output of the measurement system. A positioning device according to any one of items 1 to 9, characterized by the features described above. (Item 11) The control unit calibrates the air sensor based on the output of the air sensor when the height of the substrate stage is changed by a predetermined height based on the output of the measurement system. The positioning device according to item 10, characterized in that it is a positioning device. (Item 12) The aforementioned air sensor is A reference nozzle that discharges air through the first pipeline, A measuring nozzle that discharges air through the second pipeline, A differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, A positioning device according to any one of items 1 to 11, characterized by including the following: (Item 13) The air sensor further includes a mass flow controller, and air is supplied to the reference nozzle and the measuring nozzle via the mass flow controller. The positioning device according to item 12, characterized in that it is a positioning device. (Item 14) The aforementioned air sensor is A reference nozzle that discharges air through the first pipeline, A measuring nozzle that discharges air through the second pipeline, A first differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The system includes a second differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The sensitivities of the first differential pressure sensor and the second differential pressure sensor are different from each other. A positioning device according to any one of items 1 to 11, characterized by the features described above. (Item 15) An exposure apparatus for projecting a pattern from an original plate onto a substrate using a projection optical system and exposing the substrate, The system includes a positioning device for positioning the substrate, The positioning device is the positioning device described in any one of items 1 to 14. An exposure apparatus characterized by the following features. (Item 16) An exposure process in which the substrate is exposed using the exposure apparatus described in item 15, A developing step for developing the substrate after the exposure step, A processing step to obtain an article by processing the substrate that has undergone the development step, A method for manufacturing articles, characterized by including the following: (Item 17) A reference nozzle that discharges air through the first pipeline, A measuring nozzle that discharges air through the second pipeline, A first differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The system includes a second differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The sensitivities of the first differential pressure sensor and the second differential pressure sensor are different from each other. An air sensor characterized by the following. (Item 18) The air sensor described in item 17 for measuring the height of the circuit board, The substrate is provided with a substrate stage mechanism that adjusts the height of the substrate, A control unit that controls the substrate stage mechanism based on the output of the air sensor, A positioning device characterized by comprising: (Item 19) An exposure apparatus for projecting a pattern from an original plate onto a substrate using a projection optical system and exposing the substrate, The system includes a positioning device for positioning the substrate, The positioning device is the positioning device described in item 18. An exposure apparatus characterized by the following features. (Item 20) An exposure process in which the substrate is exposed using the exposure apparatus described in item 19, A developing step for developing the substrate after the exposure step, A processing step to obtain an article by processing the substrate that has undergone the development step, A method for manufacturing articles, characterized by including the following: (others) Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence. [Explanation of symbols]

[0047] 1: Substrate, 21: Air sensor, 51: Measuring instrument, 63: Control unit, SD: Substrate stage mechanism, PS: Positioning device

Claims

1. A positioning device for positioning a substrate, A substrate stage mechanism for driving the aforementioned substrate, A measuring instrument for measuring the height of the aforementioned substrate, An air sensor that measures the height of the substrate based on the pressure in the conduit while discharging air through the conduit, The system includes a control unit for controlling the substrate stage mechanism, The measurement range, which is the range of height that can be measured by the air sensor, is narrower than the range of height that can be measured by the measuring instrument. The control unit controls the substrate stage mechanism based on the output of the measuring instrument to bring the height of the measurement point on the substrate into the measurement range. A positioning device characterized by the following features.

2. The control unit reduces the driving speed of the substrate by the substrate stage mechanism based on the output of the measuring instrument, in accordance with the fact that the height of the measurement point on the substrate approaches the measurement range. The positioning device according to feature 1.

3. The control unit stops the driving of the substrate by the substrate stage mechanism when the height of the measurement point on the substrate enters the measurement range. The positioning device according to feature 2.

4. The control unit measures the height of the substrate using the air sensor while the substrate stage mechanism has stopped driving the substrate. The positioning device according to feature 3.

5. If the output of the air sensor is within a predetermined range, the control unit controls the substrate stage mechanism based on the output of the air sensor to set the height of the measurement point on the substrate to the target height. The positioning device according to feature 4.

6. The control unit, based on the output obtained to confirm that the output of the air sensor falls within the predetermined range, controls the substrate stage mechanism to set the height of the measurement location on the substrate to the target height. The positioning device according to feature 5.

7. If the output of the air sensor is not within the predetermined range, the control unit uses the air sensor to control the substrate stage mechanism to bring the height of the measurement point on the substrate within the predetermined range. The positioning device according to feature 5.

8. The measuring instrument measures the height of the substrate optically, electrostatically, or magnetically. The positioning device according to feature 1.

9. The measuring instrument is an oblique incidence measuring instrument that irradiates light onto the substrate and receives the reflected light from the substrate. The positioning device according to feature 1.

10. The substrate stage mechanism includes a substrate stage for holding the substrate, a drive mechanism for driving the substrate stage, and a measurement system for measuring the position and orientation of the substrate stage. The control unit controls the position and orientation of the substrate stage based on the output of the measurement system. The positioning device according to feature 1.

11. The control unit calibrates the air sensor based on the output of the air sensor when the height of the substrate stage is changed by a predetermined height based on the output of the measurement system. The positioning device according to feature 10.

12. The aforementioned air sensor is A reference nozzle that discharges air through the first pipeline, A measuring nozzle that discharges air through the second pipeline, A differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The positioning device according to claim 1, characterized by including the following:

13. The air sensor further includes a mass flow controller, and air is supplied to the reference nozzle and the measuring nozzle via the mass flow controller. The positioning device according to feature 12.

14. The aforementioned air sensor is A reference nozzle that discharges air through the first pipeline, A measuring nozzle that discharges air through the second pipeline, A first differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The system includes a second differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The sensitivities of the first differential pressure sensor and the second differential pressure sensor are different from each other. The positioning device according to feature 1.

15. An exposure apparatus for projecting a pattern from an original plate onto a substrate using a projection optical system and exposing the substrate, The system includes a positioning device for positioning the substrate, The positioning device is the positioning device described in any one of claims 1 to 14. An exposure apparatus characterized by the following features.

16. An exposure step of exposing a substrate with the exposure apparatus described in claim 15, A developing step for developing the substrate after the exposure step, A processing step to obtain an article by processing the substrate that has undergone the development step, A method for manufacturing articles, characterized by including the following:

17. A reference nozzle that discharges air through the first pipeline, A measuring nozzle that discharges air through the second pipeline, A first differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The system includes a second differential pressure sensor that detects the difference between the pressure in the first pipeline and the pressure in the second pipeline, The sensitivities of the first differential pressure sensor and the second differential pressure sensor are different from each other. An air sensor characterized by the following.

18. An air sensor according to claim 17 for measuring the height of a substrate, The substrate is provided with a substrate stage mechanism that adjusts the height of the substrate, A control unit that controls the substrate stage mechanism based on the output of the air sensor, A positioning device characterized by comprising:

19. An exposure apparatus for projecting a pattern from an original plate onto a substrate using a projection optical system and exposing the substrate, The system includes a positioning device for positioning the substrate, The positioning device is the positioning device described in claim 18. An exposure apparatus characterized by the following features.

20. An exposure step of exposing a substrate using the exposure apparatus described in claim 19, A developing step for developing the substrate after the exposure step, A processing step to obtain an article by processing the substrate that has undergone the development step, A method for manufacturing articles, characterized by including the following:

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