Processing apparatus, processing method, and chip manufacturing method

Abstract

The present invention provides a processing apparatus capable of reducing the likelihood of foreign matter adhering to the processing chamber cover when processing an object in a processing chamber where at least a portion of the chamber is defined by the processing chamber cover. [Solution] A processing apparatus for processing a workpiece in a processing chamber, comprising: a processing chamber cover defining at least a part of the processing chamber; a chuck table into which the workpiece is brought; and an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover.

Description

Technical Field

[0001] The present invention relates to a processing apparatus for processing an object to be processed in a processing chamber, a processing method for processing an object to be processed in a processing chamber, and a chip manufacturing method for manufacturing chips by processing a workpiece so as to divide the workpiece along boundaries between a plurality of devices.

Background Art

[0002] A semiconductor package including devices such as ICs (Integrated Circuits) is an essential component in various electronic devices such as mobile phones and personal computers. This semiconductor package is manufactured through semiconductor manufacturing processes that are broadly divided into a front-end process in which a plurality of devices each containing a large number of circuit elements are formed on the front side of a wafer, and a back-end process in which semiconductor packages are manufactured from a wafer having a plurality of devices formed on the front side.

[0003] In the back-end process, for example, a semiconductor package is manufactured through the following steps. First, the back side of the wafer is ground to thin the wafer. Next, a plurality of dies are manufactured by cutting the wafer so as to divide it along boundaries between the plurality of devices. Next, the plurality of dies are mounted on a lead frame such that each die is connected to an external electrode.

[0004] Next, a semiconductor package substrate is manufactured by sealing the plurality of dies with resin. Next, a plurality of semiconductor packages are manufactured by cutting the semiconductor package substrate so as to divide it along boundaries between the plurality of dies (that is, boundaries between the plurality of devices). Furthermore, between these steps, the wafer or the semiconductor package substrate is cleaned as necessary.

[0005] Processing (grinding, cutting, or cleaning, etc.) of wafers or semiconductor package substrates is performed while the workpiece is held on a chuck table (see, for example, Patent Documents 1 to 3). In addition, such processing is carried out while water is supplied to the workpiece to remove foreign matter such as processing debris generated during processing (grinding or cutting, etc.). For this reason, the workpiece is processed in a processing chamber in which at least a portion is defined by a processing chamber cover in order to suppress the scattering of this water. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2009-246098 [Patent Document 2] Japanese Patent Publication No. 2010-36275 [Patent Document 3] Japanese Patent Publication No. 2009-260094 [Overview of the project] [Problems that the invention aims to solve]

[0007] When processing materials in the processing chamber, foreign matter may be scattered along with water and adhere to the inner surface of the processing chamber cover. After processing, this foreign matter may detach from the inner surface of the processing chamber cover and adhere to the upper surface of the chuck table. In this case, when holding the material to be processed on the chuck table, a strong localized force (specifically, near the foreign matter) may be applied to the material, potentially causing damage to the material.

[0008] In view of this, the present invention aims to provide an apparatus, a processing method, and a method for manufacturing chips that can reduce the likelihood of foreign matter adhering to a processing chamber cover when processing an object to be processed in a processing chamber where at least a portion is defined by a processing chamber cover. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is a processing apparatus for processing an object to be processed in a processing chamber, comprising: a processing chamber cover defining at least a portion of the processing chamber; a chuck table into which the object to be processed is brought; and an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover.

[0010] In this processing apparatus, it is preferable that the processing chamber cover is provided such that the fluid supplied from the outlet of the ejector flows along its top plate. Furthermore, it is preferable that this processing apparatus further comprises a grinding unit for grinding the workpiece, a cutting unit for cutting, or a cleaning unit for cleaning.

[0011] According to another aspect of the present invention, a processing method is provided for processing an object to be processed in a processing chamber of a processing apparatus comprising: a processing chamber cover defining at least a portion of the processing chamber; a chuck table into which an object to be processed is brought; and an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover, wherein, when processing the object to be processed in the processing chamber, the processing method is provided in which the object to be processed is held on the chuck table by applying a suction force generated by the fluid supplied from the fluid supply source passing through the inside of the ejector from the inlet to the outlet to the object to be processed via the chuck table from the suction port, while the fluid is supplied to the processing chamber from the outlet of the ejector.

[0012] In this processing method, it is preferable that the fluid supplied from the outlet of the ejector flows along the top plate of the processing chamber cover when processing the workpiece in the processing chamber. Furthermore, in this processing method, it is preferable that the workpiece is ground, cut, or cleaned when processing the workpiece in the processing chamber.

[0013] A further aspect of the present invention provides a method for manufacturing a chip by processing a workpiece in a processing chamber of a processing apparatus, the processing chamber comprising: a processing chamber cover defining at least a portion of the processing chamber; a chuck table into which a workpiece having a plurality of devices formed thereon is loaded; and an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover, so as to divide the workpiece along the boundaries of the plurality of devices, wherein, when processing the workpiece in the processing chamber, the fluid supplied from the fluid supply source is applied to the workpiece via the chuck table from the suction port by causing a suction force generated when the fluid supplied from the fluid supply source passes through the inside of the ejector from the inlet to the outlet, thereby holding the workpiece on the chuck table, while the fluid is supplied from the outlet of the ejector into the processing chamber. [Effects of the Invention]

[0014] In this invention, the outlet of the ejector is connected to the processing chamber cover. In this case, when processing a workpiece in the processing chamber, it becomes possible to supply fluid passing through the inside of the ejector to the processing chamber in order to generate a suction force that acts on the workpiece to hold it in place on the chuck table.

[0015] As a result, when processing materials in the processing chamber, this fluid acts as a barrier, making it difficult for foreign matter to adhere to the processing chamber cover. Furthermore, even if foreign matter does adhere to the processing chamber cover, the fluid is sprayed onto the foreign matter, making it easier for it to detach from the processing chamber cover. Consequently, in this invention, it is possible to reduce the probability of foreign matter adhering to the processing chamber cover when processing materials in the processing chamber. [Brief explanation of the drawing]

[0016] [Figure 1] Figure 1 is a schematic perspective view showing an example of an object to be processed. [Figure 2] Figure 2 is a schematic perspective view showing an example of a processing device. [Figure 3] Fig. 3 is a diagram schematically showing a vertical cross-section and the like of a chuck table positioned in a processing chamber. [Figure 4] Fig. 4 is a diagram schematically showing how an object to be processed is processed in a processing chamber. MODE FOR CARRYING OUT THE INVENTION

[0017] Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view schematically showing an example of an object to be processed (wafer 11). The wafer 11 is made of, for example, silicon (Si), silicon carbide (SiC), gallium nitride (GaN), or the like. An orientation flat 11a for indicating a specific crystal orientation of the material is formed on an outer edge of the wafer 11. Further, a plurality of devices 13 are provided on the front surface 11b side of the wafer 11.

[0018] The plurality of devices 13 are provided in a matrix (specifically, arranged in both a direction from the center of the wafer 11 toward the orientation flat 11a (first arrangement direction) and a direction orthogonal to the first arrangement direction (second arrangement direction)). Therefore, the boundaries of the plurality of devices 13 extend in a grid pattern. Among the boundaries of the plurality of devices 13, portions that linearly extend along the first arrangement direction or the second arrangement direction are also referred to as lines to be divided.

[0019] Note that the wafer 11 may be provided with additional components prior to performing appropriate processing. For example, prior to grinding the back surface 11c side of the wafer 11, a sheet-shaped protection member made of resin may be fixed to the front surface 11b of the wafer 11. Further, prior to cutting or cleaning the wafer 11, a central region of a support member whose outer peripheral region is fixed to a ring frame may be fixed to the back surface 11c of the wafer 11.

[0020] Fig. 2 is a perspective view schematically showing an example of a processing apparatus (a grinding apparatus (processing apparatus) 2). The direction indicated by arrow X shown in Fig. 1 (X direction) and the direction indicated by arrow Y (Y direction) are directions orthogonal to each other on a horizontal plane, and the direction indicated by arrow Z (Z direction) is a direction orthogonal to each of the X direction and the Y direction (vertical direction). For convenience, the following description is given on the assumption that the X direction, the Y direction, and the Z direction are the backward direction, the right direction, and the upward direction, respectively.

[0021] The grinding apparatus 2 includes a base 4 that supports each component. A rectangular parallelepiped recess 4a extending along the X direction is formed on an upper surface of the base 4. A holding unit 6 for holding a wafer 11 is provided inside the recess 4a. The holding unit 6 includes a chuck table 8 for holding the wafer 11 (specifically, the surface 11b side of the wafer 11 via a protective member) on an upper surface (holding surface) thereof.

[0022] The chuck table 8 is movable between a position outside a processing chamber (processing room) (loading / unloading position) where the wafer 11 is loaded onto the holding surface and unloaded therefrom, and a position inside the processing chamber (grinding position) where the wafer 11 held on the holding surface is ground. Fig. 1 shows the grinding apparatus 2 in a state where the chuck table 8 is positioned at the loading / unloading position. The grinding position is a position spaced apart in the X direction when viewed from the loading / unloading position (specifically, a position rearward when viewed from the loading / unloading position).

[0023] Fig. 3 is a view schematically showing a longitudinal cross-section and the like of the chuck table 8 positioned at the grinding position in the processing chamber R. In Fig. 2, components of the holding unit 6 other than the chuck table 8 are shown as blocks. Also in Fig. 2, connected components are shown connected by double dashed lines.

[0024] The chuck table 8 has a disc-shaped frame 10 made of, for example, ceramics. This frame 10 has a disc-shaped bottom wall 10a and cylindrical side walls 10b that rise from the outer circumference of the bottom wall 10a. That is, a disc-shaped recess is formed on the upper surface of the frame 10, defined by the bottom wall 10a and the side walls 10b.

[0025] A disc-shaped porous plate 12 made of porous ceramics or the like is fixed in this recess. The upper surface of the side wall 10b of the frame 10 and the upper surface of the porous plate 12 have a shape corresponding to the side surface of a cone and function as a holding surface for the chuck table 8. In addition, a flow channel 10c is formed in the bottom wall 10a that opens at the bottom surface of the recess and penetrates the bottom wall 10a.

[0026] The chuck table 8 is connected to a motor (not shown) via, for example, a pulley (not shown) and a belt (not shown) wrapped around the pulley. When this motor is operated, the chuck table 8 rotates around a straight line passing through the center of its holding surface as the axis of rotation.

[0027] The chuck table 8 is supported by a tilt adjustment mechanism (not shown) via, for example, a bearing (not shown) and a table base (not shown). This tilt adjustment mechanism includes, for example, two movable shafts and one fixed shaft arranged at approximately equal angular intervals along the circumferential direction of the chuck table 8. When at least one of the two movable shafts partially raises or lowers the table base and the chuck table 8, the tilt of the rotation axis of the chuck table 8 is adjusted.

[0028] The chuck table 8 is connected to an X-direction movement mechanism (not shown) via, for example, a tilt adjustment mechanism. This X-direction movement mechanism includes, for example, a ball screw and a motor located inside the recess 4a. When this X-direction movement mechanism is operated, the chuck table 8 moves between the loading / unloading position and the grinding position.

[0029] A rectangular parallelepiped table cover 14 is provided around the chuck table 8, surrounding it so that the holding surface is exposed. The width (length along the Y direction) of this table cover 14 is approximately equal to the width of the recess 4a formed on the upper surface of the base 4. In addition, a dustproof and waterproof cover 16 that can be extended and retracted along the X direction is provided on the front and rear of the table cover 14. When the chuck table 8 moves between the loading / unloading position and the grinding position, the table cover 14 moves together with the chuck table 8, and the dustproof and waterproof cover 16 extends and retracts.

[0030] The chuck table 8 is configured to apply the suction force generated in the ejector 18 to the vicinity of the holding surface. Specifically, the ejector 18 includes an inlet 18a connected to a fluid supply source 20, a suction port 18b connected to the chuck table 8 (specifically, a flow path 10c formed in the bottom wall 10a of its frame 10), and an outlet 18c connected to a processing chamber cover (processing chamber cover) 22 that defines at least a portion of the processing chamber R.

[0031] Then, when the fluid supply source 20 is operated to supply fluid to the inlet 18a, this fluid passes through the inside of the ejector 18 from the inlet 18a to the outlet 18c. The fluid supply source 20 includes, for example, a compressor capable of supplying high-pressure liquid (e.g., water) or high-pressure gas (e.g., air). The fluid that has passed through the inside of the ejector 18 is supplied to the processing chamber R from the outlet 18c.

[0032] At this time, the internal pressure of the ejector 18 decreases, generating a suction force from the suction port 18b. Therefore, by passing fluid through the inside of the ejector 18, a suction force can be applied to the space near the holding surface via the chuck table 8 (specifically, the flow path 10c formed in the bottom wall 10a of the frame 10 and the porous plate 12).

[0033] The processing chamber cover 22 has a rectangular top plate 24 whose width (length along the Y direction) is greater than that of the recess 4a. This top plate 24 overlaps with the rear side of the recess 4a in a plan view. The top plate 24 has a circular opening 24a whose center is located at the rear side of the top plate 24, and which exposes the center and rear end of the holding surface of the chuck table 8, which is positioned at the grinding position in a plan view.

[0034] This opening 24a allows the grinding wheel 62, which will be described later, to enter and exit the machining chamber R. Specifically, the opening 24a is formed such that its center in a plan view coincides with the center of the grinding wheel 62, and its diameter is larger than the outer diameter of the grinding wheel 62.

[0035] The upper end of the front plate 26 is fixed to the underside of the front end of the top plate 24. The front plate 26 has a rectangular opening 26a formed on its holding surface that allows the chuck table 8, which holds the wafer 11, to enter and exit the processing chamber R. In other words, the front plate 26 has a gate-like shape (specifically, a shape in which the lower part of the part that overlaps with the recess 4a is cut out).

[0036] The upper ends of the rear plate 28, the left plate 30, and the right plate 32 are fixed to the lower rear, left, and right ends of the top plate 24, respectively. The rear plate 28, the left plate 30, and the right plate 32 each have a rectangular shape. The lower ends of the front plate 26, the rear plate 28, the left plate 30, and the right plate 32 are fixed to the upper surface of the base 4.

[0037] A pipe 34 is inserted into the rear plate 28 for supplying a liquid such as water to the wafer 11 held on the chuck table 8 positioned at the grinding location. The base end of this pipe is connected to a liquid supply source (not shown) including a tank and pump, and a nozzle 36 is provided at its tip. When the liquid supply source (specifically, its pump) is operated, liquid is supplied from the liquid supply source through the pipe 34 and nozzle 36 to the rear side of the wafer 11 held on the chuck table 8 at the grinding location.

[0038] Near the upper end of the right side plate 32, an opening 32a is formed that extends along the X direction. This opening 32a is connected to the outlet 18c of the ejector 18 and is formed to overlap in the Z direction with the chuck table 8, which is positioned at the grinding position when viewed from the Y direction. Therefore, the fluid supplied to the machining chamber R from the outlet 18c of the ejector 18 flows along the top plate 24 of the machining chamber cover 22 so as to act as a barrier between the chuck table 8 positioned at the grinding position and the top plate 24, and is blown onto the top plate 24.

[0039] As shown in Figure 2, a rectangular prism-shaped support structure 38 is provided in the area of ​​the upper surface of the base 4 located behind the recess 4a. A grinding unit 40 is provided on the front side of the support structure 38. This grinding unit 40 has a Z-direction movement mechanism 42 provided on the front surface of the support structure 38.

[0040] The Z-direction movement mechanism 42 includes a pair of guide rails 44, each extending along the Z-direction. A slider (not shown) is provided on the front side of each of the pair of guide rails 44 in a manner that allows it to slide along the Z-direction. The front end of this slider is fixed to the rear side of the rectangular parallelepiped Z-direction movement plate 46. Furthermore, a screw shaft 48 extending along the Z-direction is positioned between the pair of guide rails 44.

[0041] A motor 50 for rotating the screw shaft 48 is connected to the upper end of the screw shaft 48. A nut (not shown) for housing balls that circulate in accordance with the rotation of the screw shaft 48 is provided on the outer surface of the screw shaft 48 where the screw threads are formed, thus forming a ball screw. This nut is fixed to the rear side of the Z-direction moving plate 46. Therefore, when the screw shaft 48 is rotated by the motor 50, the Z-direction moving plate 46 moves along the Z-direction together with the nut.

[0042] A cylindrical support member 52 is fixed to the front side of the Z-direction moving plate 46. Inside the support member 52, a cylindrical spindle housing 54 is provided, extending along the Z direction. Inside the spindle housing 54, a spindle 58 is provided, which is supported by the spindle housing 54 in a rotatable manner, and whose upper end is connected to the motor 56 (see Figure 3).

[0043] The lower end of the spindle 58 is exposed from the spindle housing 54 and fixed to a disc-shaped wheel mount 60. An annular grinding wheel 62, having an outer diameter approximately equal to the diameter of the wheel mount 60, is attached to the underside of the wheel mount 60 using fixing members (not shown), such as bolts.

[0044] The grinding wheel 62 comprises a plurality of grinding wheels 62a and a wheel base 62b having a lower surface on which the plurality of grinding wheels 62a are arranged in a circular, discrete manner. When the motor 56 is operated, the wheel mount 60 and the grinding wheel 62 rotate around a straight line along the Z direction as the axis of rotation. The plurality of grinding wheels 62a have abrasive grains such as diamond or cubic boron nitride (cBN) dispersed in a binder such as a vitrified bond or resin bond. The wheel base 62b is made of a metal material such as stainless steel or aluminum.

[0045] Figure 4 schematically shows the grinding of the wafer 11 in the processing chamber R. In Figure 4, the flow of fluid supplied from the fluid supply source 20 is indicated by a solid arrow, and the direction of the suction force generated when this fluid passes inside the ejector 18 is indicated by a double arrow.

[0046] When grinding the wafer 11 in the processing chamber R, first, the chuck table 8 is positioned at the loading / unloading position. Next, the wafer 11 is placed on the holding surface of the chuck table 8 via a protective member so that its back surface 11c faces upward and covers the porous plate 12. Then, the fluid supply source 20 is operated to supply fluid to the inlet 18a of the ejector 18, whose suction port 18b communicates with the flow path 10c formed in the bottom wall 10a of the frame 10 of the chuck table 8.

[0047] As a result, a suction force acts on the wafer 11 from the suction port 18b through the chuck table 8 (specifically, the flow path 10c formed in the bottom wall 10a of the frame 10 and the porous plate 12), and the wafer 11 is held in place by the chuck table 8. In parallel with the holding of the wafer 11 in this way, the fluid supplied to the processing chamber R from the outlet 18c of the ejector 18 flows along the top plate 24 of the processing chamber cover 22.

[0048] Next, the chuck table 8 is positioned at the grinding location. Then, while rotating both the chuck table 8 and the grinding wheel 62, the grinding wheel 62 is lowered so that multiple grinding wheels 62a come into contact with the back surface 11c of the wafer 11. Immediately before this grinding, the supply L of liquid from the nozzle 36 toward the rear side of the wafer 11 is started. As a result, the back surface 11c of the wafer 11 is ground while liquid is supplied to the contact interface (processing point) between the multiple grinding wheels 62a and the back surface 11c of the wafer 11.

[0049] In the embodiment described above, the outlet 18c of the ejector 18 is connected to the processing chamber cover 22. In this case, when grinding the wafer 11 in the processing chamber R, it becomes possible to supply fluid passing through the inside of the ejector 18 to the processing chamber R in order to generate an attractive force acting on the wafer 11 so as to hold the wafer 11 on the chuck table 8.

[0050] As a result, when grinding the wafer 11 in the processing chamber R, this fluid acts as a barrier, making it difficult for foreign matter to adhere to the processing chamber cover 22. Furthermore, even if foreign matter does adhere to the processing chamber cover 22, the fluid is blown onto the foreign matter, making it easier for the foreign matter to detach from the processing chamber cover 22. Consequently, in the above-described embodiment, it is possible to reduce the probability of foreign matter adhering to the processing chamber cover 22 when grinding the wafer 11 in the processing chamber R.

[0051] Furthermore, in the embodiment described above, the fluid supplied to the processing chamber R from the outlet 18c of the ejector 18 flows along the top plate 24 of the processing chamber cover 22 so as to act as a barrier between the chuck table 8 positioned at the grinding position and the top plate 24, and is blown onto the top plate 24. In this case, when grinding the wafer 11 in the processing chamber R, foreign matter is less likely to adhere to the top plate 24. As a result, the probability of foreign matter falling from the top plate 24 onto the chuck table 8 after grinding can be reduced.

[0052] The embodiments described above are merely one aspect of the present invention, and the present invention is not limited to the embodiments described above. For example, the present invention may include a processing chamber cover having a structure different from that of the processing chamber cover 22. Specifically, the present invention may include a processing chamber cover in which one or more openings connected to the outlet 18c of the ejector 18 are formed in at least one of the top plate, front side plate, rear side plate, or left side plate, instead of or in addition to the right side plate.

[0053] Such a processing chamber cover may have, for example, a right-side plate and a left-side plate with openings formed near their upper ends. That is, it may have a right-side plate with an opening for the fluid supplied from the outlet 18c of the ejector 18 to flow to the left, and a left-side plate with an opening for the fluid to flow to the right. In this case, foreign matter will not adhere evenly across the entire top surface of the processing chamber cover.

[0054] Furthermore, the present invention may also be a device capable of processing other than grinding. For example, the present invention may be a cutting device that includes a cutting unit for cutting a wafer 11 and is capable of cutting the wafer 11 in a processing chamber that is at least partially defined by a processing chamber cover connected to the outlet of an ejector. Moreover, the present invention may also be a cutting method in which a fluid is supplied from the outlet of an ejector to the processing chamber when cutting the wafer 11 in this cutting device.

[0055] Furthermore, the present invention may also be an apparatus capable of performing processes other than processing. For example, the present invention may be a cleaning apparatus that includes a cleaning unit for cleaning a wafer 11 and is capable of cleaning the wafer 11 in a cleaning chamber that is at least partially defined by a cleaning chamber cover connected to the outlet of an ejector. Moreover, the present invention may also be a cleaning method in which a fluid is supplied from the outlet of an ejector to the cleaning chamber when cleaning the wafer 11 in this cleaning apparatus.

[0056] Furthermore, the present invention may use a wafer having a different structure from wafer 11 as the workpiece. For example, the present invention may use a wafer having notches formed on its outer edge instead of orientation flats as the workpiece. Alternatively, the present invention may use, in place of or in addition to a wafer, at least one of a plurality of dies manufactured from a wafer, a semiconductor package substrate manufactured by encapsulating the plurality of dies with resin, or a plurality of semiconductor packages manufactured from a semiconductor package substrate as the workpiece.

[0057] Furthermore, the present invention may also be a method for manufacturing a chip that can produce a die or a chip such as a semiconductor package by processing a wafer or a semiconductor package substrate as a workpiece. This chip is manufactured, for example, by cutting a wafer 11 so as to divide it along the boundaries of a plurality of devices 13, or by forming division starting points along the boundaries of a plurality of devices 13 on the wafer 11 and then grinding the back surface 11c side of the wafer 11 as described above so as to divide it along the boundaries of a plurality of devices 13.

[0058] The splitting point includes, for example, a groove formed by cutting the wafer 11 from the surface 11b side. Alternatively, the splitting point includes a modified portion, which is a part of the wafer 11 material where the crystal structure is disordered, and a crack that extends from the modified portion so as not to be exposed on the back surface 11c, even though it is exposed on the surface 11b.

[0059] Such modified areas are formed, for example, by irradiating the wafer 11 with a laser beam of a wavelength that penetrates the material of the wafer 11, with the focal point positioned at the boundary of multiple devices 13. When the modified areas are formed, the volume of the wafer 11 expands, generating internal stress in the wafer 11. Cracks are then formed by the internal stress acting in such a way that it cleaves the portion of the wafer 11 near the modified areas along the thickness direction.

[0060] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0061] 2: Grinding equipment (processing equipment) 4: Base (4a: Recess) 6: Holding Unit 8: Chuck Table 10: Frame (10a: bottom wall, 10b: side wall, 10c: flow path) 11: Wafer (11a: Orientation flat, 11b: Front side, 11c: Back side) 12: Porous plate 13: Devices 14: Table cover 16: Dustproof and splashproof cover 18: Ejector (18a: Inlet, 18b: Suction port, 18c: Outlet) 20: Fluid supply source 22: Processing room cover 24: Top panel (24a: Opening) 26: Front plate (26a: opening) 28: Rear side plate 30:Left side board 32: Right side plate (32a: opening) 34: Piping 36: Nozzle 38:Support structure 40: Grinding Unit 42:Z direction movement mechanism 44: Guide rail 46: Z-direction movement plate 48: Screw shaft 50: Motor 52: Support member 54: Spindle Housing 56: Motor 58: Spindle 60: Wheel Mount 62: Grinding wheel (62a: Grinding wheel, 62b: Wheel base)

Claims

1. A processing apparatus for processing materials in a processing chamber, A processing chamber cover defining at least a portion of the processing chamber, A chuck table into which the object to be processed is brought, A processing apparatus comprising an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover.

2. The apparatus according to claim 1, wherein the processing chamber cover is provided such that the fluid supplied from the outlet of the ejector flows along its top plate.

3. The processing apparatus according to claim 1 or 2, further comprising a grinding unit for grinding the workpiece.

4. The processing apparatus according to claim 1 or 2, further comprising a cutting unit for cutting the workpiece.

5. The processing apparatus according to claim 1 or 2, further comprising a washing unit for washing the object to be processed.

6. A processing method for processing an object in a processing chamber of a processing apparatus comprising: a processing chamber cover defining at least a portion of the processing chamber; a chuck table into which an object to be processed is brought; and an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover, the method comprising: A processing method in which, when processing an object to be processed in the processing chamber, the fluid supplied from the fluid supply source passes through the inside of the ejector from the inlet to the outlet, and the resulting suction force is applied to the object to be processed from the suction port through the chuck table, thereby holding the object to be processed on the chuck table, while the fluid is supplied from the outlet of the ejector to the processing chamber.

7. The processing method according to claim 6, wherein, when processing the object to be processed in the processing chamber, the fluid supplied from the outlet of the ejector flows along the top plate of the processing chamber cover.

8. The processing method according to claim 6 or 7, wherein the workpiece is ground when it is processed in the processing chamber.

9. The processing method according to claim 6 or 7, wherein the workpiece to be processed is cut when the workpiece is processed in the processing chamber.

10. The processing method according to claim 6 or 7, wherein the object to be processed is washed when the object to be processed in the processing chamber.

11. A method for manufacturing a chip, comprising a processing chamber of a processing apparatus comprising a processing chamber cover defining at least a portion of the processing chamber, a chuck table into which a workpiece having a plurality of devices formed thereon is loaded, and an ejector including an inlet connected to a fluid supply source, a suction port connected to the chuck table, and an outlet connected to the processing chamber cover, wherein the workpiece is processed in such a way as to divide it along the boundaries of the plurality of devices, A method for manufacturing a chip, wherein, when processing a workpiece in the processing chamber, the fluid supplied from the fluid supply source passes through the inside of the ejector from the inlet to the outlet, and the resulting suction force is applied to the workpiece through the chuck table from the suction port, thereby holding the workpiece on the chuck table, while the fluid is supplied from the outlet of the ejector to the processing chamber.

Images