Connection pin module for high-frequency signal transmission

Abstract

The objective is to provide a connection pin module for high-frequency signal transmission that includes a metal body and multiple signal transmission elements. [Solution] The metal body has multiple through channels, and each signal transmission body is placed within the corresponding channel. Each signal transmission body comprises a signal connection pin and a non-conductive medium. The non-conductive medium is placed around the signal connection pin, creating a gap between the signal connection pin and the channel wall. This allows the connection pin module to be constructed with a specific arrangement and corresponding materials, reducing signal interference and avoiding becoming a bottleneck that hinders improved transmission speed.

Description

[Technical Field]

[0001] The present disclosure relates to a connection pin module, and in particular, to a connection pin module for high-frequency signal transmission. [Background Art]

[0002] In a signal transmission path, signals often pass through various connection pin modules, and these connection pin modules are used to connect transmission paths between different interfaces or devices.

[0003] With the increase in data transmission volume, in order to transmit more data per unit time, it is required to expand the bandwidth at a higher frequency and achieve high-speed transmission. Due to such high-frequency requirements, conventional connection pin modules can become an obstacle to the improvement of transmission speed. This is because impedance matching is strictly required for high-frequency signals (e.g., RF signals), and the matching is affected by the configuration and combination on the transmission interface.

[0004] In a signal transmission path, it is necessary to eliminate various interferences, and the processing is generally complicated. Although connection pin modules are merely connection interfaces, transmission of high-frequency signals can be further stabilized by imparting low-interference characteristics to these connection pin modules. Therefore, a connection pin module suitable for high-frequency signal transmission is desired. [Summary of Invention] [Problem to be Solved by the Invention]

[0005] The connection pin module in some embodiments of the present disclosure provides a configuration and arrangement suitable for high-frequency signal transmission. [Means for Solving the Problem]

[0006] According to several embodiments, a connection pin module for high-frequency signal transmission is proposed, comprising a metal body and a plurality of signal transmission bodies. The metal body comprises a plurality of through-channels. Each signal transmission body is arranged within a corresponding channel. Each signal transmission body comprises signal connection pins and a non-conductive medium. The non-conductive medium is arranged around the signal connection pins, forming a gap between the signal connection pins and the walls of the channels.

[0007] According to some embodiments, the metal body may comprise an assembled first body and a second body. The channel wall of the first body may have a first stepped portion. The channel wall of the second body may have a second stepped portion. The non-conductive medium is prevented from escaping upward by the first stepped portion. The non-conductive medium is also prevented from escaping downward by the second stepped portion.

[0008] According to some embodiments, the periphery of the first body may be provided with an extended portion that extends downward. The extended portion can define a recess on the bottom side of the first body, and the second body is positioned within the recess.

[0009] According to some embodiments, the non-conductive medium may have a projection on the upper surface of the first body. The projection receives the pressing force from the upper contact plate by the second stepped portion, thereby maintaining the distance between the first body and the contact plate at a predetermined distance.

[0010] According to some embodiments, the protrusion of the protruding portion does not exceed 0.4 mm from the upper surface of the first body, or the protrusion is approximately 0.2 mm, or the protrusion is in the range of 0.16 mm to 0.24 mm.

[0011] According to some embodiments, the non-conductive medium may comprise a first medium portion and a second medium portion. The first medium portion is located within a channel of a first body, and the second medium portion is located within a channel of a second body.

[0012] According to some embodiments, the material of the non-conductive medium may include at least Teflon®.

[0013] According to some embodiments, the material of the metal body may be brass or aluminum.

[0014] According to some embodiments, a plurality of earthing connection pins may be included. The metal body further includes a plurality of blind holes. The blind holes are arranged around the corresponding channels, and each earthing connection pin is located within the corresponding blind hole and has an extendable portion protruding from the blind hole.

[0015] According to some embodiments, the blind hole is positioned as a through-hole upper blind hole in the first body and as a non-through-hole lower blind hole in the second body.

[0016] According to some embodiments, both the signal connection pin and the ground connection pin may be pogo pins. [Effects of the Invention]

[0017] Therefore, the connection pin module is constructed with a specific arrangement and corresponding materials. This makes it applicable to the transmission of high-frequency signals and does not become a bottleneck in improving transmission speed. [Brief explanation of the drawing]

[0018] [Figure 1] This is a schematic perspective view of a connection pin module according to several embodiments. [Figure 2] Figure 1 is a schematic top view of the embodiment. [Figure 3] This is a schematic cross-sectional view along line AA in the embodiment shown in Figure 2. [Figure 4] This is a schematic cross-sectional view along line BB in the embodiment shown in Figure 2. [Figure 5] This is a magnified view of a portion of Figure 3. [Modes for carrying out the invention]

[0019] In order to fully understand the objectives, features and effects of the present invention, the present invention will be described in detail below by combining specific embodiments with the accompanying drawings.

[0020] As used in this specification, the terms "a" or "one" are used to describe units, components, structures, devices, modules, systems, portions or regions, etc. This is for convenience of description only and is intended to give the general meaning of the scope of the present invention. Therefore, unless the context clearly indicates otherwise, such description should be understood to include one or at least one, and the singular form also includes the plural.

[0021] As used in this specification, the terms "comprise", "include", "have" or other similar terms are not limited to those elements recited herein, and may include other elements not explicitly described but generally inherent to the unit, component, structure, device, module, system, portion or region.

[0022] As used in this specification, similar ordinal terms such as "first" or "second" are used to distinguish or refer to the same or similar elements, structures, portions or regions, and do not necessarily imply a spatial order of these elements, structures, portions or regions. It should be understood that in some cases or configurations, ordinal terms may be used interchangeably without affecting the implementation of the present invention.

[0023] Reference is made to FIG. 1, which is a schematic perspective view of a connection pin module according to some embodiments. The connection pin module is generally disposed on a support body 300, and terminals for electrical connection with corresponding parts are provided on the upper and lower sides of the connection pin module. In other words, the connection pin module functions as a medium that establishes an electrical connection path via terminals between apparatuses, components, or other devices.

[0024] For example, a carrier (not shown) of the device under test located above the connection pin module can form an electrical connection by contacting the connection pin module. Furthermore, for example, the carrier of the device under test can form a stable electrical connection with the connection pin module by applying downward pressure. On the other hand, the lower part of the connection pin module can establish an electrical connection with a downstream control device by connecting to a transmission line or by contacting another carrier.

[0025] As shown in Figure 1, the connection pin module comprises a metal body 100, a signal transmission body 210, a low-frequency signal transmission body 220, and ground connection pins 230. The signal transmission body 210 comprises signal connection pins 211 and a non-conductive medium 212. The non-conductive medium 212 surrounds and covers the signal connection pins 211. Similarly, the low-frequency signal transmission body 220 comprises a non-conductive medium 222 surrounding the low-frequency signal connection pins 221. The ground connection pins 230 are evenly arranged in an array around the signal transmission body 210.

[0026] As shown in Figure 1, the thickness of the non-conductive medium 222 surrounding the low-frequency signal transmission body 220 is thinner than the thickness of the non-conductive medium 212 surrounding the signal connection pin 211. This is because the low-frequency signal transmission body 220 is typically used to transmit low-frequency signals (e.g., several hundred MHz or less), and the impedance requirements are relatively lenient, allowing the overall volume to be reduced by making the medium thinner. On the other hand, the signal transmission body 210 is used to transmit high-frequency signals, such as in the GHz band (e.g., 7.5 Gbps), and the impedance matching requirements are strict; therefore, in the configuration of the present invention, a thicker non-conductive medium 212 is used. Note that the ground connection pin 230 shown in Figure 1 is unnecessary in some embodiments and may not be provided.

[0027] The nonconductive media 212 and 222 are a type of high-performance nonconductive media that may be composed of Teflon®, i.e., polytetrafluoroethylene (PTFE). However, in other embodiments, other types of nonconductive media may be used.

[0028] In some embodiments of the present invention, the body of the connection pin module is constructed using a metal body 100, which includes a channel 101 that penetrates the body. The signal transmission body 210 is placed within the channel 101. The signal connection pins 211 are electrically insulated from the walls of the channel 101 by being surrounded by a non-conductive medium 212. The material of the metal body 100 may be brass or aluminum, etc. With this basic structure, the signal connection pins 211 are arranged within the metal block, and the impedance matching of the signal connection pins 211 is precisely controlled by the diameter of the channel 101 and the combined non-conductive medium 212, enabling the connection pin module to handle high-frequency signal transmission.

[0029] Next, please refer to Figures 1 to 4. Figure 2 is a schematic top view of the embodiment in Figure 1, Figure 3 is a schematic cross-sectional view along line AA in the embodiment in Figure 2, and Figure 4 is a schematic cross-sectional view along line BB in the embodiment in Figure 2.

[0030] The metal body 100 can be configured to include a first body 110 and a second body 120. The first body 110 and the second body 120 are assembled together. In the embodiments shown in Figures 1 to 4, a configuration is shown in which the second body 120 is fitted into the first body 110. With this configuration, the first body 110, which has an enclosing structure, can provide a wide area of ​​coverage and shielding to the assembly surface between the first body 110 and the second body 120, contributing to improved signal transmission quality. Regarding the channel 102, it is possible to configure it so that about half of the channel 102 is formed in the first body 110 and the remainder is formed in the second body 120. In other embodiments, different distribution ratios are also possible. Compared to the second body 120, a larger portion (more than 50%) of the channel 102 can be distributed within the first body 110, for example, 2 / 3 of the total depth of the channel 102 can be distributed within the first body 110.

[0031] The periphery of the first body 110 is configured to enclose the periphery of the second body 120 by an extended portion 115 that extends downward. Furthermore, the extended portion 115 can define a recess on the bottom side of the first body 110, and the second body 120 is fitted into this recess, thereby being positioned inside the first body 110.

[0032] Next, please refer to Figures 2 to 5. Figure 5 is a partially enlarged view of Figure 3. A first stepped portion 111 is provided on the wall surface of the channel 101 molded within the first body 110. A second stepped portion 121 is provided on the wall surface of the channel 101 molded within the second body 120. The non-conductive medium 212 is divided into a first medium portion 212a, which is located within the channel of the first body 110, and a second medium portion 212b, which is located within the channel of the second body 120, corresponding to the first body 110 and the second body 120.

[0033] The non-conductive medium 212 can be fixed and restricted by the stepped portions formed on the wall surface of the channel 101. The first medium portion 212a can be prevented from coming out upward from the channel 101 by the stopper action of the first stepped portion 111. The second medium portion 212b can be prevented from coming out downward from the channel 101 by the stopper action of the second stepped portion 121. These stepped portions are formed as a stepped structure on the wall surface surrounding the channel 101, and this configuration facilitates assembly work and subsequent maintenance.

[0034] As shown in Figures 3 and 5, the first medium portion 212a of the non-conductive medium 212 has a projection on the upper surface of the first body 110. This projection has the function of controlling the distance between the contact plate (or carrier) positioned above the connection pin module and the upper surface of the metal body 100. When the contact plate is pushed downward to establish a contact-type electrical connection, the projection of the first medium portion 212a and the second stepped portion 121 limit the maximum amount the contact plate can be pushed in. That is, the projection receives the contact plate, limiting the pushing stroke and maintaining at least a predetermined distance between the first body 110 and the contact plate.

[0035] The amount of protrusion of this protrusion (a factor that determines the minimum predetermined distance secured between the carrier and the metal body 100) also affects the quality of signal transmission. In some embodiments, the protrusion can be configured such that the height d protruding from the upper surface of the first body 110 is 0.4 mm or less. In some embodiments, the protrusions of each nonconductive medium 212 provided on the metal body 100 can be configured such that the average value of the overall height d is approximately 0.2 mm. Furthermore, in other embodiments, the height d of the protrusion can be configured to be approximately 0.16 mm to 0.24 mm from the upper surface of the first body 110.

[0036] Next, please refer to Figure 4 again. Multiple grounding connection pins 230 can be further arranged within the metal body 100. Each of these grounding connection pins 230 is placed in a corresponding blind hole 103, which is a recessed hole formed downward from the upper surface of the metal body 100. Each blind hole 103 is arranged around the corresponding channel 102, and by arranging the blind holes 103 in an array, it is possible to provide grounding connection pins 230 in the vicinity of the channel 102. Similar to the configuration of the channel 102, the blind holes 103 can also be configured such that, for example, about half of them are formed in the first body 110 and the remainder in the second body 120. In other embodiments, different distribution ratios are also possible.

[0037] In some embodiments of the present invention, both the signal connection pin 211 and the ground connection pin 230 can be configured as pogo pins. The ground connection pin 230 has an extendable portion that protrudes from the blind hole 103, and the structure of the aforementioned protrusion ensures that the extendable portion of the ground connection pin 230 functions properly, thereby ensuring a contact-type electrical connection between the ground connection pin 230 and the contact plate.

[0038] In summary, the connection pin module is constructed with a unique arrangement and corresponding materials, and this basic structure reduces signal interference. This makes it applicable to the transmission of high-frequency signals, and prevents the connection pin module from becoming a bottleneck that hinders the improvement of transmission speed.

[0039] As used herein, the terms “approximately,” “about,” “nearly,” “substantially,” or “essentially” generally mean “any approximation of a given number” or “any approximation of a given range.” These approximations may vary depending on the relevant technical field, and the range of variation shall be consistent with the broadest interpretation understood by a person of ordinary skill in the art, thereby encompassing similar embodiments and variations thereof. In some embodiments, this means within ±20%, more preferably within ±10%, and even more preferably within ±5% of a given number or range. The numbers described herein are approximations, and unless otherwise explicitly stated, these values ​​may be presumed to be “approximately,” “about,” “nearly,” “substantially,” or “essentially,” or may include other approximations.

[0040] Although the present invention has disclosed best embodiments above, as those skilled in the art will understand, these embodiments are used solely for illustrative purposes and should not be understood as limiting the scope of the invention. It should be noted that all modifications and substitutions having equivalent effects to those in these embodiments are included within the scope of the invention. Therefore, the scope of protection of the present invention is as defined in the claims. [Explanation of Symbols]

[0041] 100 Metal body 101 channels 102 channels 103 Blind Hole 110 Main body 111 First step section 115 Extension section 120 Second Main Body 121 Second step section 210 Signal transmission unit 211 Signal connection pins 212 Non-conductive medium 212a 1st medium section 212b 2nd media section 220 Low-frequency signal transmission device 221 Low-frequency signal connection pin 222 Non-conductive medium 230 Grounding connection pins 300 Support d Height

Claims

1. A metal body with multiple channels that penetrate it, A plurality of signal transmission bodies, each arranged within a corresponding channel, each comprising a signal connection pin and a non-conductive medium arranged around the signal connection pin, forming a gap between the signal connection pin and the wall surface of the channel, A connection pin module for high-frequency signal transmission, including [specific components / features].

2. The connection pin module according to claim 1, wherein the metal body comprises an assembled first body and a second body, a first stepped portion is provided on the wall surface of each channel of the first body, a second stepped portion is provided on the wall surface of each channel of the second body, the non-conductive medium is prevented from coming out upward by the first stepped portion, and the non-conductive medium is prevented from coming out downward by the second stepped portion.

3. The connection pin module according to claim 2, wherein the periphery of the first body is provided with an extension portion that extends downward, the extension portion can define a recess on the bottom side of the first body, and the second body is disposed within the recess.

4. The connection pin module according to claim 2, wherein the non-conductive medium has a protrusion on the upper surface of the first body, and the protrusion receives the pressing force from the upper contact plate by the second stepped portion, thereby maintaining the distance between the first body and the contact plate at a predetermined distance.

5. The connection pin module according to claim 4, wherein the amount of protrusion of each of the aforementioned protrusions does not exceed 0.4 mm from the upper surface of the first main body.

6. The connection pin module according to claim 4, wherein the amount of protrusion of each of the aforementioned protrusions is in the range of 0.16 mm to 0.24 mm from the upper surface of the first main body.

7. The connection pin module according to claim 4, wherein the non-conductive medium comprises a first medium portion and a second medium portion, the first medium portion being disposed within the channel of the first body and the second medium portion being disposed within the channel of the second body.

8. The connection pin module according to any one of claims 1 to 7, wherein the material of the non-conductive medium includes at least Teflon®.

9. The connection pin module according to claim 8, wherein the material of the metal body is brass or aluminum.

10. The connection pin module according to claim 9, wherein the signal connection pin is a pogo pin.

11. The connection pin module according to claim 9, further comprising a plurality of ground connection pins, wherein the metal body further comprises a plurality of blind holes, each of which blind holes is arranged around a corresponding channel, and each of which ground connection pins is arranged within the corresponding blind hole and comprises an extendable portion protruding from the blind hole.

12. The connection pin module according to claim 11, wherein the ground connection pin is a pogo pin.

13. The connection pin module according to claim 2, further comprising a plurality of ground connection pins, wherein the metal body further comprises a plurality of blind holes, each of which blind holes is arranged around a corresponding channel, each of which ground connection pins is arranged within the corresponding blind hole, each of which blind hole is a through upper blind hole portion in the first body and a non-through lower blind hole portion in the second body.

14. The connection pin module according to claim 13, wherein the material of the non-conductive medium includes at least Teflon® (registered trademark).

15. The connection pin module according to claim 14, wherein the material of the metal body is brass or aluminum.

16. The connection pin module according to claim 15, wherein both the signal connection pin and the ground connection pin are pogo pins.

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