Substrate processing apparatus and chuck

Abstract

A substrate processing apparatus is provided, comprising: a chamber having a processing space; a chuck for supporting the substrate in the processing space; a gas supply unit for supplying process gas to the processing space; and a plasma source for generating an electric field in the processing space, wherein the chuck includes a support plate for supporting the substrate and provided as an electrode for the plasma source; a support shaft for supporting the support plate; a conductor mounted inside the support shaft and electrically connected to the support plate; a connecting assembly coupled to the support shaft and electrically connected to the conductor; and a grounding line, one end of which is electrically connected to the connecting assembly and the other end of which is grounded.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate and a chuck.

Background Art

[0002] In order to manufacture semiconductor elements or flat display panels, various processes such as a deposition process, a photolithography process, an etching process, and a cleaning process are performed. Among these processes, the photolithography process includes a coating process of applying a photosensitive liquid such as photoresist to form a film on the surface of a substrate, an exposure process of transferring a circuit pattern to the film formed on the substrate, and a development process of selectively removing the film formed on the substrate in the exposed area or its reverse area. Also, a heat treatment process is performed before and after these coating, exposure, and development processes are carried out.

[0003] In this case, the etching process mainly uses a dry etching process and a wet etching process. The dry etching process mainly forms a plasma atmosphere on the substrate to proceed with the etching.

[0004] Plasma refers to an ionized gaseous state composed of ions, radicals, and electrons, etc., and is generated by a very high temperature, a strong electric field, or a radio frequency electromagnetic field (RF Electromagnetic Fields). The semiconductor element manufacturing process includes an ashing or etching process of removing a film on a substrate using plasma. The ashing or etching process is carried out by the ions and radical particles contained in the plasma colliding or reacting with the film on the substrate.

[0005] An apparatus for processing a substrate using plasma can be used to remove a film on the substrate (for example, a hard mask formed on the substrate or a photoresist film formed on the substrate). After removing the film on the substrate using plasma, the substrate is transferred to a liquid processing chamber to remove process by-products remaining on the substrate. In the liquid processing chamber, a chemical solution is supplied to the substrate to remove the processing by-products remaining on the substrate.

[0006] On the other hand, the substrate is fixed to the chuck during the plasma processing process. In this case, the chuck is used as an electrode to excite the plasma. At this time, the chuck allows the current generated during plasma discharge to flow to the ground line through a conductor installed inside it.

[0007] In this case, since the conductor is heated by heat conduction from the chuck during the plasma process, the contact resistance of the fulcrum connecting the conductor and the ground line increases due to deterioration or oxidation of the contacts when used for a long period of time.

[0008] Therefore, the connection point between the conductor and the ground line generates heat over time, causing thermal deformation, which leads to carbonization (burning) of the connection point between the conductor and the ground line. [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] The technical problem of the present invention is to provide a substrate processing apparatus and chuck that prevent thermal deformation and carbonization by ensuring that the contact resistance of the connection point between the conductor through which the plasma discharge current flows and the ground line does not increase even after prolonged use.

[0010] The problems that this invention aims to solve are not limited to those described above, and other problems not mentioned can be clearly understood by a person with ordinary skill in the art to which this invention pertains from this specification and the accompanying drawings. [Means for solving the problem]

[0011] The substrate processing apparatus of the present invention for achieving the aforementioned technical problems comprises a chamber having a processing space, a chuck for supporting the substrate in the processing space, a gas supply unit for supplying process gas to the processing space, and a plasma source for generating an electric field in the processing space, wherein the chuck includes a support plate for supporting the substrate and provided to the electrodes of the plasma source, a support shaft for supporting the support plate, a conductor mounted inside the support shaft and electrically connected to the support plate, a connecting assembly coupled to the support shaft and electrically connected to the conductor, and a grounding line with one end electrically connected to the connecting assembly and the other end grounded.

[0012] According to one embodiment, the connecting assembly can be arranged such that the pivot point electrically connected to the conductor and the pivot point electrically connected to the ground line are spaced apart.

[0013] According to one embodiment, the connecting assembly can be provided such that it elongates in one direction toward a pivot point to which the ground line is electrically connected, at a pivot point to which the conductor is electrically connected.

[0014] According to one embodiment, the support shaft has an insertion region formed therein, and the connecting assembly can be inserted into the insertion region.

[0015] According to one embodiment, the conductor is formed in a bar shape, a first hole is formed in the body, the support shaft has a screw hole further formed in the insertion region, and the connecting assembly includes a connecting terminal coupled to one end of the ground line, an inner block with one side in close contact with the inside of the support shaft and the other side in close contact with the conductor and with a second hole formed in the body, an outer block with one side in close contact with the conductor and with a fastening hole formed therein and a third hole formed therein, a first bolt whose body passes sequentially through the third hole, the first hole and the second hole and is fastened to the screw hole, with its head pressing against the outer block, and a second bolt whose body is screwed into the fastening hole of the outer block, with its head pressing against the connecting terminal and making it tightly contact with the outer block.

[0016] According to one embodiment, the inner block and the outer block may further include a conductive plating layer formed on their surfaces.

[0017] According to one embodiment, the connection terminal may further include a conductive plating layer formed on its surface.

[0018] According to one embodiment, the connecting assembly may further include a connecting plate formed in a plate shape, which is in close contact with the support shaft, has bolt holes formed in it, and is in close contact with one surface of the outer block, and a third bolt which passes through the bolt holes and is screwed onto the support shaft, and presses the connecting plate against the support shaft.

[0019] According to one embodiment, the outer block is formed in an elongated shape when viewed from above, the conductive material is in close contact with one of the two surfaces of the outer block passing through the one direction, and the fastening holes can be arranged adjacent to the other surface of the outer block passing through the one direction.

[0020] According to one embodiment, the conductor is formed in the shape of a rod, the connecting assembly comprises a connecting terminal coupled to one end of the ground line, a second block having an insertion hole into which the conductor is inserted and a fastening hole, and

[0021] The body may include a second bolt, the body of which is screwed into a fastening hole in the outer block, and whose head presses the connecting terminal against the outer block of the body for a tight fit.

[0022] According to one embodiment, the second block may further include irregularities that protrude toward the central part of the insertion hole at the inner peripheral edge of the insertion hole and come into contact with the conductor.

[0023] According to one embodiment, the second block may further include a conductive plating layer formed on the surface including the irregularities.

[0024] According to one embodiment, the connection terminal may further include a conductive plating layer formed on the surface.

[0025] According to one embodiment, the connection assembly may further include a coupling plate formed in a plate shape, adhered to the support shaft, with bolt holes formed therein, and adhered to one surface of the second block, and a third bolt that passes through the bolt holes and is screwed onto the support shaft to compress the coupling plate against the support shaft.

[0026] According to one embodiment, the second block may be formed in an elongated shape in one direction when viewed from above, the insertion hole may be disposed adjacent to one of the two surfaces passing through the one direction, and the fastening hole may be disposed adjacent to the other one of the two surfaces passing through the one direction.

[0027] On the other hand, in a chuck provided in a substrate processing apparatus for supporting a substrate, it includes a support plate for supporting the substrate, a support shaft for supporting the support plate, a conductor mounted inside the support shaft and electrically connected to the support plate, a connection assembly coupled to the support shaft and electrically connected to the conductor, and a ground line having one end electrically connected to the connection assembly and the other end grounded.

[0028] According to one embodiment, the connection assembly may be provided such that the fulcrum to which the conductor is electrically connected and the fulcrum to which the ground line is electrically connected are spaced apart.

[0029] According to one embodiment, the connection assembly may be provided such that it is elongated in one direction from the fulcrum to which the conductor is electrically connected toward the fulcrum to which the ground line is electrically connected.

[0030] According to one embodiment, the conductor is formed in a bar shape, a first hole is formed in the body, the support shaft has a screw hole further formed, and the connecting assembly includes a connecting terminal coupled to one end of the ground line, an inner block with one side in close contact with the inside of the support shaft and the other side in close contact with the conductor and with a second hole formed in the body, an outer block with one side in close contact with the conductor and with a fastening hole formed therein and a third hole formed therein, a first bolt whose body portion passes sequentially through the third hole, the first hole and the second hole and is fastened to the screw hole, with its head pressing against the outer block, and a second bolt whose body portion is screwed into the fastening hole of the outer block, with its head pressing against the connecting terminal and making it tightly contact with the outer block.

[0031] According to one embodiment, the conductor is formed in the shape of a rod, and the connecting assembly includes a connecting terminal connected to one end of the ground line, a second block having an insertion hole into which the conductor is inserted and a fastening hole, and a second bolt whose body is screwed into the fastening hole of the outer block and whose head presses the connecting terminal against the outer block to make it tightly attached. [Effects of the Invention]

[0032] This invention prevents thermal deformation and carbonization by ensuring that the contact resistance of the connection point between the conductor through which the plasma discharge current flows and the ground line does not increase even during prolonged use.

[0033] The effects of the present invention are not limited to those described above, and other effects not mentioned can be clearly understood by a person with ordinary skill in the art to which the present invention pertains from this specification and the accompanying drawings.

[0034] The diverse features and advantages of the non-limiting embodiments described herein may become more apparent by considering the detailed description together with the accompanying drawings. The accompanying drawings are provided solely for illustrative purposes and should not be construed as limiting the claims. The accompanying drawings are not considered to be drawn to scale unless expressly mentioned. For clarity, the various dimensions in the drawings may be exaggerated. [Brief explanation of the drawing]

[0035] [Figure 1] Figure 1 is a schematic diagram showing the state of a substrate being processed by a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] Figure 2 is a partial perspective view of the connecting assembly, which is coupled to the support shaft shown in Figure 1, as seen from an oblique direction. [Figure 3] Figure 3 is a perspective view of the connecting assembly shown in Figure 2, disassembled at the support shaft. [Figure 4] Figure 4 is a cross-sectional view of the connecting assembly shown in Figure 2, taken by cutting it in the longitudinal direction. [Figure 5] Figure 5 is a graph comparing the temperature change at the pivot point where the connection assembly and the ground line are connected during plasma discharge, with the temperature change at the pivot point where the ground line is connected when the connection assembly is absent. [Figure 6] Figure 6 is a partial perspective view of a connecting assembly used in a substrate processing apparatus according to another embodiment of the present invention. [Figure 7] Figure 7 is a perspective view of the connecting assembly shown in Figure 2, disassembled at the support shaft. [Figure 8] Figure 8 is a cross-sectional view of the connecting assembly shown in Figure 6, taken by cutting it in the vertical direction. [Figure 9] Figure 9 is a schematic diagram showing the state of a substrate being processed by a substrate processing apparatus according to the present invention or other embodiments. [Modes for carrying out the invention]

[0036] The exemplary embodiments will be described in more detail with reference to the accompanying drawings. The exemplary embodiments are provided to ensure thoroughness of the disclosure and to fully convey its scope to a person of ordinary skill in the art. To provide a complete understanding of the embodiments of the disclosure, several specific details are presented, such as examples of specific components, apparatus and methods. It will be apparent to a person skilled in the art that the exemplary embodiments may be embodied in many different forms, and neither should be construed as limiting the scope of the disclosure. In some exemplary embodiments, known processes, known apparatus structures and known techniques are not described in detail.

[0037] The terms used herein are solely for the purpose of describing specific exemplary embodiments and not to limit them. Singular or plural expressions, as used herein, are intended to include plural expressions unless they appear to be obviously different in context. The terms “include,” “contain,” “possess,” “have,” and “have” are open-ended and therefore identify the presence of the mentioned features, components, stages, operations, elements, and / or constituents, and do not exclude the presence or addition of one or more other features, components, stages, operations, elements, constituents, and / or groups thereof. Method stages, processes, and operations herein are not necessarily interpreted as being performed in any particular procedure discussed or described unless the procedure to be performed is explicitly stated. Additional or alternative stages may also be selected.

[0038] When an element or layer is referred to as “on,” “connected,” “joined,” “attached,” “adjacent,” or “covering” another element or layer, this means it is directly on, connected to, joined to, attached to, touching, or covering the other element or layer, or intermediate elements or layers may exist. Conversely, when an element is referred to as “directly on,” “directly connected,” or “directly joined” a different element or layer, it should be understood that there are no intermediate elements or layers. Throughout the specification, the same reference numeral refers to the same element. The term “and / or” as used in the present invention includes all combinations and subcombinations of one or more items from the enumerated items.

[0039] Although terms such as first, second, third, etc., may be used to describe various elements, regions, layers, and / or sections in the present invention, it should be understood that these elements, regions, layers, and / or sections should not be limited by these terms. These terms are used simply to distinguish one element, region, layer, or section from other elements, regions, layers, or sections. Thus, the first element, first region, first layer, or first section discussed below may be referred to as the second element, second region, second layer, or second section without escaping the teachings of the exemplary embodiments.

[0040] Spatially relative terms (e.g., “below,” “bottom,” “lower part,” “above,” “upper end,” etc.) may be used for explanatory convenience to describe the relationship between one element or feature and another element or feature as shown in the drawings. Spatially relative terms should be understood as intended to include not only the orientation shown in the drawings but also other orientations of the device in use or operation. For example, if the device in the drawing were turned upside down, the elements described as “below” or “bottom” of the other elements or features would be oriented “above” the other elements or features. Thus, the term “below” may include all top and bottom orientations. The device may be oriented differently (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used in the present invention may be interpreted accordingly.

[0041] When using the terms “identical” or “similar” in the descriptions of the examples, it should be understood that there may be some degree of uncertainty. Therefore, when one element or value is referred to as identical to other elements or values ​​that are different, it should be understood that the element or value in question is identical to other elements or values ​​within a manufacturing or operating tolerance (e.g., ±10%).

[0042] Where the terms “approximately” or “substantially” are used herein in relation to numerical values, it should be understood that such numerical values ​​include manufacturing or operating tolerances (e.g., ±10%). Furthermore, where the terms “generally” and “substantially” are used in relation to geometric forms, it should be understood that while accuracy of the geometric form is not required, there is a degree of latitude in the form within the scope of the disclosure.

[0043] Unless otherwise defined, all terms used in the present invention (including technical and scientific terms) have the same meaning as those generally understood by a person of ordinary skill in the art to which the exemplary embodiments belong. This includes commonly used, predefined terms, which should be interpreted in a way that is consistent with their meaning in the context of the relevant art, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0044] In this embodiment, a wafer is used as an example of the object to be processed. However, the technical concept of the present invention can also be applied to equipment used for processing other types of substrates besides wafers.

[0045] The following describes embodiments of the present invention with reference to the attached drawings.

[0046] Figure 1 is a schematic diagram showing the state of a substrate being processed by a substrate processing apparatus according to one embodiment of the present invention.

[0047] Referring to Figure 1, a substrate processing apparatus 10 according to one embodiment of the present invention may include a chamber 100, a chuck 200, a shower head 300, a fluid supply unit 400, a gas supply unit 500, an exhaust unit 600, a power supply unit 700, and a control unit 800.

[0048] The chamber 100 may have a processing space 102. The chamber 100 may be grounded. The processing space 102 of the chamber 100 may be a space in which a thin film removal process is performed to remove a hard mask formed on the substrate W. An entrance (not shown) may be formed on one side of the chamber 100 for loading the substrate W into the processing space 102 or for loading the substrate W out of the processing space 102. The entrance may be selectively opened and closed by a door (not shown). In addition, an exhaust hole 104 may be formed on the bottom surface of the chamber 100, which is connected to an exhaust unit 600 described later.

[0049] Furthermore, a cooling member 110 may be provided in the chamber 100. The cooling member 110 can regulate the temperature of the chamber 100. The cooling member 110 can regulate the temperature of the processing space 102. The cooling member 110 may be a flow path connected to a cooling fluid supply source that supplies a cooling fluid. The cooling fluid supplied to the cooling member 110 may be cooling water or a cooling gas. However, it is not limited to these, and the cooling member 110 can be made in various ways from known substrates that can transfer cold and heat to the chamber 100.

[0050] The chuck 200 can support the substrate W in the processing space 102. The chuck 200 can also be used as the lower electrode of the plasma source.

[0051] As an example of such a chuck 200, the chuck 200 may include a support plate 210, a support shaft 220, a heating member 230, a lifting member 240, a conductor 250, a connecting assembly 260, and a grounding line 270.

[0052] The support plate 210 may have a bonding surface to which the substrate W is bonded. The support plate 210 may have a roughly disc shape when viewed from above. A lower electrode may be provided within the support plate 210. The lower electrode provided within the support plate 210 may be grounded. When the power supply unit 700 supplies RF power to the shower head 300, the chuck 200 used as the lower electrode can excite plasma together with the process gas in the space between it and the shower head 300, which is the upper electrode. The support plate 210 may also be supported by a support shaft 220.

[0053] The support shaft 220 has its upper end connected to the lower part of the support plate 210 and its lower end connected to the upper surface of the lifting member 240. A conductor 250 may be mounted on the inside of the support shaft 220. A portion of the outer edge of the support shaft 220 may be extended outwards.

[0054] The heating element 230 may be installed inside the support plate 210. The heating element 230 may be a heater. The heating element 230 may be a heater that is heated by receiving power from a heating power source (not shown). The heating element 230 can adjust the temperature of the substrate W supported by the support plate 210 by receiving power from the heating power source.

[0055] The lifting member 240 can move the support shaft 220 in the vertical direction. The lifting member 240 can move the support shaft 220 in the vertical direction and change the height of the substrate W supported in the processing space 102.

[0056] The conductor 250 is formed in a bar shape that extends vertically from the support shaft 200. The conductor 250 may be mounted inside the support shaft 220. The upper end of the conductor 250 is electrically connected to the lower surface of the support plate 210, and the lower end is electrically connected to the connecting assembly 260. The conductor 250 can conduct the current flowing to the support plate 210 side during plasma discharge to the ground line 270.

[0057] The connecting assembly 260 electrically connects the conductor 250 and the ground line 270. The connecting assembly 260 can be coupled to an insertion region 220a formed in the support shaft 220. The connecting assembly 260 is provided in block form and provides a larger contact area than a typical conventional connector (not shown). Thus, the connecting assembly 260 conducts current while dissipating conducted heat, preventing thermal deformation and carbonization at the fulcrum where the ground line 270 is connected. Such a contact assembly is described in more detail below.

[0058] The grounding line 270 is formed in the form of a wire of a conductive metallic material. For example, the grounding line 270 may be formed in the form of a bundle of ductile conductive metallic materials such as copper. One end of the grounding line 270 may be electrically connected to the connecting assembly 260 and the other end may be grounded to the grounding surface. In this case, the grounding surface may be electrically connected to the chamber 100, and the other end of the grounding line 270 may be electrically connected to the chamber 100 and grounded.

[0059] The shower head 300 can be positioned on top of the chuck 200. The shower head 300 can be positioned on top of the substrate W supported by the chuck 200. The shower head 300 can supply process gas and / or process fluid to the processing space 102. The shower head 300 may be provided in a cylindrical shape having an internal space 302. Additionally, an injection hole 304 through which the process gas and / or process fluid flows may be formed on the lower surface of the shower head 300. An injection port may be formed on the upper part of the shower head 300, to which a fluid supply line 440 and a gas supply line 530, described later, are connected. The process fluid supplied by the fluid supply line 440 and the process gas supplied by the gas supply line 530 can flow into the internal space 302 through the injection port. The process gas and / or process fluid that have flowed into the internal space 302 can flow into the processing space 102 through the injection hole 304. Furthermore, the lower surface of the showerhead 300 can have a shape in which the lower surface of the edge region is lower than the lower surface of the central region. This allows the showerhead 300 to be inserted into and installed in an opening formed in the upper part of the chamber 100. The showerhead 300 can also be used as the upper electrode of a plasma source. When used as the upper electrode, the showerhead 300 can receive RF power from the power supply unit 700.

[0060] The fluid supply unit 400 can supply a processing fluid to the processing space 102. The processing fluid supplied by the fluid supply unit 400 may include water (H2O) or alcohol. The alcohol may be methanol (MeOH) or ethanol (EtOH). The fluid supply unit 400 may also include a processing fluid supply source 410, a vaporizer 420, a flow rate adjustment member 430, and a fluid supply line 440.

[0061] The processing fluid supply source 410 can supply a processing fluid containing water (H2O) to the vaporizer 420. The processing fluid supply source 410 can also supply a processing fluid containing alcohol to the vaporizer 420. The alcohol may be methanol (MeOH) or ethanol (EtOH).

[0062] Furthermore, the processing fluid supply source 410 can transmit liquid processing fluid to the vaporizer 420. In the vaporizer 420, the transmitted processing fluid can be transformed into a vaporized state by methods such as heating it to a high temperature. The high-temperature processing fluid transformed into a vaporized state in the vaporizer 420 can be transmitted to the shower head 300 through a fluid supply line 440 connected to the shower head 300. The processing fluid transmitted to the shower head 300 can be injected into the processing space 102 through the injection holes 304. In addition, the flow rate adjustment member 430 can change the supply flow rate of the processing fluid per unit time transmitted to the shower head 300. The flow rate adjustment member 430 may be a regulator or a flow rate adjustment valve. However, it is not limited to these, and the flow rate adjustment member 430 can be variously modified with known devices that can change the supply flow rate of the processing fluid per unit time.

[0063] The gas supply unit 500 can supply process gas to the processing space 102. The process gas supplied to the processing space 102 by the gas supply unit 500 may include at least one of N2, Ar, H2, O2, and O.

[0064] The gas supply unit 500 may include a gas supply source 510, a flow control member 520, and a gas supply line 530.

[0065] The gas supply source 510 can supply process gas to the shower head 300 through the gas supply line 530. The process gas supplied to the shower head 300 can be supplied to the processing space 102 through the injection holes 304. The gas supply source 510 may include a first gas supply source 511, a second gas supply source 512, and a third gas supply source 513. The first gas supply source 511 can supply nitrogen (N2) gas. The second gas supply source 512 can supply argon (Ar) gas. The third gas supply source 513 can supply hydrogen (H2) gas. In addition, the flow rate per unit time of the process gas supplied by the gas supply source 510 can be adjusted by a flow rate control member 520. For example, the flow rate control member 520 may include a first flow rate control member 521, a second flow rate control member 522, and a third flow rate control member 523. Furthermore, the flow rate per unit time of the process gas supplied by the first gas supply source 511 can be adjusted by a first flow rate control member 521 installed in the gas supply line 530. Similarly, the flow rate per unit time of the process gas supplied by the second gas supply source 512 can be adjusted by a second flow rate control member 522 installed in the gas supply line 530. Finally, the flow rate per unit time of the process gas supplied by the third gas supply source 513 can be adjusted by a third flow rate control member 523 installed in the gas supply line 530. The flow rate control member 520 may be a regulator or a flow rate control valve. However, it is not limited to these, and the flow rate control member 520 can be varied in any known device for adjusting the flow rate per unit time of the process gas.

[0066] The exhaust unit 600 can exhaust the processing space 102. The exhaust unit 600 can exhaust the processing space 102 at at least one time interval: before the substrate W is processed, after the substrate W is processed, and while the substrate W is being processed. The exhaust unit 600 can exhaust the processing space 102 and discharge the process gas supplied to the processing space 102, the processing fluid, and any by-products (or impurities) that may be generated during the processing of the substrate W to the outside of the processing space 102. The exhaust unit 600 may include an exhaust line 602 connected to an exhaust hole 104, and an exhaust member 604 that provides a reduced pressure to the exhaust line 602. The exhaust member 604 may be a pump. However, it is not limited to this, and the exhaust member 604 can be varied in various ways in known devices that provide a reduced pressure to the processing space 102 and exhaust the processing space 102.

[0067] The power supply unit 700 can generate an electric field in the processing space 102. The power supply unit 700 can apply RF power to the showerhead 300 to generate the electric field. The power supply unit 700 can be electrically connected between the showerhead 300 and ground. Such a power supply unit 700 can generate an electric field in the processing space 102 and generate plasma from the process gas or processing fluid supplied to the processing space 102. The power supply unit 700 may include a high-frequency power supply 702 and a matching unit 704. The high-frequency power supply 702 may be an RF power supply. The matching unit 704 can perform matching to the high-frequency power supply 702.

[0068] On the other hand, while one embodiment of the present invention has been illustrated as a substrate processing apparatus using a shower head 300 as an upper electrode, a chuck 200 as a lower electrode, and a power supply unit 700 that supplies high-frequency power to the shower head 300 and the chuck 200 as a plasma source, the plasma source is not limited to this and can be modified to various forms such as ICP type or induced magnetic field type using an antenna, which will be explained later.

[0069] The controller 800 can control the substrate processing apparatus 10. The controller 800 can control the substrate processing apparatus 10 so that it can perform a film removal step to remove a film on the substrate W, and a protective film formation step to form a protective film on the substrate W. For example, the controller 800 can control the substrate processing apparatus 10 so that it can perform the substrate processing method described below. For example, the controller 800 can control at least one of the following: the cooling member 110, the lifting member 240, the heating member 230, the heating power supply that transmits power to the heating member 230, the fluid supply unit 400, the gas supply unit 500, the exhaust unit 600, and the power supply unit 700. Furthermore, the control unit 800 may include a process controller, which is a microprocess (computer) that controls the substrate processing device 10; a user interface, which includes a keyboard for the operator to input commands and perform other operations to manage the substrate processing device 10, and a display that visualizes and displays the operating status of the substrate processing device 10; and a storage unit that stores a control program for executing the processing performed by the substrate processing device 10 under the control of the process controller, and a program for executing processing in each component according to various data and processing conditions, i.e., a processing recipe. The user interface and the storage unit may also be connected to the process controller. The processing recipe may be stored in a storage medium within the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or DVD, or a semiconducting memory such as flash memory.

[0070] The aforementioned connecting assembly 260 will be described in more detail below.

[0071] Figure 2 is a partial perspective view of the connecting assembly shown in Figure 1, which is connected to the support shaft, as seen from an oblique direction. Figure 3 is a perspective view of the connecting assembly shown in Figure 2, disassembled at the support shaft. Figure 4 is a cross-sectional view of the connecting assembly shown in Figure 2, taken by cutting it in the longitudinal direction.

[0072] Referring further to Figures 2 to 4, in one embodiment of the present invention, the substrate processing apparatus 10 has a connecting assembly 260 that electrically connects the conductor 250 and the ground line 270.

[0073] Here, the conductor 250 is formed in a bar shape as described above and is inserted inside the support shaft 220. In addition, a first hole 251 is formed at the lower end of the conductor 250, and the body of the first bolt 263, which will be described later, is inserted into the first hole 251.

[0074] Furthermore, the connecting assembly 260 may include an inner block 261, an outer block 262, a first bolt 263, a second bolt 264, a connecting terminal 265, a connecting plate 266, and a third bolt 267.

[0075] The inner block 261 is formed in a roughly rectangular parallelepiped shape. One side of the inner block 261 is in close contact with the support shaft 220, and the other side is in close contact with the conductor 250. In this case, the support shaft 220 has an insertion region 220a into which the connecting assembly 260 can be inserted. The inner block 261 is also formed of a conductive metallic material. For example, the inner block 261 can be made of copper. In this case, the surface of the inner block 261 can have a conductive plating layer formed to prevent an increase in contact resistance due to the oxidation of copper. As an example of a conductive plating layer, the conductive plating layer can be made of silver. The inner block 261 also has a second hole 261a into which the body of the first bolt 263 is inserted, and the number of second holes 261a corresponds to the number of first bolts 263. In such an inner block 261, one side is in close contact with the insertion region 220a of the support shaft 220, and the other side is in contact with one side of the conductor 250. Therefore, the inner block 261 connects the conductor 250 to the support shaft 220 by electrically linking the conductor 250 to the support shaft 220, thereby grounding the conductor 250 to the support shaft 220.

[0076] The outer block 262 is formed in the shape of a polyhedron that is elongated in at least one direction. For example, the outer block 262 can be formed in the shape of a rectangular parallelepiped. One side of the outer block 262 is in close contact with the conductor 250. The outer block 262 is also inserted into the insertion region 220a of the support shaft 220. The outer block 262 is also formed of a conductive metallic material. For example, the outer block 262 can be made of copper. In this case, a conductive plating layer can be formed on the surface of the outer block 262 to prevent an increase in contact resistance due to the oxidation of copper. As an example of a conductive plating layer, the conductive plating layer can be made of silver. The outer block 262 also has third holes 262a formed for the insertion of the body of the first bolt 263, and the number of third holes 262a corresponds to the number of first bolts 263. The outer block 262 also has fixing grooves 262b formed for fixing the heads of the first bolts 263.

[0077] Furthermore, a fastening hole 263c is formed in the outer block 262 for screwing in the body of the second bolt 264. In this case, the connection terminal 265 of the grounding line 270 is in close contact with the area around the fastening hole 263c, electrically connecting the outer block 262 and the grounding line 270. Since the outer block 262 is installed between the conductor 250 and the grounding line 270 in this way, it electrically connects the conductor 250 and the grounding line 270, absorbing and releasing the heat transferred to the conductor 250 during substrate processing. As a result, the grounding line 270 does not receive direct heat conduction on the conductor 250 side, and the thermal shock is absorbed by the outer block 262, preventing the connection terminal 265 from being heated to the point of carbonization. Therefore, since the contact area of ​​the connection terminal 265 is not carbonized, an increase in contact resistance due to carbonization is prevented.

[0078] Furthermore, the outer block 262 minimizes the transfer of heat from the conductor 250 to the ground line 270. To this end, the outer block 262 is formed as an elongated rectangle in one direction when viewed from above. In this case, when viewed from above, the conductor 250 is in contact with one of the two vertical surfaces of the outer block 262, and fastening holes 263c are formed adjacent to the other surface opposite to the surface in contact with the conductor 250. As a result, the heat transferred from the conductor 250 is continuously released before being conducted to the ground line 270, minimizing the heat conducted from the conductor 250 side to the ground line 270, preventing carbonization of the connection terminal 265, and thus preventing an increase in contact resistance. At this time, the outer block 262 can be positioned so that the fastening holes 263c are located near the lowest temperature region by positioning the fastening holes 263c so that they are adjacent to the central lower end of the upper and lower ends when viewed from the side. Therefore, the heat conducted on the conductor 250 side of the connection terminal 265 is minimized, preventing carbonization and thus preventing an increase in contact resistance.

[0079] The first bolt 263 is fastened to a threaded hole 220b formed in the insertion region 220a inside the support shaft 220, by sequentially passing through the third hole 262a of the outer block 262, the first hole 251 of the conductor 250, and the second hole 261a of the inner block 261. In this case, the head of the first bolt 263 presses the outer block 262 toward the support rod and inner block 261, increasing the bonding force between the outer block 262 and the support rod and inner block 261. Therefore, the bonding force between the outer block 262, the conductor 250, and the inner block 261, which are pressed by the first bolt 263, is maintained even when subjected to external impact, and the contact resistance does not fluctuate.

[0080] The second bolt 264 is fastened by screwing its shank into the fastening hole 263c of the outer block 262. In this case, a connecting terminal 265 is inserted into the shank of the second bolt 264, and the head of the second bolt 264 presses the connecting terminal 265 against the outer block 262, ensuring a tight fit.

[0081] The connector terminal 265 is connected to the end of the grounding line 270. The connector terminal 265 is formed with one end in an annular shape so as to be inserted into the body of the second bolt 264, and the other end is formed in a cylindrical clip shape so as to surround the end of the grounding line 270. The connector terminal 265 can be made of a conductive metallic material including copper or nickel. In addition, the connector terminal 265 can have a conductive plating layer, such as silver, formed on its surface to prevent oxidation and corrosion. When such a connector terminal 265 is connected to the end of the grounding line 270, it is compressed by the second bolt 264 and made to be tightly attached to the outer block 262, thereby electrically connecting the grounding line 270 and the outer block 262 and maintaining the bonding force between the grounding line 270 and the outer block 262 so as not to increase contact resistance. Here, the grounding line 270 connected to the connector terminal 265 may be formed in a multi-pronged conductive metallic wire configuration. In this case, the connection terminal 265 can be formed with a socket shape at one end, and the socket-shaped end can be crimped and connected to one end of the bundled grounding line 270.

[0082] The connecting plate 266 can be formed in a plate shape having a plurality of bends. The connecting plate 266 can be fastened to a fastening groove 262b formed at one end of the support shaft 220. In addition, a plurality of bolt holes 266a can be formed in the connecting plate 266, and in this case, fastening holes 263c corresponding to the bolt holes can be formed in the support shaft 220. The connecting plate 266 can be connected to the support shaft 220 by fastening it to the fastening holes 263c with the third bolt 267 fastened in the bolt holes. Here, when the connecting plate 266 is fixed by the third bolt 267 in close contact with the support shaft 220, it presses on one surface of the outer block 262, applying pressure towards the support shaft 220 to prevent the outer block 262 from detaching. Therefore, the outer block 262 will not detach from the support shaft 220 due to the connecting plate 266.

[0083] The third bolt 267 consists of multiple bolts, each of which is screwed through the bolt hole 266a of the connecting plate 266 into the connecting hole 263c of the support shaft 220 and the connecting hole 262d of the outer block 262. When the third bolt 267 is connected to the fastening hole 263c, it presses the connecting plate 266 against the support shaft 220.

[0084] The following describes the current flow and temperature changes during plasma discharge in the substrate processing apparatus described above.

[0085] First, with the substrate processing apparatus supplying process gas into the chamber 100, the power supply unit 700 applies high-frequency power to the shower head 300, which is the upper electrode, and plasma is excited between the shower head 300 and the chuck 200, which is the lower electrode. At this time, the substrate W is etched or ashed by the plasma.

[0086] At this time, the current flowing during plasma discharge flows from the conductor 250 to the connecting assembly 260, and thereafter, the current flows from the connecting assembly 260 to the ground line 270 side, with the direction periodically switching depending on the high frequency.

[0087] Therefore, the conductor 250 conducts current during plasma discharge and is heated by the conduction of the chuck's temperature, which then conducts heat to the outer block 262 and the inner block 261.

[0088] Subsequently, the outer block 262, while releasing the heat conducted to the conductor 250, allows current to flow from the conductor 250 to the ground line 270. At this time, the outer block 262 is formed in a long, narrow rectangular shape in one direction, and the connection point of the conductor 250 and the connection point of the ground line 270 are separated in the manner described above. In this case, the outer block 262 allows current to flow from the conductor 250 to the ground line 270, but releases the heat conducted on the conductor 250 side so that it is not conducted to the ground line 270 side, and prevents the contact point between the connection terminal 265 and the outer block 262 from being carbonized by heat. Therefore, since the contact point between the connection terminal 265 and the outer block 262 is not carbonized, the contact resistance does not increase.

[0089] Referring further to Figure 5, Figure 5 is a graph comparing the temperature change at the pivot point where the connecting assembly and the ground line are connected during plasma discharge with the temperature change at the pivot point where the ground line is connected when the connecting assembly is absent.

[0090] As shown in Figure 5, when the connecting assembly 260 is not configured, the temperature value 1a at the pivot point to which the grounding line 270 is connected exceeds 400°C, causing the pivot point to which the connecting terminal 265 is connected to carbonize and the contact resistance to continuously increase.

[0091] However, when the connecting assembly 260 is assembled, the temperature value 1b of the pivot point where the connecting assembly 260 and the connecting terminal 265 are connected is formed at 200°C or less. This prevents the pivot point to which the connecting terminal 265 is connected from carbonizing, thereby preventing an increase in contact resistance.

[0092] Figure 6 is a partial perspective view of a connecting assembly used in a substrate processing apparatus according to another embodiment of the present invention. Figure 7 is a perspective view of the connecting assembly shown in Figure 2 disassembled at the support shaft. Figure 8 is a cross-sectional view of the connecting assembly shown in Figure 6, taken by cutting it in the longitudinal direction.

[0093] Referring to Figures 6 to 7, a substrate processing apparatus according to another embodiment of the present invention is formed with the same configuration as the embodiment described above. The difference between this embodiment and the embodiment described above is that the conductor 250 is formed in a rod shape, and the connecting assembly 260 has a different structure so that it can be connected to the rod-shaped conductor 250.

[0094] In the previously described embodiment, the conductor 250 was shown as being formed in a bar shape. However, in this embodiment, we will focus on describing a rod-shaped conductor 250 and its surrounding bonding structure.

[0095] In this embodiment, the conductor 250 has its upper end electrically connected to the lower surface of the support plate 210 and its lower end electrically connected to the connecting assembly 260. The conductor 250 can conduct the current flowing to the support plate 210 side during plasma discharge to the ground line 270.

[0096] The connecting assembly 260a includes a second block 268, a second bolt 264, a connecting terminal 265, a connecting plate 266, and a third bolt 267.

[0097] Here, the second bolt 264, the connecting terminal 265, the coupling plate 266, and the third bolt 267 are embodied in the same or similar manner as in the previously described embodiment, so redundant explanations are omitted.

[0098] The second block 268 is formed in the shape of a polyhedron that is elongated in at least one direction. For example, the second block 268 is formed in the shape of a rectangular parallelepiped. In this case, the second block 268 has an insertion hole 268a into which the conductor 250 is inserted. The insertion hole 268a is formed to penetrate from the upper to the lower part of the support shaft 200. Also, on the inner periphery of the insertion hole 268a, protrusions 268b are formed that project toward the center side of the insertion hole 268a. Here, the multiple protrusions 268b are in electrical contact with the outer periphery of the conductor 250. The protrusions 268b are formed so that even if the conductor 250 is distorted due to assembly errors when inserted into the insertion hole 268a, the contact area is maintained at a certain level or higher. As a result, when the conductor 250 is inserted into the insertion hole 268a, it is compressed by the protrusions 268b, so that the distance of the outer diameter is smaller than the horizontal distance between the protrusions 268b. Furthermore, the second block 268 is formed of a conductive metallic material, and its entire surface, including the inner periphery of the insertion hole 268a and the irregularities 268b, is plated. In this case, the plating can be silver plating. Thus, oxidation of the surface of the second block 268 is prevented.

[0099] Furthermore, the second block 268 has a fastening hole 263c formed in it, similar to the embodiment described above, for screwing in the body of the second bolt 264. In this case, the connection terminal 265 of the grounding line 270 is placed in close contact with the area around the fastening hole 263c, electrically connecting the outer block 262 and the grounding line 270. As the second block 268 is installed between the conductor 250 and the grounding line 270, it electrically connects the conductor 250 and the grounding line 270, while absorbing and releasing the heat transferred to the conductor 250 during substrate processing. As a result, the grounding line 270 does not receive direct heat conduction on the conductor 250 side, but the thermal shock is absorbed by the second block 268, preventing the connection portion of the connection terminal 265 from being heated to the point of carbonization. Therefore, since the contact portion of the connection terminal 265 is not carbonized, an increase in contact resistance due to carbonization is prevented.

[0100] Furthermore, the second block 268 minimizes the transfer of heat from the conductor 250 to the ground line 270. To this end, the second block 268 is formed in the shape of a long, narrow rectangle when viewed from above. In this case, when viewed from above, the second block 268 is formed such that the insertion hole 268a is adjacent to one side of the two vertical surfaces, and the fastening hole 263c is adjacent to the other side. This allows the heat transferred from the conductor 250 to continuously release heat before it is conducted to the ground line 270, minimizing the heat conducted on the conductor 250 side of the ground line 270 and preventing carbonization, thus preventing an increase in contact resistance. At this time, the second block 268 is positioned so that the fastening hole 263c is located near the lowest temperature region by positioning the fastening hole 263c so that it is adjacent to the central lower end of the upper and lower ends when viewed from the side. Therefore, the heat conducted on the conductor 250 side of the connection terminal 265 is minimized, preventing carbonization and thus eliminating the increase in contact resistance.

[0101] In this case, the second block 268 is joined to the support shaft 22 in a state where it is compressed by the connecting plate 266 and the third bolt 267, as in the outer block of the embodiment described above.

[0102] The following describes the current flow and temperature changes during plasma discharge in a substrate processing apparatus according to another embodiment of the present invention described above.

[0103] First, in another embodiment of the present invention, when a process gas is supplied into the chamber 100 and the power supply unit 700 applies RF power to the shower head 300, which is the upper electrode, plasma is excited between the shower head 300 and the chuck 200, which is the lower electrode. At this time, the substrate W is etched by the plasma.

[0104] At this time, the current flowing during plasma discharge flows from the conductor 250 to the connecting assembly 260a, and thereafter, the current flows from the connecting assembly 260a to the ground line 270 side, periodically switching its direction.

[0105] As a result, the conductor 250 conducts current during plasma discharge and is heated by the conduction of the chuck's temperature, and the heat conducted to the conductor 250 is then conducted to the second block 268.

[0106] Subsequently, the second block 268, with the heat conducted to the conductor 250 released, allows current to flow from the conductor 250 to the ground line 270. At this time, the outer block 262 is formed in the shape of an elongated rectangle in one direction, and is formed so that the position of the conductor 250 and the position of the ground line 270 are separated as described above. In this case, the outer block 262 allows current to flow from the conductor 250 side to the ground line 270 side, but releases the heat conducted on the conductor 250 side so that it is not conducted to the ground line 270 side, and the point where the connection terminal 265 and the second block 268 come into contact is not carbonized by heat. Therefore, the contact resistance does not increase because the point where the connection terminal 265 and the second block 268 come into contact with each other is not carbonized. Here, the temperature change value at the pivot point where the connecting assembly 260 and the connecting terminal 265 are connected is formed at 200°C or less, similar to the temperature change value 1b shown in Figure 5. This prevents the pivot point to which the connecting terminal 265 is connected from carbonizing and thus prevents an increase in contact resistance.

[0107] On the other hand, the substrate processing apparatus of the present invention is applicable not only to plasma sources using upper and lower electrodes as described above, but also to ICP-type substrate processing apparatuses that use an antenna 1000a located outside the chamber 100 as a plasma source, as shown in Figure 9. Furthermore, it goes without saying that the substrate processing apparatus of the present invention is applicable not only to the ICP-type substrate processing apparatus shown in Figure 9, but also to various forms of CCP-type substrate processing apparatuses in which the antenna 1000a is located outside the chamber 100.

[0108] It should be understood that exemplary embodiments are disclosed herein and other modifications are possible. Individual elements or features of a particular embodiment are not generally limited to that particular embodiment, but can be used in interchangeable and selected embodiments where applicable, even if not specifically illustrated or described. Such modifications should not be considered to deviate from the spirit and scope of this disclosure, and such modifications that are obvious to an ordinary person are intended to be included within the following claims. [Explanation of Symbols]

[0109] 100 chambers 200 Chuck 210 Support plate 220 Support shaft 230 Heating element 240 Lifting Member 250 Conductors 260 Connecting Assembly 270 Grounding line 300 shower head 400 Fluid Supply Unit 500 gas supply units 600 Exhaust Unit 700 Power Supply Unit 800 Control Unit

Claims

1. In a device for processing substrates, A chamber having a processing space, A chuck that supports the substrate in the processing space, A gas supply unit that supplies process gas to the processing space, and The processing space includes a plasma source that generates an electric field, The aforementioned chuck is, A support plate that supports the substrate and is provided as an electrode for the plasma source, A support shaft that supports the aforementioned support plate, A conductor mounted inside the support shaft and electrically connected to the support plate, A connecting assembly that is coupled to the support shaft and electrically connected to the conductor, and A substrate processing apparatus comprising a grounding line, one end of which is electrically connected to the connecting assembly and the other end of which is grounded.

2. The aforementioned connecting assembly is The substrate processing apparatus according to claim 1, wherein the pivot point electrically connected to the conductor and the pivot point electrically connected to the ground line are arranged at a distance from each other.

3. The aforementioned connecting assembly is The substrate processing apparatus according to claim 2, wherein the ground line is provided such that it elongates in one direction toward the pivot point to which the conductor is electrically connected at the pivot point to which the conductor is electrically connected.

4. The aforementioned support shaft has an insertion region formed therein. The substrate processing apparatus according to claim 3, wherein the connecting assembly is inserted into the insertion region.

5. The conductor is formed in a bar shape, and a first hole is formed in the body. The support shaft has a screw hole further formed in the insertion region, The aforementioned connecting assembly is A connection terminal is connected to one end of the grounding line, An inner block having one side in close contact with the inside of the support shaft and the other side in close contact with the conductor, and having a second hole formed in the body, An outer block with one surface in close contact with a conductive material, where fastening holes are formed, and where a third hole is formed, The body of the bolt passes sequentially through the third hole, the first hole, and the second hole and is fastened to the screw hole, and the head of the first bolt presses against the outer block, and The substrate processing apparatus according to claim 4, comprising a second bolt whose body is fastened by screwing into a fastening hole in the outer block, and whose head presses the connecting terminal against the outer block for a tight fit.

6. The substrate processing apparatus according to claim 5, further comprising a conductive plating layer formed on the surface of the inner block and the outer block.

7. The substrate processing apparatus according to claim 5, further comprising a conductive plating layer formed on the surface of the connection terminal.

8. The aforementioned connecting assembly is A connecting plate formed in the shape of a plate, which is in close contact with the support shaft, has bolt holes formed in it, and is in close contact with one surface of the outer block, and The substrate processing apparatus according to claim 5, further comprising: a third bolt that passes through the bolt hole and is screwed onto the support shaft, and presses the connecting plate against the support shaft.

9. The outer block is formed in a shape that is elongated in one direction when viewed from above. The outer block has the conductive material in close contact with one of its two surfaces passing through the aforementioned direction. The substrate processing apparatus according to claim 5, wherein the fastening holes are arranged adjacent to one of the two surfaces of the outer block that pass through the one direction.

10. The aforementioned conductor is formed in the shape of a rod, The aforementioned connecting assembly is A connection terminal is attached to one end of the grounding line, A second block having an insertion hole into which the conductor is inserted and a fastening hole formed therein, and The substrate processing apparatus according to claim 4, comprising a second bolt whose body is fastened by screwing into a fastening hole in the outer block, and whose head presses the connecting terminal against the outer block for a tight fit.

11. The substrate processing apparatus according to claim 10, further comprising: the second block having irregularities that protrude toward the central part of the insertion hole at the inner peripheral edge of the insertion hole and come into contact with the conductor.

12. The substrate processing apparatus according to claim 10, further comprising: the second block: a conductive plating layer formed on the surface including the irregularities.

13. The substrate processing apparatus according to claim 10, wherein the connection terminal further comprises a conductive plating layer formed on its surface.

14. The aforementioned connecting assembly is A connecting plate formed in the shape of a plate, in close contact with the support shaft, having bolt holes formed therein, and in close contact with one surface of the second block, and The substrate processing apparatus according to claim 10, further comprising: a third bolt that passes through the bolt hole and is screwed onto the support shaft, and presses the connecting plate against the support shaft.

15. The second block is formed in a shape that is elongated in one direction when viewed from above, The second block has the insertion holes adjacent to one of the two surfaces passing through the aforementioned direction. The substrate processing apparatus according to claim 10, wherein the fastening holes are arranged adjacent to one of the two surfaces of the second block that pass through the one direction.

16. In a chuck provided for a substrate processing device that supports a substrate, A support plate that supports the aforementioned substrate, A support shaft that supports the aforementioned support plate, A conductor mounted inside the support shaft and electrically connected to the support plate, A connecting assembly that is coupled to the support shaft and electrically connected to the conductor, and A chuck comprising a grounding line, one end of which is electrically connected to the connecting assembly and the other end of which is grounded.

17. The aforementioned connecting assembly is The chuck according to claim 16, wherein the pivot point electrically connected to the conductor and the pivot point electrically connected to the ground line are arranged at a distance from each other.

18. The aforementioned connecting assembly is The chuck according to claim 17, wherein the ground line is provided such that it elongates in one direction toward the pivot point to which the conductor is electrically connected at the pivot point to which the conductor is electrically connected.

19. The conductor is formed in a bar shape, and a first hole is formed in the body. The aforementioned support shaft has a screw hole formed therein. The aforementioned connecting assembly is A connection terminal is attached to one end of the grounding line, An inner block having one side in close contact with the inside of the support shaft and the other side in close contact with the conductor, and having a second hole formed in the body, An outer block having one surface in close contact with the conductive material, with fastening holes formed therein, and a third hole formed therein, The body portion passes sequentially through the third hole, the first hole, and the second hole and is fastened to the screw hole, and the head of the first bolt presses against the outer block, and The chuck according to claim 18, comprising a second bolt whose body is screwed into a fastening hole of the outer block and whose head presses the connecting terminal against the outer block for a tight fit.

20. The aforementioned conductor is formed in the shape of a rod, The aforementioned connecting assembly is A connection terminal is connected to one end of the grounding line, A second block having an insertion hole into which the conductor is inserted and a fastening hole formed therein, and The chuck according to claim 18, comprising a second bolt whose body is screwed into a fastening hole of the outer block and whose head presses the connecting terminal against the outer block for a tight fit.

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