3-chamber housing device

JP3256600UActive Publication Date: 2026-07-13CORSAIR MEMORY INC(US)
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Patent Information

Application Number
JP2026001669U
Authority / Receiving Office
JP · JP
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2025-05-15
Filing Date
2026-05-15
Publication Date
2026-07-13
Estimated Expiration
2036-05-15

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Abstract

A three-chamber housing device is provided, including a housing unit, a divided unit, and a chamber unit. [Solution] A 3-chamber housing device comprising a housing unit 3, a divided unit 4, and a chamber unit 5, wherein the housing unit comprises a front panel 31, a rear panel 32, a left panel 33, a right panel 34, a bottom structure, and a top structure, the divided unit comprises an isolation structure 41 installed within the housing unit, the isolation structure being connected to the front panel, rear panel, and right panel respectively and extending vertically to the bottom structure and top structure, and the chamber unit being installed within the housing unit comprising a first chamber 51, a second chamber 52, and a third chamber 53, the isolation structure isolating the first chamber, second chamber, and third chamber to accommodate various computer components respectively.
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Description

Technical Field

[0001] The present invention relates to a computer casing, and more particularly to a three-chamber casing device.

Background Art

[0002] In many conventional computer casing designs, all major components such as a central processing unit (CPU) and a graphics processing unit (GPU), and other computer hardware are all installed in the same space. As the performance of computer hardware improves, more heat is inevitably generated. Therefore, such a computer casing design may cause problems with heat dissipation efficiency.

[0003] Such computer hardware generates a large amount of heat during operation and is also closely adjacent to each other, so heat accumulates in a limited space, which may cause a situation where heat dissipation is insufficient. In particular, in situations where the computer performs high-performance or intensive operations, such problems become more prominent. If heat is not discharged in a timely manner, the performance of the hardware may decline, and furthermore, the service life of computer components may be shortened.

[0004] As one method of improving computer heat dissipation, it is to design a more efficient heat dissipation system, such as adding a fan, upgrading a water-cooled system, or improving the material or design of a heat sink. In addition, some new casings have begun to adopt a partition design that separates and installs components that generate a large amount of heat, such as a CPU and a GPU, to more effectively guide and discharge heat. The partition structure can reduce heat conduction between components and at the same time improve the overall heat dissipation efficiency.

[0005] Referring to Figure 1, which shows Patent Document 1, this shows a housing 1, which includes a front panel 11, a rear panel 12, a bottom housing 13, a top structure 14, a first partition wall 15, and a second partition wall 16, wherein the first partition wall 15 is connected to the front panel 11 and the rear panel 12 and extends vertically to the bottom housing 13 and the top structure 14, and the second partition wall 16 is connected to the front panel 11 and the rear panel 12 and extends horizontally from the first partition wall 15, and the first partition wall 15 and the second partition wall 16 isolate the internal space of the housing 1 into a main space 17, a lower space 18, and an upper space 19.

[0006] While the prior art discloses a multi-space housing 1, it still suffers from the following drawbacks in actual use.

[0007] 1. It is not possible to form a chimney-type heat dissipation structure: In conventional enclosures, the second partition wall 16 within the enclosure is installed horizontally, separating the space within the enclosure into the upper space 19 and the lower space 18. Under the obstruction of the second partition wall 16, the bottom of the upper space 19 is not ventilated, the top of the lower space 18 is not ventilated, and the upper space 19 and the lower space 18 must be ventilated from the sides. Therefore, a chimney-type heat dissipation structure cannot be formed.

[0008] 2. Transparent side panels cannot be installed: The currently dominant transparent side enclosure 1 has a completely transparent side panel on its side to display the computer components installed inside. However, since the upper space 19 and lower space 18 inside the conventional enclosure 1 need to be ventilated from the side, a ventilation structure must be installed in the side panel (not shown) of the conventional enclosure 1. Therefore, since a transparent side panel cannot be used as a side panel, the conventional enclosure 1 has the disadvantage that a transparent side panel cannot be installed on its side.

[0009] 3. The upper limit of the chassis structure height is high: In a conventional enclosure 1, the upper space 19 is used to house the motherboard and central processing unit, the lower space 18 is used to house the power supply unit, the upper space 19 is stacked on top of the lower space 18, and the motherboard and power supply unit are installed vertically, so the enclosure 1 must have sufficient height to house the computer components.

[0010] Therefore, a method that allows for the installation of a chimney-type heat dissipation structure within a multi-space enclosure 1, the installation of transparent side panels, and a reduction in the overall structural height of the enclosure 1 is a goal that relevant engineers should address as soon as possible. [Prior art documents] [Patent Documents]

[0011] [Patent Document 1] U.S. Patent No. 10459498 [Overview of the Initiative]

[0012] In view of these circumstances, the object of the present invention is to provide a three-chamber housing device including a housing unit, a divided unit, and a chamber unit.

[0013] The housing unit includes a front panel, a rear panel, a left panel, a right panel, a bottom structure, and a top structure, the front panel, the rear panel, the left panel, and the right panel are sequentially connected and installed so as to surround the bottom structure and the top structure.

[0014] The divided unit includes an isolation structure installed within the housing unit, the isolation structure being connected to the front panel, the rear panel, and the right panel, respectively, and extending vertically to the bottom structure and the top structure.

[0015] The chamber unit includes a first chamber, a second chamber, and a third chamber installed within the housing unit and isolated by the isolation structure, wherein the first chamber is located between the isolation structure, the front panel, the rear panel, the left panel, the bottom structure, and the top structure; the second chamber is located between the isolation structure, the front panel, the right panel, the bottom structure, and the top structure; and the third chamber is located between the isolation structure, the rear panel, the right panel, the bottom structure, and the top structure.

[0016] In one embodiment, the three-chamber housing device is used to house a computer device, the computer device including a motherboard installed in the first chamber, a central processing unit installed on the motherboard, and a power supply installed in the third chamber, wherein air flows into the third chamber through the bottom structure and then flows out to the outside through the power supply.

[0017] In one embodiment, the computer device further includes a graphics processing unit installed on the motherboard and a heat sink installed in the second chamber, the heat sink being connected to the central processing unit and / or the graphics processing unit.

[0018] In one embodiment, the computer device further includes a graphics processing unit installed in the second chamber, and a heat sink installed in the graphics processing unit.

[0019] In one embodiment, the isolation structure comprises a first plate member connected to the rear panel, a second plate member connected to the first plate member, and a third plate member connected to the second plate member, the front panel, and the right panel, wherein the front panel, the right panel, and the third plate member cooperate with each other to define the second chamber.

[0020] In one embodiment, the front panel is provided with a first front vent connected to the second chamber, and the right panel is provided with a first right vent connected to the second chamber, and air flows into the second chamber through the first front vent and then flows out to the outside through the first right vent.

[0021] In one embodiment, the top structure includes a first top vent connected to the first chamber, the bottom structure includes a first bottom vent connected to the first chamber, and the rear panel includes a first rear vent connected to the first chamber. Air flows into the first chamber via the first bottom vent and then flows out to the outside via the first top vent and the first rear vent.

[0022] In one embodiment, the housing unit further includes a bottom air vent connected to the bottom structure and a top air vent connected to the top structure, wherein the bottom air vent connects the first chamber and the first bottom ventilation section, and the structure of the bottom air vent is set to gradually contract from the first bottom ventilation section towards the first chamber, and the top air vent connects the first chamber and the first top ventilation section, and the structure of the top air vent is set to gradually contract from the first top ventilation section towards the first chamber.

[0023] In one embodiment, the front panel includes a second front ventilation section connected to the first chamber.

[0024] In one embodiment, the bottom structure includes a first bottom ventilation portion connected to the first chamber, a second bottom ventilation portion connected to the second chamber, and a third bottom ventilation portion connected to the third chamber. The top structure includes a first top ventilation portion connected to the first chamber, a second top ventilation portion connected to the second chamber, and a third top ventilation portion connected to the third chamber. Air flows into the first chamber through the first bottom ventilation portion and then flows out to the outside through the first top ventilation portion. Air flows into the second chamber through the second bottom ventilation portion and then flows out to the outside through the second top ventilation portion. Air flows into the third chamber through the third bottom ventilation portion and then flows out to the outside through the third top ventilation portion.

[0025] Embodiments of the present invention can be obtained by arbitrarily combining the above-mentioned preferred conditions based on ordinary knowledge in the art. Specifically, the features within the scope of the claims of the present invention can be combined with each other in any manner.

[0026] The beneficial effects of the present invention are as follows. Since the isolation structure extends vertically to the bottom structure and the top structure to isolate the first chamber, the second chamber, and the third chamber, the first chamber, the second chamber, and the third chamber are located at the same height, and the structural height of the housing unit can be reduced. Furthermore, a ventilation structure communicating with the outside is installed in the bottom structure and the top structure so that the first chamber, the second chamber, and the third chamber can each independently form a chimney-type heat dissipation structure. In addition, the front panel, the left panel, and the right panel use transparent side plates so that the computer device installed in the housing unit can be seen from the outside.

Brief Description of the Drawings

[0027] [Figure 1] It is a three-dimensional schematic diagram of Patent Document 1. [Figure 2] It is a three-dimensional schematic diagram of the first embodiment of the three-chamber housing device according to the present invention. [Figure 3] This is another schematic diagram of the first embodiment described above. [Figure 4] This is a schematic partial plan view of the housing unit in the first embodiment described above. [Figure 5] This is a schematic side view of a second embodiment of the 3-chamber housing device according to the present invention. [Figure 6] This is a schematic front view of a third embodiment of the 3-chamber housing device according to the present invention. [Figure 7] This is a schematic plan view of a fourth embodiment of the three-chamber housing device according to the present invention. [Figure 8] This is a schematic diagram of the bottom view of the housing unit in the fourth embodiment described above. [Figure 9] This is a schematic three-dimensional view of the fourth embodiment described above. [Modes for carrying out the invention]

[0028] The features and technical content of the related patent applications for this invention are clearly shown in the following detailed description relating to four embodiments with reference to the drawings. Before the detailed description, it should be noted that similar components are given the same reference numerals.

[0029] Referring to Figures 2, 3, and 4, which show a first embodiment of the three-chamber housing device according to the present invention, the three-chamber housing device includes a housing unit 3, a divided unit 4, and a chamber unit 5, and is used to house a computer device 6.

[0030] The housing unit 3 includes a front panel 31, a rear panel 32, a left panel 33, a right panel 34, a bottom structure 35, and a top structure 36. The front panel 31, the rear panel 32, the left panel 33, and the right panel 34 are sequentially connected and installed so as to surround the bottom structure 35 and the top structure 36. The housing unit 3 as a whole is generally rectangular, and the left panel 33 uses a transparent side plate, but is not limited to this.

[0031] The divided unit 4 includes an isolation structure 41 installed within the housing unit 3, the cross-sectional structure of the isolation structure 41 being T-shaped and connected to the front panel 31, the rear panel 32, and the right panel 34 respectively, the isolation structure 41 extending vertically downward to the bottom structure 35, and the isolation structure 41 extending vertically upward to the top structure 36.

[0032] The chamber unit 5 is installed within the housing unit 3 and includes a first chamber 51, a second chamber 52, and a third chamber 53 isolated by the isolation structure 41. The first chamber 51 is located between the isolation structure 41, the front panel 31, the rear panel 32, the left panel 33, the bottom structure 35, and the top structure 36. The second chamber 52 is located between the isolation structure 41, the front panel 31, the right panel 34, the bottom structure 35, and the top structure 36. The third chamber 53 is located between the isolation structure 41, the rear panel 32, the right panel 34, the bottom structure 35, and the top structure 36.

[0033] In the first embodiment described above, the isolation structure 41 comprises a first plate member 411 connected to the rear panel 32, a second plate member 412 connected to the first plate member 411, and a third plate member 413 connected to the second plate member 412, the front panel 31, and the right-side panel 34, wherein the third plate member 413 has an arc that curves in the direction of the first plate member 411 within the right-side panel 34 and the front panel 31, exhibiting a deformed T-shaped structure, and the front panel 31, the rear panel 32. The left panel 33, the first plate member 411, the second plate member 412, and the third plate member 413 cooperate to define the first chamber 51, the front panel 31, the right panel 34, and the third plate member 413 cooperate to define the second chamber 52, and the front panel 31, the rear panel 32, the right panel 34, the first plate member 411, the second plate member 412, and the third plate member 413 cooperate to define the third chamber 53. In some embodiments, the isolation structure 41 can be configured such that a plate is first placed between the front panel 31 and the rear panel 32, and then another plate is placed between the plate and the right panel 34, so that the isolation structure 41 forms a T-shape. The isolation structure 41 is highly deformable and will not be described in further detail here.

[0034] In the first embodiment described above, the computer device 6 includes a motherboard 61 installed in the first chamber 51, a central processing unit (CPU) 62 installed on the motherboard 61, a graphics processing unit (GPU) 63 installed on the motherboard 61, a first heat sink 64 installed in the second chamber 52, and a power supply unit 65 installed in the third chamber 53.

[0035] In the computer device 6, the computer components that generate heat are the central processing unit 62, the graphics processing unit 63, and the power supply unit 65, respectively. In this invention, the graphics processing unit 63 is equipped with a second heat sink (not shown), which is located inside the first chamber 51 and can directly release the heat generated from the graphics processing unit 63 into the first chamber 51. The first heat sink 64 can guide the heat generated from the central processing unit 62 into the second chamber 52, and the heat generated from the power supply unit 65 can be directly released to the outside of the housing unit or into the third chamber 53. Since the heat generated from the graphics processing unit 63, the central processing unit 62, and the power supply unit 65 is guided to the first chamber 51, the second chamber 52, and the third chamber 53, respectively, the heat is not affected by the heat generated from other computer components and is dissipated entirely through independent chambers. In some embodiments, the power supply unit 65 is installed on the rear panel 32, the bottom structure 35 is provided with a vent (not shown), and the third chamber 53 receives air from the vent of the bottom structure 35. The air in the third chamber 53 flows into the power supply unit 65 and is then discharged to the outside via the rear panel 32. In some embodiments, a fan is further installed inside the power supply unit 65 to forcibly draw air from the third chamber 53 into the power supply unit 65 and then discharge it to the outside.

[0036] In some embodiments, the graphics processing unit 63 installed in the first chamber 51 is connected to the first heat sink 64 to guide the generated heat to the second chamber 52, and the central processing unit 62 is equipped with the second heat sink to guide the generated heat to the first chamber 51. In some embodiments, the central processing unit 62 and the graphics processing unit 63 are connected to the same first heat sink 64. In some embodiments, the computer device 6 further includes a graphics processing unit 63 installed in the second chamber 52 and a first heat sink 64 installed on the graphics processing unit 63, the graphics processing unit 63 is connected to the motherboard 61 using a transmission line assembly (not shown), and the central processing unit 62 is equipped with the second heat sink.

[0037] The front panel 31 includes a first front ventilation section 311 connected to the second chamber 52, and the right panel 34 includes a first right ventilation section 341 connected to the second chamber 52. In the first embodiment described above, the first front ventilation section 311 is a vent and a fan fixing bracket, and the first right ventilation section 341 is a vent. The second chamber 52 allows air to flow in through the first front ventilation section 311 (first air direction 71 in Figure 2) and air to flow out through the first right ventilation section 341 (second air direction 72 in Figure 2).

[0038] The top structure 36 includes a first top ventilation section 361 connected to the first chamber 51, the bottom structure 35 includes a first bottom ventilation section 351 connected to the first chamber 51, and the rear panel 32 includes a first rear ventilation section 321 connected to the first chamber 51. The first top ventilation section 361 and the first bottom ventilation section 351 are fan fixing brackets and can also fix a water-cooled heat sink. The first rear ventilation section 321 is a fan fixing bracket. The first chamber 51 allows air to flow in through the first bottom ventilation section 351 (third air direction 73 in Figure 2), air to flow out through the first top ventilation section 361 (fourth air direction 74 in Figure 2), and air to flow out through the first rear ventilation section 321 (fifth air direction 75 in Figure 2).

[0039] Referring to Figure 5, which shows a second embodiment of the 3-chamber housing device according to the present invention, the second embodiment described above is generally the same as the first embodiment described above, so the similarities will not be explained in further detail, and the differences are as follows. In the second embodiment described above, the housing unit 3 further includes a bottom-side air ventilator 37 connected to the bottom-side structure 35, and a top-side air ventilator 38 connected to the top-side structure 36, wherein the bottom-side air ventilator 37 connects the first chamber 51 and the first bottom-side ventilation section 351, and the structure of the bottom-side air ventilator 37 is set to gradually contract from the first bottom-side ventilation section 351 towards the first chamber 51, and the top-side air ventilator 38 connects the first chamber 51 and the first top-side ventilation section 361, and the structure of the top-side air ventilator 38 is set to gradually contract from the first top-side ventilation section 361 towards the first chamber 51.

[0040] The graphics processing unit 63 is installed in the first chamber 51, and because the graphics processing unit 63 generates a large amount of heat, the upper opening of the bottom air vent 37 is aligned with the installation position of the graphics processing unit 63, and the lower opening of the top air vent 38 is aligned with the installation position of the graphics processing unit 63, thereby quickly guiding ambient temperature air from outside to the position of the graphics processing unit 63 and discharging the hot air inside the first chamber 51 to the outside.

[0041] Referring to Figure 6, which shows a third embodiment of the 3-chamber housing device according to the present invention, the third embodiment is generally the same as the first embodiment described above, so the similarities will not be explained in further detail, and the differences are as follows. In the third embodiment described above, the front panel 31 is provided with a second front ventilation section 312 connected to the first chamber 51.

[0042] The second front ventilation section 312 and the first front ventilation section 311 are both fan fixing brackets, and a fan can be fixed to them. The first front ventilation section 311 can guide air to the second chamber 52 via the front panel 31, and the second front ventilation section 312 can guide air to the first chamber 51 via the front panel 31.

[0043] Referring to Figures 7 and 8, which show a fourth embodiment of the three-chamber housing device according to the present invention, the above fourth embodiment is generally similar to the above first embodiment, so the similarities will not be explained in further detail, and the differences are as follows. In the above fourth embodiment, the top structure 36 further comprises a second top ventilation section 362 connected to the second chamber 52 and a third top ventilation section 363 connected to the third chamber 53, and the bottom structure 35 further comprises a second bottom ventilation section 352 connected to the second chamber 52 and a third bottom ventilation section 353 connected to the third chamber 53.

[0044] The first top ventilation section 361, the second top ventilation section 362, and the third top ventilation section 363 are ventilation structures on the top structure 36, and the first bottom ventilation section 351, the second bottom ventilation section 352, and the third bottom ventilation section 353 are ventilation structures on the bottom structure 35. In some embodiments, fans can be installed in the first top ventilation section 361, the second top ventilation section 362, the third top ventilation section 363, the first bottom ventilation section 351, the second bottom ventilation section 352, and the third bottom ventilation section 353.

[0045] The first bottom ventilation section 351 is installed at the bottom of the first chamber 51, and the first top ventilation section 361 is installed at the top of the first chamber 51. The first chamber 51 allows air to flow in through the first bottom ventilation section 351 and out through the first top ventilation section 361, thereby forming a chimney-type heat dissipation structure in the first chamber 51, which is formed by the isolation structure 41, the front panel 31, the rear panel 32, the left panel 33, the first bottom ventilation section 351 of the bottom structure 35, and the first top ventilation section 361 of the top structure 36.

[0046] The first front ventilation section 311 is not required on the front panel 31, and the first right-side ventilation section 341 is not required on the right-side panel 34. The second bottom ventilation section 352 is provided at the bottom of the second chamber 52, and the second top ventilation section 362 is provided at the top of the second chamber 52. The second chamber 52 allows air to flow in through the second bottom ventilation section 352 and out through the second top ventilation section 362, thereby forming a chimney-type heat dissipation structure in the second chamber 52, which is formed by the isolation structure 41, the front panel 31, the right-side panel 34, the second bottom ventilation section 352 of the bottom structure 35, and the second top ventilation section 362 of the top structure 36.

[0047] The third bottom ventilation section 353 is provided at the bottom of the third chamber 53, and the third top ventilation section 363 is provided at the top of the third chamber 53. The third chamber 53 allows air to flow in through the third bottom ventilation section 353 and out through the third top ventilation section 363, thereby forming a chimney-type heat dissipation structure with the isolation structure 41, the rear panel 32, the right panel 34, the third bottom ventilation section 353 of the bottom structure 35, and the third top ventilation section 363 of the top structure 36.

[0048] Referring also to Figure 9, as mentioned above, since the first chamber 51, the second chamber 52, and the third chamber 53 each form an independent chimney-type heat dissipation structure, the front panel 31, the left panel 33, and the right panel 34 can use transparent side plates. In the fourth embodiment described above, the first transparent side plate 81 is installed in the left region of the front panel 31 and the left panel 33, the second transparent side plate 82 is installed in the right region of the front panel 31 and the left region of the right panel 34, and the third transparent side plate 83 is installed in the right region of the right panel 34. This makes the internal structure of the housing unit 3 visible from the outside through the first transparent side plate 81, the second transparent side plate 82, and the third transparent side plate 83.

[0049] As can be seen from the above, the three-chamber housing device according to the present invention has the following effects.

[0050] 1. Equipped with a chimney-type heat dissipation structure that can promote heat dissipation from the computer: The chimney-type heat dissipation structure fully utilizes the physical property that hot air rises, allowing heat to be discharged from the bottom to the top of the enclosure, thereby reducing heat accumulation and assisting the fan's heat dissipation. This reduces the fan's rotation speed, lowering noise and power consumption. The first chamber 51, the second chamber 52, and the third chamber 53 each draw air in from the bottom and discharge air from the top, forming independent chimney-type heat dissipation structures. This not only provides excellent heat dissipation efficiency but also ensures that the heat dissipation from each chamber does not affect the others, effectively promoting heat dissipation in personal computers or high-performance computers and enabling the computer to operate at high efficiency.

[0051] 2. By installing transparent side panels, internal components can be viewed from all directions. As described above, since the first chamber 51, the second chamber 52, and the third chamber 53 each form an independent chimney-type heat dissipation structure, there is no need to install a ventilation structure on the side panel. By using transparent side panels for the front panel 31, the left panel 33, and the right panel 34, the computer device 6 and various components installed inside the housing unit 3 can be seen from the outside. Components inside the housing are not obstructed, making it easy for the user to see the internal components from all directions, which is in line with the recent trend of panoramic housings.

[0052] 3. The maximum height of the enclosure structure can be effectively controlled: Although different computer components are housed in the first chamber 51, the second chamber 52, and the third chamber 53, since the first chamber 51, the second chamber 52, and the third chamber 53 are located at the same height, spatial stacking does not occur in this invention. Even if the motherboard 61, the graphics processing unit 63, and the power supply unit 65 are installed vertically, there is no need to increase the height of the enclosure unit 3, and the upper limit of the height of the enclosure structure can be effectively controlled, thereby expanding the range of applications for the enclosure.

[0053] In summary, the isolation structure 41 extends vertically between the bottom structure 35 and the top structure 36, and by making the first chamber 51, the second chamber 52, and the third chamber 53 independent of each other, the heat generated from the central processing unit 62, the graphics processing unit 63, and the power supply unit 65 does not affect each other. Furthermore, the first chamber 51, the second chamber 52, and the third chamber 53 are located at the same height, eliminating the need to raise the structure of the housing unit 3. Additionally, the first chamber 51, the second chamber 52, and the third chamber 53 each independently form a chimney-type heat dissipation structure, improving heat dissipation efficiency and saving energy. Moreover, by using transparent side panels for the front panel 31, the left panel 33, and the right panel 34, the computer device 6 installed inside the housing unit 3 can be seen from the outside, thus reliably achieving the objectives of the present invention.

[0054] The above description represents only four embodiments of the present invention, and the scope of the present invention is not limited thereto; that is, all simple equivalent variations and modifications made in accordance with the claims and description of the invention fall within the scope of the claims of the present invention.

[0055] The scope of protection of this invention is not limited to the specific embodiments described above, but also includes embodiments formed by any combination of the technical features of each of the specific embodiments described above. [Explanation of Symbols]

[0056] 1 cabinet 11 Front Panel 12 Rear panel 13 Bottom housing 14 Top structure 15 1st bulkhead 16 Second bulkhead 17 Main Space 18 Lower space 19 Upper space 3. Enclosure Unit 31 Front Panel 311 First front ventilation section 312 Second front ventilation section 32 Rear panel 321 First rear ventilation section 33 Left panel 34 Right panel 341 First right-side ventilation section 35 Bottom structure 351 First bottom ventilation section 352 Second bottom ventilation section 353 Third bottom ventilation section 36 Top structure 361 First apex ventilation section 362 Second apex ventilation section 363 Third apex ventilation section 37 Bottom air guide tube 38. Apex air derivative 4-part unit 41 Isolation structure 411 1st plate member 412 2nd plate member 413 Third plate member 5 Chamber Unit 51 Chamber 1 52 Second Chamber 53 Third Chamber 6. Computer equipment 61 Motherboards 62 Central Processing Unit 63 Graphics Processing Unit 64 1st radiator 65 Power Supply 71 First air direction 72 Second air direction 73 Third air direction 74 Fourth air direction 75 Fifth air direction 81 1st transparent side plate 82 2nd transparent side plate 83 Third transparent side plate

Claims

1. A three-chamber housing device, A housing unit comprising a front panel, a rear panel, a left panel, a right panel, a bottom structure, and a top structure, wherein the front panel, the rear panel, the left panel, and the right panel are sequentially connected and installed so as to surround the bottom structure and the top structure; The enclosure unit includes an isolation structure installed within the housing unit, the isolation structure being connected to the front panel, the rear panel, and the right panel, respectively, and comprising divided units that extend vertically to the bottom structure and the top structure; A three-chamber housing device comprising: a chamber unit installed within the housing unit and isolated by the isolation structure, the first chamber being located between the isolation structure, the front panel, the rear panel, the left panel, the bottom structure, and the top structure; the second chamber being located between the isolation structure, the front panel, the right panel, the bottom structure, and the top structure; and the third chamber being located between the isolation structure, the rear panel, the right panel, the bottom structure, and the top structure.

2. The three-chamber housing device according to claim 1, wherein the three-chamber housing device is used to house a computer device, the computer device includes a motherboard installed in the first chamber, a central processing unit installed on the motherboard, and a power supply installed in the third chamber, and air flows into the third chamber through the bottom structure and then flows out to the outside through the power supply.

3. The computer device further includes a graphics processing unit installed on the motherboard and a heat sink installed in the second chamber, wherein the heat sink is connected to the central processing unit and / or the graphics processing unit, as described in claim 2.

4. The three-chamber housing device according to claim 2, further comprising a graphics processing unit installed in the second chamber and a heat sink installed in the graphics processing unit.

5. The isolation structure comprises a first plate member connected to the rear panel, a second plate member connected to the first plate member, and a third plate member connected to the second plate member, the front panel, and the right panel, wherein the front panel, the right panel, and the third plate member cooperate with each other to define the second chamber, the three-chamber housing device according to claim 1.

6. The three-chamber housing device according to claim 1, wherein the front panel is provided with a first front ventilation section connected to the second chamber, and the right panel is provided with a first right ventilation section connected to the second chamber, and air flows into the second chamber through the first front ventilation section and then flows out to the outside through the first right ventilation section.

7. The three-chamber housing device according to claim 1, wherein the top structure comprises a first top vent connected to the first chamber, the bottom structure comprises a first bottom vent connected to the first chamber, and the rear panel comprises a first rear vent connected to the first chamber, and air flows into the first chamber via the first bottom vent and then flows out to the outside via the first top vent and the first rear vent.

8. The housing unit further includes a bottom air vent connected to the bottom structure and a top air vent connected to the top structure, wherein the bottom air vent connects the first chamber and the first bottom ventilation section, and the structure of the bottom air vent is set to gradually contract from the first bottom ventilation section towards the first chamber, and the top air vent connects the first chamber and the first top ventilation section, and the structure of the top air vent is set to gradually contract from the first top ventilation section towards the first chamber, as described in claim 7.

9. The three-chamber housing device according to claim 1, wherein the front panel comprises a second front ventilation section connected to the first chamber.

10. The bottom structure comprises a first bottom ventilation section connected to the first chamber, a second bottom ventilation section connected to the second chamber, and a third bottom ventilation section connected to the third chamber; the top structure comprises a first top ventilation section connected to the first chamber, a second top ventilation section connected to the second chamber, and a third top ventilation section connected to the third chamber; air flows into the first chamber via the first bottom ventilation section and then flows out to the outside via the first top ventilation section; air flows into the second chamber via the second bottom ventilation section and then flows out to the outside via the second top ventilation section; and air flows into the third chamber via the third bottom ventilation section and then flows out to the outside via the third top ventilation section, as described in claim 1.

Citation Information

Patent Citations

  • Heat dissipation in a three chamber chassis of a personal computer

    US10459498B1