Measuring device, resin molding device, and method for manufacturing resin molded products
The measuring device accurately measures substrate thickness by employing a mobile unit with optical sensors and a correction system, addressing the lack of thickness measurement in resin molding devices.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TOWA
- Filing Date
- 2024-05-27
- Publication Date
- 2026-06-10
AI Technical Summary
Existing resin molding devices lack a method to accurately measure the thickness of substrates, which is crucial for ensuring the substrates fall within a desired range.
A measuring device comprising a mobile unit with first and second optical sensors that measure substrate thickness as it passes between them, a storage unit to store a reference thickness, and a system to calculate and apply a correction value based on the reference thickness to correct the measurement.
Enables accurate measurement of substrate thickness, even when individual optical sensor measurements are inaccurate, by using a correction value based on the reference thickness.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a measuring device, a resin molding device, and a method for manufacturing a resin molded product.
Background Art
[0002] Japanese Patent Application Laid-Open No. 2019-10886 (Patent Document 1) discloses a resin molding device. This resin molding device performs resin molding on a substrate using resin.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In a device that handles a substrate such as a resin molding device, it is important that the thickness of the substrate is within a desired range. In order to determine whether the thickness of the substrate is within the desired range, it is necessary to measure the thickness of the substrate. However, the above Patent Document 1 does not disclose a technique for measuring the thickness of the substrate.
[0005] The present invention has been made to solve such problems, and an object thereof is to provide a measuring device, a resin molding device, and a method for manufacturing a resin molded product that can measure the thickness of a substrate relatively accurately.
Means for Solving the Problems
[0006] A measuring device according to a certain aspect of the present invention comprises a mobile unit, a measuring unit, and a storage unit. The mobile unit includes a reference unit used for measuring the thickness of a substrate and moves together with the substrate. The measuring unit includes first and second optical sensors, each measuring distance by light, and measures the thickness of the substrate as the substrate passes between the first and second optical sensors as the mobile unit moves. The storage unit stores a reference thickness, which is the thickness of the reference unit. The measuring unit measures the thickness of the reference unit as the reference unit passes between the first and second optical sensors, calculates a correction value based on the measurement result of the thickness of the reference unit and the reference thickness, and corrects the measurement result of the substrate thickness based on the correction value.
[0007] A resin molding apparatus according to another aspect of the present invention molds a pre-molded substrate, which has not been molded with resin, using resin. The resin molding apparatus includes the above-mentioned measuring device.
[0008] A method for manufacturing a resin molded product according to another aspect of the present invention includes manufacturing a resin molded product by molding a substrate with resin using the above-described resin molding apparatus. [Effects of the Invention]
[0009] According to the present invention, it is possible to provide a measuring device capable of measuring the thickness of a substrate with relatively high accuracy, a resin molding device, and a method for manufacturing a resin molded product. [Brief explanation of the drawing]
[0010] [Figure 1] This is a schematic diagram showing the plan view of a resin molding apparatus. [Figure 2] This diagram schematically shows the plan view of the unloading mechanism. [Figure 3] This figure schematically shows the III-III section of Figure 2. [Figure 4] This figure schematically shows the IV-IV section of Figure 2. [Figure 5] This figure schematically shows the VV cross-section of Figure 2. [Figure 6] This diagram schematically shows how molded substrates are transferred from the first output section to the second output section. [Figure 7] This diagram schematically shows how the substrate transport mechanism pushes the molded substrate from the rear. [Figure 8] This is a diagram illustrating a method for measuring the thickness of a molded substrate. [Figure 9] This is a diagram illustrating a problem related to measuring the thickness of a molded substrate. [Figure 10] This is a diagram illustrating the procedure for calculating the correction value. [Figure 11] This flowchart shows an example of a procedure for correcting the measurement results of the thickness of a molded substrate. [Figure 12] This diagram schematically shows an example of the progression of the calculated thickness. [Figure 13] This diagram schematically shows the plan view of the substrate transport mechanism, including the reference section. [Modes for carrying out the invention]
[0011] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding.
[0012] [1. Structure] <1-1. Configuration of the resin molding apparatus> Figure 1 is a schematic diagram showing a plan view of a resin molding apparatus 10 according to this embodiment. Referring to Figure 1, the resin molding apparatus 10 is configured to manufacture a resin molded product (for example, a semiconductor device) by applying resin encapsulation to a substrate W on which electronic components such as semiconductor chips are mounted. In the resin molding apparatus 10, the component mounting surface of the substrate W on which the electronic components are mounted is resin-encapsulated.
[0013] Examples of the substrate W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, etc. The substrate W may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). In the substrate W, wiring may already be provided, or wiring may not be provided.
[0014] The resin molding device 10 includes a substrate supply and storage module 100, two resin molding modules 200, a resin material supply module 300, and a computer 400. The substrate supply and storage module 100, the two resin molding modules 200, and the resin material supply module 300 are arranged in this order along the X-axis. Each module is detachable and replaceable with other modules. Also, in the resin molding device 10, each module can be increased or decreased.
[0015] The substrate supply and storage module 100 includes a substrate storage unit 110, a loading and unloading mechanism 50, a robot hand 120, a substrate temporary storage unit 130, and a substrate transfer mechanism 140. The substrate storage unit 110 has a plurality of stages arranged along the Z-axis. A part of the upper stages among the plurality of stages stores substrates (hereinafter, also referred to as "pre-molding substrates") W before resin molding. On the other hand, the remaining stages (lower stages) among the plurality of stages store substrates (hereinafter, also referred to as "molded substrates") W after resin molding. The substrate storage unit 110 supplies the stored pre-molding substrate W to a loading mechanism 590 (described later) and receives the molded substrate W unloaded from an unloading mechanism 500.
[0016] The loading and unloading mechanism 50 includes a loading mechanism 590 and an unloading mechanism 500. The loading mechanism 590 includes a pair of rails (not shown). On the pair of rails, the pre-molding substrate W supplied from the substrate storage unit 110 is placed. The unloading mechanism 500 will be described in detail later.
[0017] The robot hand 120 is configured to hold the substrate W and move the held substrate W. For example, the robot hand 120 holds the unmolded substrate W placed in the loading mechanism 590 and moves the unmolded substrate W to the temporary substrate storage unit 130. The robot hand 120 also holds the molded substrate W placed in the temporary substrate storage unit 130 and moves the molded substrate W to the unloading mechanism 500.
[0018] The temporary substrate storage unit 130 is configured to temporarily store both the unmolded substrate W and the molded substrate W. The substrate transport mechanism 140 is configured to move along the X and Y axes in the substrate supply / storage module 100 and each resin molding module 200. The substrate transport mechanism 140, for example, holds the unmolded substrate W stored in the temporary substrate storage unit 130 and transports the unmolded substrate W to the resin molding module 200. The substrate transport mechanism 140 also transports the molded substrate W, which has been molded from resin in the resin molding module 200, to the temporary substrate storage unit 130.
[0019] Each resin molding module 200 includes a compression molding section 210. The compression molding section 210 is configured to manufacture a molded substrate W (resin molded product) by compression molding. In this compression molding, a thermosetting granular resin material P is used. The resin material P may also be a thermoplastic resin material. Alternatively, the resin material P may be a liquid resin. The compression molding section 210 includes a mold 211 and a clamping mechanism 216. The mold 211 includes an upper mold 214 and a lower mold 212. The upper mold 214 and the lower mold 212 are arranged opposite each other on the Z axis. The clamping mechanism 216 raises the lower mold 212, thereby clamping the mold 211.
[0020] A cavity 212C is formed on the upper surface of the lower mold 212. A film (release film) on which the resin material P is placed is positioned in the cavity 212C. A substrate W is positioned on the lower surface of the upper mold 214. With the film on which the resin material P is placed positioned in the cavity 212C of the lower mold 212, and the substrate W positioned on the lower surface of the upper mold 214, the mold 211 is clamped. As a result, the component mounting surface of the substrate W is resin-sealed.
[0021] The resin material supply module 300 includes a movable table 310, a resin material storage section 320, a resin material supply mechanism 330, resin material transport mechanisms 340 and 360, and a temporary resin storage section 350. The movable table 310 is configured to move along the X and Y axes within the resin material supply module 300.
[0022] The resin material storage section 320 includes a film and a frame-shaped member (not shown) positioned on the upper surface of the film. The resin material storage section 320 has a space (recess 322) formed therein that corresponds to the size of the cavity 212C of the lower mold 212. The resin material storage section 320 is placed on a movable table 310. The resin material supply mechanism 330 is configured to supply resin material P to the resin material storage section 320 from above. The resin material P falling from the discharge port of the resin material supply mechanism 330 is evenly spread in the recess 322 of the resin material storage section 320 as the movable table 310 moves relative to the discharge port of the resin material supply mechanism 330.
[0023] The resin material transport mechanism 340 is configured to move along the X and Y axes in the resin material supply module 300. The resin material transport mechanism 340 transports, for example, the resin material storage section 320 containing the resin material P to the temporary resin storage section 350. The temporary resin storage section 350 is configured to temporarily store the resin material storage section 320 containing the resin material P. The resin material transport mechanism 360 is configured to transport the resin material storage section 320 stored in the temporary resin storage section 350 to the lower mold 212 and supply the resin material P to the cavity 212C of the lower mold 212.
[0024] Computer 400 is configured to control the entire resin molding apparatus 10. For example, computer 400 controls each of the substrate supply and storage module 100, the two resin molding modules 200, and the resin material supply module 300. Computer 400 includes, for example, a hardware processor such as a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory), and is configured to perform information processing based on programs and various data. Computer 400 also includes a storage unit 410. The storage unit 410 is composed of, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. Computer 400 may be located anywhere within the resin molding apparatus 10, or it may be composed of multiple computers.
[0025] <1-2. Configuration of the unloading mechanism> Figure 2 is a schematic diagram showing the plan view of the unloading mechanism 500. As shown in Figure 2, the unloading mechanism 500 includes a first unloading section 501 and a second unloading section 502. The molded substrate W is transferred from the first unloading section 501 to the second unloading section 502 and discharged from the second unloading section 502 to the substrate storage section 110. The first unloading section 501 includes a pair of rails RL1, a mobile device 510, and a distance measuring unit 520.
[0026] A pair of rails RL1 extend along the X-axis. The mobile device 510 is configured to move along the X-axis on the pair of rails RL1. With the molded substrate W held in place, the mobile device 510 moves along the pair of rails RL1 from the end opposite the second discharge section 502 to the end on the second discharge section 502 side. After the molded substrate W has been transferred to the second discharge section 502, the mobile device 510 moves along the pair of rails RL1 from the end on the second discharge section 502 side to the end opposite the second discharge section 502 side. The mobile device 510 includes a frame-shaped mobile device body 511, a pair of holding mechanisms 512, and a reference section 514.
[0027] Figure 3 is a schematic diagram showing the III-III cross-section of Figure 2. Referring to Figure 3, a pair of holding mechanisms 512 (holding mechanisms 512A, 512B) are fixed to the mobile body 511. Each of the pair of holding mechanisms 512 is configured to rotate around a rotation axis. By rotating around the rotation axis, each holding mechanism 512 transitions between a holding state that holds the molded substrate W and an open state that releases the molded substrate W. The occurrence of warping in the molded substrate W is suppressed by being sandwiched from above and below by the pair of holding mechanisms 512. With the molded substrate W held by the pair of holding mechanisms 512, at least a portion of each of the upper and lower surfaces (for example, the central part) is exposed.
[0028] Referring again to Figure 2, the mobile unit body 511 has a reference section 514 at the end opposite to the second unloading section 502. The reference section 514 is a plate-shaped member that protrudes from the mobile unit body 511 along the X-axis. A through hole H1 is formed in the reference section 514 that penetrates in the Z-axis direction. In a plan view of the unloading mechanism 500, the optical sensors 522 and 524 (Figure 4) and the through hole H1 overlap in part of the movement path of the mobile unit 510. The role of the reference section 514 will be explained later.
[0029] Figure 4 is a schematic diagram showing the IV-IV cross section of Figure 2. Referring to Figure 4, the distance measuring unit 520 includes optical sensors 522 and 524. Each of the optical sensors 522 and 524 is configured to measure the distance from itself to an object by irradiating the object with light. Optical sensor 522 irradiates light downward along the Z-axis, and optical sensor 524 irradiates light upward along the Z-axis. Each of the optical sensors 522 and 524 can be realized by various known optical sensors. In the distance measuring unit 520, the optical sensors 522 and 524 are arranged so that their optical axes coincide. As the mobile unit 510 moves along the X-axis, the molded substrate W may be positioned between the optical sensors 522 and 524. In this state, optical sensor 522 measures the distance from optical sensor 522 to the top surface of the molded substrate W, and optical sensor 524 measures the distance from optical sensor 524 to the bottom surface of the molded substrate W. As will be explained in more detail later, the thickness of the molded substrate W is measured based on the measurement results of the optical sensors 522 and 524.
[0030] Each of the light sensors 522 and 524 includes, for example, a light emitter, a light receiver, a first convex lens, and a second convex lens. The light emitter emits light toward an object via the first convex lens. The light reflected by the object is received by the light receiver via the second convex lens. The position where the light is received by the light receiver changes according to the distance between the first convex lens and the object. Based on this position, for example, the distance from the first convex lens to the object is calculated. The configuration of each of the light sensors 522 and 524 is not limited to a configuration having a light emitter, a light receiver, a first convex lens, and a second convex lens, as long as it is configured to emit light toward an object and receive the light reflected by the object.
[0031] Referring again to Figure 2, the second discharge section 502 includes a pair of rails RL2 and a substrate transport mechanism 530. The pair of rails RL2 extend along the X-axis. The substrate transport mechanism 530 is configured to move along the X-axis on the pair of rails RL2. The substrate transport mechanism 530 includes a base 532, a gripper 534, and a pair of pushers 536. The substrate transport mechanism 530 moves along the X-axis as the base 532 moves along the X-axis on the pair of rails RL2.
[0032] Figure 5 is a schematic diagram showing the VV cross-section of Figure 2. Referring to Figure 5, the gripper 534 is provided at the end of the base 532 on the side of the first discharge section 501. The gripper 534 is configured to hold the molded substrate W by gripping it from above and below. A pair of pushers 536 are provided at the end of the base 532 opposite to the first discharge section 501. The pair of pushers 536 are configured to push the molded substrate W from the rear.
[0033] Figure 6 schematically shows how a molded substrate W is transferred from the first discharge section 501 to the second discharge section 502. Referring to Figure 6, in the moving machine 510, the pair of holding mechanisms 512 are in an open state. In this state, the grippers 534 of the substrate transport mechanism 530 grip the end of the molded substrate W on the second discharge section 502 side from above and below.
[0034] In the mobile unit 510, the reference section 514 is provided at the end opposite to the second discharge section 502 (the end in the direction opposite to the direction of movement when the mobile unit 510 moves together with the molded substrate W). Therefore, the resin molding apparatus 10 can suppress the occurrence of the reference section 514 interfering with the gripper 534 when the molded substrate W is transferred from the first discharge section 501 to the second discharge section 502. In Figure 6, the direction of movement is to the left, and the direction opposite to the direction of movement is to the right.
[0035] With the gripper 534 holding the molded substrate W, the substrate transport mechanism 530 moves along the X-axis. As a result, the molded substrate W is pulled by the gripper 534 and transferred from the first discharge section 501 to the second discharge section 502. With the gripper 534 holding the molded substrate W, the substrate transport mechanism 530 moves toward the end on the substrate storage section 110 side on the pair of rails RL2. When the substrate transport mechanism 530 arrives near the end on the substrate storage section 110 side on the pair of rails RL2, it moves along rails (not shown) extending along the Z-axis and X-axis and moves around to the rear of the molded substrate W. After that, the substrate transport mechanism 530 pushes the molded substrate W from behind and discharges the molded substrate W into the substrate storage section 110.
[0036] Figure 7 schematically shows how the substrate transport mechanism 530 pushes the molded substrate W from the rear. As shown in Figure 7, the pair of pushers 536 of the substrate transport mechanism 530 are in contact with the rear surface of the molded substrate W. In this state, the substrate transport mechanism 530 moves along the X axis toward the substrate storage section 110. As a result, the substrate transport mechanism 530 pushes the molded substrate W from the rear and discharges the molded substrate W into the substrate storage section 110. Once the molded substrate W is discharged into the substrate storage section 110, the substrate transport mechanism 530 moves again toward the end of the pair of rails RL2 toward the first discharge section 501.
[0037] [2. Problems related to measuring the thickness of pre-molded substrates] In the resin molding apparatus 10, it is important that the thickness of the manufactured molded substrate W falls within a desired range. To determine whether or not the thickness of the molded substrate W falls within a desired range, it is necessary to measure the thickness of the molded substrate W. As described above, in the resin molding apparatus 10, the thickness of the molded substrate W is measured based on the measurement results of the optical sensors 522 and 524.
[0038] Figure 8 is a diagram illustrating a method for measuring the thickness of a molded substrate W. Referring to Figure 8, in the resin molding apparatus 10, the distance Lt between optical sensors 522 and 524 is measured in advance and stored. Information regarding the distance Lt is stored, for example, in the storage unit 410 of the computer 400. Optical sensor 522 measures the distance La1 from optical sensor 522 to the upper surface of the molded substrate W by irradiating light onto the upper surface of the molded substrate W and receiving the reflected light. Optical sensor 524 measures the distance Lb1 from optical sensor 524 to the lower surface of the molded substrate W by irradiating light onto the lower surface of the molded substrate W and receiving the reflected light. The computer 400 measures the thickness of the molded substrate W by subtracting the distances La1 and Lb1 from the distance Lt stored in the storage unit 410.
[0039] Figure 9 illustrates a problem related to measuring the thickness of a molded substrate W. Referring to Figure 9, for example, no problem arises if the optical axes of the respective optical sensors 522 and 524 coincide with the normal to the molded substrate W. The optical sensors 522 and 524 are installed, for example, during the manufacturing process of the resin molding apparatus 10. For example, if the optical sensors 522 and 524 are installed in a short time, the optical axes of optical sensor 522 and optical sensor 524 do not necessarily coincide perfectly. In this example, optical sensor 522 is tilted. Therefore, the measurement result of optical sensor 522 is longer than the actual distance between optical sensor 522 and the top surface of the molded substrate W. As a result, when the distance Lt - (distance La1 + distance Lb1) (see Figure 8) is calculated, the calculated result is shorter than the actual thickness of the molded substrate W.
[0040] Furthermore, each of the optical sensors 522 and 524 includes one or more lenses. The measurement results of the optical sensors 522 and 524 are affected by contamination of the lenses contained in them. Therefore, depending on the degree of contamination of the lenses contained in the optical sensors 522 and 524, the difference between the measured thickness of the molded substrate W and the actual thickness of the molded substrate W may exceed the acceptable range.
[0041] In the resin molding apparatus 10, the thickness of the reference section 514 is measured in advance, and the measured thickness of the reference section 514 is stored. The stored thickness of the reference section 514 is the actual thickness of the reference section 514. The actual thickness of the reference section 514 is measured in advance, for example, using a micrometer or the like. Information regarding the thickness of the reference section 514 (hereinafter also referred to as "reference thickness") is stored, for example, in the storage unit 410 of the computer 400. In the resin molding apparatus 10, the measured thickness of the molded substrate W is corrected by using the reference thickness stored in the storage unit 410.
[0042] Figure 10 is a diagram illustrating the procedure for calculating the correction value. Referring to Figure 10, as the reference section 514 passes between the optical sensors 522 and 524, optical sensor 522 measures the distance La2 from optical sensor 522 to the upper surface of the reference section 514, and optical sensor 524 measures the distance Lb2 from optical sensor 524 to the lower surface of the reference section 514. The computer 400 measures the thickness of the reference section 514 by subtracting the distances La2 and Lb2 from the distance Lt stored in the storage unit 410. The computer 400 calculates the correction value by subtracting the measured thickness of the reference section 514 from the reference thickness. The computer 400 corrects the measured thickness of the molded substrate W by adding the correction value to the measured thickness of the molded substrate W. Alternatively, the computer 400 may calculate the correction value by subtracting the reference thickness from the measured thickness of the reference section 514, and then correct the measured thickness of the molded substrate W by subtracting the correction value from the measured thickness of the molded substrate W.
[0043] In the resin molding apparatus 10, a correction value is calculated based on the measurement result of the thickness of the reference section 514 and the reference thickness, and the measurement result of the thickness of the molded substrate W is corrected based on the correction value. Therefore, with the resin molding apparatus 10, for example, even if the measurement result of at least one of the optical sensors 522 and 524 is inaccurate, the thickness of the molded substrate W can be measured relatively accurately. As a result, for example, the man-hours required for the installation of the optical sensors 522 and 524 in the manufacturing process of the resin molding apparatus 10 can be reduced.
[0044] Furthermore, in the resin molding apparatus 10, the correction of the measurement result of the thickness of the molded substrate W is performed by adding a correction value to the measurement result of the thickness of the molded substrate W. Therefore, with the resin molding apparatus 10, the correction of the measurement result of the thickness of the molded substrate W can be performed relatively easily.
[0045] [3. Operation] Figure 11 is a flowchart showing an example of a procedure for correcting the measurement results of the thickness of the molded substrate W. The process shown in this flowchart is performed by computer 400.
[0046] Referring to Figure 11, the computer 400 calculates the thickness of the object that passed between the optical sensors 522 and 524 based on the measurement results of each optical sensor 522 and 524 from the time the mobile device 510 starts moving until the mobile device 510 has completed passing between the optical sensors 522 and 524 (step S100). The optical sensors 522 and 524 continuously measure distance at predetermined intervals.
[0047] Figure 12 schematically shows an example of the progression of the calculated thickness. Referring to Figure 12, the horizontal axis represents time, and the vertical axis represents the calculated thickness. In this example, the thickness of the molded substrate W is calculated at times t1-t4. In particular, at times t2-t3, the thickness of the resin-sealed portion of the molded substrate W is calculated. At times t5-t8, the thickness of the reference section 514 is calculated. In particular, at times t6-t7, the through-hole H1 passes between the optical sensors 522 and 524. The reference thickness stored in the memory unit 410 corresponds to the thickness calculated at times t7-t8.
[0048] Referring again to Figure 11, the computer 400 identifies the data showing the thickness of the reference section 514 from the data showing the progression of the calculated thickness (see Figure 12) (step S110). For example, the computer 400 identifies the section corresponding to the through hole H1 (times t6-t7 in Figure 12) and considers the thickness measured immediately after that section (thickness at time t7-t8 in Figure 12) to be the thickness of the reference section 514.
[0049] As described above, in a plan view of the discharge mechanism 500, the optical sensors 522 and 524 and the through-hole H1 of the reference section 514 overlap in a portion of the movement path of the mobile machine 510. Therefore, with the resin molding apparatus 10, the measurement results of the optical sensors 522 and 524 when they overlap with the through-hole H1 of the reference section 514 are distinctive (the thickness is 0), making it relatively easy to identify the measurement results of the optical sensors 522 and 524 that are related to the thickness of the reference section 514.
[0050] Once the thickness of the reference section 514 is determined, the computer 400 calculates a correction value based on the determined thickness of the reference section 514 (step S120). Specifically, the computer 400 calculates the correction value by subtracting the determined thickness of the reference section 514 from the reference thickness stored in the storage unit 410.
[0051] The computer 400 identifies the data representing the thickness of the molded substrate W from the data showing the thickness progression calculated in step S100 (see Figure 12) (step S130). For example, the computer 400 considers each thickness in the longest interval where thickness is continuously detected (times t1-t4 in Figure 12) to be the thickness of the molded substrate W.
[0052] The computer 400 corrects each of the specified thicknesses of the molded substrate W by using the correction value calculated in step S120 (step S140). Specifically, the computer 400 corrects each of the specified thicknesses of the molded substrate W by adding the correction value to each of the specified thicknesses of the molded substrate W.
[0053] [4. Features] As described above, in the resin molding apparatus 10 according to this embodiment, a correction value is calculated based on the measurement result of the thickness of the reference section 514 and the reference thickness, and the measurement result of the thickness of the molded substrate W is corrected based on the correction value. Therefore, with the resin molding apparatus 10, for example, even if the measurement result of at least one of the optical sensors 522 and 524 is inaccurate, the thickness of the molded substrate W can be measured relatively accurately.
[0054] Note that substrate W is an example of a "substrate" in the present invention, reference unit 514 is an example of a "reference unit" in the present invention, and mobile unit 510 is an example of a "mobile unit" in the present invention. Optical sensors 522 and 524 are examples of the "first and second optical sensors" in the present invention, respectively. The configuration consisting of distance measuring unit 520 and computer 400 is an example of a "measuring unit" in the present invention. Storage unit 410 is an example of a "storage unit" in the present invention. Holding mechanism 512 is an example of a "holding mechanism" in the present invention. Rail RL1 is an example of a "first rail" in the present invention, and rail RL2 is an example of a "second rail" in the present invention.
[0055] [5. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.
[0056] <5-1> In the above embodiment, the reference unit 514 is provided on the mobile unit 510. However, the location where the reference unit 514 is provided is not limited to this. The reference unit 514 may be provided, for example, on the substrate transport mechanism 530.
[0057] Figure 13 is a schematic diagram showing the plan view of the substrate transport mechanism 530X including the reference section 514. As shown in Figure 13, in the substrate transport mechanism 530X, the reference section 514 is attached to the base section 532 and is located between a pair of pushers 536. In this case, for example, a distance measuring section 520 is provided between a pair of rails RL2. As the substrate transport mechanism 530X passes between the optical sensors 522 and 524 while holding the molded substrate W, the thickness of the object passing between the optical sensors 522 and 524 is measured. A correction value is calculated based on the measured thickness of the reference section 514, and the measured thickness of the molded substrate W is corrected based on the correction value.
[0058] <5-2> In the above embodiment, the correction value was calculated by subtracting the measured thickness of the reference portion 514 from the reference thickness. However, the method for calculating the correction value is not limited to this. For example, the correction value may be calculated by dividing the reference thickness by the measured thickness of the reference portion 514. In this case, the measured thickness of the molded substrate W may be corrected by accumulating the correction value to the measured thickness of the molded substrate W. Alternatively, the correction value may be calculated by dividing the measured thickness of the reference portion 514 by the reference thickness, in which case the measured thickness of the molded substrate W may be corrected by dividing the measured thickness of the molded substrate W by the correction value.
[0059] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.
[0060] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.
[0061] [6. Addendum] This specification discloses a variety of technical ideas, including at least the following technologies:
[0062] <Technology 1> (composition) A mobile device that includes a reference section used for measuring the thickness of the substrate and moves together with the substrate, A measuring unit includes first and second optical sensors, each measuring distance by light, and measures the thickness of the substrate as the substrate passes between the first and second optical sensors as the mobile device moves, The system includes a storage unit that stores the reference thickness, which is the thickness of the reference portion, A measuring device comprising: a measuring unit that measures the thickness of the reference unit as the reference unit passes between the first and second optical sensors; a measuring unit that calculates a correction value based on the measurement result of the thickness of the reference unit and the reference thickness; and a measuring device that corrects the measurement result of the thickness of the substrate based on the correction value. (Effects, etc.) In this measuring device, a correction value is calculated based on the measurement result of the reference thickness and the reference thickness, and the measurement result of the substrate thickness is corrected based on the correction value. Therefore, with this measuring device, for example, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the substrate thickness can be measured relatively accurately.
[0063] <Technology 2> (composition) The measuring apparatus according to Technology 1, wherein the substrate is a pre-molded substrate made of resin. (Effects, etc.) In this measuring device, a correction value is calculated based on the measurement result of the thickness of the reference section and the reference thickness, and the measurement result of the thickness of the molded substrate is corrected based on the correction value. Therefore, with this measuring device, for example, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the thickness of the molded substrate can be measured relatively accurately.
[0064] <Technology 3> (composition) The mobile device further includes a holding mechanism that holds the substrate in a state in which at least a portion of each of the first and second surfaces of the substrate is exposed. The measuring apparatus according to Technology 1 or Technology 2, wherein the holding mechanism holds the substrate by clamping at least a portion of the peripheral edge of the substrate. (Effects, etc.) In this measuring device, the substrate is held by the holding mechanism by which at least a portion of the peripheral edge of the substrate is clamped. Therefore, with this measuring device, since at least a portion of the peripheral edge of the substrate is clamped by the holding mechanism when measuring the thickness of the substrate, the occurrence of warping of the substrate during the measurement of the substrate thickness can be suppressed.
[0065] <Technology 4> (composition) The aforementioned reference portion has a through hole formed in it. A measuring device according to any one of the technologies 1 to 3, wherein, in a plan view, the first and second optical sensors and the through-holes overlap in a portion of the movement path of the mobile device. (Effects, etc.) In this measuring device, in a plan view, the first and second optical sensors and the through-holes of the reference section overlap in a portion of the movement path of the mobile device. Therefore, with this measuring device, the measurement results of the first and second optical sensors when they overlap with the through-holes of the reference section are characteristic, making it relatively easy to identify the measurement results related to the thickness of the reference section from among the measurement results of the first and second optical sensors.
[0066] <Technology 5> (composition) The correction value is the difference between the measurement result of the reference thickness and the thickness of the reference part, as described in any one of the technologies 1 to 4. (Effects, etc.) In this measuring device, the correction value is the difference between the measured thickness of the reference section and the measured thickness of the reference part. Therefore, this measuring device makes it relatively easy to correct the measured thickness of the substrate.
[0067] <Technology 6> (composition) The aforementioned mobile device moves along the first rail, As the moving device moves together with the substrate to the end of the first rail, the substrate is transferred to the second rail. The transfer of the substrate to the second rail is performed by the gripper pulling the substrate. The measuring device according to any one of the technologies 1 to 5, wherein the reference portion is provided at the end of the mobile device in the direction opposite to the direction of movement when the mobile device moves together with the substrate. (Effects, etc.) In this measuring device, the reference section is located at the end of the mobile unit in the direction opposite to the direction of movement when the mobile unit moves together with the substrate. Therefore, this measuring device can suppress the occurrence of the reference section interfering with the gripper.
[0068] <Technology 7> (composition) A resin molding apparatus for molding a pre-molded substrate that has not been molded with resin using resin, A resin molding apparatus equipped with a measuring device described in any one of the technologies 1 to 6. (Effects, etc.) With this resin molding apparatus, for example, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the thickness of the substrate can be measured with relative accuracy.
[0069] <Technology 8> (composition) A method for manufacturing a resin molded product, comprising manufacturing a resin molded product by molding the pre-molding substrate with resin using the resin molding apparatus described in Technical 7. (Effects, etc.) According to this method for manufacturing resin molded products, for example, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the thickness of the resin molded product can be measured relatively accurately. [Explanation of symbols]
[0070] 10 Resin molding apparatus, 50 Loading / unloading mechanism, 100 Substrate supply / storage module, 110 Substrate storage section, 120 Robot hand, 130 Temporary substrate storage section, 140, 530 Substrate transport mechanism, 200 Resin molding module, 210 Compression molding section, 211 Molding die, 212 Lower die, 212C Cavity, 214 Upper die, 216 Clamping mechanism, 300 Resin material supply module, 310 Mobile table, 320 Resin material storage section, 322 Recess, 330 Resin material supply mechanism, 340, 360 Resin material transport mechanism, 350 Temporary resin storage section, 400 Computer, 410 Memory section, 500 Unloading mechanism, 501 First unloading section, 502 Second unloading section, 510 Mobile machine, 511 Mobile machine body, 512 Holding mechanism, 514 Reference section, 520 Distance measuring section, 522, 524 Optical sensor, 532 Base section, 534 Gripper, 536 Pusher, 590 Loading mechanism, H1 Through hole, P Resin material, RL1, RL2 Rails, W Substrate.
Claims
1. A mobile device that includes a reference section used for measuring the thickness of the substrate and moves together with the substrate, A measuring unit includes first and second optical sensors, each measuring distance by light, and measures the thickness of the substrate as the substrate passes between the first and second optical sensors as the mobile device moves, The system includes a storage unit that stores the reference thickness, which is the thickness of the reference portion, The measuring unit measures the thickness of the reference unit as it passes between the first and second optical sensors, calculates a correction value based on the measurement result of the thickness of the reference unit and the reference thickness, and corrects the measurement result of the thickness of the substrate based on the correction value. The aforementioned reference portion has a through hole formed in it. A measuring device in which, in a plan view, the first and second optical sensors and the through-holes overlap in a portion of the movement path of the mobile device.
2. A mobile device that includes a reference section used for measuring the thickness of a substrate and moves together with the substrate, A measuring unit includes first and second optical sensors, each measuring distance by light, and measures the thickness of the substrate as the substrate passes between the first and second optical sensors as the mobile device moves, The system includes a storage unit that stores the reference thickness, which is the thickness of the reference portion, The measuring unit measures the thickness of the reference unit as it passes between the first and second optical sensors, calculates a correction value based on the measurement result of the thickness of the reference unit and the reference thickness, and corrects the measurement result of the thickness of the substrate based on the correction value. The aforementioned mobile device moves along the first rail, As the moving device moves together with the substrate to the end of the first rail, the substrate is transferred to the second rail. The transfer of the substrate to the second rail is performed by the gripper pulling the substrate. A measuring device in which the reference portion is provided at the end of the mobile device in the direction opposite to the direction of movement when the mobile device moves together with the substrate.
3. The measuring apparatus according to claim 1 or claim 2, wherein the substrate is a pre-molded substrate formed from resin.
4. The mobile device further includes a holding mechanism that holds the substrate in a state in which at least a portion of each of the first and second surfaces of the substrate is exposed. The measuring device according to claim 1 or claim 2, wherein the holding mechanism holds the substrate by clamping at least a portion of the peripheral edge of the substrate.
5. The measuring device according to claim 1 or claim 2, wherein the correction value is the difference between the measurement result of the reference thickness and the thickness of the reference portion.
6. A resin molding apparatus for molding a pre-molded substrate that has not been molded with resin using resin, A resin molding apparatus comprising the measuring device described in claim 1 or claim 2.
7. A method for manufacturing a resin molded product, comprising manufacturing a resin molded product by molding the pre-molding substrate with resin using the resin molding apparatus described in claim 6.