Manufacturing equipment and manufacturing method for semiconductor devices

Abstract

To provide a manufacturing device for further improving the quality of a semiconductor device to be manufactured.SOLUTION: A manufacturing device 10 for manufacturing a semiconductor device by bonding a wire 108 to an overhang die 102 having a bonding point at an overhung part includes a capillary 18, a bonding arm 14, a load sensor 22 for detecting a load received by the capillary as a detection load Ld, and a controller 34 for lowering the capillary while monitoring the detection load, and determining that the capillary is grounded in the case that the detection load becomes equal to or more than a specified ground load La. The controller corrects offset of the load sensor 22 so as to make a detection load at a point time of satisfying a correction condition in the case of satisfying a prescribed correction condition in the process of a descent of the capillary. The correction condition changes a past detection load being a detection load detected before a prescribed unit time, and its change amount is equal to or less than a reference load Ls smaller than a ground load.SELECTED DRAWING: Figure 1

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