Electronic module, assembly, and method for manufacturing an electronic module

Abstract

To provide an electronic module that can achieve heat dissipation from the back surface through a back surface exposed part and can more securely prevent burrs, etc., from being generated due to resin wrapping around the back surface, a combinational body using the electronic module, and a manufacturing method for the electronic module.SOLUTION: An electronic module has electronic elements 10, a sealing part 90 that seals the electronic elements 10, and a back surface exposed part in which the electronic elements 10 are arranged on the front surface and the back surface is exposed from the sealing part 90. A recess 80 extending from the side surface to the inside is provided on the front surface of the sealing part 90. The recess 80 is positioned on the front surface side of the back surface exposed part.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an electronic module having a back surface exposed portion, an assembly, and a method for manufacturing an electronic module.

Background Art

[0002] Conventionally, semiconductor devices used in inverter circuits and relay circuits used in vehicles such as automobiles have been known. Patent Document 1 discloses a semiconductor module having a power supply terminal, an output terminal, and a ground terminal. In such a semiconductor module, it is desirable to enhance the heat dissipation efficiency from an electronic element. For this reason, it is also conceivable to expose the back surface of a conductor having a terminal portion from a sealing portion such as a mold resin.

[0003] However, even if an attempt is made to expose the back surface of the conductor in this way, there is a possibility that the resin may flow around to the back surface side of the conductor when resin-sealing. In particular, when the conductor is divided into a plurality of members, such resin flow-around may become remarkable.

[0004] In order to solve such problems, Patent Document 2 and the like have been proposed, but further improvement in preventing resin flow-around while realizing heat dissipation from the back surface has been attempted.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention provides an electronic module that achieves heat dissipation from the back surface through an exposed back surface portion while more reliably preventing resin from seeping to the back surface and causing burrs, an assembly using the electronic module, and a method for manufacturing the electronic module. [Means for solving the problem]

[0007] [Concept 1] The electronic module according to the present invention is Electronic components and, A sealing portion for sealing the aforementioned electronic component, The electronic element is arranged on the front surface, and the back surface is an exposed back surface portion that is exposed from the sealing portion, Equipped with, The front surface of the sealing portion is provided with a recess that extends inward from the side, The recess may be positioned on the front side of the exposed back surface portion.

[0008] [Concept 2] In the electronic module according to Concept 1, The exposed rear surface portion has a main body portion and a protruding portion that protrudes laterally from the main body portion. The recess may be provided on the front side of the protrusion.

[0009] [Concept 3] In the electronic module based on Concept 2, Having multiple exposed back surfaces, Each of the exposed parts on the back surface has the aforementioned protrusion, The recesses may be provided corresponding to each protrusion.

[0010] [Concept 4] In an electronic module based on Concept 3, Having two or more of the aforementioned protrusions, The recesses may be provided corresponding to each protrusion.

[0011] [Concept 5] In an electronic module based on any one of concepts 1 to 4, A non-exposed back surface portion provided via a bent portion is provided on the exposed back surface portion, A terminal portion protruding outward from the side surface of the sealing portion may be provided on the non-exposed back surface portion.

[0012] [Concept 6] In the electronic module according to any one of Concepts 1 to 5, The terminal portion functions as an output terminal, A power supply terminal and a ground terminal protrude to the outside from one side of the sealing portion, An output terminal, a first gate terminal, and a second gate terminal protrude to the outside from the other side of the sealing portion, The output terminal may protrude to the outside from the sealing portion between the first gate terminal and the second gate terminal.

[0013] [Concept 7] The combination according to any one of Concepts 1 to 6 is, Any of the above-described electronic modules, A substrate provided on the front surface of the sealing portion, A heat sink provided on the back surface of the exposed back surface portion, And includes, The terminal portion may be connected to a conductor layer provided on the substrate.

[0014] [Concept 8] The method for manufacturing an electronic module according to the present invention is, A step of placing a back surface exposed portion having a main body portion on which an electronic element is mounted and a protruding portion protruding laterally from the main body portion in a mold, A step of sealing with a sealing resin while pressing the protruding portion with a pressing portion, After separating the pressing portion from the protruding portion, a step of forming a recess made of a sealing resin by additionally supplying the sealing resin, May include.

Effect of the Invention

[0015] Since the exposed back surface is exposed from the sealing surface, a heat dissipation effect can be achieved. By adopting a method in which the exposed back surface is pressed by a pressing surface extending in the in-plane direction while sealing with resin, it is possible to more reliably prevent the resin from wrapping around to the back surface and generating burrs, etc. In addition, by providing a recess on the front surface of the sealing surface that extends inward from the side, it is possible to create a configuration in which water, etc., can be discharged even if it gets into the recess. [Brief explanation of the drawing]

[0016] [Figure 1] Figure 1 is a perspective view of an electronic module that may be used in an embodiment of the present invention, showing the inside of the sealing portion. [Figure 2] Figure 2 is a front view of an electronic module that may be used in an embodiment of the present invention, viewed along a third direction, and shows the inside of the sealing portion. [Figure 3] Figure 3 is a plan view of an electronic module that may be used in an embodiment of the present invention, viewed along a first direction, and shows the inside of the sealing portion. [Figure 4A] Figure 4A is a plan view showing a sealing portion and a recess that may be used in an embodiment of the present invention. [Figure 4B] Figure 4B is a schematic diagram of the cross-section obtained by cutting along the straight line BB in Figure 4A. [Figure 4C] Figure 4C is a schematic diagram of the cross-section obtained by cutting along the straight line CC in Figure 4A. [Figure 5] Figure 5 is a bottom view of an electronic module that may be used in an embodiment of the present invention, viewed along a first direction, and shows the inside of the sealing portion. [Figure 6] Figure 6 is an enlarged plan view showing the first electronic element, the second electronic element, etc., that may be used in embodiments of the present invention. [Figure 7] Figure 7 is a schematic side cross-sectional view showing an electronic element that can be used in an embodiment of the present invention, in which the exposed back surface and the connector are connected via a conductive adhesive. [Figure 8]Figure 8 is a side view showing a second connector that may be used in an embodiment of the present invention. [Figure 9A] Figure 9A is a plan view showing a first connector that may be used in an embodiment of the present invention. [Figure 9B] Figure 9B is a side view showing a first connector that may be used in an embodiment of the present invention. [Figure 10] Figure 10 is a schematic lateral cross-sectional view showing the peripheral region of an embodiment of the present invention. [Figure 11] Figure 11 is a circuit diagram of an electronic module according to an embodiment of the present invention. [Figure 12] Figure 12 is a side view of an electronic module that may be used in an embodiment of the present invention, viewed along the second direction (viewed from the right side in Figure 3), and shows the inside of the sealing portion. [Figure 13] Figure 13 is a side view of an electronic module that may be used in an embodiment of the present invention, viewed along the second direction (viewed from the left side of Figure 3), and shows the inside of the sealing portion. [Figure 14] Figure 14 is a schematic side view showing an assembly using an electronic module according to an embodiment of the present invention. [Figure 15A] Figure 15A is a schematic side view showing an example of a method for manufacturing an electronic module according to an embodiment of the present invention. [Figure 15B] Figure 15B is a schematic side view showing the process following Figure 15A. [Figure 15C] Figure 15C is a schematic side view showing the process following Figure 15B. [Figure 16] Figure 16 is a plan view showing a modified example of an embodiment of the present invention. [Modes for carrying out the invention]

[0017] Embodiment "composition" In this embodiment, "one side" refers to the upper side of Figure 2, and "the other side" refers to the lower side of Figure 2. The vertical direction in Figure 2 is called the "first direction," the horizontal direction is called the "second direction," and the front-to-back direction of the paper is called the "third direction." The in-plane direction, including the second and third directions, is called the "in-plane direction." Reference numerals shown in parentheses in the drawing indicate that they also correspond to the component indicated by that numeral. For example, "11(10)" indicates that the component is both the "first electronic element 11" and the "electronic element 10."

[0018] As shown in Figure 1, the electronic module of this embodiment includes an electronic element 10, a sealing portion 90 that encloses the electronic element 10, and a conductor portion 30 on which the electronic element 10 is positioned on the front surface and which includes a back surface exposed portion 40 that is exposed from the sealing portion 90. The conductor portion 30 is made of, for example, copper.

[0019] As shown in Figures 4A to 4C, the front surface of the sealing portion 90 is provided with recesses 80 that extend inward from the side. In the configuration shown in Figure 4A, there are six recesses 80 extending in the left-right direction in the sealing portion. In this embodiment, this number (6) matches the number of exposed back surfaces 40. As shown in Figures 4B and 4C, the recesses 80 are located on the front surface side of the exposed back surfaces 40.

[0020] An electronic element 10 may be provided on the front surface of the exposed back surface portion 40 via a conductive adhesive 190 such as solder (see Figure 7), and the electronic element 10 may be connected via a connector 200 or a connecting member such as a wire. Conductive adhesive 190 may also be provided between the electronic element 10 and the connecting member, and between the terminal portion 100 and the connecting member. In the following description, a configuration in which a connector 200 is used as the connecting member will be used, but the description is not limited to this, and a wire may be used instead of the connector 200. For example, a copper clip can be used as the connector 200, and for example, an aluminum wire can be used as the wire. Note that the amount of current that can flow can be increased by using a wider connector 200.

[0021] As shown in Figure 6, the exposed back portion 40 may have a first exposed back portion 51 that is integrated with the non-exposed back portion 49, and a second exposed back portion 52 that is not integrated with the non-exposed back portion 49. A bent portion 45 that is bent inward (bent upward) from the sealing portion 90 may be provided between the first exposed back portion 51 and the non-exposed back portion 49. In this case, the first exposed back portion 51, the bent portion 45, and the non-exposed back portion 49 may be integrated to form a single integrated member. An output terminal 110 that protrudes outward from the side surface of the sealing portion 90 may be provided integrally with this non-exposed back portion 49, in which case the first exposed back portion 51, the bent portion 45, the non-exposed back portion 49, and the output terminal 110 will be integrated.

[0022] As shown in Figures 1, 3, and 5, the terminal section 100 may have a power terminal 120, a ground terminal 130, a first gate terminal 140, and a second gate terminal 150, in addition to the output terminal 110. For example, the power terminal 120 and the ground terminal 130 may protrude to the outside from one side of the sealing section 90 (see Figure 12), and the output terminal 110, the first gate terminal 140, and the second gate terminal 150 may protrude to the outside from the other side of the sealing section 90 (see Figure 13). The output terminal 110 may protrude to the outside from the sealing section 90 between the first gate terminal 140 and the second gate terminal 150.

[0023] As shown in Figure 3, a damming portion 43 may be provided on the front surface of the exposed back surface portion 40 to function as a stopper to prevent the conductive adhesive 190 from leaking out. Damming portions (not shown) that function as stoppers may also be provided on each of the first gate terminal 140 and the second gate terminal 150. Damming portions (not shown) that function as stoppers may also be provided on each of the power terminal 120 and the ground terminal 130.

[0024] The electronic element 10 may be a semiconductor element such as a MOSFET, and the electronic module may be a semiconductor module, for example. As shown in Figure 7, the electronic element 10 may have a source electrode 10s, a gate electrode 10g, and a drain electrode 10d. The source electrode 10s and the gate electrode 10g may be provided on the front surface of the electronic element 10, and the drain electrode 10d may be provided on the back surface of the electronic element 10. The drain electrode 10d may be provided on the exposed back surface portion 40 via a conductive adhesive 190.

[0025] As shown in Figure 6, in this embodiment, the first connector 210 may electrically connect the output terminal 110, the power terminal 120, or the ground terminal 130 to the electronic element 10, and the second connector 220 may electrically connect the first gate terminal 140 or the second gate terminal 150 to the electronic element 10.

[0026] The electronic element 10 may have a first electronic element 11 provided on the front surface of the first back surface exposed portion 51 and a second electronic element 12 provided on the front surface of the second back surface exposed portion 52. As an example, as shown in Figure 6, the first connector 210 may connect the source electrode 11s provided on the front surface of the first electronic element 11 to the ground terminal 130 via a conductive adhesive 190 (see Figure 7). Alternatively, the first connector 210 may connect the source electrode 12s etc. provided on the front surface of the second electronic element 12 to the output terminal 110 via a conductive adhesive 190. Furthermore, the second connector 220 may connect the gate electrode 11g provided on the front surface of the first electronic element 11 to the second gate terminal 150 via a conductive adhesive 190. Furthermore, the second connector 220 may connect the gate electrode 12g provided on the front surface of the second electronic element 12 to the first gate terminal 140 via a conductive adhesive 190.

[0027] The thickness of the first connector 210 may be greater than the thickness of the second connector 220. For example, the thickness of the first connector 210 may be 1.2 times or more and 1.5 times or less the thickness of the second connector 220.

[0028] As shown in Figures 9A and 9B, the first connector 200 may have a first recess 211 recessed to the other side and a first connecting projection 212 provided in the first recess 211 and protruding to the other side. This first connecting projection 212 may be provided at the corner of the first recess 211, and in this embodiment, four first connecting projections 212 are provided. As shown in Figure 8, the second connector 220 may have a second recess 221 recessed to the other side and a second connecting projection 222 corresponding to this second recess 221 and protruding to the other side.

[0029] As shown in Figure 6, the exposed back surface portion 40 may have main body portions 51a, 52a and protruding portions 51b, 52b that project laterally from the main body portions 51a, 52a. As mentioned above, the recess 80 may be provided on the front side of the protruding portions 51b, 52b (see Figures 4A to 4C). More specifically, the first exposed back surface portion 51 may have a first main body portion 51a and a first protruding portion 51b that project laterally from the first main body portion 51a. The second exposed back surface portion 52 may have a second main body portion 52a and a second protruding portion 52b that project laterally from the second main body portion 52a.

[0030] As shown in Figure 10, the main body portions 51a and 52a of the exposed back surface portion 40 may have peripheral regions 51c and 52c whose back surfaces are covered by the sealing portion 90 (see also Figure 5). The height positions of the peripheral regions 51c and 52c and the unexposed back surface portion 49 may correspond. In this embodiment, "corresponding" in height positions means that the height positions of the center positions coincide within a range of 5% or less of the thickness of the electronic module in the first direction. Therefore, for the height positions of the peripheral regions 51c and 52c and the unexposed back surface portion 49 to correspond means that the center position in the thickness direction (first direction) of the peripheral regions 51c and 52c and the center position in the thickness direction (first direction) of the unexposed back surface portion 49 coincide or fall within a range of 5% or less of the thickness of the electronic module.

[0031] Multiple electronic elements 10 may be provided. If multiple back surface exposed portions 40 are provided, each back surface exposed portion 40 may have protrusions 51b, 52b. And recesses 80 may be provided corresponding to each protrusion 51b, 52b. For example, six electronic elements 10 may be provided, each of which is positioned on the front surface side (upper side in Figure 2) of the back surface exposed portion 40, and each of which has six protrusions 51b, 52b. And recesses 80 may be provided corresponding to each protrusion 51b, 52b.

[0032] As shown in Figure 14, a substrate 310 may be provided on the front surface (lower surface in Figure 14) of the sealing portion 90. Terminals 100 such as the output terminal 110, power terminal 120, ground terminal 130, first gate terminal 140, and second gate terminal 150 may be connected to a conductor layer 320 provided on the substrate 310. A heat sink 300 may be provided on the back surface (upper surface in Figure 14) of the exposed back surface portion 40. In this embodiment, the electronic module according to this embodiment, the substrate 310, and the heat sink 300 constitute the assembly.

[0033] In this embodiment, only the exposed back surface portion 40 is exposed from the back surface of the sealing portion 90, while the non-exposed back surface portion 49, the output terminal 110, the power terminal 120, the ground terminal 130, the first gate terminal 140, and the second gate terminal 150 are not exposed from the back surface of the sealing portion 90. As previously mentioned, the output terminal 110, the power terminal 120, the ground terminal 130, the first gate terminal 140, and the second gate terminal 150 protrude to the outside from the side of the sealing portion 90.

[0034] As the electronic module, for example, a power electronic module may be used. As the first electronic element 11 and the second electronic element 12, for example, MOSFETs may be used, as described above. The circuit diagram of the electronic module according to this embodiment is shown in Figure 11, for example. In the embodiment shown in Figure 6, the first electronic element 11 and the second electronic element 12 are MOSFETs, and in Figure 6, the drain electrode 11d (see Figure 7) of the MOSFET which is the first electronic element 11 is located on the side of the first back surface exposed portion 51, and the source electrode 11s is located on the opposite side (front side) from the first back surface exposed portion 51. Also, the drain electrode 12d (see Figure 7) of the MOSFET which is the second electronic element 12 is located on the side of the second back surface exposed portion 52, and the source electrode 12s is located on the opposite side (front side) from the second back surface exposed portion 52.

[0035] The electronic module of this embodiment may be a three-phase bridge circuit. One of the three output terminals 110 may be connected to the U-phase coil, another to the V-phase coil, and the remaining one to the W-phase coil (see Figure 11). The connection point between the first electronic element 11 and the second electronic element 12 may be connected to the U-phase coil, V-phase coil, or W-phase coil of the motor.

[0036] 《Manufacturing method》 An example of a method for manufacturing an electronic module according to this embodiment will be described.

[0037] First, the main body portions 51a and 52a and the back surface exposed portion 40 having protrusions 51b and 52b projecting laterally from the main body portions 51a and 52a are placed inside the mold 400 (see Figure 15A). Electronic elements 10 are provided on each of the main body portions 51a and 52a of the back surface exposed portion 40 via a conductive adhesive 190. More specifically, a first electronic element 11 is provided on the front surface of the first main body portion 51a via a conductive adhesive 190, and a second electronic element 12 is provided on the front surface of the second main body portion 52a via a conductive adhesive 190.

[0038] Next, the protrusions 51b and 52b of the exposed back surface portion 40 are pressed by a pressing part 450, such as a pressing pin, and sealed with sealing resin (see Figure 15B). More specifically, the first protrusion 51b of the first exposed back surface portion 51 and the second protrusion 52b of the second exposed back surface portion 52 are pressed by the pressing part 450 and sealed with sealing resin. In the embodiment shown in Figure 3, each of the six protrusions 51b and 52b is pressed by the pressing part 450.

[0039] Next, after separating the pressing portion 450 from the protrusions 51b and 52b, a small amount of sealing resin is supplied to the area where the pressing portion 450 was located to form a recessed area 80 that is more recessed than other areas. In the embodiment shown in Figure 3, six recessed areas 80 are formed.

[0040] As described above, an electronic module can be generated in which a recess 80 extending from the side toward the interior is provided on the front surface of the sealing portion 90, and this recess 80 is positioned on the front surface side of the back surface exposed portion 40.

[0041] "effect" Next, an example of the effects of this embodiment, which has the configuration described above, will be explained. Note that any of the embodiments described in "Effects" can be adopted in the above configuration.

[0042] Since the exposed back surface portion 40 is exposed from the sealing portion 90, a heat dissipation effect can be achieved. Furthermore, by adopting a method in which the exposed back surface portion 40 is pressed by a pressing portion 450 extending in the in-plane direction while sealing with resin (see Figure 15B), it is possible to more reliably prevent the resin from wrapping around to the back surface and generating burrs, etc. In addition, by providing a recess 80 extending from the side toward the interior on the front surface of the sealing portion 90, it is possible to configure the recess 80 so that any water or other liquids that get into it can be drained. In other words, the recess 80 in this embodiment also functions as a liquid drainage recess.

[0043] By adopting a configuration in which protrusions 51b and 52b are provided that project laterally from the main body portions 51a and 52a, the protrusions 51b and 52b, which are positioned appropriately, can be pressed by the pressing portion 450, thereby more reliably preventing the resin from wrapping around to the back surface and causing burrs or other defects.

[0044] By adopting a configuration in which each of the exposed back surface portion 40 has protrusions 51b, 52b, and recesses 80 are provided corresponding to each of the protrusions 51b, 52b, each of the exposed back surface portion 40 can be pressed by the pressing portion 450, thereby more reliably preventing the resin from seeping to the back surface and causing burrs or the like.

[0045] By adopting a configuration in which a terminal portion 100 protruding outward from the side surface of the sealing portion 90 is provided on the non-exposed back surface portion 49, the back surface of the terminal portion 100 is covered by the sealing portion 90. Therefore, the terminal portion 100 can be fixed more securely to the sealing portion 90.

[0046] By adopting a configuration in which the power terminal 120 and ground terminal 130 protrude to the outside from one side of the sealing portion 90, and the output terminal 110, first gate terminal 140, and second gate terminal 150 protrude to the outside from the other side of the sealing portion 90, with the output terminal 110 protruding from the sealing portion 90 between the first gate terminal 140 and the second gate terminal 150 (see Figures 12 and 13), the size of the electronic module in the longitudinal direction can be reduced, and the wiring path can also be shortened.

[0047] As shown in Figure 14, a substrate 310 is provided on the front surface of the sealing portion 90, and the terminal portion 100 is connected to a conductor layer 320 provided on the substrate 310, while on the other hand, a heat sink 300 is provided on the back surface of the exposed back surface portion 40. By adopting this configuration, heat can be dissipated to the conductor layer 320 via the terminal portion 100 and to the heat sink 300 via the exposed back surface portion 40, and a high heat dissipation effect can be expected.

[0048] (modified version) In the above embodiment, a configuration in which three first electronic elements 11 and three second electronic elements 12 are provided is shown, but the embodiment is not limited to this configuration. One first electronic element 11 and two second electronic elements 12 may be provided, or four or more first electronic elements 11 and two second electronic elements 12 may be provided.

[0049] Furthermore, it is not necessary to provide both the first electronic element 11 and the second electronic element 12; only one electronic element 10 may be provided. As an example, as shown in Figure 16, the electronic module may have one electronic element 10, a sealing portion 90 that seals the electronic element 10, and a back surface exposed portion 40 on which the electronic element 10 is positioned on the front surface and whose back surface is exposed from the sealing portion 90. A recess 80 extending inward from the side is provided on the front surface of the sealing portion 90, and this recess 80 may be located on the front surface side of the back surface exposed portion 40. More specifically, the back surface exposed portion 40 has a main body portion 41 and a protruding portion 42 that protrudes laterally from the main body portion 41, and the recess 80 may be provided on the front surface side of the protruding portion 42. In this modified example, the main body portion 41 corresponds to the first main body portion 51a in the embodiment, and the protruding portion 42 corresponds to the first protruding portion 51b.

[0050] The reference numerals in Figure 16 have the same meaning as in the embodiment, and the same reference numerals indicate the same components. Also in Figure 16, the sealing portion 90 and the recess 80 are shown with dotted lines.

[0051] The above-described embodiments, modifications, and drawings are merely examples for illustrating the invention described in the claims, and the invention described in the claims is not limited by the above-described embodiments or drawings. Furthermore, the initial claims are merely examples, and the claims may be modified as appropriate based on the description in the specification, drawings, etc. [Explanation of Symbols]

[0052] 10 electron elements 30 Conductor section 40 Exposed area on the back 41 Main body 42 Protrusion 45. Bending section 49 Non-exposed area on the back 51a First body part 51b First protrusion 52a Second body part 52b Second protrusion 80 recess 90 Sealing part 110 Output terminals 120 Power terminal 130 Ground terminal 140 First gate terminal 150 Second gate terminal 300 Heatsink 310 circuit board 320 Conductor layer

Claims

1. Electronic components and, A sealing portion for sealing the aforementioned electronic component, The electronic element is arranged on the front surface, and the back surface is exposed from the sealing portion, with a plurality of exposed back surfaces. Equipped with, The front surface of the sealing portion is provided with a recess that extends inward from the side, The recess is located on the front side of the exposed back surface portion, The exposed rear surface portion has a main body portion and a protruding portion that protrudes laterally from the main body portion. The recess is provided on the front side of the protrusion. Each of the exposed parts on the back surface has the aforementioned protrusion, An electronic module in which the recesses are provided corresponding to each protrusion.

2. Having two or more of the aforementioned protrusions, The electronic module according to claim 1, wherein the recesses are provided corresponding to each protrusion.

3. An electronic element and A sealing portion for sealing the aforementioned electronic component, The electronic element is arranged on the front surface, and the back surface is an exposed back surface portion that is exposed from the sealing portion, Equipped with, The front surface of the sealing portion is provided with a recess that extends inward from the side, The recess is located on the front side of the exposed back surface portion, A non-exposed portion of the back surface is provided via a bent portion on the exposed back surface, An electronic module in which a terminal portion is provided on the non-exposed back surface portion, protruding outward from the side surface portion of the sealing portion.

4. The terminal connected to the exposed rear surface portion functions as an output terminal. A power terminal and a ground terminal protrude to the outside from one side of the sealing portion. The output terminal, the first gate terminal, and the second gate terminal protrude outward from the other side of the sealing portion. The electronic module according to any one of claims 1 to 3, wherein the output terminal protrudes to the outside from the sealing portion between the first gate terminal and the second gate terminal.

5. The exposed rear surface portion has a main body portion and a protruding portion that protrudes laterally from the main body portion. The electronic module according to claim 3, wherein the recess is provided on the front side of the protrusion.

6. Having multiple exposed back surfaces, Each of the exposed parts on the back surface has the aforementioned protrusion, The electronic module according to claim 5, wherein the recesses are provided corresponding to each protrusion.

7. Having two or more of the aforementioned protrusions, The electronic module according to claim 6, wherein the recesses are provided corresponding to each protrusion.

8. An electronic module according to any one of claims 1 to 3 and 5 to 7, A substrate provided on the front surface of the sealing portion, A heat sink provided on the back surface of the exposed back surface portion, Equipped with, The terminal portion connected to the exposed back surface is a combination connected to a conductor layer provided on the substrate.

9. A step of placing a main body on which electronic elements are mounted and a back surface exposed portion having a protruding portion that protrudes laterally from the main body into a mold, The process involves sealing the aforementioned protruding portion with a sealing resin while pressing it with a pressing portion, The process involves separating the pressing portion from the protruding portion, and then adding and supplying sealing resin to form a recess made of sealing resin. A method for manufacturing an electronic module equipped with the following features.

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