Electronic modules and assemblies

Abstract

To provide an electronic module that can prevent the generation of burrs, etc. and improve reliability while achieving a certain level of heat-dissipating effect and a combinational body using the electronic module.SOLUTION: An electronic module has electronic elements 10, a sealing part that seals the electronic elements 10, and a conductor part 30 that has a back surface exposed part 40 in which the electronic elements 10 are arranged on the front surface and the back surface is exposed from the sealing part and a back surface non-exposed part 49 provided integrally on the back surface exposed part 40 via a bending part 45. The back surface non-exposed part 49 has a terminal part (output terminal 110) protruding outwardly from the side surface of the sealing part.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to an electronic module and an assembly having a back surface exposed portion.

Background Art

[0002] Conventionally, semiconductor devices used in inverter circuits and relay circuits used in vehicles such as automobiles are known. Patent Document 1 discloses a semiconductor module having a power supply terminal, an output terminal, and a ground terminal. In such a semiconductor module, it is desirable to improve the heat dissipation efficiency from the electronic element. For this reason, it is also conceivable to expose the back surface of the conductor having the terminal portion from the sealing portion such as a mold resin.

[0003] However, even if the back surface of the conductor is exposed in this way, there is a possibility that the resin may flow around the back surface side of the conductor when resin-sealing. In particular, when the conductor is divided into a plurality of members, such resin flow may become remarkable.

[0004] In order to solve such problems, Patent Document 2 and the like have been proposed. Although exposure on the back surface is large and a heat dissipation effect can be realized, an improvement in reliability such as prevention of generation of burrs and internal peeling of the resin is desired.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention provides an electronic module that can achieve a certain heat dissipation effect while preventing the generation of burrs and other defects, and improving reliability, as well as an assembly using the electronic module. [Means for solving the problem]

[0007] [Concept 1] The electronic module according to the present invention is Electronic components and, A sealing portion for sealing the aforementioned electronic component, A conductive portion having a back surface exposed portion where the electronic element is arranged on the front surface and the back surface is exposed from the sealing portion, and a back surface non-exposed portion integrally provided with the back surface exposed portion via a bent portion, Equipped with, The non-exposed portion on the back surface may be connected to an electronic element different from the electronic element via a connecting member, and may also be integrated with a terminal portion that protrudes outward from the side surface of the sealing portion.

[0008] [Concept 2] In the electronic module according to Concept 1, A peripheral region where the back surface is covered by the sealing portion may be provided around the periphery of the exposed back surface portion.

[0009] [Concept 3] In an electronic module according to Concept 1 or 2, The height positions of the peripheral region and the unexposed portion of the back surface may correspond.

[0010] [Concept 4] In an electronic module based on any one of concepts 1 to 3, The exposed back portion has a first exposed back portion that is integrated with the non-exposed back portion, and a second exposed back portion that is not integrated with the non-exposed back portion. Only the first exposed back surface portion and the second exposed back surface portion on which the electronic element is provided may be exposed from the back surface of the sealing portion.

[0011] [Concept 5] In the electronic module according to Concept 4, Two or more electronic elements are provided. Each of the electronic elements may be disposed on the front surface side of either the first back surface exposed portion or the second back surface exposed portion.

[0012] [Concept 6] In the electronic module according to Concept 4 or 5, The back surface non-exposed portion may be positioned on the side along the short side direction of the sealing portion of the second back surface exposed portion.

[0013] [Concept 7] In the electronic module according to any one of Concepts 1 to 6, The terminal portion functions as an output terminal, The power supply terminal and the ground terminal protrude to the outside from one side of the sealing portion, The output terminal, the first gate terminal, and the second gate terminal protrude to the outside from the other side of the sealing portion, The output terminal may protrude to the outside from the sealing portion between the first gate terminal and the second gate terminal.

[0014] [Concept 8] The combination according to the present invention is an electronic module according to any one of Concepts 1 to 7, a substrate provided on the front surface of the sealing portion, a heat sink provided on the back surface of the back surface exposed portion, and includes The terminal portion may be connected to a conductor layer provided on the substrate. [Advantages of the Invention]

[0015] By adopting a mode in which the back surface exposed portion and the back surface non-exposed portion are integrated via a bent portion, it is possible to suppress the area exposed on the back surface and prevent the generation of burrs and the like, and to realize the heat dissipation effect from the back surface via the back surface exposed portion. Further, by adopting this mode, internal peeling of the resin is also less likely to occur, so that the reliability can be improved. [Brief Description of the Drawings]

[0016] [Figure 1] Figure 1 is a perspective view of an electronic module that may be used in an embodiment of the present invention, showing the inside of the sealing portion. [Figure 2] Figure 2 is a front view of an electronic module that may be used in an embodiment of the present invention, viewed along a third direction, and shows the inside of the sealing portion. [Figure 3] Figure 3 is a magnified plan view showing the first electronic element, the second electronic element, and the like that can be used in embodiments of the present invention. [Figure 4] Figure 4 is a schematic lateral cross-sectional view showing the peripheral region of an embodiment of the present invention. [Figure 5A] Figure 5A is a plan view showing a sealing portion and a recess that may be used in an embodiment of the present invention. [Figure 5B] Figure 5B is a schematic diagram of the cross-section obtained by cutting along the straight line BB in Figure 5A. [Figure 5C] Figure 5C is a schematic diagram of the cross-section obtained by cutting along the straight line CC in Figure 5A. [Figure 6] Figure 6 is a plan view of an electronic module that may be used in an embodiment of the present invention, viewed along a first direction, and shows the inside of the sealing portion. [Figure 7] Figure 7 is a bottom view of an electronic module that may be used in an embodiment of the present invention, viewed along a first direction, and shows the inside of the sealing portion. [Figure 8] Figure 8 is a side view showing a second connector that may be used in an embodiment of the present invention. [Figure 9A] Figure 9A is a plan view showing a first connector that may be used in an embodiment of the present invention. [Figure 9B] Figure 9B is a side view showing a first connector that may be used in an embodiment of the present invention. [Figure 10] Figure 10 is a schematic side cross-sectional view showing an electronic element that can be used in an embodiment of the present invention, in which the back surface exposed portion and the connector are connected via a conductive adhesive. [Figure 11] Figure 11 is a circuit diagram of an electronic module according to an embodiment of the present invention. [Figure 12] Figure 12 is a side view of an electronic module that may be used in an embodiment of the present invention, viewed along the second direction (viewed from the right side of Figure 6), and shows the inside of the sealing portion. [Figure 13] Figure 13 is a side view of an electronic module that may be used in an embodiment of the present invention, viewed along the second direction (viewed from the left side of Figure 6), and shows the inside of the sealing portion. [Figure 14] Figure 14 is a schematic side view showing an assembly using an electronic module according to an embodiment of the present invention. [Figure 15] Figure 15 is a plan view showing a modified example of an embodiment of the present invention. [Modes for carrying out the invention]

[0017] Embodiment "composition" In this embodiment, "one side" refers to the upper side of Figure 2, and "the other side" refers to the lower side of Figure 2. The vertical direction in Figure 2 is called the "first direction," the horizontal direction is called the "second direction," and the front-to-back direction of the paper is called the "third direction." The in-plane direction, including the second and third directions, is called the "in-plane direction." Reference numerals shown in parentheses in the drawing indicate that they also correspond to the component indicated by that numeral. For example, "11(10)" indicates that the component is both the "first electronic element 11" and the "electronic element 10."

[0018] As shown in Figure 1, the electronic module of this embodiment includes an electronic element 10, a sealing portion 90 that encloses the electronic element 10, and a conductor portion 30 on which the electronic element 10 is positioned on the front surface. The conductor portion 30 is made of, for example, copper.

[0019] The conductor portion 30 has a back surface exposed portion 40. An electronic element 10 is provided on the front surface of the back surface exposed portion 40 via a conductive adhesive 190 such as solder (see Figure 10), and the electronic element 10 may be connected via a connector 200 or a connecting member such as a wire. Conductive adhesive 190 may also be provided between the electronic element 10 and the connecting member, and between the terminal portion 100 and the connecting member. In the following description, a configuration in which a connector 200 is used as the connecting member will be used, but the invention is not limited to this, and a wire may be used instead of the connector 200. For example, a copper clip can be used as the connector 200, and for example, an aluminum wire can be used as the wire. Note that the amount of current that can flow can be increased by using a wider connector 200.

[0020] As shown in Figure 3, the exposed back portion 40 may have a first exposed back portion 51 integrated with the non-exposed back portion 49, and a second exposed back portion 52 that is not integrated with the non-exposed back portion 49. A bent portion 45 that is bent inward (bent upward) from the sealing portion 90 may be provided between the first exposed back portion 51 and the non-exposed back portion 49. In this case, the first exposed back portion 51, the bent portion 45, and the non-exposed back portion 49 may be integrated to form a single integrated member. An output terminal 110 that protrudes outward from the side surface of the sealing portion 90 may be provided integrally with this non-exposed back portion 49, in which case the first exposed back portion 51, the bent portion 45, the non-exposed back portion 49, and the output terminal 110 will be integrated. The first electronic element 11, which will be described later, will be placed on the first exposed back portion 51, and the second electronic element 12, which will be described later, will be placed on the second exposed back portion 52, but the output terminal 110 is connected to the second electronic element 12 via the first connector 210. Thus, in this embodiment, the non-exposed back surface portion 49 is connected via a first connector 210 to a second electronic element 12 that is different from the first electronic element 11 provided on the front surface of the first exposed back surface portion 51. An output terminal 110 that protrudes outward from the side surface of the sealing portion 90 is integrally formed on the non-exposed back surface portion 49. Furthermore, if the non-exposed back surface portion 49 is positioned on the side (left side in Figure 6) along the short direction (second direction) of the sealing portion 90 of the second exposed back surface portion 52, it is also advantageous in that the size of the sealing portion 90 in the longitudinal direction (third direction) can be reduced. In this case, the bent portion 49 will extend along the third direction in a plan view along the first direction.

[0021] As shown in Figures 1, 6, and 7, the terminal section 100 may have a power terminal 120, a ground terminal 130, a first gate terminal 140, and a second gate terminal 150, in addition to the output terminal 110. For example, the power terminal 120 and the ground terminal 130 may protrude to the outside from one side of the sealing section 90 (see Figure 12), and the output terminal 110, the first gate terminal 140, and the second gate terminal 150 may protrude to the outside from the other side of the sealing section 90 (see Figure 13). The output terminal 110 may protrude to the outside from the sealing section 90 between the first gate terminal 140 and the second gate terminal 150.

[0022] The electronic element 10 is, for example, a semiconductor element such as a MOSFET, and the electronic module may be, for example, a semiconductor module. As shown in Figure 10, the electronic element 10 may have a source electrode 10s, a gate electrode 10g, and a drain electrode 10d. The source electrode 10s and the gate electrode 10g may be provided on the front surface of the electronic element 10, and the drain electrode 10d may be provided on the back surface of the electronic element 10. The drain electrode 10d may be provided on the exposed back surface portion 40 via a conductive adhesive 190.

[0023] As shown in Figure 3, in this embodiment, the first connector 210 may electrically connect the output terminal 110, the power terminal 120, or the ground terminal 130 to the electronic element 10, and the second connector 220 may electrically connect the first gate terminal 140 or the second gate terminal 150 to the electronic element 10.

[0024] The electronic element 10 may have a first electronic element 11 provided on the front surface of the first back surface exposed portion 51 and a second electronic element 12 provided on the front surface of the second back surface exposed portion 52. As an example, as shown in Figure 3, the first connector 210 may connect the source electrode 11s provided on the front surface of the first electronic element 11 to the ground terminal 130 via a conductive adhesive 190 (see Figure 10). Alternatively, the first connector 210 may connect the source electrode 12s etc. provided on the front surface of the second electronic element 12 to the output terminal 110 via a conductive adhesive 190. Furthermore, the second connector 220 may connect the gate electrode 11g provided on the front surface of the first electronic element 11 to the second gate terminal 150 via a conductive adhesive 190. Furthermore, the second connector 220 may connect the gate electrode 12g provided on the front surface of the second electronic element 12 to the first gate terminal 140 via a conductive adhesive 190.

[0025] Two or more electronic elements 10 may be provided. Each of the electronic elements 10 may be arranged on the front side of either the first back surface exposed portion 51 or the second back surface exposed portion 52. More specifically, each of the one or more first electronic elements 11 may be provided on the front surface of the first back surface exposed portion 51 via a conductive adhesive 190, and each of the one or more second electronic elements 12 may be provided on the front surface of the second back surface exposed portion 52 via a conductive adhesive 190.

[0026] As shown in Figure 4, the main body portions 51a and 52a of the exposed back surface portion 40 may have peripheral regions 51c and 52c whose back surfaces are covered by the sealing portion 90 (see also Figure 7). The height positions of the peripheral regions 51c and 52c and the unexposed back surface portion 49 may correspond. In this embodiment, "corresponding" in height positions means that the height positions of the center positions coincide within a range of 5% or less of the thickness of the electronic module in the first direction. Therefore, for the height positions of the peripheral regions 51c and 52c and the unexposed back surface portion 49 to correspond means that the center position in the thickness direction (first direction) of the peripheral regions 51c and 52c and the center position in the thickness direction (first direction) of the unexposed back surface portion 49 coincide or fall within a range of 5% or less of the thickness of the electronic module.

[0027] As shown in Figures 5A to 5C, the front surface of the sealing portion 90 is provided with recesses 80 that extend inward from the side, and in the configuration shown in Figure 5A, six recesses 80 extending in the left-right direction may be provided in the sealing portion. As shown in Figures 5B and 5C, the recesses 80 may be positioned on the front surface side of the exposed back surface portion 40.

[0028] As shown in Figure 3, a damming portion 43 may be provided on the front surface of the exposed back surface portion 40 to function as a stopper to prevent the conductive adhesive 190 from leaking out. Damming portions (not shown) that function as stoppers may also be provided on each of the first gate terminal 140 and the second gate terminal 150. Damming portions (not shown) that function as stoppers may also be provided on each of the power terminal 120 and the ground terminal 130.

[0029] The thickness of the first connector 210 may be greater than the thickness of the second connector 220. For example, the thickness of the first connector 210 may be 1.2 times or more and 1.5 times or less the thickness of the second connector 220.

[0030] As shown in Figures 9A and 9B, the first connector 200 may have a first recess 211 recessed to the other side and a first connecting projection 212 provided in the first recess 211 and protruding to the other side. This first connecting projection 212 may be provided at the corner of the first recess 211, and in this embodiment, four first connecting projections 212 are provided. As shown in Figure 8, the second connector 220 may have a second recess 221 recessed to the other side and a second connecting projection 222 corresponding to this second recess 221 and protruding to the other side.

[0031] As shown in Figure 3, the exposed back surface portion 40 may have main body portions 51a, 52a and protruding portions 51b, 52b projecting laterally from the main body portions 51a, 52a. The recess 80 may be provided on the front side of the protruding portions 51b, 52b (see Figures 5A to 5C). More specifically, the first exposed back surface portion 51 may have a first main body portion 51a and a first protruding portion 51b projecting laterally from the first main body portion 51a. The second exposed back surface portion 52 may have a second main body portion 52a and a second protruding portion 52b projecting laterally from the second main body portion 52a.

[0032] Multiple electronic elements 10 may be provided. If multiple back surface exposed portions 40 are provided, each back surface exposed portion 40 may have protrusions 51b, 52b. And recesses 80 may be provided corresponding to each protrusion 51b, 52b. For example, six electronic elements 10 may be provided, each of which is arranged on the front surface side of the back surface exposed portion 40, and each may have six protrusions 51b, 52b. And recesses 80 may be provided corresponding to each protrusion 51b, 52b.

[0033] As shown in Figure 14, a substrate 310 may be provided on the front surface (lower surface in Figure 14) of the sealing portion 90. Terminals 100 such as the output terminal 110, power terminal 120, ground terminal 130, first gate terminal 140, and second gate terminal 150 may be connected to a conductor layer 320 provided on the substrate 310. A heat sink 300 may be provided on the back surface (upper surface in Figure 14) of the exposed back surface portion 40. In this embodiment, the electronic module according to this embodiment, the substrate 310, and the heat sink 300 constitute the assembly.

[0034] In this embodiment, only the exposed back surface portion 40 is exposed from the back surface of the sealing portion 90, while the non-exposed back surface portion 49, the output terminal 110, the power terminal 120, the ground terminal 130, the first gate terminal 140, and the second gate terminal 150 are not exposed from the back surface of the sealing portion 90. As previously mentioned, the output terminal 110, the power terminal 120, the ground terminal 130, the first gate terminal 140, and the second gate terminal 150 protrude to the outside from the side of the sealing portion 90.

[0035] As the electronic module, for example, a power electronic module may be used. As the first electronic element 11 and the second electronic element 12, for example, MOSFETs may be used, as described above. The circuit diagram of the electronic module according to this embodiment is shown in Figure 11, for example. In the embodiment shown in Figure 3, the first electronic element 11 and the second electronic element 12 are MOSFETs, and in Figure 3, the drain electrode 11d (see Figure 10) of the MOSFET which is the first electronic element 11 is located on the side of the first back surface exposed portion 51, and the source electrode 11s is located on the opposite side (front side) from the first back surface exposed portion 51. Also, the drain electrode 12d (see Figure 10) of the MOSFET which is the second electronic element 12 is located on the side of the second back surface exposed portion 52, and the source electrode 12s is located on the opposite side (front side) from the second back surface exposed portion 52.

[0036] The electronic module of this embodiment may be a three-phase bridge circuit. One of the three output terminals 110 may be connected to the U-phase coil, another to the V-phase coil, and the remaining one to the W-phase coil (see Figure 11). The connection point between the first electronic element 11 and the second electronic element 12 may be connected to the U-phase coil, V-phase coil, or W-phase coil of the motor.

[0037] "effect" Next, an example of the effects of this embodiment, which has the configuration described above, will be explained. Note that any of the embodiments described in "Effects" can be adopted in the above configuration.

[0038] By adopting a configuration in which the exposed back portion 40 and the non-exposed back portion 49 are integrated via a bent portion 45, the area exposed on the back surface is reduced, preventing the generation of burrs and the like, while achieving heat dissipation from the back surface via the exposed back portion 40. Furthermore, by adopting this configuration, internal delamination of the resin is less likely to occur, thereby improving reliability.

[0039] In an configuration in which peripheral regions 51c and 52c, whose back surface is covered by a sealing portion 49, are provided around the periphery of the exposed back surface portion 40, internal delamination of the resin in the exposed back surface portion 40 can be prevented, thereby further improving reliability.

[0040] By exposing only the first back surface exposed portion 51 and the second back surface exposed portion 52, where the first electronic element 11 and the second electronic element 12 are provided, from the back surface of the sealing portion, only the first back surface exposed portion 51 and the second back surface exposed portion 52, where the heat-generating first electronic element 11 and the second electronic element 12 are provided, can be exposed from the back surface, thereby achieving an effective heat dissipation effect while minimizing the generation of burrs and internal delamination of the resin.

[0041] By adopting a configuration in which the power terminal 120 and ground terminal 130 protrude to the outside from one side of the sealing portion 90, and the output terminal 110, first gate terminal 140, and second gate terminal 150 protrude to the outside from the other side of the sealing portion 90, and the output terminal 110 protrudes to the outside from the sealing portion 90 between the first gate terminal 140 and the second gate terminal 150, the size of the electronic module in the longitudinal direction can be reduced, and the wiring path can also be shortened.

[0042] As shown in Figure 14, a substrate 310 is provided on the front surface of the sealing portion 90, and the terminal portion 100 is connected to a conductor layer 320 provided on the substrate 310. On the other hand, a heat sink 300 is provided on the back surface of the exposed back surface portion 40. By adopting this configuration, heat can be dissipated to the conductor layer 320 via the terminal portion 100 and to the heat sink 300 via the exposed back surface portion 40, and a high heat dissipation effect can be expected.

[0043] By adopting a configuration in which protrusions 51b and 52b are provided that project laterally from the main body portions 51a and 52a, these protrusions 51b and 52b can be pressed by a pressing portion (not shown), thereby more reliably preventing the resin from wrapping around to the back surface and causing burrs or other defects.

[0044] By adopting a configuration in which each of the exposed back surface portion 40 has protrusions 51b, 52b, and recesses 80 are provided corresponding to each of the protrusions 51b, 52b, each of the exposed back surface portion 40 can be pressed by the pressing portion 450, thereby more reliably preventing the resin from seeping to the back surface and causing burrs or the like.

[0045] (modified version) In the above embodiment, a configuration in which three first electronic elements 11 and three second electronic elements 12 are provided is shown, but the embodiment is not limited to this configuration. One first electronic element 11 and two second electronic elements 12 may be provided, or four or more first electronic elements 11 and two second electronic elements 12 may be provided.

[0046] Furthermore, it is not necessary to provide both the first electronic element 11 and the second electronic element 12; only one electronic element 10 may be provided. As an example, as shown in Figure 15, the electronic module may have one electronic element 10, a sealing portion 90 that seals the electronic element 10, a back surface exposed portion 40 on which the electronic element 10 is positioned on the front surface and whose back surface is exposed from the sealing portion 90, and a back surface non-exposed portion 49 integrally provided with the back surface exposed portion 40 via a bent portion 45.

[0047] Note that the reference numerals in Figure 15 have the same meaning as in the embodiment, and the same reference numerals as in the embodiment indicate the same components. In addition, the modified example does not have the protruding and recessed parts that were used in the embodiment.

[0048] The above-described embodiments, modifications, and drawings are merely examples for illustrating the invention described in the claims, and the invention described in the claims is not limited by the above-described embodiments or drawings. Furthermore, the initial claims are merely examples, and the claims may be modified as appropriate based on the description in the specification, drawings, etc. [Explanation of Symbols]

[0049] 10 electron elements 30 Conductor section 40 Exposed area on the back 45. Bending section 49 Non-exposed area on the back 51 First back exposed part 51a First body part 51b First protrusion 52 Second back exposed part 52a Second body part 52b Second protrusion 90 Sealing part 110 Output terminals 120 Power terminal 130 Ground terminal 140 First gate terminal 150 Second gate terminal 300 Heatsink 310 circuit board 320 Conductor layer

Claims

1. A first electronic element, A sealing portion that seals the first electronic element, A conductor portion having a first back surface exposed portion on which the first electronic element is arranged on the front surface and whose back surface is exposed from below the sealing portion, and a back surface non-exposed portion integrally provided with the first back surface exposed portion via a bent portion, Equipped with, The non-exposed portion on the back surface is connected to a second electronic element different from the first electronic element via a connecting member, and is integrated with a terminal portion that protrudes outward from the side surface of the sealing portion. The second electronic element is an electronic module located on the front surface of a second back surface exposed portion, which is different from the first back surface exposed portion and whose back surface is exposed from below the sealing portion.

2. An electronic element, A sealing portion for sealing the aforementioned electronic component, A conductive portion having a back surface exposed portion where the electronic element is arranged on the front surface and the back surface is exposed from the sealing portion, and a back surface non-exposed portion integrally provided with the back surface exposed portion via a bent portion, Equipped with, The non-exposed portion on the back surface is connected to an electronic element different from the electronic element via a connecting member, and is integrated with a terminal portion that protrudes outward from the side surface of the sealing portion. The exposed back portion has a first exposed back portion that is integrated with the non-exposed back portion, and a second exposed back portion that is not integrated with the non-exposed back portion. An electronic module in which only the first back surface exposed portion and the second back surface exposed portion, on which the electronic elements are provided, are exposed from the back surface of the sealing portion.

3. An electronic element and A sealing portion for sealing the aforementioned electronic component, A conductive portion having a back surface exposed portion where the electronic element is arranged on the front surface and the back surface is exposed from the sealing portion, and a back surface non-exposed portion integrally provided with the back surface exposed portion via a bent portion, Equipped with, The non-exposed portion on the back surface is connected to an electronic element different from the electronic element via a connecting member, and is integrated with a terminal portion that protrudes outward from the side surface of the sealing portion. The aforementioned terminal section functions as an output terminal. The power terminal and ground terminal protrude to the outside from one side of the sealing portion. The output terminal, the first gate terminal, and the second gate terminal protrude outward from the other side of the sealing portion. An electronic module in which the output terminal protrudes to the outside from the sealing portion between the first gate terminal and the second gate terminal.

4. The electronic module according to claim 2 or 3, wherein a peripheral region is provided at the periphery of the exposed back surface portion, the back surface of which is covered by the sealing portion.

5. The electronic module according to claim 4, wherein the height positions of the peripheral region and the unexposed back surface portion correspond.

6. The exposed back portion has a first exposed back portion that is integrated with the non-exposed back portion, and a second exposed back portion that is not integrated with the non-exposed back portion. The electronic module according to claim 3, wherein only the first back surface exposed portion and the second back surface exposed portion on which the electronic element is provided are exposed from the back surface of the sealing portion.

7. Two or more electronic elements are provided, The electronic module according to claim 6, wherein each electronic element is arranged on the front side of either the first back surface exposed portion or the second back surface exposed portion.

8. The electronic module according to claim 6, wherein the non-exposed back surface portion is positioned laterally along the short-side direction of the sealing portion of the second exposed back surface portion.

9. The aforementioned terminal section functions as an output terminal. The power terminal and ground terminal protrude to the outside from one side of the sealing portion. The output terminal, the first gate terminal, and the second gate terminal protrude outward from the other side of the sealing portion. The electronic module according to any one of claims 1 to 3, wherein the output terminal protrudes to the outside from the sealing portion between the first gate terminal and the second gate terminal.

10. The electronic module according to claim 2 or 3, A substrate provided on the front surface of the sealing portion, A heat sink provided on the back surface of the exposed back surface portion, Equipped with, The terminal portion is an assembly connected to a conductor layer provided on the substrate.

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