Expansion method and expansion device

Abstract

To suppress contact between chips.SOLUTION: An expansion method includes: a frame fixation step 302 which fixes a frame of a work unit with a frame fixation unit; an expansion step 303 which expands an expanding tape by pressing the expanding tape on the outside of a workpiece from the expanding tape side of the work unit; a holding step 304 which suction-holds the workpiece via the expanding tape by a holding table; a first speed table movement step 305 which lowers the holding table at a first speed so that a holding surface of the holding table gets close to the height position of a top surface of a frame mounting plate of the frame fixation unit; a second speed table movement step 306 which lowers the holding table at a second speed lower than the first speed so that the holding surface and the top surface become flush; and a shrinkage step 307 which heats and shrinks the expanding tape on the outside of the workpiece.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an expansion method and an expansion device.

Background Art

[0002] In a work unit in which a work such as a work piece or a die attach film is attached to a frame via a sheet, an expansion device that divides the work by expanding the sheet is widely used (see, for example, Patent Document 1 and Patent Document 2).

[0003] In the expansion devices shown in Patent Document 1 and Patent Document described above, slack is formed in the sheet by expanding the sheet. However, if the sheet is in a slack state, the chips formed by dividing the work may contact each other and be damaged.

[0004] Therefore, the expansion devices shown in Patent Document 1 and Patent Document described above heat and shrink the slack sheet after sheet expansion. Specifically, with the sheet in an expanded state, the work is sucked and held by a suction table through the sheet. After maintaining the interval between adjacent chips, the work is positioned on the same plane as the frame. When the work is positioned at the same height as the frame, slack is formed in the sheet, and the slack sheet is heated and shrunk.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the expansion devices described in Patent Documents 1 and 2, the sheet may peel off from the holding surface of the table while the workpiece is being positioned flush with the frame, causing negative pressure to leak. When the sheet peels off from the holding surface of the table, the chips may come into contact with each other and be damaged.

[0007] The object of the present invention is to provide an expansion method and an expansion device that can suppress contact between chips. [Means for solving the problem]

[0008] To solve the above-mentioned problems and achieve the objective, the present invention provides an expansion method for expanding a tape of a work unit in which a workpiece is mounted on a frame via a tape, comprising: a frame fixing step of fixing the frame with a frame fixing unit comprising a frame support portion including a frame support surface that supports the frame of the work unit and a frame pressing portion that clamps the frame together with the frame support portion; and an expansion step, after performing the frame fixing step, of pressing the tape on the outside of the workpiece from the tape side of the work unit to expand the tape and position the workpiece away from the frame support surface. The method is characterized by comprising: an expansion step, followed by a holding step of suction-holding the workpiece via the tape on a table having a holding surface for suction-holding the workpiece; a first speed table movement step of moving the table at a first speed so that the holding surface of the table approaches the height position of the frame support surface after the holding step; a second speed table movement step of moving the table at a second speed lower than the first speed so that the holding surface of the table and the frame support surface are on the same plane after the first speed table movement step; and a shrinking step of heating and shrinking the tape on the outside of the workpiece.

[0009] In the expansion method described above, the contraction step may be performed after the second speed table movement step.

[0010] In the expansion method described above, the contraction step may be performed at least simultaneously with the second speed table movement step.

[0011] The present invention relates to an expansion device for expanding a tape of a workpiece unit in which a workpiece is mounted on a frame via a tape, and comprises: a frame fixing unit comprising: a frame support portion including a frame support surface that supports the frame of the workpiece unit; a lifting unit that raises and lowers the frame support portion; and a frame pressing portion that clamps the frame together with the frame support portion raised by the lifting unit; a pressing member that presses the tape on the outside of the workpiece from the tape side of the workpiece of the workpiece unit whose frame is fixed by the frame fixing unit to expand the tape and position the workpiece away from the frame support surface; and a table that, with the tape expanded by the pressing member, holds the workpiece by suction through the tape on a holding surface on which the workpiece is placed; and the pressing member An expansion unit comprising: a pressing member lifting unit that raises and lowers a pressing member and raises the pressing member to expand the tape and position the workpiece away from the frame support surface; a table moving unit that, while the table holds the workpiece by suction via the tape, the lifting unit lowers the frame support portion and the pressing member lifting unit lowers the pressing member, moves the table at a first speed so that the holding surface of the table approaches the height of the frame support surface, and after moving the table at the first speed, moves the table at a second speed lower than the first speed so that the holding surface of the table and the frame support surface are on the same plane; and a heating unit that heats and shrinks the tape on the outside of the workpiece. [Effects of the Invention]

[0012] This invention has the effect of suppressing contact between chips. [Brief explanation of the drawing]

[0013] [Figure 1] Figure 1 is a perspective view showing an example configuration of the expansion device according to Embodiment 1. [Figure 2] Figure 2 is a perspective view showing an example of a workpiece unit to be processed by the expansion device according to Embodiment 1. [Figure 3] Figure 3 is a schematic cross-sectional view showing an example of the configuration of the divided unit of the expansion device shown in Figure 1. [Figure 4] Figure 4 is a schematic cross-sectional view showing an example of the configuration of the heat shrink unit of the expansion device shown in Figure 1. [Figure 5] Figure 5 is a flowchart showing the flow of the extension method according to Embodiment 1. [Figure 6] Figure 6 is a schematic cross-sectional view showing the state in which the frame of the work unit is placed on the upper surface of the frame mounting plate of the frame fixing unit of the divided unit during the division step of the expansion method shown in Figure 5. [Figure 7] Figure 7 is a schematic cross-sectional view showing the state in which the frame fixing unit of the splitting unit fixes the frame of the work unit during the splitting step of the expansion method shown in Figure 5. [Figure 8] Figure 8 is a schematic cross-sectional view showing the state in which the expansion drum of the splitting unit rises and the expanded tape is expanded during the splitting step of the expansion method shown in Figure 5. [Figure 9] Figure 9 is a schematic cross-sectional view showing the state in which the frame of the work unit is placed on the upper surface of the frame mounting plate of the heat shrink frame fixing unit during the frame fixing step of the expansion method shown in Figure 5. [Figure 10] Figure 10 is a schematic cross-sectional view showing the state in which the heat shrink frame fixing unit fixes the frame of the work unit during the frame fixing step of the expansion method shown in Figure 5. [Figure 11] Figure 11 is a schematic cross-sectional view showing the extension steps of the extension method shown in Figure 5. [Figure 12] Figure 12 is a schematic cross-sectional view showing the holding step of the expansion method shown in Figure 5. [Figure 13]FIG. 13 is a cross-sectional view schematically showing the first speed table movement step of the expansion method shown in FIG. 5. [Figure 14] FIG. 14 is a cross-sectional view schematically showing the second speed table movement step of the expansion method shown in FIG. 5. [Figure 15] FIG. 15 is a cross-sectional view schematically showing the contraction step of the expansion method shown in FIG. 5. [Figure 16] FIG. 16 is a flowchart showing the flow of the expansion method according to a modification of Embodiment 1. [Figure 17] FIG. 17 is a perspective view showing a modification of the work unit shown in FIG. 2.

Mode for Carrying Out the Invention

[0014] The mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions or changes in the configuration can be made without departing from the gist of the present invention.

[0015] 〔Embodiment 1〕 The expansion device according to Embodiment 1 of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing a configuration example of the expansion device according to Embodiment 1. FIG. 2 is a perspective view showing an example of a work unit to be processed by the expansion device according to Embodiment 1. FIG. 3 is a cross-sectional view schematically showing a configuration example of the divided unit of the expansion device shown in FIG. 1. FIG. 4 is a cross-sectional view schematically showing a configuration example of the heat shrink unit of the expansion device shown in FIG. 1.

[0016] (Work Unit) The expansion device 1 shown in Figure 1 according to Embodiment 1 is a device for expanding the expandable tape 203 of the work unit 200 shown in Figure 2. As shown in Figure 2, the work unit 200 comprises a workpiece 201, a die attach film (hereinafter referred to as DAF) 202, an expandable tape 203 which is a tape, and a frame 204.

[0017] In Embodiment 1, the workpiece 201 is a disc-shaped semiconductor wafer or optical device wafer, etc., with a substrate made of silicon, sapphire, gallium arsenide, or SiC (silicon carbide). As shown in Figure 2, the workpiece 201 has devices 207 formed in each region partitioned by a plurality of intersecting division lines 206 on its surface 205.

[0018] Device 207 is, for example, an integrated circuit such as an IC (Integrated Circuit) or LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), or various types of memory (semiconductor memory devices).

[0019] Workpiece 201 is subjected to a laser beam with a wavelength that is transparent to the substrate, irradiated from the back surface 208 side of the surface 205 along the planned division line 206, forming a modified layer 209 (shown as a dotted line in Figure 2), which is the starting point for division, inside the substrate along the planned division line 206. Workpiece 201 is divided into individual chips 210 starting from the modified layer 209. Each chip 210 comprises a portion of the substrate divided along the planned division line 206 and a device 207 formed on the surface of the substrate, with a portion of the divided DAF 202 attached to the back surface 208 of the substrate.

[0020] The modified layer 209 refers to a region whose density, refractive index, mechanical strength, and other physical properties are different from those of the surrounding area. Examples include melted regions, cracked regions, dielectric breakdown regions, refractive index change regions, and regions where these regions are mixed.

[0021] DAF202 is an adhesive film for die bonding, used to fix individually divided chips 210 to other chips or substrates. DAF202 is formed in a disc shape with a diameter larger than the diameter of the workpiece 201. DAF202 is attached to the back surface 208 of the workpiece 201.

[0022] The expandable tape 203 is made of a stretchable resin and has heat-shrinkable properties, shrinking when heated. The expandable tape 203 is formed in a disc shape with a diameter larger than the diameters of the workpiece 201 and DAF 202 and comprises a base layer made of a synthetic resin that is stretchable and heat-shrinkable, and an adhesive layer laminated on the base layer and attached to the workpiece 201, and made of a synthetic resin that is stretchable and heat-shrinkable.

[0023] The surface of the adhesive layer is the adherend surface to which DAF202 is attached, and to which the back surface 208 of the workpiece 201 is attached via DAF202. In Embodiment 1, the adhesive layer is made of a synthetic resin that hardens and loses its adhesive strength when irradiated with ultraviolet light.

[0024] In Embodiment 1, the expandable tape 203 has a DAF 202 pre-attached to the surface to be adhered to, and is attached to the back surface 208 of the workpiece 201 via the DAF 202, thus being a so-called 2-in-1 tape.

[0025] Frame 204 is formed in an annular shape with an inner diameter larger than the diameters of workpiece 201 and DAF 202, and the outer circumference of the expandable tape 203 is attached to it.

[0026] The work unit 200 with the configuration described above is constructed such that the back surface 208 of the workpiece 201 is attached to the DAF 202 which is attached to the adhesive surface of the expandable tape 203, and the frame 204 is attached to the outer circumference of the expandable tape 203. In other words, in the work unit 200, the workpiece 201 is mounted to the frame 204 via the expandable tape 203.

[0027] (Expansion device) The expansion device 1 according to Embodiment 1 shown in Figure 1 is a device that expands the expandable tape 203 of the work unit 200 to divide the work 201, on which a modified layer 209 has been formed as a dividing starting point, into individual chips 210 along the dividing line 206, and also divides the DAF 202 for each chip 210. As shown in Figure 1, the expansion device 1 comprises a cassette elevator 3 provided on the device body 2, a dividing unit 10, a heat shrink unit 30, a washing unit 40, an ultraviolet irradiation unit 60, a transport unit 50, and a control unit 100 which is a control means.

[0028] The cassette elevator 3 is positioned at one end of the device body 2 in the Y-axis direction parallel to the horizontal direction, and a cassette 4 that houses multiple work units 200 is detachably mounted on it. The cassette 4 houses multiple work units 200 at intervals in the Z-axis direction parallel to the vertical direction. The cassette 4 is mounted on the cassette elevator 3 with an opening 5 that allows the work units 200 to be easily inserted and removed, facing the center of the device body 2 in the Y-axis direction. The cassette elevator 3 raises and lowers the cassette 4 in the Z-axis direction.

[0029] The expansion device 1 also includes a pair of first guide rails 6 and a pair of second guide rails 7 on which work units 200 to be inserted into and removed from the cassette 4 are temporarily placed. The pair of first guide rails 6 are parallel to the Y-axis direction and are spaced apart from each other in the X-axis direction, which is parallel to the horizontal direction and perpendicular to the Y-axis direction. The pair of first guide rails 6 are positioned in the center of the device body 2 in the Y-axis direction so as to be aligned with both ends in the X-axis direction of the opening 5 of the cassette 4 placed on the cassette elevator 3 in the Y-axis direction. The pair of first guide rails 6 are provided to be movable in the X-axis direction by a drive mechanism (not shown), and move closer to and away from each other by the drive mechanism. When the work units 200 to be inserted into and removed from the cassette 4 are placed on the pair of first guide rails 6 and move closer to each other by the drive mechanism, the work units 200 are positioned in the X-axis direction.

[0030] The pair of second guide rails 7 are used to temporarily place work units 200 and the like that have been transported from the first guide rail 6 by the transport unit 50. The pair of second guide rails 7 are parallel to the Y-axis direction, parallel to the horizontal direction, and spaced apart from each other in the X-axis direction. The pair of second guide rails 7 are located in the center of the device body 2 in the Y-axis direction and next to the first guide rail 6 in the X-axis direction. The pair of second guide rails 7 are provided to be movable in the X-axis direction by a drive mechanism (not shown), and the drive mechanism moves them closer to and further apart from each other. The pair of second guide rails 7 are used to place work units 200 and the like that that have been transported from the first guide rail 6, and when they move closer to each other by the drive mechanism, they position the work units 200 in the X-axis direction.

[0031] The transport unit 50 includes a first transport unit 51 that transports the work unit 200 between the cassette 4 and the first guide rail 6, and between the first guide rail 6 and the ultraviolet irradiation unit 60; a second transport unit 52 that transports the work unit 200 between the first guide rail 6 and the second guide rail 7, between the second guide rail 7 and the heat shrink unit 30, between the heat shrink unit 30 and the washing unit 40, and between the washing unit 40 and the first guide rail 6; and a third transport unit 53 that transports the work unit 200 between the second guide rail 7 and the splitting unit 10.

[0032] The split unit 10 is positioned next to one side of the pair of second guide rails 7 in the Y-axis direction. As shown in Figure 3, the split unit 10 comprises a frame fixing unit 11, a pressing unit 12, and a holding table 13. The frame fixing unit 11 and the pressing unit 12 are housed in a cooling chamber 19 (shown in Figure 1) whose interior is cooled, which is positioned next to one side of the pair of second guide rails 7 of the device body 2 in the Y-axis direction.

[0033] The frame fixing unit 11 fixes the frame 204 of the work unit 200 and comprises a frame mounting plate 15 and a frame retaining plate 16. The frame mounting plate 15 has a circular opening 151 in its planar shape, and its upper surface 152 is formed as a flat plate parallel to the horizontal direction. The inner diameter of the opening 151 of the frame mounting plate 15 is the same as the inner diameter of the frame 204 and is larger than the diameter of the DAF 202. The frame mounting plate 15 is used when the frame 204 of the work unit 200 is positioned on the opening 151 and the frame 201 of the work unit 200 is placed on the upper surface 152.

[0034] In Embodiment 1, the frame mounting plate 15 is raised in the Z-axis direction by the cylinder 17 from a position where its upper surface 152 is on the same plane as the lower surface of the frame 204 of the work unit 200, which is positioned in the X-axis direction by the second guide rail 7. That is, the frame mounting plate 15 is attached to the tip of the extendable rod 171 of the cylinder 17, and is provided to be able to move up and down in the Z-axis direction by extending and retracting the rod 171 of the cylinder 17.

[0035] The frame retaining plate 16 is fixed above the frame mounting plate 15. The frame retaining plate 16 is formed in a plate shape with approximately the same dimensions as the frame mounting plate 15, and has a circular opening 161 in the center that is the same dimensions as the opening 151. The opening 161 of the frame retaining plate 16 is positioned coaxially with the opening 151 of the frame mounting plate 15.

[0036] The frame fixing unit 11 receives the work unit 200 via the third transport unit 53 as the rod 171 retracts and the work unit 200 is placed on the upper surface 152 of the frame mounting plate 15 located below it. After the frame 204 of the work unit 200 is placed on the upper surface 152 of the frame mounting plate 15, the rod 171 of the cylinder 17 extends and the frame mounting plate 15 rises. The frame fixing unit 11 then clamps and fixes the frame 204 of the work unit 200 between the frame retaining plate 16 and the raised frame mounting plate 15.

[0037] The pressing unit 12 presses the region 212 (shown in Figure 2) between the inner circumference of the frame 204 and the outer circumference of the workpiece 201 of the workpiece unit 200, which includes the frame 204 fixed by the frame fixing unit 11, from the base material layer side, which is the back side of the surface to be adhered. The pressing unit 12 comprises an expansion drum 121 and a plurality of pressing rollers 122.

[0038] In Embodiment 1, the expansion drum 121 is formed in a cylindrical shape, with an outer diameter smaller than the inner diameter of the frame 204 which is placed on the upper surface 152 of the frame mounting plate 15, and an inner diameter larger than the diameter of the workpiece 201 which is attached to the expandable tape 203. The expansion drum 121 is arranged coaxially with the openings 151 and 161 of the frame fixing unit 11.

[0039] The pressing roller 122 is cylindrical in shape and is supported at the upper end of the expansion drum 121 so as to be rotatable around its axis (hereinafter referred to as the rotation axis). The pressing rollers 122 are arranged at equal intervals in the circumferential direction. The rotation axis of the pressing roller 122 is arranged parallel to the tangent to the expansion drum 121 in a plan view.

[0040] The expansion drum 121 is attached to the cylinder 18 and moves up and down in the Z-axis direction by the cylinder 18. That is, the expansion drum 121 is attached to the end of the extendable rod of the cylinder 18 and is provided to move up and down in the Z-axis direction as the rod of the cylinder 18 extends and retracts.

[0041] In Embodiment 1, the expansion drum 121 moves up and down in the Z-axis direction between a position where the upper end of the pressing roller 122 is lowered by the cylinder 18 and is located below the upper surface 152 of the frame mounting plate 15 of the frame fixing unit 11, and a position where the upper end of the pressing roller 122 is raised and is located above the upper surface 152 of the frame mounting plate 15 of the frame fixing unit 11 that fixes the frame 204.

[0042] As the cylinder 18 rises, the upper end of the pressing roller 122 is positioned above the upper surface 152 of the frame mounting plate 15 of the frame fixing unit 11 that secures the frame 204. Therefore, the pressing roller 122 presses against the area 212 between the inner circumference of the frame 204 and the outer circumference of the workpiece 201 of the expandable tape 203 of the workpiece unit 200, which is secured by the frame fixing unit 11.

[0043] The holding table 13 is formed in a disc shape with an outer diameter smaller than the inner diameter of the expansion drum 121, and is positioned inside the expansion drum 121 and coaxially with the expansion drum 121. The holding table 13 has a holding surface 131 that sucks and holds the workpiece 201 of the work unit 200 via the expand tape 203. The holding table 13 is disc-shaped with a diameter smaller than the inner diameter of the frame 204 and the expansion drum 121, and comprises a disc-shaped frame 132 made of a metal such as stainless steel, and a disc-shaped suction part 133 made of a porous material such as porous ceramic and surrounded by the frame 132.

[0044] The upper surfaces of the frame 132 and the suction part 133 are arranged on the same plane, forming a holding surface 131 that sucks and holds the workpiece 201. The outer diameter of the suction part 133 is slightly larger than the outer diameter of the workpiece 201. The suction part 133 is connected to a suction source 135 such as an ejector via a suction passage 134 formed in the frame 132, etc.

[0045] The holding table 13 has the back surface 208 side of the workpiece 201 placed on its holding surface 131 via the expanded tape 203 of the workpiece unit 200 that has been transported by the third transport unit 53. The holding table 13 can hold the back surface 208 side of the workpiece 201 by suction, as the suction portion 133 of the holding surface 131 is sucked by the suction source 135.

[0046] The holding table 13 is attached to the cylinder 14 and moves up and down in the Z-axis direction by the cylinder 14. That is, the holding table 13 is attached to the end of the extendable rod 141 of the cylinder 14 and is provided to move up and down in the Z-axis direction as the rod 141 of the cylinder 14 extends and retracts.

[0047] In Embodiment 1, the holding table 13 moves up and down in the Z-axis direction between a position where the holding surface 131 is on the same plane as the upper end of the pressing roller 122, which has been lowered by the cylinder 14, and a position where the holding surface 131 is slightly lower than the upper end of the pressing roller 122, which has been raised, and above the upper surface 152 of the frame mounting plate 15, which has been raised.

[0048] The splitting unit 10 fixes the frame 204 of the work unit 200 with the frame fixing unit 11, and raises the expansion drum 121 and holding table 13 from a position where the upper end of the pressing roller 122 and the holding surface 131 are below the upper surface 152 of the frame mounting plate 15 of the frame fixing unit 11 that fixes the frame 204. The pressing roller 122 presses the region 212 between the inner circumference of the frame 204 and the outer circumference of the workpiece 201 of the work unit 200's expandable tape 203, thereby expanding the expandable tape 203 in the planar direction. After expanding the expandable tape 203, the splitting unit 10 lowers the expansion drum 121 and holding table 13, creating slack in the region 212 between the inner circumference of the frame 204 and the outer circumference of the workpiece 201 of the work unit 200's expandable tape 203.

[0049] The heat shrink unit 30 is positioned next to the other side of the pair of second guide rails 7 in the Y-axis direction. As shown in Figure 4, the heat shrink unit 30 comprises a frame fixing unit 31, an extension unit 36, and a heating unit 37.

[0050] The frame fixing unit 31 fixes the frame 204 of the work unit 200. The frame fixing unit 31 comprises a frame mounting plate 33 which is a frame support part, a cylinder 35 which is a lifting unit, a frame holding plate 34 which is a frame holding part, and a cylinder 343 which is a moving unit. The frame mounting plate 33 has a circular opening 331 in its planar shape, and its upper surface 332 which is a frame support surface is formed as a flat plate parallel to the horizontal direction. The frame 204 of the work unit 200 is placed on the upper surface 332 of the frame mounting plate 33, and the upper surface 332 supports the frame 204 of the work unit 200. Thus, the frame mounting plate 33 includes an upper surface 332 that supports the frame 204 of the work unit 200.

[0051] The inner diameter of the opening 331 of the frame mounting plate 33 is the same as the inner diameter of the frame 204 and is larger than the diameter of the DAF 202. As shown in Figure 1, the frame mounting plate 33 is provided with centering guides 333 (shown in Figure 1) that are horizontally movable at the four corners of the upper surface 332 and adjust the position of the frame 204 by moving horizontally, thereby positioning the workpiece 201 in a position coaxial with the opening 311.

[0052] Furthermore, the frame mounting plate 33 is provided to be able to move up and down in the Z-axis direction by a cylinder 35, which is a lifting unit. Specifically, the frame mounting plate 33 is attached to the end of a retractable rod 351 of the cylinder 35, and the rod 351 of the cylinder 35 extends and retracts, allowing the frame mounting plate 33 to move up and down in the Z-axis direction. In this way, the cylinder 35 raises and lowers the frame mounting plate 33.

[0053] The frame retaining plate 34 is formed in a plate shape with approximately the same dimensions as the frame mounting plate 33, and has a circular opening 341 in the center with the same dimensions as the opening 331. The frame retaining plate 34 clamps the frame 204 of the work unit 200 together with the frame mounting plate 33, which is raised by the cylinder 35, which is a lifting unit. The frame retaining plate 34 is attached to the tip of the piston rod of the cylinder 343, which is a moving unit, and is movable between a position above the frame mounting plate 33 and a position retracted from above the frame mounting plate 33 by the extension and retraction of the piston rod along the Y-axis. As shown in Figure 1, the frame retaining plate 34 has elongated holes 342 at its four corners into which the centering guides 333 can enter. The position above the frame mounting plate 33 is the position in which the frame retaining plate 34 clamps the frame 204 of the work unit 200 between itself and the frame mounting plate 33.

[0054] The frame fixing unit 31 is positioned with the frame retaining plate 34 retracted from above the frame mounting plate 33, and with the centering guides 333 separated from each other, the frame 204 of the work unit 200, which has been transported by the second transport unit 52, is placed on the upper surface 332 of the frame mounting plate 33, which has been lowered by the cylinder 35. The frame fixing unit 31 brings the centering guides 333 closer together to position the frame 204 of the work unit 200. The frame fixing unit 31 positions the frame retaining plate 34 above the frame mounting plate 33, and the frame mounting plate 33 is raised by the cylinder 35, clamping and fixing the frame 204 of the work unit 200 between the frame mounting plate 33 and the frame retaining plate 34.

[0055] The expansion unit 36 ​​extends the expandable tape 203 of the work unit 200, whose frame 204 is fixed by the frame fixing unit 31. As shown in Figure 4, the expansion unit 36 ​​comprises a pressing member 361, a holding table 32 which is a table, a cylinder 362 which is a pressing member lifting unit for raising and lowering the pressing member 361, and a holding table lifting unit 363 which is a table moving unit.

[0056] The pressing member 361 is formed in a cylindrical shape, with an outer diameter smaller than the inner diameter of the frame 204 which is placed on the upper surface 332 of the frame mounting plate 33, and an inner diameter larger than the diameter of the workpiece 201 which is attached to the expandable tape 203. The pressing member 361 is positioned within the opening 331 of the frame mounting plate 33 and is positioned coaxially with the frame mounting plate 33. A pressing roller 364 is rotatably attached to the upper end of the pressing member 361. The pressing roller 364 is formed in a cylindrical shape and is supported at the upper end of the pressing member 361 so as to be rotatable around its axis (hereinafter referred to as the rotation axis). The pressing rollers 364 are arranged at equal intervals in the circumferential direction. The rotation axis of the pressing roller 364 is positioned parallel to the tangent to the pressing member 361 in a plan view.

[0057] In Embodiment 1, the pressing member 361 moves up and down in the Z-axis direction between a position where the upper end of the pressing roller 364 is located below the upper surface 332 of the frame mounting plate 33, which has been lowered by the cylinder 35 by the cylinder 362, and a position where the upper end of the pressing roller 364 is located above the upper surface 332 of the frame mounting plate 33 of the frame fixing unit 31 that secures the frame 204. As the pressing member 361 is raised by the cylinder 362, the pressing roller 364 presses the area 212 of the expanded tape 203 outside the workpiece 201 from the side of the expanded tape 203 of the workpiece unit 200 to which the frame 204 is secured by the frame fixing unit 31, thereby expanding the expanded tape 203 and positioning the workpiece 201 away from the upper surface 332 of the frame mounting plate 33 along its vertical axis. In this manner, the cylinder 362, which is a pressing member lifting unit, expands the expandable tape 203 when the pressing member 361 is raised, positioning the workpiece 201 at a location away from the upper surface 332 of the frame mounting plate 33 along the axis.

[0058] The holding table 32 is formed in a disc shape with an outer diameter smaller than the inner diameter of the pressing member 361, and is positioned inside the pressing member 361 and coaxial with the pressing member 361. The holding table 32 has a holding surface 321 that sucks and holds the workpiece 201 of the work unit 200 via the expanded tape 203. The holding table 32 is disc-shaped with a diameter smaller than the inner diameter of the frame 204 and the pressing member 361, and comprises a disc-shaped frame 322 made of a metal such as stainless steel, and a disc-shaped suction part 323 made of a porous material such as porous ceramic and surrounded by the frame 322.

[0059] The upper surfaces of the frame 322 and the suction part 323 are arranged on the same plane, forming a holding surface 321 that sucks and holds the workpiece 201. The outer diameter of the suction part 323 is slightly larger than the outer diameter of the workpiece 201. The suction part 323 is connected to a suction source 325, such as an ejector, via a suction passage 324 formed in the frame 322, etc.

[0060] The back surface 208 of the workpiece 201 is placed on the holding surface 321 of the holding table 32 via the expanded tape 203 of the workpiece unit 200 that has been transported by the second transport unit 52. The holding table 32 can hold the back surface 208 of the workpiece 201 by suction, as the suction portion 323 of the holding surface 321 is sucked by the suction source 325.

[0061] The holding table 32 is attached to the holding table lifting unit 363 and moves up and down in the Z-axis direction by the holding table lifting unit 363. In other words, the holding table 32 is attached to the end of the extendable rod 365 of the holding table lifting unit 363 and is provided to move up and down in the Z-axis direction as the rod 365 of the holding table lifting unit 363 extends and retracts.

[0062] In Embodiment 1, the holding table 32 moves up and down in the Z-axis direction between a position where the holding surface 321 is lowered by the holding table lifting unit 363 and is on the same plane as the upper surface 332 of the frame mounting plate 33, and a position where the holding surface 321 is raised and is located above the upper surface 332 of the frame mounting plate 33 and on the same plane as the upper end of the raised pressing roller 364. The holding table 32 holds the workpiece 201 by suction to the holding surface 321 on which the workpiece 201 is placed, via the expanded tape 203, with the pressing member 361 raised by the cylinder 362 expanding the expanded tape 203.

[0063] The cylinder 362 moves the pressing member 361 up and down in the Z-axis direction, between a position where the upper end of the pressing roller 364 is located below the upper surface 332 of the lowered frame mounting plate 33 and the holding surface 321 of the holding table 32, and a position where it is located above the upper surface 332 of the raised frame mounting plate 33.

[0064] The holding table lifting unit 363 raises and lowers the holding table 32 in the Z-axis direction between a position where the holding surface 321 is located below the upper surface 332 of the lowered frame mounting plate 33 and a position where it is located above the upper surface 332 of the raised frame mounting plate 33 and on the same plane as the upper end of the raised pressing roller 364. In Embodiment 1, the holding table lifting unit 363 is configured to include a well-known ball screw that extends along the Z-axis direction and is rotatable about its axis, a well-known motor that rotates the ball screw about its axis, and a well-known guide rail that supports the holding table 32 so that it can move in the Z-axis direction.

[0065] The heating unit 37 heats and shrinks the slack in the region 212 between the frame 204 of the expanded tape 203, which is formed when the expanded tape 203 is expanded by the dividing unit 10, and the workpiece 201. The heating unit 37 comprises a plurality of heating parts 371 that are movable in the Z-axis direction and rotate around an axis parallel to the Z-axis direction.

[0066] The heating units 371 are arranged at equal intervals in the circumferential direction above the region 212 of the expanded tape 203 of the work unit 200, which includes the frame 204 fixed by the frame fixing unit 31, and are positioned on a circle corresponding to the region 212 of the expanded tape 203. The heating units 371 are positioned facing the region 212 of the expanded tape 203 of the work unit 200 held by the holding table 32 and the frame fixing unit 31 in the Z-axis direction. In Embodiment 1, four heating units 371 are provided at equal intervals in the circumferential direction, but the present invention is not limited to four.

[0067] The heating unit 371 is of a type that heats the region 212 of the expanded tape 203 by irradiating infrared rays downward, for example, an infrared ceramic heater that heats up and emits infrared rays when a voltage is applied. The heating unit 371 rotates around an axis coaxial with the axis of the holding table 32 and revolves over the aforementioned region 212 of the expanded tape 203.

[0068] The heating unit 37 has a heating section 371 that descends to face vertically the region 212 of the expanded tape 203 of the workpiece unit 200 held by the holding table 32 and the frame fixing unit 31. By rotating around its axis and swirling over the aforementioned region 212 of the expanded tape 203, the heating unit 37 heats and contracts the slack in the region 212 of the expanded tape 203 outside the workpiece 201.

[0069] The cleaning unit 40 primarily cleans the workpiece 201 of the work unit 200, which has been expanded by the splitting unit 10 and whose slack has been heated and shrunk by the heat shrinking unit 30. The cleaning unit 40 includes a spinner table 41 positioned below a pair of first guide rails 6 and which holds the workpiece 201 by suction via the expanded tape 203 of the work unit 200, and a cleaning water supply nozzle (not shown) that supplies cleaning water to the surface 205 of the workpiece 201 held by the spinner table 41 by suction.

[0070] When the pair of first guide rails 6 separate, the second transport unit 52 heats the slack in the heat shrink unit 30, and the shrunk workpiece unit 200 is placed on the spinner table 41. The cleaning unit 40 rotates the spinner table 41 around an axis parallel to the Z-axis direction and supplies cleaning water from the cleaning water supply nozzle to the surface 205 of the workpiece 201 to clean the workpiece 201.

[0071] The ultraviolet irradiation unit 60 irradiates the expanded tape 203 of the work unit 200, which has been cleaned by the cleaning unit 40, with ultraviolet light to harden the adhesive layer and reduce the adhesive strength of the adhesive layer. The ultraviolet irradiation unit 60 is located at the other end of the main body of the apparatus 2 in the Y-axis direction and is positioned next to one side of the first guide rail 6 in the Y-axis direction.

[0072] The UV irradiation unit 60 receives the cleaned work unit 200 on the first guide rail 6 via the first transport unit 51, and irradiates the expanded tape 203 of the transported work unit 200 with ultraviolet light for a predetermined time. The UV irradiation unit 60 then receives the work unit 200 that has been irradiated with ultraviolet light via the first transport unit 51 and returns it to the first guide rail 6.

[0073] The control unit 100 controls each of the above-mentioned components of the expansion device 1 to cause the expansion device 1 to perform machining operations on the workpiece 201. The control unit 100 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device with memory such as ROM (read-only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to the computer program stored in the storage device and outputs control signals for controlling the expansion device 1 to the above-mentioned components of the expansion device 1 via the input / output interface device.

[0074] The control unit 100 is connected to a display unit (not shown) which consists of a liquid crystal display device that displays the status of machining operations and images, and an input unit (not shown) which is used by the operator to register machining conditions, etc. The input unit consists of at least one of the following: a touch panel provided on the display unit and an external input device such as a keyboard.

[0075] Next, the expansion method according to Embodiment 1 will be described. Figure 5 is a flowchart showing the flow of the expansion method according to Embodiment 1. The expansion method according to Embodiment 1 is a method in which the expansion device 1 expands the expand tape 203 of the work unit 200, breaks the work 201 starting from the modified layer 209, divides the work 201 into individual chips 210, and also divides the DAF 202 along the planned division line 206 for each individual chip 210. In other words, the expansion method according to Embodiment 1 is also a processing operation of the expansion device 1.

[0076] The expansion method according to Embodiment 1 involves an operator or the like placing a work unit 200 into a cassette 4, and the expansion device 1 places the cassette 4 containing multiple work units 200 on a cassette elevator 3. Furthermore, the expansion method according to Embodiment 1 is implemented when the control unit 100 receives processing conditions via an input unit and stores them in a storage device, and the control unit 100 receives a processing start instruction from the operator. As shown in Figure 5, the expansion method according to Embodiment 1 comprises a splitting step, a frame fixing step 302, an expansion step 303, a holding step 304, a first speed table moving step 305, a second speed table moving step 306, a shrinking step 307, a cleaning step 308, and an ultraviolet irradiation step 309.

[0077] (Division step) Figure 6 is a schematic cross-sectional view showing the state in which the frame of the work unit is placed on the upper surface of the frame mounting plate of the frame fixing unit of the splitting unit during the splitting step of the expansion method shown in Figure 5. Figure 7 is a schematic cross-sectional view showing the state in which the frame fixing unit of the splitting unit has fixed the frame of the work unit during the splitting step of the expansion method shown in Figure 5. Figure 8 is a schematic cross-sectional view showing the state in which the expansion drum of the splitting unit has risen and the expandable tape has been expanded during the splitting step of the expansion method shown in Figure 5. Note that Figures 6, 7 and 8 omit the DAF202.

[0078] The splitting step 301 is a step in which the expandable tape 203 of the work unit 200 is expanded to break the work unit 201 starting from the modified layer 209, thereby dividing the work unit 201 into individual chips 210, and also dividing the DAF 202 along the planned splitting line 206 for each individual chip 210. In Embodiment 1, in the splitting step 301, the expansion device 1 lowers the expansion drum 121, holding table 13, and frame mounting plate 15 of the splitting unit 10, takes out one work unit 200 from the cassette 4 with the first transport unit 51, temporarily places the work unit 200 on a pair of first guide rails 6, and then brings the pair of first guide rails 6 closer together to position the work unit 200 in the X-axis direction.

[0079] In the splitting step 301, the expansion device 1 uses the second transport unit 52 to transport the work unit 200 on the first guide rail 6 onto the second guide rail 7, bringing the pair of second guide rails 7 closer together to position the work unit 200 in the X-axis direction. In the splitting step 301, as shown in Figure 6, the expansion device 1 uses the third transport unit 53 to transport the work unit 200 on the pair of second guide rails 7 onto the upper surface 152 of the lowered frame mounting plate 15 of the splitting unit 10, and places the frame 204 of the work unit 200 on the upper surface 152 of the frame mounting plate 15.

[0080] In the splitting step 301, as shown in Figure 7, the expansion device 1 raises the frame mounting plate 15 of the splitting unit 10, and fixes the work unit 200 by sandwiching the frame 204 between the frame retaining plate 16 and the frame mounting plate 15. In the splitting step 301, as shown in Figure 8, the expansion device 1 raises the expansion drum 121 and the holding table 13. Then, the pressure roller 122 provided at the upper end of the expansion drum 121 comes into contact with the region 212 of the expanded tape 203, and the pressure roller 122 presses the region 212 from below upward, and the expanded tape 203 expands in the planar direction. In the splitting step 301, as a result of the expansion of the expanded tape 203, tensile forces act radially on the expanded tape 203.

[0081] When a tensile force is applied radially to the expandable tape 203 attached to the back surface 208 of the workpiece 201, the workpiece 201 is divided into individual chips 210 along the planned division line 206, with the modified layer 209 forming along the planned division line 206 as the starting point. In addition, the space between the chips 210 of the workpiece 201 widens, creating gaps between the chips 210. Furthermore, when a tensile force is applied radially to the expandable tape 203, the DAF 202 breaks along the modified layer 209, i.e., the planned division line 206, for each individual chip 210.

[0082] In the splitting step 301, the expansion device 1 lowers the expansion drum 121 and holding table 13 of the splitting unit 10 after the expansion tape 203 has been expanded. As a result, the work unit 200 has slack formed in the region 212 of the expansion tape 203 because the expansion tape 203 has been expanded. In Embodiment 1, the splitting step 301 is performed while cooling the workpiece 201 in the cooling chamber 19.

[0083] (Frame fixing step) Figure 9 is a schematic cross-sectional view showing the state in which the work unit frame is placed on the upper surface of the frame mounting plate of the heat shrink frame fixing unit during the frame fixing step of the expansion method shown in Figure 5. Figure 10 is a schematic cross-sectional view showing the state in which the heat shrink frame fixing unit has fixed the work unit frame during the frame fixing step of the expansion method shown in Figure 5. Note that DAF202 is omitted in Figures 9 and 10.

[0084] The frame fixing step 302 is the step of fixing the frame 204 of the work unit 200 with a frame fixing unit 31 which includes a frame mounting plate 33 including an upper surface 332 that supports the frame 204 of the work unit 200 and a frame retaining plate 34 that clamps the frame 204 together with the frame mounting plate 33. In Embodiment 1, in the frame fixing step 302, the expansion device 1 lowers the frame mounting plate 15 of the frame fixing unit 11 of the division unit 10 and the third transport unit 53 transports the work unit 200 on the frame mounting plate 15 onto a pair of second guide rails 7.

[0085] In the frame fixing step 302, the expansion device 1 lowers the pressing member 361, holding table 32, and frame mounting plate 33 of the heat shrink unit 30, and positions the frame retaining plate 34 of the frame fixing unit 31 in a position retracted from above the frame mounting plate 33. Then, as shown in Figure 9, the second transport unit 52 transports the frame 204 of the work unit 200 on the second guide rail 7 onto the upper surface 332 of the frame mounting plate 33, thereby placing the frame 204 of the work unit 200 on the upper surface 332 of the frame mounting plate 33.

[0086] In frame fixing step 302, the expansion device 1 brings the centering guides 333 of the frame fixing unit 31 closer together to position the frame 204 of the work unit 200. In frame fixing step 302, the expansion device 1 positions the frame retaining plate 34 above the frame mounting plate 33, raises the frame mounting plate 33, and fixes the work unit 200 by sandwiching the frame 204 between the frame mounting plate 33 and the frame retaining plate 34, as shown in Figure 10.

[0087] (Extension step) Figure 11 is a schematic cross-sectional view showing the expansion step of the expansion method shown in Figure 5. Note that the DAF 202 is omitted in Figure 11. The expansion step 303 is a step in which, after performing the frame fixing step 302, the tape is expanded by pressing the area 212 of the expand tape 203 outside the workpiece 201 from the expand tape 203 side of the work unit 200, thereby positioning the workpiece 201 away from the upper surface 332 along its axis.

[0088] In Embodiment 1, in expansion step 303, the expansion device 1 raises the pressing member 361 and the holding table 32 of the heat shrink unit 30. Then, as shown in Figure 11, the expansion device 1 expands the expand tape 203 by pressing the area 212 of the expand tape 203 upward from the expand tape 203 side of the work unit 200 with the pressing roller 364. The expansion device 1 presses the area 212 of the expand tape 203 upward with the pressing roller 364 to stretch the expanded area 212 of the expand tape 203, positioning the workpiece 201 along its axis away from the upper surface 332 and creating a gap between the chips 210.

[0089] (Holding step) Figure 12 is a schematic cross-sectional view showing the holding step of the expansion method shown in Figure 5. Note that the DAF 202 is omitted in Figure 12. The holding step 304 is a step in which, after performing the expansion step 303, the workpiece 201 is held by suction using the expandable tape 203 with a holding table 32 having a holding surface 321 for suction holding the workpiece 201.

[0090] In Embodiment 1, during the holding step 304, the expansion device 1 uses the suction source 325 to draw in the suction part 323 and holds the back surface 208 of the workpiece 201 to the holding surface 321 of the holding table 32 via the expand tape 203, thereby maintaining the spacing between the tips 210. Also during the holding step 304, as shown in Figure 12, the expansion device 1 lowers the pressing member 361 and the frame mounting plate 33, and retracts the frame retaining plate 34 from above the frame mounting plate 33.

[0091] (First velocity table movement step) Figure 13 is a schematic cross-sectional view showing the first speed table movement step of the extension method shown in Figure 5. Note that the DAF202 is omitted in Figure 13. The first speed table movement step 305 is a step in which, after performing the holding step 304, the holding table 32 is moved at a first speed so that the holding surface 321 of the holding table 32 approaches the height position of the upper surface 332 of the frame mounting plate 33.

[0092] In Embodiment 1, during the first speed table movement step 305, the expansion device 1 lowers the holding table 32 at a first speed (for example, 5 mm / sec) while maintaining a state in which the back surface 208 of the workpiece 201 is suction-held to the holding surface 321 via the expandable tape 203, as shown in Figure 13. As a result, the frame 204 of the workpiece unit 200 comes into contact with the upper surface 332 of the frame mounting plate 33. In Embodiment 1, the first speed table movement step 305 is performed until the holding surface 321 of the holding table 32 is positioned at a predetermined height above the upper surface 332 of the frame mounting plate 33. The predetermined height is, for example, 0.5 mm or more and 1.0 mm or less.

[0093] (Second speed table movement step) Figure 14 is a schematic cross-sectional view showing the second speed table movement step of the extension method shown in Figure 5. Note that the DAF202 is omitted in Figure 14. The second speed table movement step 306 is a step in which, after performing the first speed table movement step 305, the holding table 32 is moved at a second speed lower than the first speed so that the holding surface 321 of the holding table 32 and the upper surface 332 of the frame mounting plate 33 are on the same plane.

[0094] In Embodiment 1, during the second speed table movement step 306, the expansion device 1 lowers the holding table 32 at a second speed (for example, a speed of 0.1 mm / sec or more and 0.5 mm / sec or less) while maintaining the state in which the back surface 208 of the workpiece 201 is held by suction on the holding surface 321 via the expand tape 203. In Embodiment 1, during the second speed table movement step 306, as shown in Figure 14, the expansion device 1 stops lowering the holding table 32 when the holding surface 321 and the upper surface 332 of the frame mounting plate 33 are on the same plane. As a result, the back surface 208 of the workpiece 201 is held by suction via the expand tape 203, and the distance between the tips 210 is maintained at the distance after the expansion step 303, causing slack in the area 212 of the expand tape 203.

[0095] Thus, across the first speed table movement step 305 and the second speed table movement step 306, the holding table lifting unit 363, with the holding table 32 suction-holding the workpiece 201 via the expandable tape 203 in the holding step 304, the cylinder 35 lowering the frame mounting plate 33, the cylinder 362 lowering the pressing member 361, and the cylinder 343 positioning the frame retaining plate 34 retracted from above the frame mounting plate 33, lowers the holding table 32 at a first speed so that the holding surface 321 of the holding table 32 approaches the height of the upper surface 332 of the frame mounting plate 33, and after lowering the holding table 32 at the first speed, lowers the holding table 32 at a second speed, which is slower than the first speed, so that the holding surface 321 of the holding table 32 and the upper surface 332 of the frame mounting plate 33 are on the same plane.

[0096] (Contraction step) Figure 15 is a schematic cross-sectional view showing the shrinkage step of the expansion method shown in Figure 5. Note that the DAF 202 is omitted in Figure 15. The shrinkage step 307 is a step in which the region 212 of the expanded tape 203 outside the workpiece 201 is heated and shrunk.

[0097] In Embodiment 1, during the shrinking step 307, the expansion device 1 lowers the heating unit 37 of the heat shrink unit 30, so that the heating section 371 faces the region 212 of the expandable tape 203, as shown in Figure 15. In Embodiment 1, during the shrinking step 307, the expansion device 1 drives all the heating sections 371 of the heating unit 37 of the heat shrink unit 30, causing the heating sections 371 to rotate a predetermined number of times above the region 212 while emitting infrared rays from all of them. In this way, during the shrinking step 307, the expansion device 1 heats and shrinks the slack in the region 212 around its entire circumference. Thus, in the expansion method according to Embodiment 1, the shrinking step 307 is performed after the second speed table movement step 306.

[0098] (Washing step) The cleaning step 308 is the step of cleaning the workpiece 201 in the cleaning unit 40 after performing the shrinking step 307. In the cleaning step 308, the expansion device 1 stops the rotation and heating of the heating section 371 of the heating unit 37 of the heat shrink unit 30, raises the heating unit 37, and stops the suction holding of the holding table 32, etc. In the cleaning step 308, the expansion device 1 transports the workpiece unit 200 to the cleaning unit 40 using the second transport unit 52. In the cleaning step 308, the expansion device 1 cleans the workpiece unit 200 in the cleaning unit 40.

[0099] (UV irradiation step) The ultraviolet irradiation step 309 is a step in which ultraviolet light is irradiated onto the expanded tape 203 of the work unit 200 after cleaning. In the ultraviolet irradiation step, the expansion device 1 transports the work unit 200 from the cleaning unit 40 to the ultraviolet irradiation unit 60 using the second transport unit 52 and the first transport unit 51.

[0100] In the ultraviolet irradiation step 309, the expansion device 1 irradiates the work unit 200 with ultraviolet light for a predetermined time using the ultraviolet irradiation unit 60, and then houses it in the cassette 4 using the first transport unit 51. The expansion device 1 sequentially expands the expandable tape 203 of the work unit 200 in the cassette 4 to divide the work 201 into individual chips 210. Once the expandable tape 203 of all the work unit 200 in the cassette 4 has been expanded and the work 201 has been divided into individual chips 210, the processing operation is completed.

[0101] As described above, in the expansion method and expansion device 1 according to Embodiment 1, after the expansion step 303 and the holding step 304, the holding table 32 is lowered at a first speed in the first speed table movement step 305, and then the holding table 32 is lowered at a second speed that is slower than the first speed to position the holding surface 321 of the holding table 32 and the upper surface 332 of the frame mounting plate 33 at the same height. In this way, in the expansion method and expansion device 1 according to Embodiment 1, the holding table 32 is lowered at a second speed that is slower than the first speed just before the holding surface 321 of the holding table 32 and the upper surface 332 of the frame mounting plate 33 are at the same height, where a large amount of slack occurs in the area 212 of the expand tape 203, so the risk of the expand tape 203 peeling off the holding surface 321 of the holding table 32 can be reduced.

[0102] For this reason, the expansion method and expansion device 1 according to Embodiment 1 can suppress leakage of the negative pressure drawn by the suction source 325 from between the holding surface 321 and the expand tape 203, and can suppress displacement of the tip 210 relative to the holding surface 321 while the holding table 32 is descending. As a result, the expansion method and expansion device 1 according to Embodiment 1 have the effect of suppressing contact between the tips 210.

[0103] [Variation] Next, an extension method relating to a modified example of Embodiment 1 will be described with reference to the drawings. Figure 16 is a flowchart showing the flow of the extension method relating to a modified example of Embodiment 1. Note that in Figure 16, the same reference numerals are used for the same parts as in Embodiment 1, and their descriptions are omitted.

[0104] The expansion method according to a modification of Embodiment 1 is the same as the expansion method of Embodiment 1, except that, as shown in Figure 16, after performing the first speed table movement step 305, the contraction step 307 is performed while performing the second speed table movement step 306. In addition, in the present invention, the contraction step 307 may be performed while performing the first speed table movement step 305 and the second speed table movement step 306 in order. In short, in the present invention, the contraction step 307 only needs to be performed at least simultaneously with the second speed table movement step 306.

[0105] In the modified expansion method, after the expansion step 303 and the holding step 304, the holding table 32 is lowered at a first speed in the first speed table movement step 305, and then the holding table 32 is lowered at a second speed that is slower than the first speed, so that the holding surface 321 of the holding table 32 and the upper surface 332 of the frame mounting plate 33 are at the same height. This reduces the risk of the expandable tape 203 peeling off the holding surface 321 of the holding table 32, and, similar to Embodiment 1, has the effect of suppressing contact between the chips 210.

[0106] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core principles of the present invention. In Embodiment 1, a modified layer 209 was formed as the dividing point, but the present invention is not limited to this, and a laser-processed groove or a cutting groove may be formed as the dividing point.

[0107] Furthermore, in Embodiment 1, the expansion device 1 may be configured such that the workpiece 201 of the work unit 200 is divided into individual chips 210 along the division line 206 by a division groove 214 formed on the division line 206, as shown in Figure 17.

[0108] Figure 17 is a perspective view showing a modified example of the work unit shown in Figure 2. In Figure 17, the same reference numerals are used for the same parts as in Embodiment 1, and their descriptions are omitted. The dividing groove 214 penetrates the workpiece 201 and divides the workpiece 201 into individual chips 210, and is formed by cutting or laser ablation of the workpiece 201.

[0109] In other words, in the present invention, the expansion method and expansion device 1 divide the DAF 202 into individual chips 210 in the division step 301, and may also widen the spacing between the chips 210 in the division step 301 and the expansion step 303 compared to before the division step 301 and the expansion step 303.

[0110] Furthermore, in this invention, the work unit 200 does not necessarily have to be equipped with a DAF202. [Explanation of symbols]

[0111] 1. Expansion device 31 Frame Fixing Unit 32 Holding Table (Table) 33. Frame mounting plate (frame support part) 34. Frame retaining plate (frame retaining part) 35 Cylinder (Lifting Unit) 36 Expansion Units 37 Heating Unit 200 work units 201 Work 203 Expandable Tape (Tape) 204 frames 302 Frame fixing step 303 Extension Step 304 Holding step 305 First speed table movement step 306 Second speed table movement step 307 Contraction step 321 Holding surface 332 Top surface (frame support surface) 343 Cylinder (moving unit) 361 Pressing member 362 Cylinder (Pressing Member Lifting Unit) 363 Holding Table Lifting Unit (Table Moving Unit)

Claims

1. A method for extending a tape in a work unit in which a workpiece is attached to a frame via tape, A frame fixing step for fixing the frame with a frame fixing unit comprising a frame support portion including a frame support surface that supports the frame of the work unit and a frame pressing portion that clamps the frame together with the frame support portion, After performing the frame fixing step, an expansion step is performed in which the tape on the outside of the workpiece is pressed from the tape side of the workpiece unit to expand the tape and position the workpiece away from the frame support surface. After performing the expansion step, a holding step is performed in which the workpiece is held by suction via the tape on a table having a holding surface for holding the workpiece by suction, After performing the holding step, a first speed table moving step is performed to move the table at a first speed so that the holding surface of the table approaches the height position of the frame support surface, After performing the first speed table movement step, a second speed table movement step is performed to move the table at a second speed lower than the first speed so that the holding surface of the table and the frame support surface are on the same plane. An expansion method comprising a shrinking step of heating and shrinking the tape on the outside of the workpiece.

2. The expansion method according to claim 1, wherein the contraction step is performed after the second speed table movement step is performed.

3. The expansion method according to claim 1, wherein the contraction step is performed at least simultaneously with the second speed table movement step.

4. An expansion device for expanding the tape of a work unit in which a workpiece is mounted to a frame via tape, A frame fixing unit comprising: a frame support portion including a frame support surface that supports the frame of the work unit; a lifting unit that raises and lowers the frame support portion; and a frame holding portion that clamps the frame together with the frame support portion raised by the lifting unit; A pressing member that presses the tape on the outside of the workpiece from the tape side of the workpiece, to which the frame is fixed by the frame fixing unit, thereby expanding the tape and positioning the workpiece away from the frame support surface; a table that, with the pressing member expanding the tape, holds the workpiece by suction through the tape on a holding surface on which the workpiece is placed; and a pressing member lifting unit that raises and lowers the pressing member and, when the pressing member is raised, expands the tape and positions the workpiece away from the frame support surface. An extension unit comprising: a table moving unit that moves the table at a first speed so that the holding surface of the table approaches the height of the frame support surface, while the table holds the workpiece by suction via the tape, the lifting unit lowers the frame support portion, and the pressing member lifting unit lowers the pressing member, and then moves the table at a second speed lower than the first speed so that the holding surface of the table and the frame support surface are on the same plane; An expansion device comprising a heating unit for heating and shrinking the tape on the outside of the workpiece.

Images