Resin sheets and their uses

JP7874086B2Active Publication Date: 2026-06-15NITTO DENKO CORP
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Patent Information

Application Number
JP2023503810
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-03-03
Filing Date
2022-02-28
Publication Date
2026-06-15
Estimated Expiration
2042-02-28

AI Technical Summary

Technical Problem

Existing adhesive layers used in semiconductor processing are not sufficiently flexible and tough, leading to issues such as adhesive residue and low peel strength due to stringing phenomena, which are exacerbated by increased crosslinking density to prevent residue.

Method used

A resin film with a double network structure, comprising a first and second mesh formed from specific polymers and polyfunctional monomers, achieving a stress integral value of 10-1000 MPa and elongation at break of 300%-4500%, ensuring flexibility and toughness.

Benefits of technology

The resin film provides high peel strength with minimal adhesive residue, improved impact resistance, and balanced flexibility, suitable for adhesive sheets and components.

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Patent Text Reader

Abstract

Provided is a resin film having a stress integral value of from 10 to 1000 MPa, inclusive, when uniaxially stretched to break at a tensioning rate of 300 mm / min at 25°C. A resin film that exhibits such properties is supple and tough.
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Citation Information

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