Evaluation method, search method, and search system
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- HITACHI HIGH TECH CORP
- Filing Date
- 2024-06-20
- Publication Date
- 2026-06-15
AI Technical Summary
Existing methods for evaluating the shape of patterns in microscopic images, such as those used in semiconductor manufacturing, are subjective and lack accuracy due to reliance on manual grading and qualitative assessments, which are not suitable for machine learning analysis.
A method involving two quantitative approaches, the area and distance methods, to evaluate the shape of cross-sectional images by comparing them to a normalized template, using dimensionless indices to quantify the difference between the target and ideal shapes.
Enables accurate, objective evaluation of cross-sectional shapes, allowing for efficient machine learning applications and reducing the complexity of optimizing processing conditions.
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