Temporary fixed substrate

JP7874213B2Active Publication Date: 2026-06-15NGK CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
NGK CORP
Filing Date
2025-03-05
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

Conventional temporary fixing substrates used in semiconductor package manufacturing suffer from issues such as chipping and delamination, leading to decreased yield.

Method used

A translucent alumina temporary fixing substrate with a chamfered region on its edges, featuring a two-stage configuration with specific inclination angles and surface roughness, is used to prevent chipping and delamination during the manufacturing process.

Benefits of technology

The chamfered edges effectively suppress chipping and delamination, enhancing the yield of semiconductor packages by maintaining the integrity of the resin and adhesive layers.

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Patent Text Reader

Abstract

To suppress chipping in an outer peripheral section of a temporarily fixed substrate.SOLUTION: On a temporarily fixed substrate, on which a predetermined fixing target is temporarily fixed on one principal surface, the arithmetic average roughness of a side end is greater than the arithmetic average roughness of the one principal surface and is 5 μm or less.SELECTED DRAWING: Figure 2
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