Method for removing foreign matter, forming method, method for manufacturing articles, foreign matter removal apparatus, system, and template

Abstract

To provide technique enabling foreign matter on a member to be efficiently removed.SOLUTION: A foreign matter removal method is for removing foreign matter on a first member. The foreign matter removal method includes a supplying step, a pressing step, a curing step, and a separating step. The supplying step is for supplying a composition onto the first member. The pressing step is for pressing a second member onto the composition on the first member in such a manner that the composition supplied onto the first member in the supplying step spreads over a target range on the first member and foreign matter in the target range is incorporated into the composition. The curing step is for curing the composition after the pressing step, in a state in which the second member and the composition on the first member are in contact with each other, and The separating step is for separating the composition from the target range on the first member after the curing step by separating the second member from the first member in a state in which the second member and the composition are attached to each other.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a foreign matter removal method, a forming method, a method for manufacturing an article, a foreign matter removal device, a system, and a template.

Background Art

[0002] In the manufacture of semiconductor devices, MEMS, etc., members such as semiconductor substrates are cleaned. Conventionally, megasonic cleaning, two-fluid cleaning, RCA cleaning using a chemical solution, etc. have been applied to the cleaning of such members. As these cleaning principles, there are a cleaning method that removes foreign matter attached to a substrate by using a physical force due to a fluid force (see Patent Document 1), and a cleaning method that removes foreign matter in a lift-off manner by using a chemical action (for example, an etching effect) of a chemical solution (see Patent Document 2). Further, as a cleaning method for a member, Patent Documents 3-4 describe a solid-phase cleaning method in which a solid film is formed on the member, foreign matter on the member is included in the solid film, and then the solid film is removed using a chemical solution.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Patent Document 6

Summary of the Invention

Problems to be Solved by the Invention

[0004] Recently, with the advancement of miniaturization of patterns in the manufacturing of semiconductor devices and the like, there is a need to remove even very small foreign matter (e.g., tens of nanometers or less) from semiconductor substrates and other materials during cleaning. However, in cleaning methods using fluid force, as described in Patent Document 1, increasing the fluid force to remove small foreign matter or unwanted materials such as polymers attached to the material can damage the microstructure formed as the underlying layer (underlying pattern) on the material. Similarly, in cleaning methods using the chemical action of chemical solutions, as described in Patent Document 2, damage to the underlying layer of the material can also occur. Therefore, the above cleaning methods are reaching their limits in terms of the removal of small foreign matter. Furthermore, in solid-phase cleaning methods described in Patent Documents 3-4, when dissolving (removing) the solid film using chemical solutions, foreign matter may reattach to the material, and there are problems with the environmental burden and cost burden of wastewater treatment, etc.

[0005] Therefore, as a method for cleaning components, solid-phase cleaning methods (sometimes called dry solid-phase cleaning methods) that remove foreign matter from components using an imprint method without using chemicals are attracting attention. For example, Patent Document 5 describes a solid-phase cleaning method in which a template is pressed onto a resin coated on a dummy wafer, and after the resin is cured, the template is removed from the resin to remove foreign matter from the template. Patent Document 6 also describes a solid-phase cleaning method in which a planarizing member is brought into contact with a resin coated on a mold from which foreign matter is to be removed to form a resin film, the resin film is cured, the planarizing member is peeled off the resin film, and then the resin film is peeled off the mold. With such solid-phase cleaning methods using an imprint method, it is desirable to efficiently remove foreign matter from components.

[0006] The present invention aims to provide a technology that can efficiently remove foreign matter from a component. [Means for solving the problem]

[0007] To achieve the above objective, a foreign matter removal method as one aspect of the present invention is a foreign matter removal method for removing foreign matter on a first member, comprising: a supply step of supplying a composition onto the first member; a pressing step of pressing a second member onto the composition on the first member so that the composition supplied onto the first member in the supply step spreads over a target area of ​​the first member and foreign matter within the target area is incorporated into the composition; a curing step of curing the composition while the composition on the first member and the second member are in contact after the pressing step; and a separation step of separating the composition from the target area of ​​the first member by separating the second member from the first member while the second member and the composition are adhered together after the curing step. The target range includes at least a portion of the bevel portion of the first member, and in the supply step, the liquid composition is supplied to the portion of the first member other than the bevel portion. It is characterized by the following:

[0008] Further objects or other aspects of the present invention will be revealed by preferred embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, for example, it is possible to provide a technology that can efficiently remove foreign matter from a component. [Brief explanation of the drawing]

[0010] [Figure 1] Flowchart showing the foreign matter removal method of the first embodiment [Figure 2] A schematic diagram illustrating the steps of the foreign matter removal method of the first embodiment in chronological order. [Figure 3] Diagram illustrating the challenges in the pressing process. [Figure 4] Diagram showing an example of template configuration [Figure 5] A schematic diagram showing an example configuration of the foreign matter removal device according to the first embodiment. [Figure 6] A schematic diagram illustrating the steps of the foreign matter removal method of the second embodiment in chronological order. [Figure 7] A schematic diagram showing an example of a system configuration comprising a foreign matter removal device and a forming device. [Figure 8] Figure for explaining the manufacturing method of an article

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are given the same reference numerals, and duplicate explanations are omitted.

[0012] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which the direction parallel to the surface (upper surface) of the member to be removed of foreign matter is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are θX, θY, and θZ, respectively. The control and drive (movement) regarding the X-axis, Y-axis, and Z-axis respectively mean the control or drive (movement) regarding the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis. Further, the control or drive regarding the θX-axis, θY-axis, and θZ-axis respectively mean the control or drive regarding the rotation around the axis parallel to the X-axis, the rotation around the axis parallel to the Y-axis, and the rotation around the axis parallel to the Z-axis.

[0013] <First Embodiment> The foreign matter removal method according to the first embodiment of the present invention will be described. The foreign matter removal method of the present embodiment is a method for removing foreign matter on a member (first member), and specifically, it is a solid-phase cleaning method (so-called dry solid-phase cleaning method) for removing foreign matter on the member without using a chemical solution.

[0014] [Foreign Matter Removal Method] Hereinafter, the foreign matter removal method (solid-phase cleaning method) of the present embodiment will be described while referring to FIGS. 1 to 2. FIG. 1 is a flowchart showing the foreign matter removal method of the present embodiment. Further, FIG. 2 is a schematic diagram for explaining each step of the foreign matter removal method of the present embodiment in chronological order. Note that the examples shown in FIGS. 1 to 2 are merely representative examples and are not limited to the examples shown in FIGS. 1 to 2.

[0015] First, in step S11 (preparation step), a member 1 (first member) to be the target for removing foreign matter is prepared. Hereinafter, the member 1 to be the target for removing foreign matter may be referred to as "target member 1". The preparation step may be understood as a step of loading the target member 1 into a foreign matter removal apparatus that removes foreign matter on the target member 1. A configuration example of the foreign matter removal apparatus will be described later.

[0016] As shown in FIG. 2(a), the target member 1 can be, for example, a substrate on which a pattern is formed by a lithography process for manufacturing a semiconductor device or a flat panel display. Examples of such a substrate include a semiconductor wafer, a MEMS wafer, a power semiconductor wafer, on which a pattern (underlying pattern) is formed, a glass substrate (glass plate) for a display, a bioelement, and the like. Here, in the present embodiment, an example in which a substrate is applied as the target member 1 will be described, but the target member 1 may be a master used for forming a pattern on the substrate in the lithography process. Examples of such a master include an EUV exposure mask, a semiconductor exposure mask, a semiconductor imprint mold (template), a MEMS exposure mask, a power semiconductor exposure mask, a display exposure mask, and the like. Note that MEMS is an abbreviation for Micro Electro Mechanical System, and EUV is an abbreviation for Extreme Ultraviolet.

[0017] In the example shown in Figure 2(a), various sizes of foreign matter 2 (particles) are attached to the top surface and bottom surface of the pattern 3 (base pattern) already formed on the pattern portion 1a of the target member 1, and to the peripheral portion 1b of the target member 1. In particular, extremely small foreign matter with a particle size of 30 nm or less and foreign matter attached to the bottom surface of pattern 3 are difficult to remove with conventional cleaning methods such as megasonic cleaning and two-fluid cleaning. Here, the pattern portion 1a refers to the part (region) of the target member 1 on which pattern 3 is formed. In this embodiment, the pattern 3 formed on the pattern portion 1a is configured as an uneven pattern in which recesses and protrusions are repeatedly (for example, periodically) provided. The peripheral portion 1b is the end surrounding the pattern portion 1a, and in this embodiment, it refers to the part (region) on which beveling (for example, chamfering) has been performed. Hereafter, the peripheral portion 1b of the target member 1 may be referred to as "bevel portion 1b".

[0018] Next, in step S12 (supply step), as shown in Figure 2(b), a composition 4 for capturing and encapsulating foreign matter 2 on the target member 1 is supplied onto the target member 1. The composition 4 is supplied onto the target member 1 in a fluid state (i.e., a liquid state). Furthermore, from the viewpoint of avoiding overflowing to the outside of the target member 1 (bevel portion 1b), it is preferable that the composition 4 is not supplied onto the bevel portion 1b of the target member 1, that is, only onto the pattern portion 1a of the target member 1 (i.e., the portion other than the bevel portion).

[0019] Composition 4 is a curable composition (e.g., a resin) that hardens when curing energy is applied. The curable composition is a composition that hardens by irradiation with light or by heating. Of these, the photocurable composition (photocurable resin) that hardens by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as needed. A polymerizable compound is a compound that reacts with polymerization factors (radicals, etc.) generated from the photopolymerization initiator and forms a film made of a polymer compound by a chain reaction (polymerization reaction). Examples of such polymerizable compounds include radical polymerizable compounds, and it is preferable that they are compounds having one or more acryloyl groups or methacryloyl groups, i.e., (meth)acrylic compounds. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internally added mold release agents, surfactants, antioxidants, polymer components, etc. The viscosity of composition 4 (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0020] In this embodiment, composition 4 may be supplied (coated) onto the target member 1 using an apparatus that ejects composition 4 by an inkjet method. However, the method of supplying (coating) composition 4 onto the target member 1 is not limited to the inkjet method, and any method that allows control of the amount of composition 4 supplied onto the target member 1 (for example, the coating thickness of composition 4) is acceptable. For example, composition 4 may be supplied onto the target member 1 using dispenser coating, spin coating, various printing methods such as screen printing, gravure printing, and offset printing, or dipping coating.

[0021] Furthermore, the amount of composition 4 supplied onto the target member 1 should be determined (set) based on the size of the foreign matter 2 adhering to the target member 1, such that the film thickness of composition 4 formed on the target member 1 through the pressing process described later becomes thicker than the size of the foreign matter 2. The size of the foreign matter 2 may be a measured value obtained by measuring (inspecting) the size of the foreign matter 2 adhering to the target member 1 in advance, or it may be a predicted value obtained from calculations (simulations) based on past empirical rules.

[0022] Here, it is preferable that the surface (top surface) of the target member 1 has high wettability so as to prevent air bubbles from being trapped between the target member 1 and the composition 4, and / or so that the composition 4 can spread easily over the target member 1. In other words, it is preferable to make the contact angle between the target member 1 and the composition 4 as small as possible. The allowable range of this contact angle is preferably 2 degrees or less, and more preferably 1 degree or less.

[0023] Therefore, it is preferable that the surface of the target member 1 be treated with composition 4 to make it hydrophilic (hydrophilic liquefaction treatment) before the supply process (step S12). The hydrophilic liquefaction treatment includes a treatment to remove organic contaminants on the target member 1. Examples of hydrophilic liquefaction treatments include baking, plasma ashing, atmospheric pressure plasma treatment, and alkaline or ozone water washing. In this embodiment, atmospheric pressure plasma treatment, which can be realized with a simple apparatus configuration, can be used as the hydrophilic liquefaction treatment. If the target member 1 is sufficiently hydrophilic, the hydrophilic liquefaction treatment can be omitted. When performing the hydrophilic liquefaction treatment, it is preferable to select the etching amount so as to remove contaminants from the very surface without damaging the surface layer of the target member 1. By supplying composition 4 onto the target member 1 after pre-hydrophilizing the surface of the target member 1 in this way, the composition 4 can be easily penetrated by capillary force into the narrow channel (gap) between the target member 1 and the foreign matter 2 attached to it. Furthermore, the liquefaction treatment may be performed by an external device of the foreign matter removal device before the preparation step (step S11), for example, before the target member 1 is brought into the foreign matter removal device. In addition, a separation layer (e.g., fluorine-based) may be formed on the target member 1 before the supply step (step S12) to facilitate the separation (peeling) of the target member 1 and the composition 4 in the separation step (step S15) described later.

[0024] Next, in step S13 (pressing step), the template 5 is pressed against the composition 4 on the target member 1 so that the composition 4 spreads over the target area of ​​the target member 1. Specifically, as shown in Figure 2(c), the pressing step involves bringing the template 5 into contact with the composition 4 supplied onto the target member 1 in the supply step, and then, as shown in Figure 2(d), the template 5 is used to spread the composition 4 on the target member 1. At this time, the template 5 is pressed against the composition 4 on the target member 1 so that the composition 4 spreads over the target area of ​​the target member 1 and any foreign matter 2 within the target area is incorporated into the composition 4. The pressing step may be performed by a drive mechanism that drives the target member 1 and the template 5 relative to each other.

[0025] The target area of ​​the target member 1 is the area from which foreign matter should be removed, and may include at least a portion of the bevel portion 1b in addition to the pattern portion 1a. In this embodiment, the target area is set to include the entire bevel portion 1b, that is, the entire surface (top surface) of the target member 1. The template 5 is a member (second member) that acts as a handle for spreading the composition 4 supplied onto the target member 1 in the supply process, and for separating (peeling off) the hardened composition 4 from the target member 1 in the hardening process described later. The template 5 is preferably made larger than the target member 1 (target area) in order to effectively clean the edges and the entire bevel portion 1b of the target member 1.

[0026] In the pressing process, as shown in Figure 3(a), if the template 5 is pressed onto the composition 4 on the target member 1 while the template 5 and the target member 1 are tilted relative to each other, it may become difficult to spread the composition 4 over the entire target area of ​​the target member 1. As a result, as shown in Figure 3(b), foreign matter 2 may remain on the target member 1 (e.g., the bevel portion 1b) even after the separation process described later. In addition, the composition 4 may extend beyond the target area of ​​the target member 1, and the excess portion of the composition 4 may remain on the target member 1 as foreign matter after the separation process.

[0027] Therefore, in the pressing step of this embodiment, the parallelism between the template 5 and the target member 1, and / or the pressing force of the template 5 against the composition 4 on the target member 1, can be controlled so that the composition 4 spreads over the entire target range of the target member 1. The parallelism and / or pressing force may be controlled so that the composition 4 does not extend beyond the target range of the target member 1. For example, the parallelism between the template 5 and the target member 1 can be controlled by adjusting the relative orientation (relative inclination) between the template 5 and the target member 1 so that the pressing surface 5a of the template 5 and the upper surface of the target member 1 are parallel. The pressing surface 5a of the template 5 is the surface (e.g., the lower surface) that is pressed against the composition 4 on the target member 1. The parallelism and pressing force can be controlled by a drive mechanism that drives the target member 1 and the template 5 relative to each other.

[0028] Furthermore, in the pressing step of this embodiment, as shown in Figure 2(d), the pressing of the template 5 onto the composition 4 on the target member 1 (e.g., parallelism and / or pressing force) may be controlled while observing the spread of the composition 4 on the target member 1 using the imaging unit 16. The imaging unit 16 may include, for example, a camera 16a and an observation optical system 16b, and may be configured so that the entire target range of the target member 1 is captured within the field of view. This makes it possible to control the pressing of the template 5 onto the composition 4 of the target member so that the composition 4 spreads over the target range of the target member 1, and / or so that the composition 4 does not extend beyond the target range of the target member 1. Here, the pressing step is not limited to the observation results of the imaging unit 16, but may also be controlled by time management.

[0029] Next, in step S14 (curing step), as shown in Figure 2(e), energy 7 is applied to the composition 4 while the composition 4 on the target member 1 and the template 5 are in contact, thereby curing the composition 4. For example, if a photocurable resin (e.g., an ultraviolet-curable monomer) is used as the composition 4, light (ultraviolet light) as energy 7 is irradiated (applied) to the composition 4 through the template 5. In this case, the template 5 is preferably made of a material that can transmit light (ultraviolet light), such as quartz. Here, the composition 4 is not limited to a material that hardens by irradiation with ultraviolet light, but may also be a material that hardens by a polymerization reaction caused by irradiation with other energy such as X-rays or visible light, or a material that hardens by thermal energy.

[0030] Next, in step S15 (separation step), as shown in Figure 2(f), the composition 4, which has hardened in the hardening step, and the template 5 are adhered to each other. By widening the gap between the template 5 and the target member 1, the composition 4 is separated (peeled) from the target member 1. In other words, the template 5 is separated from the target member 1 together with the composition 4 while the hardened composition 4, which contains the foreign matter 2, is adhered to the template 5. By using such a separation step, the foreign matter 2 on the target member 1 can be removed efficiently and with a simple process, that is, the target member 1 can be effectively cleaned, which can also be advantageous in terms of throughput.

[0031] In order to perform the separation process described above, the adhesion between the template 5 and the composition 4 must be higher than the adhesion between the target member 1 and the composition 4. Therefore, it is preferable to perform a pretreatment on the template 5 to improve the adhesion between the template 5 and the composition 4 before the pressing process (step S13). This pretreatment may include a film formation process in which an adhesion film (adhesion layer) that adheres to the composition 4 is formed (applied) on the surface (pressing surface 5a) of the template 5. The film formation process can be performed by general thin film formation methods such as spraying, vapor deposition, or spin coating. The pretreatment (coating process) may be performed by an external device of the foreign matter removal device before the template 5 is brought into the foreign matter removal device.

[0032] Furthermore, the surface of the template 5 (pressing surface 5a) is preferably as wettable as possible so that air bubbles are not trapped between the template 5 and the composition 4 during the pressing process, and / or so that the composition 4 spreads easily on the template 5. In other words, it is preferable to make the contact angle between the template 5 and the composition 4 on the target member 1 as small as possible during the pressing process. The allowable range of the contact angle between the template 5 and the composition 4 is preferably 2 degrees or less, more preferably 1 degree or less, and is about 0.5 to 1 degree smaller than the contact angle between the target member 1 and the composition 4. For example, if a fluorine-based separation layer is formed on the target member 1, the contact angle between the target member 1 and the composition 4 does not meet the above allowable range, so it is preferable to set the contact angle between the template 5 and the composition 4 to 1 degree or less to increase the spreading speed of the composition 4 on the template 5.

[0033] Therefore, before the pressing step (step S13), the template 5 may be subjected to a treatment to make the surface of the template 5 (pressing surface 5a) hydrophilic to the composition 4 (hydrophilic liquefaction treatment). The hydrophilic liquefaction treatment includes a treatment to remove organic contaminants on the surface of the template 5 (pressing surface 5a). Examples of hydrophilic liquefaction treatments include baking, atmospheric pressure plasma treatment, ashing treatment, and alkaline or ozone water washing. In this embodiment, atmospheric pressure plasma treatment, which can be realized with a simple apparatus configuration, can be used as the removal treatment. By making the surface of the template 5 (pressing surface 5a) hydrophilic in this way, the contact angle between the template 5 and the composition 4 can be reduced during the pressing step, making it easier for the composition 4 to spread on the template 5. Note that the hydrophilic liquefaction treatment may be performed by an external device of the foreign matter removal device before the template 5 is brought into the foreign matter removal device.

[0034] [Template structure] The following describes an example of the configuration of the template 5 used in the foreign matter removal method of this embodiment. Figure 4 is a diagram showing an example of the configuration of the template 5. Figure 4(a) is a view of the template 5 from below (-Z direction), and Figure 4(b) is a cross-sectional view AA of the template 5 shown in Figure 4(a).

[0035] The template 5 used in the foreign matter removal method of this embodiment may be configured such that the pressing surface 5a is a flat surface, but it is preferable that it be configured so that the composition 4 can be efficiently spread over the target area of ​​the target member 1 during the pressing step (step S13). For example, in the pressing step (step S13), as the spread of the composition 4 approaches the edge of the target member 1, the gap between the template 5 and the target member 1 widens due to the bevel portion 1b of the target member 1, and the spreading speed of the composition 4 decreases. For this reason, the template 5 has a plurality of first grooves 5b extending radially on the pressing surface 5a to guide (assist) the spreading of the composition 4 during the pressing step. The plurality of first grooves 5b may be arranged on the pressing surface 5a of the template 5 at positions corresponding to the bevel portion 1b of the target member 1.

[0036] The width W of each first groove 5b is preferably set to a width that allows a predetermined capillary force to be generated in relation to the composition 4, and can be set to several tens of micrometers to several hundred nanometers. The radial length L of each first groove 5b is preferably set to be longer than the length of the bevel portion 1b of the target member 1, and can be set to, for example, 1 mm or more. As an example, each first groove 5b of the template 5 is configured with a width W of 100 nm, a length L of 2 mm, and a depth of 100 nm. By providing multiple such first grooves 5b in the template 5, the composition 4 can be efficiently spread over the target area of ​​the target member 1 using the capillary force generated in each first groove 5b.

[0037] Furthermore, the template 5 may have a second groove 5c on the pressing surface 5a that is frame-shaped to stop the spreading of the composition 4 during the pressing process. The second groove 5c may be positioned at a location corresponding to the outer circumference of the target range of the target member 1 (for example, the edge of the target member 1). In the example of Figure 4, since the entire circular target member 1 is the target range, the second groove 5c of the template 5 is configured circumferentially (for example, circularly) along the edge of the target member 1. By providing such a second groove on the template 5, the spreading of the composition 4 can be stopped within the target range of the target member 1, and it is possible to prevent the composition 4 from overflowing outside the target range.

[0038] [Configuration of the foreign object removal device] The following describes an example configuration of the foreign matter removal device 10 of this embodiment. Figure 5 is a schematic diagram showing an example configuration of the foreign matter removal device 10 of this embodiment. The foreign matter removal device 10 of this embodiment is a device that removes foreign matter from a target member 1 by performing the foreign matter removal method described above using Figures 1 and 2. The foreign matter removal device 10 may include, for example, a stage 11, a holding unit 12, a supply unit 13, a first processing unit 14, a second processing unit 15, an imaging unit 16, a hardening unit 17, and a control unit 18. The control unit 18 is composed of, for example, a computer having a processor such as a CPU or MPU, or a logic circuit and a memory unit, and controls the foreign matter removal process to remove foreign matter from the target member 1 by controlling each part of the foreign matter removal device 10. The control unit 18 may also have a communication unit for communicating with an external device. Note that CPU is an abbreviation for Central Processing Unit, and MPU is an abbreviation for Micro Processing Unit.

[0039] Stage 11 is configured to hold the target member 1 (first member) from which foreign matter is to be removed using vacuum force or electrostatic force, and to be movable in the XY direction on the base plate BP. In other words, Stage 11 is a mechanism that holds the target member 1 and drives it in the XY direction. In this embodiment, Stage 11 is configured to drive the target member 1 only in the XY direction, but it may also be configured to drive the target member 1 in the Z direction and in the rotational direction of each axis. The holding part 12 is a mechanism that holds the template 5 (second member) using vacuum force or electrostatic force, and drives the template 5 in the Z direction. In this embodiment, the holding part 12 is configured to drive the template 5 only in the Z direction, but it may also be configured to drive the template 5 in the XY direction and in the rotational direction of each axis. Here, Stage 11 and Holding Part 12 can constitute a drive mechanism (drive unit) that drives the target member 1 and the template 5 relative to each other.

[0040] The supply unit 13 is a mechanism for supplying (discharging, coating) a liquid composition 4 onto the target member 1. When the supply unit 13 supplies the composition 4 onto the target member 1, the stage 11 positions the target member 1 below the supply unit 13. The first processing unit 14 is a mechanism for performing a liquefaction treatment on the target member 1. When the first processing unit 14 performs the liquefaction treatment on the target member 1, the stage 11 positions the target member 1 below the first processing unit 14. The second processing unit 15 is a mechanism for performing a film formation treatment and a liquefaction treatment on the template 5. In this embodiment, the second processing unit 15 is supported by a moving mechanism 19 that can move on the base plate BP in the XY direction. When the second processing unit 15 performs the film formation treatment and a liquefaction treatment on the template 5, the moving mechanism 19 positions the second processing unit 15 below the template 5.

[0041] The imaging unit 16 is a mechanism for observing (photographing) the spread of composition 4 on the target member 1 during the pressing process described above. The imaging unit 16 may include, for example, a camera 16a (image sensor) and an observation optical system 16b. In the example in Figure 5, the imaging unit 16 is configured to photograph the spread of composition 4 on the target member 1 via a mirror MR and a template 5. The curing unit 17 is a mechanism for curing composition 4 on the target member 1 during the curing process described above. The curing unit 17 may include, for example, an energy source 17a that emits energy (e.g., ultraviolet light) to cure composition 4, and an irradiation optical system 17b that irradiates the composition 4 on the target member 1 with the energy emitted from the energy source 17a. In the example in Figure 5, the curing unit 17 cures composition 4 by irradiating it with energy via a mirror MR and a template 5.

[0042] [Operation of the foreign object removal device] The following describes an example of the operation of the foreign matter removal device 10 of this embodiment. The series of operations of the foreign matter removal device 10 are performed by the control unit 18 transmitting signals to each part.

[0043] (Operations from the delivery of the target components to the supply process) First, the target member 1 is transported onto the stage 11 by a transport mechanism (not shown) and held by the stage 11 (preparation step). Then, the target member 1 is driven by the stage 11 to be positioned below the first processing unit 14, after which the first processing unit 14 performs a liquefaction treatment on the target member 1. The first processing unit 14 can perform a liquefaction treatment which is appropriately selected from baking, plasma ashing, atmospheric pressure plasma treatment, alkaline or ozone water washing, etc., that can remove organic contaminants on the target member 1.

[0044] Next, the target member 1 is driven by the stage 11 to position the target member 1 below the supply unit 13, after which the liquid composition 4 is supplied onto the target member 1 by the supply unit 13 (supply process). The supply unit 13 can supply the composition 4 onto the target member 1 using a method appropriately selected from inkjet, dispenser, printing, etc. In the example of Figure 5, the first processing unit 14 and the supply unit 13 are provided as components of the foreign matter removal device 10, but the first processing unit 14 and / or the supply unit 13 may be provided as external elements (external devices) of the foreign matter removal device 10. In this case, the target member 1, which has undergone liquefaction treatment and / or supply of composition 4 outside the foreign matter removal device 10, can be brought into the foreign matter removal device 10.

[0045] Here, the amount of composition 4 supplied onto the target member 1 by the supply unit 13 will be described. The control unit 18 acquires information indicating the size of foreign matter attached to the target member 1 (hereinafter sometimes referred to as foreign matter information). The foreign matter information may include information indicating the representative size of the foreign matter, which is obtained by measuring the size of the foreign matter on the target member 1 using an external inspection device. The representative size of the foreign matter may be, for example, the maximum size of the foreign matter attached to the target member 1, or the average size. If there are multiple target members 1, a representative size may be obtained for each target member 1, but from the viewpoint of throughput, a representative size may be obtained from several target members 1 that are sampled (representative) from among the multiple target members 1. In this case, the maximum size or average size of the foreign matter on the sampled target members 1 may be used as the representative size.

[0046] Furthermore, the control unit 18 acquires information indicating the height (e.g., the height of the unevenness) of the pattern 3 formed on the target member 1 (hereinafter, this may be referred to as pattern information). The pattern information may be information indicating the measurement result of the height of the pattern 3 on the target member 1, or it may be design information of the pattern 3 on the target member 1.

[0047] The control unit 18 then determines the amount of composition 4 to be supplied, based on the foreign matter information and pattern information, such that the film thickness T of the composition 4 formed between the target member 1 and the template 5 after the aforementioned pressing process satisfies the following equation (1). In equation (1), "α" can be appropriately set between 1 and 100, but in this embodiment, α = 1.5 was set considering the curing shrinkage of composition 4 in the curing process and the measurement accuracy of the size of foreign matter. The control unit 18 controls the supply unit 13 by transmitting an instruction signal to the supply unit 13 according to the determined amount of composition 4 to be supplied. T = (Maximum size of foreign object + height of pattern 3) × α, α > 1 ···(1)

[0048] (The process from template delivery to the pressing process) The template 5 is transported onto the holding section 12 by a transport mechanism (not shown), and the template 5 is held by the holding section 12. Then, the second processing section 15 is positioned below the template 5 by the moving mechanism 19, and the second processing section 15 performs a film formation process on the template 5. The film formation process is a process to form an adhesion film (adhesion layer) on the pressing surface 5a of the template 5 to improve the adhesion between the template 5 and the composition 4, and may include surface treatments such as silane coupling treatment, silazane treatment, and organic thin film formation. When such an adhesion film is formed on the pressing surface 5a of the template 5, the template 5 and the composition 4 are brought into close contact in the separation step described above, and the template 5 can be completely separated (peeled) from the target member 1 together with the composition 4. In other words, it becomes possible to efficiently and reliably remove foreign matter from the target member 1. Depending on the components of the composition 4 and the composition and materials of the template 5, the formation of the adhesion film may be omitted.

[0049] Next, the second processing unit 15 performs a hydrophilic liquefaction treatment on the template 5. The second processing unit 15 can perform a hydrophilic liquefaction treatment which can be appropriately selected from baking, plasma ashing, atmospheric pressure plasma treatment, alkaline or ozone water washing, etc., that can remove organic contaminants on the template 5. Note that if the aforementioned adhesion layer surface is sufficiently hydrophilic, the hydrophilic liquefaction treatment can be omitted. When performing the hydrophilic liquefaction treatment, it is preferable to select the etching amount so as to remove contaminants from the very surface without damaging the adhesion layer. In addition, although the second processing unit 15 is provided as a component of the foreign matter removal device 10 in the example of Figure 5, the second processing unit 15 may also be provided as an external element (external device) of the foreign matter removal device 10. In this case, the template 5, which has undergone film formation treatment and / or hydrophilic liquefaction treatment outside the foreign matter removal device 10, can be brought into the foreign matter removal device 10.

[0050] Next, the target member 1 is driven by the stage 11 to position it below the template 5. Then, the holding unit 12 lowers the template 5 and presses it against the composition 4 on the target member 1 (pressing step). The time for the pressing step (i.e., the time the composition is spread on the target member 1) can be appropriately set according to the material and properties of the composition 4 so that the composition 4 can sufficiently enclose any foreign matter within the target area of ​​the target member 1.

[0051] In the stamping process, the pressing of the template 5 onto the composition 4 on the target member 1 (e.g., parallelism and / or pressing force) can be controlled while observing the uniformity / non-uniformity of the spread of the composition 4 on the target member 1 using the imaging unit 16. For example, the control unit 18 can observe (monitor) the uniformity / non-uniformity of the spread of the composition 4 on the target member 1 by performing known image processing on the image acquired from the imaging unit 16 and detecting the outer periphery of the composition 4 and / or the edges of the target member 1. If the control unit 18 detects non-uniformity in the spread of the composition 4, it controls the relative posture between the template 5 and the target member 1, and / or the pressing force of the template 5, using the stage 11 and the holding unit 12, so that the non-uniformity is corrected. This makes it possible to uniformly spread the composition 4 over the target area of ​​the target member 1 and reliably remove foreign matter on the bevel portion 1b included in the target area.

[0052] Furthermore, during the pressing process, a gas may be introduced from a gas supply nozzle (not shown) provided in the holding section 12 to promote the disappearance of air bubbles trapped between the template 5 and the target member 1, and / or to avoid poor curing of the composition 4 due to oxygen inhibition. Examples of such gases include He, H2, and mixtures thereof. However, even if air bubbles are trapped between the template 5 and the composition 4, if there is no problem with the adhesion between the template 5 and the composition 4, it is not necessary to introduce gas from the gas supply nozzle.

[0053] (The process from the hardening step to the peeling step) Once the composition 4 has spread over the target area of ​​the target member 1 through the pressing process, a signal instructing the curing of the composition 4 is transmitted from the control unit 18 to the curing unit 17. In response to receiving this signal, the curing unit 17 emits energy (e.g., ultraviolet light) from the energy source 17a to cure the composition 4 and irradiates the composition 4 with this energy via the irradiation optical system 17b, mirror MR, and template 5 (curing process). This allows the composition 4 between the template 5 and the target member 1 to be cured.

[0054] The energy source 17a can be appropriately selected in terms of material and wavelength so that the emitted energy can penetrate the template 5. In this embodiment, the template 5 is made of quartz, and ultraviolet light with a wavelength of 365 nm is used as the energy emitted from the energy source 17a. However, the energy emitted from the energy source 17a is not limited to ultraviolet light with a wavelength of 365 nm, and depending on the materials of the template 5 and composition 4, visible light, ultraviolet light with wavelengths other than 365 nm, infrared light, X-rays, radiation, electron beams, etc. may be used.

[0055] In the curing process, the energy intensity (light intensity) and irradiation time (exposure time) irradiated onto the composition 4 can be appropriately set so that the composition 4 can be sufficiently cured, that is, so that the composition 4 hardens to the target hardness. Since the curing speed of the composition 4 may vary depending on the amount of oxygen in the surrounding atmosphere, the amount of oxygen in the surrounding atmosphere may be detected by a sensor or the like, and the energy intensity and / or irradiation time may be set based on the detection result.

[0056] Through the above process, the composition 4 on the target member 1 spreads over the target area of ​​the target member 1 due to capillary force and wettability, capturing (enveloping) foreign matter in the target area, and becomes separable from the target member 1 due to shrinkage during hardening (hardening shrinkage).

[0057] Next, the holding unit 12 raises the template 5, separating it from the target member 1 (separation step). At this time, the template 5 and the hardened composition 4 are stuck together, so the composition 4 is separated from the target member 1 along with the template 5. The speed at which the template and the target member 1 are separated can be set so as not to damage the pattern on the target member 1. By separating the template 5 together with the composition 4 from the target member 1 in this way, foreign matter on the target member 1 can be removed efficiently and with simple processing, which can also be advantageous in terms of throughput.

[0058] When separating the template 5 and composition 4 from the target member 1, the target member 1 may become charged (called peeling charge), attracting surrounding foreign matter by electrostatic force. Therefore, it is advisable to perform the separation process while discharging the template 5, composition 4, and / or target member 1 using an ionizer (not shown). Since composition 4 will be attached to the template 5 after the separation process, the template 5 may be replaced or cleaned when performing a foreign matter removal treatment on a new target member 1.

[0059] Once the separation process is complete, the target member 1 is separated from the stage 11 and transported away by a transport mechanism (not shown). The template 5 is also separated from the holding unit 12 and transported away by a transport mechanism (not shown). When separating the target member 1 from the stage 11 and / or separating the template 5 from the holding unit 12, it is preferable to use an ionizer (not shown) to remove static electricity.

[0060] As described above, in the foreign matter removal method of this embodiment, after supplying a liquid composition 4 onto the target member 1, the composition 4 is spread over a target area of ​​the target member 1, and the template 5 is pressed against the composition 4 so that the foreign matter within the target area is incorporated into the composition 4. Then, after the composition 4 is cured while the template 5 and the composition 4 on the target member 1 are in contact, the template 5 is separated from the target member 1 together with the composition 4 while the template 5 and the cured composition 4 are still attached. This allows for the efficient and simple removal of foreign matter 2 on the target member 1, which may also be advantageous in terms of throughput.

[0061] <Second Embodiment> A second embodiment of the present invention will now be described. This embodiment basically follows the first embodiment, and can be followed in all respects except for those described below.

[0062] The bevel portion 1b (periphery) of a target component 1, such as a wafer or substrate, may include an edge region that has little influence on pattern formation in the subsequent lithography process. Such an edge region may be called an edge exclusion region (hereinafter sometimes referred to as an EE region), and may be understood as a region from which the evaluation of the presence or absence of foreign matter in the pattern formation is excluded.

[0063] Figure 6 is a schematic diagram illustrating the steps of the foreign matter removal method of this embodiment in chronological order. The steps shown in Figures 6(a) to 6(f) correspond to the steps shown in Figures 2(a) to 6(f) described above, and are the same steps as those in Figures 2(a) to 6(f) of the first embodiment. However, in Figures 6(a) to 6(f), the target range of the target member 1 is different from that in Figures 2(a) to 6(f).

[0064] In this embodiment, the target range of the target member 1 (the range from which foreign matter should be removed) is set so as not to include the EE area 8. That is, the target range of the target member 1 is set to include the pattern portion 1a and the portion of the bevel portion 1b excluding the EE area 8. Here, the template 5 used when considering the EE area 8 may be set to a size larger than the target range of the target member 1, but it may also be smaller than the target member 1 itself. From the viewpoint of making the template 5 easier to handle, it is preferable that the template 5 be the same size as the target member 1, or larger than the target member 1.

[0065] <Third Embodiment> A third embodiment of the present invention will now be described. In this embodiment, a system 100 equipped with the foreign matter removal device 10 described in the first embodiment will be described. This embodiment basically follows the first embodiment, and except for the matters described below, it can follow the first embodiment. Furthermore, this embodiment may also follow the second embodiment.

[0066] Figure 7 is a schematic diagram showing an example configuration of the system 100 of this embodiment. The system 100 of this embodiment comprises a foreign matter removal device 10 and a forming device 20. In the system 100 of this embodiment, the foreign matter removal device 10 and the forming device 20 are connected inline by a conveying device 30, and the target member 1 from which foreign matter has been removed by the foreign matter removal device 10 is transported to the forming device 20 by the conveying device 30.

[0067] The foreign matter removal device 10 is a device that removes foreign matter from the target member 1, as described in the first embodiment. The target member 1 can be a substrate from which a pattern is formed by the forming device 20, and / or a master plate having a pattern that is transferred onto the substrate by the forming device 20, as described above. The forming device 20 is a device that forms a pattern on the substrate using the target member 1 from which foreign matter has been removed by the foreign matter removal device 10. The forming device 20 in this embodiment can be configured as a lithography device that transfers the pattern of a master plate onto the substrate. For example, if the target member 1 is a substrate, the forming device 20 transfers the pattern onto the substrate from which foreign matter has been removed by the foreign matter removal device 10. If the target member 1 is a master plate, the forming device 20 transfers the pattern of the master plate from which foreign matter has been removed by the foreign matter removal device 10 onto the substrate. Lithography equipment that constitutes the forming apparatus 20 includes exposure equipment that exposes a substrate with pattern light that has passed through a master plate (mask, reticle), and imprint equipment that forms a pattern of imprint material on a substrate using a master plate (mold).

[0068] Next, an example of the operation of the system 100 of this embodiment will be described. Here, we will describe an example in which the target member 1 from which foreign matter is removed by the foreign matter removal device 10 is a substrate, and the forming device 20 is an imprint device.

[0069] Substrates are fed into system 100 from a coater-developer apparatus (not shown). The coater-developer apparatus may be inline with the foreign matter removal apparatus 10 and the forming apparatus 20 in system 100, or it may be standalone, but inline is preferable from the viewpoint of preventing foreign matter adhesion and contamination. In the coater-developer apparatus, a masking material such as SOC / SOG is applied to the substrate, and the substrate is then transported to the inline foreign matter removal apparatus 10.

[0070] In the system 100 of this embodiment, before the substrate is fed into the forming apparatus 20 (imprint apparatus), the substrate is subjected to a foreign matter removal process by the foreign matter removal apparatus 10. This foreign matter removal process is as described in the first embodiment, so its description is omitted here. After the foreign matter removal process by the foreign matter removal apparatus 10 is performed on the substrate, it is transported to the forming apparatus 20, which is inline connected to the foreign matter removal apparatus 10, where a pattern formation process (imprint process) is performed. In the imprint process, after supplying imprint material onto the substrate, a quartz mold (template) with a fine uneven pattern is brought into contact with the imprint material on the substrate. Then, after the imprint material is cured while the imprint material on the substrate and the mold are in contact, the mold is separated (peeled) from the cured imprint material on the substrate. As a result, the pattern of the mold is transferred to the imprint material on the substrate, and a pattern composed of cured imprint material can be formed on the substrate.

[0071] In this imprint process, if foreign matter is present (adhered) to the substrate, for example, if inorganic foreign matter of about 80 nm or less is present, the mold having a relief pattern of about 20 nm may be damaged. Once the mold is damaged, defects will be formed in the pattern of the imprint material formed on the substrate in subsequent imprint processes using that mold. Therefore, foreign matter management of the substrate and original plate (mold) is a very important issue. The foreign matter removal device 10 of this embodiment is very suitable as a method to solve these problems because the device configuration is simple and it can remove even very small foreign matter.

[0072] In this embodiment, in system 100, after foreign matter removal processing was performed by the foreign matter removal device 10, pattern formation processing (imprint processing) was performed by the forming device 20 (imprint device). As a result, the defect density DD (pieces / cm) 2 The increase in ΔDD is 1 unit / cm 2 It was confirmed that the number of substrates that flowed to reach this stage increased dramatically from a few lots to several hundred lots depending on whether or not the foreign matter removal device 10 was present.

[0073] <Embodiment for manufacturing an article> The method for manufacturing articles according to embodiments of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having microstructures. The method for manufacturing articles according to this embodiment includes a foreign matter removal step for removing foreign matter from a target member, a forming step for forming a pattern on a substrate, a processing step for processing the substrate on which the pattern was formed in the forming step, and a manufacturing step for manufacturing an article from the substrate processed in the processing step. In the foreign matter removal step, foreign matter is removed from the target member using the foreign matter removal method described above. The target member is a substrate on which a pattern is formed in the forming step, and / or a master plate having a pattern that is transferred onto the substrate in the forming step. Furthermore, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing articles according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0074] When an imprint apparatus is used as a forming device to form a pattern on a substrate in the formation process, the pattern of the cured material formed by the imprint apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. Articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, or molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0075] The pattern of the cured material is either used as is as a component of at least a part of the above-mentioned article, or temporarily used as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.

[0076] Next, we will explain the specific manufacturing method of the article. Here, we will explain an example using an imprint apparatus (imprint processing). As shown in Figure 8(a), a substrate 1z such as a silicon wafer is prepared on which a workpiece material 2z such as an insulator is formed on its surface. Subsequently, an imprint material 3z is applied to the surface of the workpiece material 2z by an inkjet method or the like. Here, we show how multiple droplet-shaped imprint material 3z are applied to the substrate.

[0077] As shown in Figure 8(b), the mold 4z for imprinting is positioned opposite the imprint material 3z on the substrate, with the side where the uneven pattern is formed facing it. As shown in Figure 8(c), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is shone through the mold 4z as curing energy, the imprint material 3z hardens.

[0078] As shown in Figure 8(d), after the imprint material 3z has cured, when the mold 4z and substrate 1z are separated, a pattern of the cured imprint material 3z is formed on the substrate 1z. In this cured pattern, the recesses of the mold correspond to the protrusions of the cured material, and the protrusions of the mold correspond to the recesses of the cured material. In other words, the uneven pattern of the mold 4z has been transferred to the imprint material 3z. Note that an RLT (Residual Layer Thickness, sometimes called residual film thickness) of several tens of nanometers in thickness (not shown) remains in the recesses of the cured material.

[0079] As shown in Figure 8(e), when etching is performed including the RLT portion using the cured material pattern as an etching-resistant mask, the parts of the workpiece 2z surface that are free of cured material or have a thin remaining layer are removed, forming grooves 5z. As shown in Figure 8(f), when the cured material pattern is removed, an article with grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the cured material pattern was removed, but it may also be used without removal after processing, for example, as an interlayer insulating film included in semiconductor devices, i.e., as a component of the article.

[0080] <Summary of Embodiments> This disclosure includes the following methods for removing foreign matter, forming methods, methods for manufacturing articles, devices for removing foreign matter, systems, and templates.

[0081] (Item 1) A method for removing foreign matter from a first member, A supply step of supplying the composition onto the first member, A pressing step in which a second member is pressed against the composition on the first member so that the composition supplied onto the first member in the supply step spreads over a target area of ​​the first member and foreign matter within the target area is incorporated into the composition, After the pressing step, a curing step is performed in which the composition on the first member and the second member are in contact and the composition is cured. After the curing step, a separation step is performed to separate the composition from the target area of ​​the first member by separating the second member from the first member while the second member and the composition are adhered to each other, A method for removing foreign matter, characterized by including [a specific component].

[0082] (Item 2) The method for removing foreign matter according to item 1, characterized in that the target range includes at least a portion of the bevel portion of the first member.

[0083] (Item 3) The method for removing foreign matter according to item 2, characterized in that, in the supply step, the liquid composition is supplied to the portion of the first member other than the bevel portion.

[0084] (Item 4) The method for removing foreign matter according to any one of items 1 to 3, characterized in that, in the pressing step, the parallelism between the first member and the second member is controlled so that the composition supplied onto the first member in the supply step spreads over the target range.

[0085] (Item 5) A method for removing foreign matter according to any one of items 1 to 4, characterized in that, in the pressing step, the pressing force of the second member against the composition on the first member is controlled so that the composition supplied on the first member in the supply step spreads over the target range.

[0086] (Item 6) A method for removing foreign matter according to any one of items 1 to 5, characterized in that, in the pressing step, the pressing of the second member against the composition on the first member is controlled while observing the spread of the composition on the first member so that the composition supplied on the first member in the supply step spreads over the target range.

[0087] (Item 7) The method for removing foreign matter according to any one of items 1 to 6, further comprising a step of performing a treatment on the first member to make the surface of the first member hydrophilic with the liquid composition before the supply step.

[0088] (Item 8) The method for removing foreign matter according to any one of items 1 to 7, further comprising a step of performing a treatment on the second member to improve the adhesion between the composition and the second member before the pressing step.

[0089] (Item 9) The method for removing foreign matter according to any one of items 1 to 8, characterized in that the second member has a pressing surface that is pressed against the composition, and has a plurality of grooves extending radially on the pressing surface to guide the spread of the composition during the pressing step.

[0090] (Item 10) The method for removing foreign matter according to item 9, characterized in that the second member further has a frame-shaped second groove on the pressing surface for stopping the spreading of the composition during the pressing step.

[0091] (Item 11) The method for removing foreign matter according to any one of items 1 to 10, characterized in that the first member is a substrate on which a pattern is formed.

[0092] (Item 12) The method for removing foreign matter according to any one of items 1 to 10, characterized in that the first member is a master plate used to form a pattern on a substrate.

[0093] (Item 13) A method for forming a pattern on a substrate, A foreign matter removal step in which foreign matter is removed from the first member using the foreign matter removal method described in any one of items 1 to 12, A forming process for forming a pattern on a substrate, Includes, The forming method is characterized in that the first member on which the foreign matter removal step is performed is the substrate on which the pattern is formed in the forming step, and / or the master plate having the pattern to be transferred onto the substrate.

[0094] (Item 14) A step of forming a pattern on a substrate using the formation method described in item 13, A process of processing the substrate on which the pattern has been formed, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by including the following:

[0095] (Item 15) A foreign matter removal device for removing foreign matter from a first member, A supply unit that supplies a liquid composition onto the first member, A drive unit that drives the first member and the second member relative to each other, A curing section for curing the aforementioned composition, A control unit that controls a foreign matter removal process to remove foreign matter from the first member, Equipped with, The control unit performs the foreign matter removal process as follows: A supply step in which the supply unit supplies a liquid composition onto the first member, A pressing step in which the drive unit presses the second member against the composition on the first member so that the composition supplied onto the first member in the supply step spreads over a target area of ​​the first member and foreign matter within the target area is incorporated into the composition, After the pressing step, a curing step is performed in which the composition on the first member and the second member are in contact, and the composition is cured by the curing unit. After the curing step, the second member and the composition are adhered together, and the second member is separated from the first member by the drive unit, thereby separating the composition from the target area of ​​the first member. A foreign matter removal device characterized by performing the following.

[0096] (Item 16) A foreign matter removal device described in item 15 for removing foreign matter on the first member, A forming apparatus for forming patterns on a substrate, Equipped with, The system is characterized in that the first member from which foreign matter is removed by the foreign matter removal device is the substrate on which a pattern is formed by the forming device, and / or a master plate having a pattern to be transferred onto the substrate.

[0097] (Item 17) A template for spreading a composition supplied onto a member on the member, A template characterized by having a pressing surface that is pressed against the composition on the member, and having a plurality of grooves extending radially on the pressing surface to guide the spread of the composition on the member.

[0098] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0099] 1: Target component (first component), 4: Composition, 5: Template (second component), 10: Foreign matter removal device, 11: Stage, 12: Holding unit, 13: Supply unit, 16: Imaging unit, 17: Curing unit, 18: Control unit, 20: Forming device

Claims

1. A method for removing foreign matter from a first member, A supply step of supplying the composition onto the first member, A pressing step in which the second member is pressed against the composition on the first member so that the composition supplied on the first member in the supply step spreads over a target area of ​​the first member and foreign matter within the target area is incorporated into the composition, After the pressing step, a curing step is performed in which the composition on the first member and the second member are in contact and the composition is cured. The separation step includes separating the second member from the first member while the second member and the composition are adhered together after the curing step, thereby separating the composition from the target area of ​​the first member. The target range includes at least a portion of the bevel portion of the first member, A method for removing foreign matter, characterized in that, in the supply step, the liquid composition is supplied to the portion of the first member other than the bevel portion.

2. The method for removing foreign matter according to claim 1, characterized in that, in the pressing step, the parallelism between the first member and the second member is controlled so that the composition supplied onto the first member in the supply step spreads over the target range.

3. The method for removing foreign matter according to claim 1, characterized in that, in the pressing step, the pressing force of the second member against the composition on the first member is controlled so that the composition supplied on the first member in the supply step spreads over the target range.

4. The method for removing foreign matter according to claim 1, characterized in that, in the pressing step, the pressing of the second member against the composition on the first member is controlled while observing the spread of the composition on the first member so that the composition supplied on the first member in the supply step spreads over the target range.

5. The method for removing foreign matter according to claim 1, further comprising the step of performing a treatment on the first member to make the surface of the first member hydrophilic with the liquid composition before the supply step.

6. The method for removing foreign matter according to claim 1, further comprising a step of performing a treatment on the second member to improve the adhesion between the composition and the second member before the pressing step.

7. The method for removing foreign matter according to claim 1, characterized in that the second member has a pressing surface that is pressed against the composition, and has a plurality of grooves extending radially on the pressing surface to guide the spread of the composition during the pressing step.

8. The method for removing foreign matter according to claim 7, characterized in that the second member further has a frame-shaped second groove on the pressing surface for stopping the spreading of the composition during the pressing step.

9. The method for removing foreign matter according to claim 1, characterized in that the first member is a substrate on which a pattern is formed.

10. The method for removing foreign matter according to claim 1, characterized in that the first member is a master plate used to form a pattern on a substrate.

11. A method for forming a pattern on a substrate, A foreign matter removal step of removing foreign matter on a first member using the foreign matter removal method described in any one of claims 1 to 10, A forming process for forming a pattern on a substrate, Includes, The forming method is characterized in that the first member on which the foreign matter removal step is performed is the substrate on which the pattern is formed in the forming step, and / or the original plate having the pattern to be transferred onto the substrate.

12. A step of forming a pattern on a substrate using the forming method described in claim 11, A process of processing the substrate on which the pattern has been formed, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by including the following:

13. A foreign matter removal device for removing foreign matter from a first member, A supply unit that supplies a liquid composition onto the first member, A drive unit that drives the first member and the second member relative to each other, A curing section for curing the aforementioned composition, A control unit that controls a foreign matter removal process to remove foreign matter from the first member, Equipped with, The control unit performs the foreign matter removal process as follows: A supply step in which the supply unit supplies a liquid composition onto the first member, A pressing step in which the drive unit presses the second member against the composition on the first member so that the composition supplied onto the first member in the supply step spreads over a target area of ​​the first member and foreign matter within the target area is incorporated into the composition, After the pressing step, a curing step is performed in which the composition on the first member and the second member are in contact, and the composition is cured by the curing unit. After the curing step, a separation step is performed in which the second member and the composition are separated by the drive unit while the second member and the composition are adhered to each other, thereby separating the composition from the target area of ​​the first member. The target range includes at least a portion of the bevel portion of the first member, A foreign matter removal device characterized in that, in the supply step, the liquid composition is supplied to the portion of the first member other than the bevel portion.

14. A foreign matter removal device according to claim 13 for removing foreign matter on a first member, A forming apparatus for forming patterns on a substrate, Equipped with, The system is characterized in that the first member from which foreign matter is removed by the foreign matter removal device is the substrate from which a pattern is formed by the forming device, and / or a master plate having a pattern to be transferred onto the substrate.

15. A template for spreading a composition supplied onto a member on the member, The pressing surface has a pressing surface that is pressed against the composition on the member, and the pressing surface has a plurality of first grooves that extend radially to guide the spread of the composition on the member, and a second groove that is provided in a frame shape near the outer edge of the pressing surface, The template is characterized in that the second groove is provided at a position corresponding to the outer circumference of the member, and the composition is prevented from spreading outside the second groove.

Images