Semiconductor equipment
The semiconductor device addresses the issue of insufficient solder supply by incorporating grooves with flat and inclined portions in the cooling plate, enhancing bonding material thickness and reliability, particularly under high stress.
JP7876723B2Active Publication Date: 2026-06-19MITSUBISHI ELECTRIC CORP
Patent Information
- Application Number
- JP2025521717
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-05-24
- Publication Date
- 2026-06-19
- Estimated Expiration
- 2043-05-24
Smart Images
Figure 0007876723000001 
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Abstract
The purpose of the present invention is to reliably supply a bonding material to a groove on a cooling plate provided directly under a corner part of an insulating substrate. This semiconductor device includes an insulating substrate and a cooling plate. The insulating substrate holds a semiconductor chip. The cooling plate holds the insulating substrate. The cooling plate includes a groove. The groove is provided along at least a part of a peripheral edge portion of the insulating substrate in plan view. The groove includes: a flat portion such that the bottom surface of the groove is flat; and an inclined portion having a downward inclination such that the bottom surface of the groove is inclined toward the flat portion. The flat portion is provided so as to overlap a corner portion of the insulating substrate, the corner portion being included in the peripheral edge portion of the insulating substrate in plan view.
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Citation Information
Patent Citations
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