Substrate processing method and substrate processing system

The substrate processing method addresses quality management by monitoring and controlling laser processing through data-driven techniques, ensuring effective crack formation and preventing lens contamination for improved substrate processing quality.

JP7884080B2Active Publication Date: 2026-07-02TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2024554384
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-10-31
Filing Date
2023-10-18
Publication Date
2026-07-02
Estimated Expiration
2043-10-18

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Abstract

This substrate processing method for processing a substrate includes forming a reformed layer and a crack by irradiating a substrate with a laser beam, and involves: acquiring data relating to a cumulative number of substrates processed, an amount of contamination of a cover glass protecting a condensing lens for laser beam irradiation, a flow rate of a gas supplied along the lower surface of the cover glass, and a length of the crack that extends as a result of the laser beam irradiation; and controlling the laser beam irradiation on the basis of the acquired data.
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Citation Information

Patent Citations

  • Laser processing head

    CN201573009U

  • Laser processing apparatus

    JP2012179642A

  • Laser beam machining method

    JP2013126683A

  • Processing method of wafer

    JP2015012015A

  • Laser processing device

    JP2019000856A