Transparent light-emitting package and method for manufacturing the same
The integration of R, G, and B LED chips and driver ICs in a single transparent light-emitting package addresses the limitations of conventional technologies by achieving ultra-thinness, cost reduction, and improved transparency and heat resistance through a laminated substrate design with through-electrodes.
JP7884282B2Active Publication Date: 2026-07-03GLOBAL TECH CO LTD
Patent Information
- Application Number
- JP2024075914
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2023-05-10
- Filing Date
- 2024-05-08
- Publication Date
- 2026-07-03
- Estimated Expiration
- 2044-05-08
Smart Images
Figure 0007884282000001 
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Figure 0007884282000003
Abstract
To provide a transparent light-emitting package and a manufacturing method thereof, in which a light-emitting element and a driving element can be packaged to form one pixel.SOLUTION: A transparent light-emitting package 100 may include a substrate 10, a first wiring layer L1 formed on a first surface of the substrate, at least one light-emitting element 20 mounted on a portion of the first wiring layer, at least one driving element 30 mounted on another portion of the first wiring layer and driving the light-emitting element, a second wiring layer L2 formed on a second surface of the substrate, and a through electrode 40 formed through at least a portion of the substrate such that the first wiring layer and the second wiring layer are electrically connected.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
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