Photosensitive resin composition

A photosensitive resin composition with a polyimide precursor, crosslinking agent, photoradical generator, and high molecular weight sensitizer addresses poor developability in semiconductor substrates, enhancing resolution and residual film properties for improved semiconductor packaging.

JP7885648B2Active Publication Date: 2026-07-07AJINOMOTO CO INC
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Patent Information

Application Number
JP2022157092
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-09-29
Publication Date
2026-07-07
Estimated Expiration
2042-09-29

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Abstract

To provide a photosensitive resin composition with excellent resolution and residual film properties.SOLUTION: A photosensitive resin composition comprises (A) a polyimide precursor, (B) a crosslinker, (C) a photoradical generating agent, and (D) a photosensitizer with a molecular weight of 400 or more.SELECTED DRAWING: None
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Citation Information

Patent Citations

  • Device for sending out material in fooddforming machine

    JP1981032978A

  • Photographic developing device

    JP1989040944A

  • Method for forming patterned polyimide coating film on substrate

    JP1995181689A

  • Photocurable composition and hardened product of the same

    JP2015011209A

  • Photocurable resin composition, cured product of the same and printed wiring board

    JP2015028588A